XBLCD4013
Dual D-Type Flip Flop
General Description
The CD4013 is a dual D-type flip-flop that features independent set-direct input (SD), clear-direct input (CD),
clock input (CP) and outputs (Q, �). Data is accepted when CP is LOW and is transferred to the output on the positive
-going edge of the clock. The active HIGH asynchronous CD and SD inputs are independent and override the D or CP
inputs. The outputs are buffered for best system performance. The clock input’s Schmitt-trigger action makes the
circuit highly tolerant of slower clock rise and fall times. It operates over a recommended VDD power supply range of
3V to 15V referenced to VSS (usually ground). Unused inputs must be connected to VDD, VSS, or another input.
Features
Wide supply voltage range from 3V to 15V
Fully static operation
5V, 10V, and 15V parametric ratings
Standardized symmetrical output characteristics
Tolerant of slow clock rise and fall times
Specified from -40℃ to +85℃
Packaging information: DIP14/SOP14/TSSOP14
ORDERING INFORMATION
DEVICE
Package Type
MARKING
Packing
Packing QTY
CD4013BE
CD4013BDTR
CD4013BTDTR
DIP-14
SOP-14
TSSOP-14
CD4013BE
CD4013B
CD4013B
Tube
Tape
Tape
1000/Box
2500/Reel
3000/Reel
XBLW version 1.0
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第 1 页 共 13 页
XBLCD4013
Dual D-Type Flip Flop
Block Diagram And Pin Description
Block Diagram
Figure 1. Functional diagram
Figure 2. Logic diagram(one flip-flop)
Pin Configurations
XBLW version 1.0
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第 2 页 共 13 页
XBLCD4013
Dual D-Type Flip Flop
Pin Description
Pin No.
Pin Name
Description
1
2
3
4
5
6
7
8
9
10
11
12
13
14
1Q
1�
1CP
1CD
1D
1SD
VSS
2SD
2D
2CD
2CP
2�
2Q
VDD
true output
complement output
clock input (LOW to HIGH edge-triggered)
asynchronous clear-direct input (active HIGH)
data input
asynchronous set-direct input(active HIGH)
ground (0V)
asynchronous set-direct input(active HIGH)
data input
asynchronous clear-direct input (active HIGH)
clock input (LOW to HIGH edge-triggered)
complement output
true output
supply voltage
Function Table
Input
Output
nSD
nCD
nCP
nD
nQ
H
L
X
X
H
L
H
X
X
L
H
H
X
X
H
L
L
↑
L
L
L
L
↑
H
H
Note: H=HIGH voltage level; L=LOW voltage level; X=don’t care; ↑=LOW-to-HIGH clock transition.
nQ
L
H
H
H
L
Electrical Parameter
Absolute Maximum Ratings (Voltages are referenced to VSS (ground=0V), unless otherwise specified.)
Parameter
Symbol
Conditions
Min.
Max.
Unit
supply voltage
DC input current
input voltage
storage temperature
total power
dissipation
device dissipation
VDD
IIK
VI
Tstg
any one input
all inputs
-
-0.5
-0.5
-65
+18
±10
VDD +0.5
+150
V
mA
V
℃
Ptot
-
-
500
mW
-
100
mW
℃
℃
Soldering
temperature
XBLW version 1.0
P
TL
per output transistor
DIP
10s
SOP
245
250
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第 3 页 共 13 页
XBLCD4013
Dual D-Type Flip Flop
Note:
[1] For DIP14 packages: above 70℃ the value of Ptot derates linearly with 12mW/K.
[2] For SOP14 packages: above 70℃ the value of Ptot derates linearly with 8mW/K.
[3] For (T)SSOP14 packages: above 60℃ the value of Ptot derates linearly with 5.5mW/K.
Recommended Operating Conditions
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
supply voltage
ambient
temperature
VDD
-
3
-
15
V
Tamb
in free air
-40
-
+85
℃
VDD=5V
VDD=10V
VDD=15V
VDD=5V
VDD=10V
VDD=15V
VDD=5V
VDD=10V
VDD=15V
VDD=5V
VDD=10V
VDD=15V
VDD=5V
VDD=10V
VDD=15V
40
20
15
140
60
40
3.5
8
12
-
-
-
ns
ns
ns
ns
ns
ns
MHz
MHz
MHz
uS
us
uS
ns
set-up time
tSU
clock pulse width
twCL
7
fCL
16
24
15
clock rise and fall time
trCL, tfCL
10
5
180
Set or reset pulse width
twS/R
80
ns
50
ns
Note: If more than one unit is cascaded in a parallel clocked operation, trCL must be made less than or equal to the
clock input
frequency
sum of the fixed propagation delay time at 15pF and the transistion time of the output driving stage for the estimated
capacitive load.
XBLW version 1.0
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第 4 页 共 13 页
XBLCD4013
Dual D-Type Flip Flop
Electrical Characteristics
DC Characteristics 1 (Tamb=25℃, voltages are referenced to VSS (ground=0V), unless otherwise specified.)
Parameter
supply current
LOW-level
output current
HIGH-level
output current
LOW-level
output voltage
HIGH-level
output voltage
LOW-level
input voltage
Symbol
IDD
IOL
IOH
VOL
VOH
VIL
HIGH-level
input voltage
VIH
input leakage
current
II
XBLW version 1.0
VO
Conditions(V)
VIN
VDD
Min.
Tamb=25℃
Typ.
Max.
Unit
-
0, 5
5
-
0.02
1
μA
-
0, 10
10
-
0.02
2
μA
-
0, 15
15
-
0.02
4
μA
0.4
0, 5
5
0.51
1
-
mA
0.5
0, 10
10
1.3
2.6
-
mA
1.5
0, 15
15
3.4
6.8
-
mA
4.6
0, 5
5
-0.51
-1
-
mA
2.5
0, 5
5
-1.6
-3.2
-
mA
9.5
0, 10
10
-1.3
-2.6
-
mA
13.5
0, 15
15
-3.4
-6.8
-
mA
-
0, 5
5
-
0
0.05
V
-
0, 10
10
-
0
0.05
V
-
0, 15
15
-
0
0.05
V
-
0, 5
5
4.95
5
-
V
-
0, 10
10
9.95
10
-
V
-
0, 15
15
14.95
15
-
V
0.5, 4.5
-
5
-
-
1.5
V
1, 9
-
10
-
-
3
V
1.5, 13.5
-
15
-
-
4
V
0.5, 4.5
-
5
3.5
-
-
V
1, 9
-
10
7
-
-
V
1.5, 13.5
-
15
11
-
-
V
-
0, 15
15
-
±10-5
±0.1
μA
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第 5 页 共 13 页
XBLCD4013
Dual D-Type Flip Flop
DC Characteristics 2
(Tamb=-40℃ to +85℃, voltages are referenced to VSS (ground=0V), unless otherwise specified.)
Parameter
supply
current
Symbol
IDD
LOW-level
output
current
IOL
HIGH-level
output
current
IOH
LOW-level
output
voltage
VOL
HIGH-level
output
voltage
VOH
LOW-level
input voltage
VIL
HIGH-level
input voltage
VIH
input leakage
current
II
XBLW version 1.0
Conditions(V)
VO
VIN VDD
Tamb=-40℃
Min.
Max.
Tamb=+85℃
Min. Max.
Unit
-
0, 5
5
-
1
-
30
μA
-
0, 10
10
-
2
-
60
μA
-
0, 15
15
-
4
-
120
μA
0.4
0.5
1.5
4.6
2.5
9.5
13.5
0.5, 4.5
1, 9
1.5, 13.5
0.5, 4.5
1, 9
1.5, 13.5
0, 5
0, 10
0, 15
0, 5
0, 5
0, 10
0, 15
0, 5
0, 10
0, 15
0, 5
0, 10
0, 15
-
5
10
15
5
5
10
15
5
10
15
5
10
15
5
10
15
5
10
15
0.61
1.5
4
-0.61
-1.8
-1.5
-4
4.95
9.95
14.95
3.5
7
11
0.05
0.05
0.05
1.5
3
4
-
0.42
1.1
2.8
-0.42
-1.3
-1.1
-2.8
4.95
9.95
14.95
3.5
7
11
0.05
0.05
0.05
1.5
3
4
-
mA
mA
mA
mA
mA
mA
mA
V
V
V
V
V
V
V
V
V
V
V
V
-
0, 15
15
-
±0.1
-
±1
μA
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第 6 页 共 13 页
XBLCD4013
Dual D-Type Flip Flop
AC Characteristics (Tamb=25℃, VSS=0V, tr, tf=20ns, CL=50pF, RL=20KΩ, unless otherwise specified.)
Parameter
HIGH to LOW
propagation
delay
Symbol
Conditions
nCP to nQ,n�;
see Figure 4
tPHL
nSD to n�
or nCD to nQ
nCP to nQ,n�;
see Figure 4
LOW to HIGH
propagation
delay
tPLH
transition time
tt
see Figure 4
maximum
clock
frequency
fclk(max)
see Figure 4
nSD to nQ
or nCD to n�
nCP input LOW;
see Figure 4
pulse width
tW
set-up time
tSU
nD to nCP;
see Figure 4
hold time
th
nD to nCP;
see Figure 4
clock input rise
or fall time
trCL,tfCL
-
input
CI
capacitance
Note: tt is the same as tTLH and tTHL.
XBLW version 1.0
nSD input HIGH
or nCD input HIGH;
see Figure 5
VDD=5V
VDD=10V
VDD=15V
VDD=5V
VDD=10V
VDD=15V
VDD=5V
VDD=10V
VDD=15V
VDD=5V
VDD=10V
VDD=15V
VDD=5V
VDD=10V
VDD=15V
VDD=5V
VDD=10V
VDD=15V
VDD=5V
VDD=10V
VDD=15V
VDD=5V
VDD=10V
VDD=15V
VDD=5V
VDD=10V
VDD=15V
VDD=5V
VDD=10V
VDD=15V
VDD=5V
VDD=10V
VDD=15V
any input
Min.
Typ.
Max.
Unit
3.5
8
12
-
150
65
45
200
85
60
150
65
45
150
65
45
100
50
40
7
16
24
70
30
20
90
40
25
20
10
7
2
2
2
-
300
130
90
400
170
120
300
130
90
300
130
90
200
100
80
140
60
40
180
80
50
40
20
15
5
5
5
15
10
5
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
MHz
MHz
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
us
us
us
-
5
7.5
pF
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第 7 页 共 13 页
XBLCD4013
Dual D-Type Flip Flop
Testing Circuit
AC Testing Circuit
Figure 3. Test circuit for switching times
Definitions for test circuit:
DUT=Device Under Test
CL=Load capacitance including jig and probe capacitance.
RT=Termination resistance should be equal to the output impedance Zo of the pulse generator.
AC Testing Waveforms
Figure 4. Set-up time, hold time, minimum clock pulse width, propagation delays and transition times
XBLW version 1.0
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第 8 页 共 13 页
XBLCD4013
Dual D-Type Flip Flop
Figure 5. nSD, nCD pulse width
Measurement Points
Supply voltage
VDD
5V to 15V
Input
VM
0.5×VDD
Output
VX
0.1×VDD
VM
0.5×VDD
VY
0.9×VDD
Test Data
Supply voltage
VDD
VI
tr, tf
Load
CL
5V to 15V
VSS or VDD
≤20ns
50pF
XBLW version 1.0
Input
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第 9 页 共 13 页
XBLCD4013
Dual D-Type Flip Flop
Package Information
DIP14
Symbol
A
A1
A2
B
B1
C
D
E
E1
e
L
E2
XBLW version 1.0
Dimensions In Millimeters
Min
Max
3.710
4.310
0.510
3.200
3.600
0.380
0.570
1.524(BSC)
0.204
0.360
18.800
19.200
6.200
6.600
7.320
7.920
2.540(BSC)
3.000
3.600
8.400
9.000
Dimensions In Inches
Min
Max
0.146
0.170
0.020
0.126
0.142
0.015
0.022
0.060(BSC)
0.008
0.014
0.740
0.756
0.244
0.260
0.288
0.312
0.100(BSC)
0.118
0.142
0.331
0.354
文档仅供参考,实际应用测试为准
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第 10 页 共 13 页
XBLCD4013
Dual D-Type Flip Flop
SOP14
XBLW version 1.0
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第 11 页 共 13 页
XBLCD4013
Dual D-Type Flip Flop
TSSOP14
SYMBOL
A
A1
A2
A3
b
b1
c
c1
D
E1
E
e
L
L1
θ
XBLW version 1.0
文档仅供参考,实际应用测试为准
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MILLIMETER
MIN
MAX
1.20
0.05
0.15
0.90
1.05
0.39
0.49
0.20
0.30
0.19
0.25
0.13
0.19
0.12
0.14
4.86
5.06
4.30
4.50
6.20
6.60
0.65BSC
0.45
0.75
1.00BSC
0°
8°
第 12 页 共 13 页
XBLCD4013
Dual D-Type Flip Flop
Statements And Notes
Part name
Lead and
lead
compounds
Lead frame
○
Plastic resin
○
○
○
○
○
○
Chip
○
○
○
○
○
The lead
Plastic sheet
installed
○
○
○
○
○
○
○
○
explanation
Cadmium
and
cadmium
compounds
○
Hazardous substances or Elements
Polybro
Hexavalent
Polybro
minated
Dibutyl
chromium
minated
biphenyl
phthalate
compounds biphenyls
ethers
○
○
○
○
Mercury
and
mercury
compounds
○
Butyl
benzyl
phthalate
Di-2ethylhexyl
phthalate
Diisobutyl
phthalate
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○: Indicates that the content of hazardous substances or elements in the detection limit of the following the SJ/T11363-2006 standard.
×: Indicates that the content of hazardous substances or elements exceeding the SJ/T11363-2006 Standard limit requirements
Statement:
Shenzhen xinbole electronics co., ltd. reserves the right to change the product specifications, without notice!
Before placing an order, the customer needs to confirm whether the information obtained is the latest version,
and verify the integrity of the relevant information.
Any semiconductor product is liable to fail or malfunction under certain conditions, and the buyer shall be
responsible for complying with safety standards in the system design and whole machine manufacturing using
Shenzhen xinbole electronics co., ltd products, and take appropriate security measures to avoid the potential risk
of failure may result in personal injury or property losses of the situation occurred!
Product performance is never ending, Shenzhen xinbole electronics co., ltd will be dedicated to provide
customers with better performance, better quality of integrated circuit products.
XBLW version 1.0
文档仅供参考,实际应用测试为准
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第 13 页 共 13 页