深圳市长江微电科技有限公司
SZCJIANGTECHNOLOGYCO.,LTD
Specification for Approval
Customer
Product Name
Wire Wound Molded SMD Power Inductors
Customer P/N:
Cjiang P/N:
[
SPM2510 Series
New Released,
Revised]
SPEC No.:
REMARK:
Customer Approval Feedback
●深圳市长江微电科技有限公司
SZ CJIANG TECHNOLOGY CO.,LTD
ADD:11F, International Science and Technology Building, Fuhong Road, Futian District, Shenzhen
Factory ADD:No. shanyang RD CJIANG Industrial Park HUAi'AN Section HUAI'AN City Jiangsu Province
TEL: 0755-82529562 FAX:0755-83977004
http://www.CJING.COM.CN
E-mail: BOND@Cjiang.com.cn;ann@cjiang.com.cn
Version change history
Rev
Date
1.0
2022/8/9
Description
文件制定
APPROVED
CHECKED
DRAWN
Bond
Charles
王云燕
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深圳市长江微电科技有限公司
SZ CJIANG TECHNOLOGY CO.,LTD
Caution :
All products listed in this specification are developed, designed and intended for use in general electronics equipment. The products are not
designed or Warranted to meet the requirements of the applications listed below, whose performance and/or quality require especially high reliability,
or whose failure, malfunction or trouble might directly cause damage to society, person, or property. Please understand that we are not responsible
for any damage or liability caused by use of the products in any of the applications below. Please contact us for more details if you intend to use our
products in the following applications.
1. Aircraft equipment.
2. Aerospace equipment.
3. Undersea equipment.
4. nuclear control equipment.
5. military equipment.
6. Power plant equipment.
7. Medical equipment.
8. Transportation equipment (automobiles, trains, ships,etc.)
9. Traffic signal equipment.
10. Disaster prevention / crime prevention equipment.
11. Data-processing equipment.
12. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above.
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深圳市长江微电科技有限公司
SZCJIANGTECHNOLOGYCO.,LTD
1. Scope
Featurs
1.1
1.2
1.3
1.4
1.5
1.6
Metal material for large current and low loss.
High performance (Isat) realized by metal dust core.
Low loss realized with low Rdc.
Closed magnetic circuit design reduces leakage flux.
Vinyl thermal spray, better surface compactness.
100% lead (Pb) free meet RoHS standard.
2. Application
2.1
2.2
2.3
2.4
2.5
2.6
DC/DC converters.
Pad,Smart phone.
Portable gaming devices, Smart wear, Wi-Fi module.
Notebooks, VR, AR.
LCD displays, HDDs, DVCs, DSCs, etc.
Baseband power supply, Amplifier, Power management, Module power supply, Camera power manageme.
3. Ordering Procedure
SPM
①
2510
②
-
1R0
③
M
④
A
⑤
①Series Name: Mini Molding Power Inductors
②External Dimensions(L×W):2016=2.0*1.6 mm
③Inductance value:1R0=1.0uH
④Tolerance:K=±10%
M=±20%
N=±30%
⑤Special define:A=Routine B~Z=Special
For special characteristics, please refer to the specific values in Item 5 "Specifications".
.
SHAPE AND DIMENSIONS
Outline Dimensions
Recommend Land Pattern Dimensions
Units: mm
Series
L
G(TYP)
W
T
A
B
C
SPM2510
2.5±0.2
0.7
2.0±0.2
1.00Max.
2.60
0.70
2.10
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深圳市长江微电科技有限公司
SZCJIANGTECHNOLOGYCO.,LTD
5. Marking
SPM2510(2.5*2.0*1.0mm)
P/N
@ (0A) 1MHz
Heat rating current
Irms(A)
Rdc(mΩ)
L0(µH)
Saturation current
Isat(A)
Typical
Max
Typical
Max
Typical
Max
SPM2510-R22MA
0.22
12
17
6.8
6.5
8.6
7.9
SPM2510-R24MA
0.24
12
17.5
6.7
6.4
8.5
7.8
SPM2510-R33MA
0.33
13
19
6.5
6.2
7.6
7.2
SPM2510-R47MA
0.47
15
22
6.1
5.6
7.0
6.5
SPM2510-R68MA
0.68
23
27
5.6
5.0
5.9
5.5
SPM2510-1R0MA
1.0
22.5
30
5.4
4.1
5.3
4.8
SPM2510-1R5MA
1.5
45
55
3.4
3.0
4.3
3.9
SPM2510-2R2MA
2.2
60.5
70
2.5
2.1
3.5
3.0
SPM2510-3R3MA
3.3
86
100
2.5
2.1
2.8
2.5
SPM2510-4R7MA
4.7
160
180
2.0
1.6
2.6
2.0
SPM2510-4R7MD
4.7
145
160
2.0
1.6
2.6
2.0
SPM2510-6R8MA
6.8
270
320
1.6
1.4
2.4
1.9
SPM2510-100MA
10.0
500
560
1.05
0.95
1.55
1.4
SPM2510-220MA
22.0
1100
1300
0.85
0.6
1.1
0.9
Test remarks
Note 1.:All test data is referenced to 25 ℃ ambient.
Note 2.:Test Condition:1MHz, 1.0Vrms.
Note 3.:Irms:DC current (A) that will cause an approximate △T of 40 ℃.
Note 4.: Isat:DC current (A) that will cause L0 to drop approximately 30%.
Note 5.: Operating Temperature Range -55℃ to + 125℃.
Note 6.:The part temperature (ambient + temp rise) should not exceed 125 under ℃ the worst case operating conditions. Circuit design,
Note 7.:The rated current as listed is either the saturation current or the heating current depending on which value is lower.
Note 8 :For SPM series inductors,absolute maximum voltage: DC 20V
6 . Structure
component placement, PCB trace size and thickness, airflow and other cooling provision all affect the part temperature. Part
temperature should be verified in the end application.
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深圳市长江微电科技有限公司
SZCJIANGTECHNOLOGYCO.,LTD
SPM2510-R24MA
SPM2510-R22MA
SPM2510-R47MA
SPM2510-R68MA
SPM2510-1R5MA
SPM2510-2R2MA
SPM2510-4R7MA
SPM2510-4R7MD
SPM2510-R33MA
SPM2510-1R0MA
SPM2510-3R3MA
SPM2510-6R8MA
SPM2510-100MA
SPM2510-220MA
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深圳市长江微电科技有限公司
SZCJIANGTECHNOLOGYCO.,LTD
7. Reliability
Item
Requirements
Insulation Resistance
≥100MΩ
Test Methods and Remarks
100 VDC between inductor coil and The
middle of the top surface of the body for 60 seconds.
Dip pads in flux .
Solderability
90% or more of electrode area shall
Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free).
be coated by new solde.
Solder Temperature: 245±5℃.
Immersion Time: (5±1) s.
Dip pads in flux.
Resistance to Soldering
Heat
No visible mechanical damage.
Inductance change: Within ±10.
Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free).
Solder Temperature: 260±5℃.
Immersion Time: 10±1sec.
Adhesion of teral
electrode
High temperature
Strong bond between the pad and
the core, without come off PCB.
No case deformation or change in
appearance.
Inductance change: Within ±10%
Low temperature
No visible mechanical damage.
Inductance change: Within ±10%
Inductors shall be subjected to (260±5)℃ for (20±5)s
Soldering in the base whit 0.3mm solder.
And then aplombelectrode way plus tax 10 N for
(10±1) seconds.
Temperature: 125±2℃.
Time : 1000 hours.
Measurement at 24±4 hours after test conclusion.
Temperature: -40±2℃.
Time : 1000 hours.
Measurement at 24±4 hours after test conclusion.
The test sample shall be placed at (-55±3)℃ and
Thermal shock
Temperature
characteristic
No visible mechanical damage.
Inductance change: Within ±10%
Inductance change Pc-b,Pc-d:
Within ±20%
Static
Humidity
No visible mechanical damage.
Inductance change: Within ±10%
Life
No visible mechanical damage.
Inductance change: Within ±10%
(125±3)℃ for (30±3) , different temperature
conversion time is 2~3 utes.
The temperature cycle shall be repeated 32 cycles.
Placed at room temperature for 2 hours, within 48±4
hours of testing.
a:+20 ℃ (30~45) →
b: -40 ℃ (30~45) →
c: +20 ℃ (30~45) →
d: +125 ℃ (30~45) →
e: +20 ℃ (30~45)
Lb Lc
Ld Lc
Pc-b
100% Pc-d
100%
Lc
Lc
;
Inductors shall be subjected to (95±3)%RH .
at(60±2)℃ for (1000±4) h.
Placed at room temperature for 2 hours, within 48
hours of testing.
Inductors shall be store at (85±2)℃ for (1000±4)
hours with Irms applied.
Placed at room temperature for 2 hours, within 48
hours of testing
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8. Soldering Condition
(This is for recommendation, please customer perform adjustment according to actual application)
Recommend Reflow Soldering Profile:(solder : Sn96.5 / Ag3 / Cu0.5)
Profile Feature
Lead (Pb)-Free solder
Preheat:
Temperature Min (Tsmin)
150℃
Temperature Max (Tsmax)
200℃
Time (Tsmin to Tsmax ) (ts)
60 -120 seconds
Average ramp-up rate:
(Ts max to Tp)
3℃ / second max.
Time maintained above :
Temperature (TL )
217℃
Time (tL)
60-150 seconds
Peak Temperature (Tp)
260℃
Time within
+0
℃ of actual peak Temperature (tp)2
−5
10 seconds
Ramp-down Rate
6℃/second max.
Time 25℃ to Peak Temperature
8minutes max.
Allowed Re-flow times : 2 times
Remark : To avoid discoloration phenomena of chip on terminal electrodes, please use N2 Re-flow furnace .
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9. Packing
9.1 Dimension of plastic taping: (Unit: mm)
Series
W
±0.30
A0
±0.05
B0
+0.1/-0
D
+0.1/-0
D1
Min
E
±0.10
F
±0.10
K0
±0.05
P0
±0.10
P2
±0.10
P
±0.10
T
±0.05
Qty/Reel
2510
8.0
2.40
2.80
1.50
1.0
1.75
3.50
1.20
4.00
2.00
4.00
0.23
3K
9.2 Dimension of Reel:(Unit: mm)
Type
A
0.5
B
0.5
C
0.5
D
1
All
178
60
12
1.5
10. Note
10.1 recommend products store in warehouse with temperature between 15 to 35℃ under humidity between 25 to 75%RH.
Even under storage conditions recommended above, solder ability of products will be degraded stored over 1 year old.
10.2 Cartons must be placed in correct direction which indicated on carton, .otherwise the reel or wire will be deformed
10.3 Storage conditions as below are inappropriate:
a. Stored in high electrostatic environment
b. Stored in direct sunshine, rain, snow or condensation.
c. Exposed to sea wind or corrosive gases, such as Cl2, H2S, NH3, SO2, NO2, etc.
10.4 The products are used in circuit board thickness greater than 1.6mm. If customers use less than the thickness of the circuit board that you
should confirm with the company, in order to recommend a more suitable product.
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深圳市长江微电科技有限公司
SZCJIANGTECHNOLOGYCO.,LTD
11. Record
Version
Description
Page
Date
Amended by
Checked by
A0
First version
1~23
Nov.21.2022
Xi Rui.Niu
Dirk.Wang
1~23
Dec.14.2022
Xi Rui.Niu
Dirk.Wang
A1
newly increased: SPM2510-6R8MA
SPM2510-220MA
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