YSMC2016S-R47M

SMD Power Inductors -YSMC2016S Series ■ Features ● Molding Inductor. ● Low Profile,Low Temp. ● Large Current. ● Customize For Different Need. ● Operating temperature:-40℃ ~ +125℃. ■ Applications ● General Electronic. ● Video Device,TV,TFT. ● Power Module for PC. ● NB/Lap Top Computer. ● Server,VGA Card/Module. ■ Product Identification ⑴ ：Type ⑵ ：Dimensions ⑶ ：Inductance value ⑷ ：Inductance Tolerance：N=±30%,M=±20%，K=±10% 深圳市益嘉源电子有限公司 http://www.yjycoin.com Tel:0755-27803896 Mob:(86)13682526134 -1- SMD Power Inductors -YSMC2016S Series ■ Shapes and Dimensions (Unit：mm) TYPE A B C Max. D E F Ref. G Ref. H Ref. YSMC2016S 2.0±0.2 1.6±0.2 1.0 0.8 Typ 0.5 Typ 2.1 1.7 0.5 ■ YSMC2016S Series Part Number Inductance DC Resistance Saturation Heat Rating (uH) (mΩ) current(A) current(A) @100KHz Typ. Max. Typ. Max. Typ. Max. YSMC2016S-R24□ 0.24 9 12 7.8 7.0 5.9 5.4 YSMC2016S-R33□ 0.33 16 19 7.6 6.8 5.7 5.2 YSMC2016S-R47□ 0.47 18 21 6.0 5.6 5.4 4.8 YSMC2016S-1R0□ 1.0 35 42 4.5 4.2 4.6 4.2 YSMC2016S-1R5□ 1.5 61 68 3.5 3.0 3.6 3.2 ※ Saturation current：indicates the current when the inductance decrease to approximately 70% of initial value.(at 25℃) ※ The temperature rise current value is the DC current value having temperature increase up to approximately 40℃. (at 25℃) 深圳市益嘉源电子有限公司 http://www.yjycoin.com Tel:0755-27803896 Mob:(86)13682526134 -2- SMD Power Inductors -YSMC2016S Series ■ Reliability Test NO. ITEMS 1 OPERATION TEMPERATURE STORAGE TEMPERATURE 2 TEMPERATURE COEFFICIENT 3 4 5 6 7 FIXING STRENGTH RESISTANCE TO SOLDERING HEAT TEST SOLDERABILITY TEST HUMIDITY TEST THERMAL SHOCK TEST CONDITIONS -40 ~ +125 ℃ （INCLUDING COIL TEMPERATURE RISE） -40 ~ +125 ℃ -30 ~ +105 ℃ 0 ~ 2000ppm/℃ SAMPLE IS PUSHED IN THREE DIRECTIONS O,Y AND Z WITH FORCE OF 5. ON FOR 10±5 SECONDS.AFTER SOLDERING BETWEEN COPPER PLATE AND ELECTRODES. NO ELECTRODE DETACHMENT. REFER TO THE SPEC “STD-001NP” NO MECHANICAL BREAKAGE.DEVIATION RELATIVE TO INITIAL VALUE:L:WITHIN ±5.0% IMMERSE THE ELECTRODE IN FLUX FOR 5 SECONDS.THEN DIP THE ELECTRODE INTO A SOLDERING BATH OF 245±5 ℃ FOR 2±0.5 SECONDS. OVER 95% OF THE SURFACE BEING IMMERSED SHALL BE COVERED WITH NEW SOLDER UNIFORMLY. TEMPERATURE:60℃±2℃ HUMIDITY:90%~95%RH DURATION:96±4 HOURS. DEVIATION RELATIVE TO INITIAL VALUE: L:WITHIN ±5.0% 20 CYCLES OF +105℃ FOR 30 MINUTES,-40℃ FOR 30 MINUTES.CHARACTERISTICS ARE MEASURED AFTER THE AMBIENT AIR EXPOSURE OF 1 HOUR. 8 HIGH TEMPERATURE STORAGE TEST TEMPERATURE:125℃±2℃ DURATION:96±4 HOURS 9 LOW TEMPERATURE STORAGE TEST TEMPERATURE:-40℃±3℃ DURATION:96±4 HOURS. 深圳市益嘉源电子有限公司 http://www.yjycoin.com SPECIFICATION Tel:0755-27803896 DEVIATION RELATIVE TO INITIAL VALUE: L:WITHIN ±5.0% Mob:(86)13682526134 -3- SMD Power Inductors -YSMC2016S Series ■ Reflow profile for SMT components ■ Reflow is referred to standard IPC/JEDEC J-STD-020D Profile Feature Lead(Pb) Free solder Preheat and Soak Temperature Min.(Tsmin) 150℃ Temperature Max.(Tsmax) 200℃ time(Tsmin to Tsmax)(ts) 60-120 Seconds Average ramp up rate Tsmax to Tp 3℃/Second Max. Liquidous temperature(TL) 217℃ Time(TL)maintained above TL 60-150 Seconds Peak package body temperature(Tp) Table2 Time(tp)*within 5℃ of the specified classification 30*seconds Temperature(Tc) Average Ramp-down rate(Tp to TL) 6℃/second max Time 25℃ to peak temperature 8 minutes max. Table2.Pb-Free Process-Classification Temperatures(Tc) Package Thickness Volume mm³ ＜350 Volume mm³ 350~2000 Volume mm³ ＞2000 ＜1.6mm 260℃ 260℃ 260℃ 1.6mm – 2.5mm 260℃ 250℃ 245℃ ＞2.5mm 250℃ 245℃ 245℃ 深圳市益嘉源电子有限公司 http://www.yjycoin.com Tel:0755-27803896 Mob:(86)13682526134 -4- SMD Power Inductors -YSMC2016S Series ■ Taping Dimensions(Unit:mm) TYPE W A B C D E P K Ref T MPQ YSMC2016S 8.0±0.1 2.35±0.05 2.8±0.05 2.75 3.5±0.05 1.35±0.05 4.0±0.1 1.35 0.25±0.05 3000 ■ Reel Dimensions(Unit:mm) TYPE W W1 W2 W3 A B C D YSMC2016S 178±2.0 12.8±1.50 14.4MAX 8.4 Min 13.0±0.50 21.0±0.80 2.0±0.50 100 Min 深圳市益嘉源电子有限公司 http://www.yjycoin.com Tel:0755-27803896 Mob:(86)13682526134 -5- SMD Power Inductors -YSMC2016S Series ■ Direction of rolling ■ Cover tape peel off condition Cover tape peel force shall be 0.1N to 1.3N. Reference peel speed 300±10mm/min. 深圳市益嘉源电子有限公司 http://www.yjycoin.com Tel:0755-27803896 Mob:(86)13682526134 -6-