RP114x SERIES
300 mA LDO REGULATOR
No.EA-236-230719
OUTLINE
The RP114x is a CMOS-based voltage regulator IC with high output voltage accuracy, low supply current, low
dropout, and high ripple rejection. This IC consists of a voltage reference unit, an error amplifier, resistors for
setting output voltage, a short current limit circuit, a chip enable circuit, and so on. The RP114x features a
minimum input voltage from 1.4V and the output voltage, which can be set from 0.8V to 3.6V (in 0.1V step).
The output voltage of this IC is internally fixed. This IC perform with low dropout voltage due to built-in transistor
with low ON resistance. Low supply current and a chip enable function prolong the battery life of each system.
The ripple rejection, line transient response and load transient response of the RP114x is excellent, thus this
IC is very suitable for the power supply for hand-held communication equipment. Since the packages for this
IC are DFN(PL)1010-4、DFN(PL)1010-4B、SC-88A、SOT-23-5, therefore high density mounting of the IC on
boards is possible.
FEATURES
• Supply Current ................................................................ Typ. 50µA
• Standby Current ............................................................. Typ. 0.1µA
• Input Voltage Range ....................................................... 1.4V to 5.25V
• Output Voltage Range(1) ................................................. 0.8V to 3.6V (0.1V steps)
• Output Voltage Accuracy ................................................ ±1.0% (VSET>2.0V, Ta = 25°C)
• Temperature-Drift Coefficient of Output Voltage ............. Typ. ±80ppm/°C
• Dropout Voltage .............................................................. Typ. 0.25V (IOUT = 300mA, VSET = 2.8V)
• Ripple Rejection ............................................................. Typ. 75dB (f=1kHz)
• Line Regulation ............................................................... Typ. 0.02%/V
• Packages ...................................................................... DFN(PL)1010-4、DFN(PL)1010-4B、
SC-88A、SOT-23-5
• Built-in Fold Back Protection Circuit ............................... Typ. 60mA (Current at short mode)
• Ceramic capacitors are recommended to be used with this IC ...... 1.0µF or more
APPLICATIONS
• Power source for portable communication equipment.
• Power source for electrical appliances such as cameras, VCRs and camcorders.
• Power source for battery-powered equipment.
(1)
For other voltages, please refer to Product-specific Electrical Characteristics.
1
RP114x
No.EA-236-230719
SELECTION GUIDE
The set output voltage, the auto discharge function(1), and the package type for the ICs are user-selectable
options.
Product Name
Package
Quantity per Reel
Pb Free
Halogen Free
DFN(PL)1010-4
10,000 pcs
Yes
Yes
DFN(PL)1010-4B
10,000 pcs
Yes
Yes
RP114Qxx2∗(y)-TR-FE
SC-88A
3,000 pcs
Yes
Yes
RP114Nxx1∗(y)-TR-FE
SOT-23-5
3,000 pcs
Yes
Yes
RP114Kxx1∗(y)-TR
RP114Kxx1∗(y)-TRB
xx : Specify the set output voltage within the range of 0.8 V (08) to 3.6 V (36) in 0.1 V step.
(y): If the output voltage includes the 3rd digit, indicate the digit of 0.01V.
Ex. If the output voltage is 1.25V, RP114K121∗5-TR
If the output voltage is 1.85V, RP114K181∗5-TR
∗: Specify a combination of the CE pin polarity and the auto-discharge function.
(B) “H” Active, without Auto-Discharge function
(D) “H” Active, with Auto-Discharge function
BLOCK DIAGRAMS
VDD
VOUT VDD
Vref
Vref
Current Limit
CE
Current Limit
GND CE
RP114xxxxB Block Diagram
(1)
VOUT
GND
RP114xxxxD Block Diagram
Auto-Discharge function quickly lowers the output voltage to 0V by releasing the electrical charge in the external
capacitor when the chip enable signal is switched from the active mode to the standby mode.
2
RP114x
No.EA-236-230719
PIN DESCRIPTIONS
RP114K [DFN(PL)1010-4]
Top View
4
RP114K [DFN(PL)1010-4B]
Bottom View
3
3
4
Bottom View
Top View
4
3
3
∗
∗
1
2
2
1
1
2
RP114Q (SC-88A)
5
5
(mark side)
2
2
1
RP114N (SOT-23-5)
4
1
4
4
(mark side)
3
1
2
3
RP114K Pin Description [DFN(PL)1010-4 / DFN(PL)1010-4B]
Pin No
Symbol
Pin Description
1
VOUT
Output Pin
2
GND
Ground Pin
3
CE
4
VDD
Chip Enable Pin ("H" Active)
Input Pin
∗ Tab is GND level. (They are connected to the reverse side of this IC.) The tab is better to be connected to the GND, but
leaving it open is also acceptable.
RP114Q Pin Description (SC-88A)
Pin No
Symbol
Description
1
CE
Chip Enable Pin (“H” Active)
2
NC
No Connection
3
GND
Ground Pin
4
VOUT
Output Pin
5
VDD
Input Pin
3
RP114x
No.EA-236-230719
RP114N Pin Description (SOT-23-5)
Pin No
Symbol
Description
1
VDD
Input Pin
2
GND
Ground Pin
3
CE
Chip Enable Pin (“H” Active)
4
NC
No Connection
5
VOUT
Output Pin
4
RP114x
No.EA-236-230719
ABSOLUTE MAXIMUM RATINGS
Symbol
Item
Rating
Unit
VIN
Input Voltage
6.0
V
VCE
Input Voltage (CE Pin)
6.0
V
VOUT
Output Voltage
−0.3 to VIN+0.3
V
IOUT
Output Current
400
mA
PD
Power Dissipation(1)
DFN(PL)1010-4, JEDEC STD. 51
800
DFN(PL)1010-4B, JEDEC STD. 51
800
SC-88A,
Our Evaluation Board
380
SOT-23-5, JEDEC STD. 51
660
mW
Tj
Junction Temperature Range
−40 to 125
°C
Tstg
Storage Temperature Range
−55 to 125
°C
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent
damages and may degrade the life time and safety for both device and system using the device in the field.
The functional operation at or over these absolute maximum ratings are not assured.
RECOMMENDED OPERATING CONDITIONS
Symbol
Item
VIN
Input Voltage
Ta
Operating Temperature Range
Rating
1.4 to 5.25
Unit
(2)
−40 to 85
V
°C
RECOMMENDED OPERATING CONDITIONS
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating conditions, even if when they are used over such ratings by momentary electronic noise or surge. And the
semiconductor devices may receive serious damage when they continue to operate over the recommended
operating conditions.
(1)
Refer to POWER DISSIPATION for detailed information.
the input voltage exceeds the maximum value of 5.25 V for some reasons, the operational accumulated time
becomes up to 500 hours at 5.5V.
(2) If
5
RP114x
No.EA-236-230719
ELECTRICAL CHARACTERISTICS
VIN = VSET(1)+1.0 V (VSET > 1.5 V)，VIN = 2.5 V (VSET ≤ 1.5V)，IOUT = 1 mA，CIN = COUT = 1.0 µF,
unless otherwise noted.
The specifications in
are guaranteed by design engineering at -40ºC ≤ Ta ≤ 85ºC.
RP114xxxxB/D Electrical Characteristics
Symbol
Item
(Ta=25°C)
Conditions
Ta = 25°C
VOUT
Output Voltage
-40°C ≤ Ta ≤ 85°C
IOUT
Typ.
Max.
Unit
VSET > 2.0 V
×0.99
×1.01
V
VSET ≤ 2.0 V
-20
+20
mV
VSET > 2.0 V
×0.97
×1.03
V
VSET ≤ 2.0 V
-60
+60
mV
Output Current
∆VOUT/∆IOUT Load Regulation
Min.
300
1 mA ≤ IOUT ≤ 300 mA
mA
15
40
mV
VDIF
Dropout Voltage
ISS
Supply Current
IOUT = 0 mA
50
75
μA
Standby Current
VCE = 0 V
0.1
1.0
μA
0.02
0.10
%/V
Istandby
∆VOUT
/∆VIN
Line Regulation
Please refer to Product-specific Electrical Characteristics attached.
VSET + 0.5 V ≤ VIN ≤ 5.25 V
(VIN ≥ 1.4 V)
f=1kHz, Ripple 0.2 Vp-p,
RR
Ripple Rejection
VIN=VSET +1V, IOUT = 30 mA
75
dB
(When VSET ≤ 2.0 V, VIN = 3.0 V)
Output Voltage
∆VOUT/∆Ta Temperature
Coefficient
ISC
Short Current Limit
IPD
CE Pull-down Current
VCEH
CE Input Voltage “H”
VCEL
CE Input Voltage “L”
en
RLOW
-40°C ≤ Ta ≤ 85°C
±80
VOUT = 0 V
60
0.3
ppm
/°C
mA
0.6
1.0
μA
V
0.4
V
Output Noise
BW = 10 Hz to 100 kHz,
IOUT = 30 mA
75
μVrms
Low Output Nch. On
Resistance
(RP114xxxxD Only)
VIN = 4.0 V, VCE = 0 V
50
Ω
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25ºC) except for
Output Noise, Ripple Rejection, and Output Voltage Temperature Coefficient.
(1)
VSET: Set Output Voltage
6
RP114x
No.EA-236-230719
The specifications in
are guaranteed by design engineering at -40ºC ≤ Ta ≤ 85ºC.
Dropout Voltage by Set Output Voltage
(Ta=25°C)
Dropout Voltage VDIF (V)
Set Output Voltage
VSET (V)
Typ.
Max.
VSET=0.8
0.560
0.720
VSET=0.9
0.510
0.650
1.0 ≤ VSET < 1.2
0.460
0.590
1.2 ≤ VSET < 1.4
0.390
0.500
0.350
0.440
1.7 ≤ VSET < 2.1
0.300
0.390
2.1 ≤ VSET < 2.5
0.260
0.340
2.5 ≤ VSET < 3.0
0.250
0.300
3.0 ≤ VSET ≤ 3.6
0.220
0.290
1.4 ≤ VSET < 1.7
Condition
IOUT=300mA
7
RP114x
No.EA-236-230719
Product-specific Electrical Characteristics
The specifications in
Product Name
RP114x081x
RP114x091x
RP114x101x
RP114x101x5
RP114x111x
RP114x111x5
RP114x121x
RP114x121x5
RP114x131x
RP114x131x5
RP114x141x
RP114x151x
RP114x161x
RP114x171x
RP114x171x5
RP114x181x
RP114x181x5
RP114x191x
RP114x201x
RP114x211x
RP114x221x
RP114x231x
RP114x241x
RP114x251x
RP114x261x
RP114x271x
RP114x281x
RP114x281x5
RP114x291x
RP114x301x
RP114x311x
RP114x321x
RP114x331x
RP114x341x
RP114x341x5
RP114x351x
RP114x361x
are guaranteed by design engineering at -40ºC ≤ Ta ≤ 85ºC.
VOUT [V] (Ta = 25°C)
Min.
Typ.
Max.
0.780
0.800
0.820
0.880
0.900
0.920
0.980
1.000
1.020
1.030
1.050
1.070
1.080
1.100
1.120
1.130
1.150
1.170
1.180
1.200
1.220
1.230
1.250
1.270
1.280
1.300
1.320
1.330
1.350
1.370
1.380
1.400
1.420
1.480
1.500
1.520
1.580
1.600
1.620
1.680
1.700
1.720
1.730
1.750
1.770
1.780
1.800
1.820
1.830
1.850
1.870
1.880
1.900
1.920
1.980
2.000
2.020
2.079
2.100
2.121
2.178
2.200
2.222
2.277
2.300
2.323
2.376
2.400
2.424
2.475
2.500
2.525
2.574
2.600
2.626
2.673
2.700
2.727
2.772
2.800
2.828
2.822
2.850
2.879
2.871
2.900
2.929
2.970
3.000
3.030
3.069
3.100
3.131
3.168
3.200
3.232
3.267
3.300
3.333
3.366
3.400
3.434
3.416
3.450
3.485
3.465
3.500
3.535
3.564
3.600
3.636
VOUT [V] (−40°C ≤ Ta ≤ 85°C)
Min.
Typ.
Max.
0.740
0.800
0.860
0.840
0.900
0.960
0.940
1.000
1.060
0.990
1.050
1.110
1.040
1.100
1.160
1.090
1.150
1.210
1.140
1.200
1.260
1.190
1.250
1.310
1.240
1.300
1.360
1.290
1.350
1.410
1.340
1.400
1.460
1.440
1.500
1.560
1.540
1.600
1.660
1.640
1.700
1.760
1.690
1.750
1.810
1.740
1.800
1.860
1.790
1.850
1.910
1.840
1.900
1.960
1.940
2.000
2.060
2.037
2.100
2.163
2.134
2.200
2.266
2.231
2.300
2.369
2.328
2.400
2.472
2.425
2.500
2.575
2.522
2.600
2.678
2.619
2.700
2.781
2.716
2.800
2.884
2.765
2.850
2.936
2.813
2.900
2.987
2.910
3.000
3.090
3.007
3.100
3.193
3.104
3.200
3.296
3.201
3.300
3.399
3.298
3.400
3.502
3.347
3.450
3.554
3.395
3.500
3.605
3.492
3.600
3.708
VDIF [V]
Typ.
Max.
0.560
0.720
0.510
0.650
0.460
0.590
0.390
0.500
0.350
0.440
0.300
0.390
0.260
0.340
0.250
0.300
0.220
0.290
8
RP114x
No.EA-236-230719
TEST CIRCUITS
VDD VOUT
RP114x
Series
C1
CE
V
C2
VOUT
IOUT
↓
GND
C1 = Ceramic 1.0μF
C2 = Ceramic 1.0μF
Figure 1. Basic Test Circuit
VDD VOUT
A
ISS
RP114x
Series
C1
CE
VOUT
C2
GND
C1 = Ceramic 1.0μF
C2 = Ceramic 1.0μF
Figure 2. Test Circuit for Supply Current
Pulse
Generator
VDD VOUT
RP114x
Series
P.G.
CE
C2
↓
IOUT
GND
C2 = Ceramic 1.0μF
Figure 3. Test Circuit for Ripple Rejection
VOUT
VDD VOUT
C1
RP114x
Series
CE
C2
GND
↓ IOUTa
↓
IOUTb
C1 = Ceramic 1.0μF
C2 = Ceramic 1.0μF
Figure 4. Test Circuit for Load Transient Response
9
RP114x
No.EA-236-230719
TECHNICAL NOTES ON EXTERNAL COMPONENTS
When using these ICs, consider the following points:
Phase Compensation
In this IC, phase compensation is made for securing stable operation even if the load current is varied. For this
purpose, use a capacitor C2 with 1.0µF or more and good ESR (Equivalent Series Resistance).
(Note: If additional ceramic capacitors are connected with parallel to the output pin with an output capacitor for
phase compensation, the operation might be unstable. Because of this, test this IC with as same external
components as ones to be used on the PCB.)
PCB Layout
Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result.
Connect a capacitor C1 with a capacitance value as much as 1.0µF or more between VDD and GND pins, and
as close as possible to the pins.
Set external components, especially the output capacitor C2, as close as possible to the IC, and make wiring
as short as possible.
Typical Application Circuit
VOUT
VDD VOUT
C1
1.0 µF
CE Control
RP114x
Series
CE
C2
1.0 µF
GND
10
RP114x
No.EA-236-230719
ESR vs. Output Current
When using these ICs, consider the following points:
The relations between IOUT (Output Current) and ESR of an output capacitor are shown below. The conditions
when the white noise level is under 40µV (Avg.) are marked as the hatched area in the graph.
Measurement conditions
Frequency Band: 10Hz to 2MHz
Temperature
: −40°C to 85°C
C1, C2
: 1.0µF
RP114x08xx
RP114x25xx
VIN=1.4V to 5.25V
100
VIN=2.5V to 5.25V
100
Topt=85°C
Ta
Topt=85°C
Ta
10
Topt=-40°C
Ta
1
ESR (Ω)
ESR (Ω)
10
0.1
Topt=-40°C
Ta
1
0.1
0.01
0.01
0
50
100 150 200 250
Output Current IOUT (mA)
300
0
50
100
150
200
250
300
Output Current IOUT (mA)
RP114x36xx
VIN=3.6V to 5.25V
100
Topt=85°C
Ta
ESR (Ω)
10
Topt=-40°C
Ta
1
0.1
0.01
0
50
100 150 200 250
Output Current IOUT (mA)
300
11
RP114x
No.EA-236-230719
TYPICAL CHARACTERISTICS
Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed.
1) Output Voltage vs. Output Current (C1=1.0µF, C2=1.0µF, Ta=25°C)
RP114x08xx
0.7
Output Voltage VOUT (V)
0.8
Output Voltage VOUT (V)
RP114x25xx
3.0
0.9
VIN=1.8V
VIN=2.8V
VIN=3.6V
VIN=4.2V
VIN=5.0V
VIN=5.25V
0.6
0.5
0.4
0.3
0.2
0.1
2.5
2.0
VIN=3.5V
1.5
VIN=5.0V
VIN=5.25V
VIN=4.2V
1.0
0.5
0
0
0
0
100 200 300 400 500 600 700
Output Current IOUT (mA)
100 200 300 400 500 600 700
Output Current IOUT (mA)
RP114x36xx
4.0
Output Voltage VOUT (V)
3.5
3.0
VIN=4.6V
2.5
VIN=5.0V
2.0
VIN=5.25V
1.5
1.0
0.5
0
0
100 200 300 400 500 600 700
Output Current IOUT (mA)
2) Output Voltage vs. Input Voltage (C1=1.0µF, C2=1.0µF, Ta=25°C)
RP114x08xx
RP114x25xx
3.0
0.8
0.7
0.6
0.5
0.4
IOUT=1mA
0.3
IOUT=30mA
0.2
IOUT=50mA
0.1
0
Output Voltage VOUT (V)
Output Voltage VOUT (V)
0.9
2.5
2.0
1.5
IOUT=1mA
IOUT=30mA
1.0
IOUT=50mA
0.5
0
0
1
2
3
4
Input Voltage VIN (V)
5
0
1
2
3
4
Input Voltage VIN (V)
5
12
RP114x
No.EA-236-230719
RP114x36xx
Output Voltage VOUT (V)
4.0
3.5
3.0
2.5
2.0
1.5
IOUT=1mA
1.0
IOUT=30mA
IOUT=50mA
0.5
0
0
1
2
3
4
Input Voltage VIN (V)
5
3) Supply Current vs. Input Voltage (C1=1.0µF, C2=1.0µF, Ta=25°C)
RP114x25xx
70
70
60
60
Supply Current ISS (µA)
Supply Current ISS (µA)
RP114x08xx
50
40
30
20
10
50
40
30
20
10
0
0
0
1
2
3
4
Input Voltage VIN (V)
5
0
1
2
3
4
Input Voltage VIN (V)
5
RP114x36xx
Supply Current ISS (µA)
70
60
50
40
30
20
10
0
0
1
2
3
4
Input Voltage VIN (V)
5
13
RP114x
No.EA-236-230719
4) Output Voltage vs. Temperature (C1=1.0µF, C2=1.0µF, IOUT=1mA)
RP114x08xx
0.83
0.82
0.81
0.80
0.79
0.78
0.77
0.76
0.75
-50
-25
0
25
50
75
Temperature Topt
(°C)
Ta (°C)
RP114x36xx
3.65
3.64
Output Voltage VOUT (V)
RP114x25xx
VIN=1.8V
Output Voltage VOUT (V)
Output Voltage VOUT (V)
0.85
0.84
2.55
2.54
2.53
VIN=3.5V
2.52
2.51
2.50
2.49
2.48
2.47
2.46
2.45
-50
100
-25
0
25
50
75
Temperature Topt
(°C)
Ta (°C)
100
VIN=4.6V
3.63
3.62
3.61
3.60
3.59
3.58
3.57
3.56
3.55
-50
-25
0
25
50
75
Ta (°C)
Temperature Topt
(°C)
100
5) Supply Current vs. Temperature (C1=1.0µF, C2=1.0µF, IOUT=0mA)
RP114x08xx
60
70
Supply Current ISS (μA)
Supply Current ISS (μA)
70
RP114x25xx
VIN=1.8V
50
40
30
20
10
0
VIN=3.5V
60
50
40
30
20
10
0
-50
-25
0
25
50
75
Ta (°C)
Temperature Topt
(°C)
100
-50
-25
0
25
50
75
Ta
(°C)
Temperature Topt (°C)
100
14
RP114x
No.EA-236-230719
RP114x36xx
VIN=4.6V
Supply Current ISS (μA)
70
60
50
40
30
20
10
0
-50
-25
0
25
50
75
100
Temperature Topt
(°C)
Ta (°C)
6) Dropout Voltage vs. Output Current (C1=1.0µF, C2=1.0µF)
RP114x08xx
600
500
400
300
-40°C
25°C
85°C
200
100
RP114x25xx
300
Dropout Voltage VDIF (mV)
Dropout Voltage VDIF (mV)
700
250
200
150
100
-40°C
25°C
85°C
50
0
0
0
50
100
150
200
250
300
Output Current IOUT (mA)
0
50
100
150
200
250
300
Output Current IOUT (mA)
RP114x36xx
Dropout Voltage VDIF (mV)
250
200
150
100
-40°C
25°C
85°C
50
0
0
50
100
150
200
250
300
Output Current IOUT (mA)
15
RP114x
No.EA-236-230719
7) Dropout Voltage vs. Set Output Voltage (C1=1.0µF, C2=1.0µF, Ta=25°C)
Dropout Voltage VDIF (mV)
600
IOUT=30mA
500
IOUT=100mA
400
IOUT=300mA
300
200
100
0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
Set Output Voltage VREG (V)
8) Dropout Voltage vs. Temperature (C1=none, C2=1.0µF)
RP114x08xx
RP114x25xx
300
600
Dropout Voltage VDIF (mV)
Dropout Voltage VDIF (mV)
700
50mA
150mA
300mA
500
400
300
200
100
0
250
50mA
150mA
300mA
200
150
100
50
0
-50
-25
0
25
50
75
Temperature Topt
Ta (°C)
(°C)
100
-50
-25
0
25
50
75
100
Temperature Topt
Ta (°C)
RP114x36xx
Dropout Voltage VDIF (mV)
250
200
50mA
150mA
300mA
150
100
50
0
-50
-25
0
25
50
75
100
Temperature Topt
Ta (°C)
(°C)
16
RP114x
No.EA-236-230719
9) Ripple Rejection vs. Input Voltage (C1=none, C2=1.0µF, Ripple=0.2Vp-p, Ta=25°C)
Ripple Rejection RR (dB)
100
90
IOUT=1mA
80
70
60
50
40
1kHz
30
20
10
RP114x25xx
10kHz
100kHz
IOUT=30mA
100
90
Ripple Rejection RR (dB)
RP114x25xx
80
70
60
50
40
30
20
10
1kHz
10kHz
100kHz
0
0
2.5
3.0
3.5
4.0
4.5
5.0
Input Voltage VIN (V)
2.5
5.5
3.0
3.5
4.0
4.5
5.0
Input Voltage VIN (V)
5.5
10) Ripple Rejection vs. Frequency (C1=none, C2=1.0µF, Ta=25°C)
Ripple Rejection RR (dB)
100
90
80
70
60
50
40
30
20
10
0
VIN=3.0V
1mA
30mA
150mA
0.1
1
10
100
Frequency f (kHz)
RP114x36xx
Ripple Rejection RR (dB)
100
90
80
70
60
50
40
30
20
10
0
RP114x25xx
100
90
80
70
60
50
40
30
20
10
0
Ripple Rejection RR (dB)
RP114x08xx
1000
VIN=3.5V
1mA
30mA
150mA
0.1
1
10
100
Frequency f (kHz)
1000
VIN=4.6V
1mA
30mA
150mA
0.1
1
10
100
1000
Frequency f (kHz)
17
RP114x
No.EA-236-230719
11) Input Transient Response (IOUT=30mA, tr=tf=5µs, Ta=25°C)
RP114x08xx
RP114x25xx
0.815
1.0
0.810
0.805
0.800
0.795
0.790
Output Voltage
4.5
4.0
2.505
2.500
2.495
2.490
Output Voltage
2.485
2.480
0
20
40
60
80
100
3.5
3.0
Input Voltage
3.5V4.5V
0
20
40
Time t (µs)
60
80
Input Voltage VIN (V)
1.5
Input Voltage
1.8V2.8V
5.0
Output Voltage VOUT (V)
2.5
2.0
Input Voltage VIN (V)
Output Voltage VOUT (V)
3.0
100
Time t (µs)
RP114x36xx
5.5
5.0
4.5
4.0
Input Voltage
4.6V5.6V
3.610
3.605
3.600
Output Voltage
3.595
3.590
0
20
40
60
80
Input Voltage VIN (V)
Output Voltage VOUT (V)
6.0
100
Time t (µs)
12) Load Transient Response (C1=1.0µF, C2=1.0µF, tr=tf=0.5µs, Ta=25°C)
Output Voltage
0.78
0.76
0.74
0
100
200
300
Time t (µs)
400
500
VIN=3.5V
200
150
100
50
Output Current
50mA100mA
2.54
2.52
2.50
2.48
0
Output Voltage
2.46
2.44
0
100
200
300
Time t (µs)
400
Output Current IOUT (mA)
200
150
100
50
0
Output Current
50mA100mA
0.84
0.82
0.80
RP114x25xx
Output Voltage VOUT (V)
VIN=1.8V
Output Current IOUT (mA)
Output Voltage VOUT (V)
RP114x08xx
500
18
RP114x
VIN=4.6V
Output Current
50mA100mA
Output Voltage
200
300
Time t (µs)
Output Voltage VOUT (V)
RP114x08xx
500
RP114x25xx
VIN=1.8V
450
300
150
0
Output Current
1mA300mA
1.0
0.9
0.8
Output Voltage
0.7
0.6
0.5
0
100
200
300
Time t (µs)
RP114x36xx
Output Voltage VOUT (V)
400
400
VIN=4.6V
Output Current
1mA300mA
3.8
3.7
3.6
3.5
3.4
3.3
450
300
150
0
Output Voltage
0
100
200
300
Time t (µs)
400
Output Current
1mA300mA
2.7
2.6
2.5
2.4
2.3
2.2
450
300
150
0
Output Voltage
0
500
VIN=3.5V
100
200
300
Time t (µs)
400
500
500
19
Output Current IOUT (mA)
100
Output Voltage VOUT (V)
0
Output Current IOUT (mA)
3.62
3.60
3.58
3.56
3.54
200
150
100
50
0
Output Current IOUT (mA)
Output Voltage VOUT (V)
RP114x36xx
Output Current IOUT (mA)
No.EA-236-230719
RP114x
No.EA-236-230719
13) Turn On Speed with CE pin (C1=1.0µF, C2=1.0µF, Ta=25°C)
RP114x25xx VIN=3.5V
2
CE Input Voltage
1
0
0.8
0.6
Output Voltage
0.4
IOUT=0mA
IOUT=30mA
IOUT=300mA
0.2
0.0
0
40
80
Time t (µs)
120
Output Voltgage VOUT (V)
3
6
4
CE Input Voltage
2
IOUT=0mA
IOUT=30mA
IOUT=300mA
4
3
2
0
Output Voltage
1
CE Input Voltage VCE (V)
VIN=1.8V
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
RP114x08xx
0
0
160
40
80
Time t (µs)
120
160
RP114x36xx
4
CE Input Voltage
2
IOUT=0mA
IOUT=30mA
IOUT=300mA
4
6
0
3
Output Voltage
2
1
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
VIN=4.6V
0
0
40
80
Time t (µs)
120
160
14) Turn Off Speed with CE pin (B version) (C1=1.0µF, C2=1.0µF, Ta=25°C)
3
2
CE Input Voltage
1
0
0.8
IOUT=0mA
0.6
0.4
Output Voltage
0.2
VIN=3.5V
6
4
2
CE Input Voltage
0
4
IOUT=0mA
3
2
Output Voltage
1
CE Input Voltage VCE (V)
RP114x25xB
Output Voltgage VOUT (V)
VIN=1.8V
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
RP114x08xB
0
0.0
0
2
4
6 8 10 12 14 16 18
Time t (ms)
0
2
4
6 8 10 12 14 16 18
Time t (ms)
20
RP114x
No.EA-236-230719
RP114x36xB
6
4
CE Input Voltage
2
0
4
IOUT=0mA
3
2
Output Voltage
1
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
VIN=4.6V
0
0
2
4
6 8 10 12 14 16 18
Time t (ms)
15) Turn Off Speed with CE pin (D version) (C1=1.0µF, C2=1.0µF, Ta=25°C)
2
CE Input Voltage
1
0
0.8
IOUT=0mA
IOUT=30mA
IOUT=300mA
0.6
0.4
0.2
Output Voltage
4
CE Input Voltage
2
0
IOUT=0mA
IOUT=30mA
IOUT=300mA
4
3
2
1
Output Voltage
VIN=4.6V
6
4
CE Input Voltage
IOUT=0mA
IOUT=30mA
Time t (µs)
2
0
IOUT=300mA
2
Output Voltage
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
RP114x36xD
1
6
0 100 200 300 400 500 600 700 800
0 100 200 300 400 500 600 700 800
Time t (µs)
3
VIN=3.5V
0
0.0
4
Output Voltgage VOUT (V)
3
CE Input Voltage VCE (V)
RP114x25xD
VIN=1.8V
CE Input Voltage VCE (V)
Output Voltgage VOUT (V)
RP114x08xD
0
0 100 200 300 400 500 600 700 800
Time t (µs)
21
POWER DISSIPATION
DFN(PL)1010-4
PD-DFN(PL)1010-4-(85125150)-JE-B
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Environment
Board Material
Board Dimensions
Measurement Conditions
Mounting on Board (Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic (Four-Layer Board)
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
φ 0.2 mm × 21 pcs
Copper Ratio
Through-holes
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
Thermal Resistance (θja)
Thermal Characterization Parameter (ψjt)
800 mW
θja = 125°C/W
ψjt = 58°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
1200
1000
Power Dissipation (mW)
1000
800
800
600
400
200
0
0
25
50
75 85 100
125
150
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
i
PACKAGE DIMENSIONS
DFN(PL)1010-4
DM-DFN(PL)1010-4-JE-C
DFN(PL)1010-4 Package Dimensions
i
POWER DISSIPATION
DFN(PL)1010-4B
PD-DFN(PL)1010-4B-(85125150)-JE-B
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Environment
Board Material
Board Dimensions
Measurement Conditions
Mounting on Board (Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic (Four-Layer Board)
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
φ 0.2 mm × 21 pcs
Copper Ratio
Through-holes
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Power Dissipation
Thermal Resistance (θja)
Thermal Characterization Parameter (ψjt)
Measurement Result
800 mW
θja = 125°C/W
ψjt = 58°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
1200
1000
Power Dissipation (mW)
1000
800
800
600
400
200
0
0
25
50
75 85 100
Ambient Temperature (°C)
125
150
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
i
PACKAGE DIMENSIONS
DFN(PL)1010-4B
DM-DFN(PL)1010-4B-JE-B
DFN (PL) 1010-4B Package Dimensions
*
The tab on the bottom of the package is a substrate potential (GND/VDD). It is recommended that this tab be connected
to the ground plane/VDD pin on the board but it is possible to leave the tab floating.
i
PART MARKINGS
RP114K
MK-RP114K-JE-B
: Product Code … Refer to Part Marking List
: Lot Number … Alphanumeric Serial Number
①②
③④
RP114K [DFN(PL)1010-4B], DFN(PL)1010-4 Part Markings
NOTICE
There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In
the case of recognizing the marking characteristic with AOI, please contact our sales or our distributor before
attempting to use AOI.
i
PART MARKINGS
RP114K
MK-RP114K-JE-B
RP114Kxx1B Part Marking List
Product Name
①②
RP114K081B
RP114K091B
RP114K101B
RP114K111B
RP114K121B
RP114K131B
RP114K141B
RP114K151B
RP114K161B
RP114K171B
RP114K181B
RP114K191B
RP114K201B
RP114K211B
RP114K221B
RP114K231B
RP114K241B
RP114K251B
RP114K261B
RP114K271B
RP114K281B
RP114K291B
RP114K301B
RP114K311B
RP114K321B
RP114K331B
RP114K341B
RP114K351B
RP114K361B
RP114K121B5
RP114K181B5
RP114K281B5
RP114K341B5
RP114K101B5
RP114K171B5
RP114K111B5
RP114K131B5
L0
L1
L2
L3
L4
L5
L6
L7
L8
L9
M0
M1
M2
M3
M4
M5
M6
M7
M8
M9
N0
N1
N2
N3
N4
N5
N6
N7
N8
N9
P0
P1
P2
P3
P4
P5
P6
Set Output
Voltage
0.8V
0.9V
1.0V
1.1V
1.2V
1.3V
1.4V
1.5V
1.6V
1.7V
1.8V
1.9V
2.0V
2.1V
2.2V
2.3V
2.4V
2.5V
2.6V
2.7V
2.8V
2.9V
3.0V
3.1V
3.2V
3.3V
3.4V
3.5V
3.6V
1.25V
1.85V
2.85V
3.45V
1.05V
1.75V
1.15V
1.35V
RP114Kxx1D Part Marking List
Product Name
①②
RP114K081D
RP114K091D
RP114K101D
RP114K111D
RP114K121D
RP114K131D
RP114K141D
RP114K151D
RP114K161D
RP114K171D
RP114K181D
RP114K191D
RP114K201D
RP114K211D
RP114K221D
RP114K231D
RP114K241D
RP114K251D
RP114K261D
RP114K271D
RP114K281D
RP114K291D
RP114K301D
RP114K311D
RP114K321D
RP114K331D
RP114K341D
RP114K351D
RP114K361D
RP114K121D5
RP114K181D5
RP114K281D5
RP114K341D5
RP114K101D5
RP114K171D5
RP114K111D5
RP114K131D5
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
R0
R1
R2
R3
R4
R5
R6
R7
R8
R9
S0
S1
S2
S3
S4
S5
S6
S7
S8
S9
T0
T1
T2
T3
T4
T5
T6
Set Output
Voltage
0.8V
0.9V
1.0V
1.1V
1.2V
1.3V
1.4V
1.5V
1.6V
1.7V
1.8V
1.9V
2.0V
2.1V
2.2V
2.3V
2.4V
2.5V
2.6V
2.7V
2.8V
2.9V
3.0V
3.1V
3.2V
3.3V
3.4V
3.5V
3.6V
1.25V
1.85V
2.85V
3.45V
1.05V
1.75V
1.15V
1.35V
ii
POWER DISSIPATION
SC-88A
PD-SC-88A-(85125150)-JE-B
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following conditions are used in this measurement.
Measurement Conditions
Item
Our Evaluation Board
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Double-Sided Board)
Board Dimensions
40 mm × 40 mm × 1.6 mm
Top Side: Approx. 50%
Copper Ratio
Bottom Side: Approx. 50%
Through-holes
φ 0.5 mm × 44 pcs
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Our Evaluation Board
Power Dissipation
380 mW
Thermal Resistance (θja)
θja = 263°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 75°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
600
40
475
400
380
300
40
Power Dissipation (mW)
500
200
100
0
0
25
50
75 85 100
125
Ambient Temperature (°C)
150
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
13,000 hours
Total Years of Use (4 hours/day)
9 years
i
PACKAGE DIMENSIONS
SC-88A
DM-SC-88A-JE-A
SC-88A Package Dimensions
i
PART MARKINGS
RP114Q
MK-RP114Q-JE-A
: Product Code … Refer to Part Marking List
: Lot Number … Alphanumeric Serial Number
5
4
①②③
④⑤⑥
1
2
3
RP114Q (SC-88A) Part Markings
NOTICE
There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In
the case of recognizing the marking characteristic with AOI, please contact our sales or our distributor before
attempting to use AOI.
i
PART MARKINGS
RP114Q
MK-RP114Q-JE-A
RP114Qxx2B Part Marking List
Product Name
RP114Q082B
RP114Q092B
RP114Q102B
RP114Q112B
RP114Q122B
RP114Q132B
RP114Q142B
RP114Q152B
RP114Q162B
RP114Q172B
RP114Q182B
RP114Q192B
RP114Q202B
RP114Q212B
RP114Q222B
RP114Q232B
RP114Q242B
RP114Q252B
RP114Q262B
RP114Q272B
RP114Q282B
RP114Q292B
RP114Q302B
RP114Q312B
RP114Q322B
RP114Q332B
RP114Q342B
RP114Q352B
RP114Q362B
RP114Q122B5
RP114Q182B5
RP114Q282B5
RP114Q342B5
RP114Q102B5
AG08
AG09
AG10
AG11
AG12
AG13
AG14
AG15
AG16
AG17
AG18
AG19
AG20
AG21
AG22
AG23
AG24
AG25
AG26
AG27
AG28
AG29
AG30
AG31
AG32
AG33
AG34
AG35
AG36
AG37
AG38
AG39
AG40
AG41
Set Output
Voltage
0.8 V
0.9 V
1.0 V
1.1 V
1.2 V
1.3 V
1.4 V
1.5 V
1.6 V
1.7 V
1.8 V
1.9 V
2.0 V
2.1 V
2.2 V
2.3 V
2.4 V
2.5 V
2.6 V
2.7 V
2.8 V
2.9 V
3.0 V
3.1 V
3.2 V
3.3 V
3.4 V
3.5 V
3.6 V
1.25 V
1.85 V
2.85 V
3.45 V
1.05 V
RP114Qxx2D Part Marking List
Product Name
RP114Q082D
RP114Q092D
RP114Q102D
RP114Q112D
RP114Q122D
RP114Q132D
RP114Q142D
RP114Q152D
RP114Q162D
RP114Q172D
RP114Q182D
RP114Q192D
RP114Q202D
RP114Q212D
RP114Q222D
RP114Q232D
RP114Q242D
RP114Q252D
RP114Q262D
RP114Q272D
RP114Q282D
RP114Q292D
RP114Q302D
RP114Q312D
RP114Q322D
RP114Q332D
RP114Q342D
RP114Q352D
RP114Q362D
RP114Q122D5
RP114Q182D5
RP114Q282D5
RP114Q342D5
RP114Q102D5
AH08
AH09
AH10
AH11
AH12
AH13
AH14
AH15
AH16
AH17
AH18
AH19
AH20
AH21
AH22
AH23
AH24
AH25
AH26
AH27
AH28
AH29
AH30
AH31
AH32
AH33
AH34
AH35
AH36
AH37
AH38
AH39
AH40
AH41
Set Output
Voltage
0.8 V
0.9 V
1.0 V
1.1 V
1.2 V
1.3 V
1.4 V
1.5 V
1.6 V
1.7 V
1.8 V
1.9 V
2.0 V
2.1 V
2.2 V
2.3 V
2.4 V
2.5 V
2.6 V
2.7 V
2.8 V
2.9 V
3.0 V
3.1 V
3.2 V
3.3 V
3.4 V
3.5 V
3.6 V
1.25 V
1.85 V
2.85 V
3.45 V
1.05 V
ii
POWER DISSIPATION
SOT-23-5
PD-SOT-23-5-(85/125/150)-JE-A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Board Material
Mounting on Board (Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
φ 0.3 mm × 7 pcs
Copper Ratio
Through-holes
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
660 mW
Thermal Resistance (θja)
θja = 150°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 51°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
1000
900
830
Power Dissipation (mW)
800
700
600
660
500
400
300
200
100
0
0
25
50
75 85 100 125
Ambient Temperature (°C)
150
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
13,000 hours
Total Years of Use (4 hours/day)
9 years
i
SOT-23-5
PACKAGE DIMENSIONS
DM-SOT-23-5-JE-B
2.9±0.2
1.1±0.1
1.9±0.2
0.8±0.1
(0.95)
4
1
2
0～0.1
0.2min.
+0.2
1.6-0.1
5
2.8±0.3
(0.95)
3
0.4±0.1
+0.1
0.15-0.05
SOT-23-5 Package Dimensions
i
PART MARKINGS
RP114N
MK-RP114N-JE-A
: Product Code … Refer to Part Marking List
: Lot Number … Alphanumeric Serial Number
5
4
1
2
3
RP114N (SOT-23-5) Part Markings
NOTICE
There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In
the case of recognizing the marking characteristic with AOI, please contact our sales or our distributor before
attempting to use AOI.
i
PART MARKINGS
RP114N
MK-RP114N-JE-A
RP114Nxx1B Part Marking List
Product Name
RP114N081B
RP114N091B
RP114N101B
RP114N111B
RP114N121B
RP114N131B
RP114N141B
RP114N151B
RP114N161B
RP114N171B
RP114N181B
RP114N191B
RP114N201B
RP114N211B
RP114N221B
RP114N231B
RP114N241B
RP114N251B
RP114N261B
RP114N271B
RP114N281B
RP114N291B
RP114N301B
RP114N311B
RP114N321B
RP114N331B
RP114N341B
RP114N351B
RP114N361B
RP114N121B5
RP114N181B5
RP114N281B5
RP114N341B5
RP114N101B5
QAA
QAB
QAC
QAD
QAE
QAF
QAG
QAH
QAJ
QAK
QAL
QAM
QAN
QAP
QAQ
QAR
QAS
QAT
QAU
QAV
QAW
QAX
QAY
QAZ
RAA
RAB
RAC
RAD
RAE
RAF
RAG
RAH
RAJ
RAK
Set Output
Voltage
0.8 V
0.9 V
1.0 V
1.1 V
1.2 V
1.3 V
1.4 V
1.5 V
1.6 V
1.7 V
1.8 V
1.9 V
2.0 V
2.1 V
2.2 V
2.3 V
2.4 V
2.5 V
2.6 V
2.7 V
2.8 V
2.9 V
3.0 V
3.1 V
3.2 V
3.3 V
3.4 V
3.5 V
3.6 V
1.25 V
1.85 V
2.85 V
3.45 V
1.05 V
RP114Nxx1D Part Marking List
Product Name
RP114N081D
RP114N091D
RP114N101D
RP114N111D
RP114N121D
RP114N131D
RP114N141D
RP114N151D
RP114N161D
RP114N171D
RP114N181D
RP114N191D
RP114N201D
RP114N211D
RP114N221D
RP114N231D
RP114N241D
RP114N251D
RP114N261D
RP114N271D
RP114N281D
RP114N291D
RP114N301D
RP114N311D
RP114N321D
RP114N331D
RP114N341D
RP114N351D
RP114N361D
RP114N121D5
RP114N181D5
RP114N281D5
RP114N341D5
RP114N101D5
QBA
QBB
QBC
QBD
QBE
QBF
QBG
QBH
QBJ
QBK
QBL
QBM
QBN
QBP
QBQ
QBR
QBS
QBT
QBU
QBV
QBW
QBX
QBY
QBZ
RBA
RBB
RBC
RBD
RBE
RBF
RBG
RBH
RBJ
RBK
Set Output
Voltage
0.8 V
0.9 V
1.0 V
1.1 V
1.2 V
1.3 V
1.4 V
1.5 V
1.6 V
1.7 V
1.8 V
1.9 V
2.0 V
2.1 V
2.2 V
2.3 V
2.4 V
2.5 V
2.6 V
2.7 V
2.8 V
2.9 V
3.0 V
3.1 V
3.2 V
3.3 V
3.4 V
3.5 V
3.6 V
1.25 V
1.85 V
2.85 V
3.45 V
1.05 V
ii
1.
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11.
12.
13.
The products and the product specifications described in this document are subject to change or discontinuation of production without
notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to our sales representatives for the
latest information thereon.
The materials in this document may not be copied or otherwise reproduced in whole or in part without the prior written consent of us.
This product and any technical information relating thereto are subject to complementary export controls (so-called KNOW controls)
under the Foreign Exchange and Foreign Trade Law, and related politics ministerial ordinance of the law. (Note that the complementary
export controls are inapplicable to any application-specific products, except rockets and pilotless aircraft, that are insusceptible to design
or program changes.) Accordingly, when exporting or carrying abroad this product, follow the Foreign Exchange and Foreign Trade
Control Law and its related regulations with respect to the complementary export controls.
The technical information described in this document shows typical characteristics and example application circuits for the products. The
release of such information is not to be construed as a warranty of or a grant of license under our or any third party's intellectual property
rights or any other rights.
The products listed in this document are intended and designed for use as general electronic components in standard applications (office
equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those
customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application
where the failure or misoperation of the product could result in human injury or death should first contact us.
• Aerospace Equipment
• Equipment Used in the Deep Sea
• Power Generator Control Equipment (nuclear, steam, hydraulic, etc.)
• Life Maintenance Medical Equipment
• Fire Alarms / Intruder Detectors
• Vehicle Control Equipment (automotive, airplane, railroad, ship, etc.)
• Various Safety Devices
• Traffic control system
• Combustion equipment
In case your company desires to use this product for any applications other than general electronic equipment mentioned above, make
sure to contact our company in advance. Note that the important requirements mentioned in this section are not applicable to cases
where operation requirements such as application conditions are confirmed by our company in writing after consultation with your
company.
We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail
with certain probability. In order to prevent any injury to persons or damages to property resulting from such failure, customers should be
careful enough to incorporate safety measures in their design, such as redundancy feature, fire containment feature and fail-safe feature.
We do not assume any liability or responsibility for any loss or damage arising from misuse or inappropriate use of the products.
The products have been designed and tested to function within controlled environmental conditions. Do not use products under conditions
that deviate from methods or applications specified in this datasheet. Failure to employ the products in the proper applications can lead
to deterioration, destruction or failure of the products. We shall not be responsible for any bodily injury, fires or accident, property damage
or any consequential damages resulting from misuse or misapplication of the products.
Quality Warranty
8-1. Quality Warranty Period
In the case of a product purchased through an authorized distributor or directly from us, the warranty period for this product shall be
one (1) year after delivery to your company. For defective products that occurred during this period, we will take the quality warranty
measures described in section 8-2. However, if there is an agreement on the warranty period in the basic transaction agreement,
quality assurance agreement, delivery specifications, etc., it shall be followed.
8-2. Quality Warranty Remedies
When it has been proved defective due to manufacturing factors as a result of defect analysis by us, we will either deliver a substitute
for the defective product or refund the purchase price of the defective product.
Note that such delivery or refund is sole and exclusive remedies to your company for the defective product.
8-3. Remedies after Quality Warranty Period
With respect to any defect of this product found after the quality warranty period, the defect will be analyzed by us. On the basis of
the defect analysis results, the scope and amounts of damage shall be determined by mutual agreement of both parties. Then we
will deal with upper limit in Section 8-2. This provision is not intended to limit any legal rights of your company.
Anti-radiation design is not implemented in the products described in this document.
The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristics in the
evaluation stage.
WLCSP products should be used in light shielded environments. The light exposure can influence functions and characteristics of the
products under operation or storage.
Warning for handling Gallium and Arsenic (GaAs) products (Applying to GaAs MMIC, Photo Reflector). These products use Gallium (Ga)
and Arsenic (As) which are specified as poisonous chemicals by law. For the prevention of a hazard, do not burn, destroy, or process
chemically to make them as gas or power. When the product is disposed of, please follow the related regulation and do not mix this with
general industrial waste or household waste.
Please contact our sales representatives should you have any questions or comments concerning the products or the technical
information.
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https://www.nisshinbo-microdevices.co.jp/en/
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https://www.nisshinbo-microdevices.co.jp/en/buy/
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