RP130x Series
Low Noise 150 mA LDO Regulator
No. EA-173-230725
OUTLINE
The RP130x is a voltage regulator IC with high ripple rejection, low dropout voltage, high output voltage
accuracy and extremely low supply current. The IC consists of a voltage reference unit, an error amplifier, a
resistor-net for voltage setting, a short current limit circuit and a chip enable circuit.
This IC has an excellent low supply current performed by CMOS process, moreover they perform with low
dropout voltage due to built-in low on-resistance. A chip enable function prolongs the battery life.
The input transient response, the load transient response and the ripple rejection have been improved in the
RP130x compared with the conventional products. Besides achieving low supply current (Typ.38 μA).
The range of the operation voltage is capable from 1.7 V to 6.5 V and the range of the output voltage is capable
from 1.2 V to 5.3 V for this product, which is wider range as our conventional product R1114x.
The output voltage of this IC is fixed with high accuracy. Since the packages for this IC are DFN(PL)1010-4,
SOT-23-5 and SC-82AB, therefore high density mounting of the IC on board is possible.
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
Supply Current ........................................................... Typ. 38 µA
Standby Current ........................................................... Typ. 0.1 µA
Ripple Rejection ........................................................... Typ. 80 dB (f = 1 kHz)
Input Voltage Range (Maximum Rating) ...................... 1.7 V to 6.5 V (7.0 V)
Output Voltage Range .................................................. 1.2 V to 5.3 V (0.1 V step(1))
Output Voltage Accuracy.............................................. ±1.0% (VOUT > 2.0 V, Ta = 25°C)
Temperature-Drift Coefficient of Output Voltage .......... Typ. ±20 ppm/°C
Dropout Voltage ........................................................... Typ. 0.32 V (IOUT = 150 mA, VOUT = 2.8 V)
Line Regulation ............................................................ Typ. 0.02%/V
Packages ..................................................................... DFN(PL)1010-4, SC-82AB, SOT-23-5
Built-in Fold Back Protection Circuit ............................ Typ. 40 mA
Ceramic capacitors are recommended to be used with this IC ..... 0.47 µF or more
APPLICATIONS
•
•
•
•
(1)
Power source for battery-powered equipment.
Power source for portable communication equipment.
Power source for electrical appliances such as cameras, VCRs and camcorders.
Power source for high stable reference voltage.
For other voltages, please refer to SELECTION GUIDE.
1
RP130x
No. EA-173-230725
SELECTION GUIDE
The set output voltage, chip enable polarity, auto-discharge function(1), and packages for the IC can be selected
at the user’s request.
Selection Guide
Product Name
Package
Quantity per Reel
Pb Free
Halogen Free
DFN(PL)1010-4
10,000 pcs
Yes
Yes
RP130Qxx1∗-TR-FE
SC-82AB
3,000 pcs
Yes
Yes
RP130Nxx1∗-TR-FE
SOT-23-5
3,000 pcs
Yes
Yes
RP130Kxx1∗-TR
xx : Set Output Voltage (VSET)
Fixed Type: 12 to 53 Stepwise setting with 0.1 V increment in the range from 1.2 V to 5.3 V
Exception: 1.25 V = RP130x121∗5
1.85 V = RP130x181∗5
2.85 V = RP130x281∗5
3.45 V = RP130x341∗5
4.25 V = RP130x421∗5
∗ : CE pin polarity and auto-discharge function at off state are options as follows.
A: active low, without auto-discharge function at off state.
B: active high, without auto-discharge function at off state.
D: active high, with auto-discharge function at off state.
(1) Auto-discharge function quickly lowers the output voltage to 0 V by releasing the electrical charge in the external
capacitor when the chip enable signal is switched from the active mode to the standby mode.
2
RP130x
No. EA-173-230725
BLOCK DIAGRAMS
VDD
VOUT
VDD
VOUT
Vref
Vref
Current Limit
Current Limit
CE
GND
GND
RP130xxx1B Block Diagram
RP130xxx1A Block Diagram
VDD
CE
VOUT
Vref
Current Limit
CE
GND
RP130xxx1D Block Diagram
3
RP130x
No. EA-173-230725
PIN DESCRIPTIONS
Top View
4
3
Bottom View
3
4
4
(1)
1
2
2
3
5
(mark side)
1
DFN(PL)1010-4 Pin Configuration
1
1
(mark side)
2
1
SC-82AB Pin Configuration
DFN(PL)1010-4 Pin Description
Pin No
Symbol
4
2
3
SOT-23-5 Pin Configuration
Pin Description
1
VOUT
Output Pin
2
GND
Ground Pin
3
CE / CE
4
VDD
Chip Enable Pin ("L" Active / "H" Active)
Input Pin
SC-82AB Pin Description
Pin No
Symbol
Pin Description
1
CE / CE
Chip Enable Pin ("L" Active / "H" Active)
2
GND
Ground Pin
3
VOUT
Output Pin
4
VDD
Input Pin
SOT-23-5 Pin Description
Pin No
Symbol
Pin Description
1
VDD
Input Pin
2
GND
Ground Pin
3
CE / CE
4
NC
5
VOUT
Chip Enable Pin ("L" Active / "H" Active)
No Connection
Output Pin
(1) Tab
is GND level (they are connected to the reverse side of this IC). The tab is better to be connected to the GND, but
leaving it open is also acceptable.
4
RP130x
No. EA-173-230725
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings
Symbol
Item
Rating
Unit
7.0
V
−0.3 to 7.0
V
VIN
Input Voltage
VCE
Input Voltage (CE Pin)
VOUT
Output Voltage
−0.3 to VIN + 0.3
V
IOUT
Output Current
200
mA
DFN(PL)1010-4
PD
Power
Dissipation(1)
SC-82AB
SOT-23-5
JEDEC STD. 51-7
Test Land Pattern
Standard
Test Land Pattern
JEDEC STD. 51-7
Test Land Pattern
800
380
mW
660
Tj
Junction Temperature Range
−40 to 125
°C
Tstg
Storage Temperature Range
−55 to 125
°C
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent
damages and may degrade the lifetime and safety for both device and system using the device in the field. The
functional operation at or over these absolute maximum ratings are not assured.
RECOMMENDED OPERATING CONDITIONS
Recommended Operating Conditions
Symbol
Item
Rating
Unit
VIN
Input Voltage
1.7 to 6.5
V
Ta
Operating Temperature Range
−40 to 85
°C
RECOMMENDED OPERATING CONDITIONS
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the
semiconductor devices may receive serious damage when they continue to operate over the recommended operating
conditions.
(1)
Refer to POWER DISSIPATION for detailed information.
5
RP130x
No. EA-173-230725
ELECTRICAL CHARACTERISTICS
VIN = VSET + 1 V (VOUT > 1.5 V), VIN = 2.5 V (VOUT ≤ 1.5 V), IOUT = 1 mA, CIN = COUT = 0.47 µF,
unless otherwise noted.
The specifications surrounded by
are guaranteed by design engineering at −40ºC ≤ Ta ≤ 85°C.
RP130xxx1A Electrical Characteristics
Symbol
Item
(Ta = 25°C)
Conditions
Ta = 25°C
VOUT
Output Voltage
−40°C ≤ Ta ≤ 85°C
ILIM
∆VOUT
/∆IOUT
VDIF
Dropout Voltage
ISS
Supply Current
Supply Current
Istandby
(Standby)
∆VOUT
Line Regulation
/∆VIN
RR
Ripple Rejection
VIN
Input Voltage
∆VOUT
/∆Ta
ISC
Max.
Unit
x 0.99
x 1.01
V
VSET ≤ 2.0 V
−20
20
mV
VSET > 2.0 V
x0.985
x1.015
V
VSET ≤ 2.0 V
−30
30
mV
150
1 mA ≤ IOUT ≤ 150 mA
mA
10
30
1.2 V ≤ VSET < 1.5 V
0.67
1.00
1.5 V ≤ VSET < 1.7 V
0.54
0.81
1.7 V ≤ VSET < 2.0 V
0.46
0.68
2.0 V ≤ VSET < 2.5 V
0.41
0.60
2.5 V ≤ VSET < 4.0 V
0.32
0.51
4.0 V ≤ VSET
0.24
0.37
IOUT = 0 mA
38
58
µA
VCE = VIN
0.1
1.0
µA
VSET + 0.5 V ≤ VIN ≤ 6.5 V
0.02
0.10
%/V
IOUT = 150 mA
f = 1 kHz, Ripple 0.2 Vp-p
VIN = VSET + 1 V
IOUT = 30 mA (In case that VOUT ≤
2.0 V, VIN = 3.0 V)
80
1.7
mV
V
dB
6.5
V
Output Voltage
Temperature Coefficient
−40°C ≤ Ta ≤ 85°C
±20
ppm
/°C
Short Current Limit
VOUT = 0 V
40
mA
VCEH
CE Input Voltage "H"
VCEL
CE Input Voltage "L"
en
Typ.
VSET > 2.0 V
Output Current Limit
Load Regulation
Min.
Output Noise
1.0
µA
0.4
BW = 10 Hz to 100 kHz
IOUT = 30 mA
20
xVSET
µVrms
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C) except for
Output Noise, Ripple Rejection, and Output Voltage Temperature Coefficient.
6
RP130x
No. EA-173-230725
ELECTRICAL CHARACTERISTICS (continued)
VIN = VSET + 1 V (VOUT > 1.5 V), VIN = 2.5 V (VOUT ≤ 1.5 V), IOUT = 1 mA, CIN = COUT = 0.47 µF,
unless otherwise noted.
The specifications surrounded by
are guaranteed by design engineering at −40ºC ≤ Ta ≤ 85°C.
RP130xxx1B/D Electrical Characteristics
Symbol
Item
(Ta = 25°C)
Conditions
Ta = 25°C
VOUT
Output Voltage
−40°C ≤ Ta ≤ 85°C
ILIM
∆VOUT
/∆IOUT
VDIF
ISS
Dropout Voltage
Supply Current
Istandby Standby Current
V
VSET ≤ 2.0 V
−20
20
mV
VSET > 2.0 V
x 0.985
x 1.015
V
VSET ≤ 2.0 V
−30
30
mV
150
1 mA ≤ IOUT ≤ 150 mA
mA
10
30
1.2 V ≤ VSET < 1.5 V
0.67
1.00
1.5 V ≤ VSET < 1.7 V
0.54
0.81
1.7 V ≤ VSET < 2.0 V
0.46
0.68
2.0 V ≤ VSET < 2.5 V
0.41
0.60
2.5 V ≤ VSET < 4.0 V
0.32
0.51
4.0 V ≤ VSET
0.24
0.37
IOUT = 0 mA
38
58
µA
VCE = 0 V
0.1
1.0
µA
0.02
0.10
%/V
IOUT = 150 mA
VSET + 0.5 V ≤ VIN ≤ 6.5 V
RR
Ripple Rejection
f = 1 kHz, Ripple 0.2 Vp-p
VIN = VSET + 1 V, IOUT = 30 mA (In
case that VOUT ≤ 2.0 V, VIN = 3.0 V)
VIN
Input Voltage
80
1.7
mV
dB
6.5
V
Output Voltage
Temperature Coefficient
−40°C ≤ Ta ≤ 85°C
±20
ppm
/°C
Short Current Limit
VOUT = 0 V
40
mA
0.4
µA
IPD
CE Pull-down Current
VCEH
CE Input Voltage "H"
VCEL
CE Input Voltage "L"
RLOW
Unit
x 1.01
Line Regulation
en
Max.
x 0.99
∆VOUT
/∆VIN
∆VOUT
/∆Ta
ISC
Typ.
VSET > 2.0 V
Output Current Limit
Load Regulation
Min.
Output Noise
Nch ON Resistance
for Auto Discharge
(RP130xxx1D)
1.0
µA
0.4
BW = 10 Hz to 100 kHz
IOUT = 30 mA
VIN = 4.0 V
VCE = 0 V
20
xVSET
µVrms
30
Ω
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj≈Ta=25ºC) except for
Output Noise, Ripple Rejection, and Output Voltage Temperature Coefficient.
7
RP130x
No. EA-173-230725
The specifications surrounded by
are guaranteed by design engineering at −40ºC ≤ Ta ≤ 85°C.
Product-specific Electrical Characteristics
VOUT [V]
(Ta = 25°C)
Product Name
Min.
Typ.
RP130x121x
1.180
1.2
RP130x121x5
1.230
1.25
RP130x131x
1.280
1.3
RP130x141x
1.380
1.4
RP130x151x
1.480
1.5
RP130x161x
1.580
1.6
RP130x171x
1.680
1.7
RP130x181x
1.780
1.8
RP130x181x5
1.830
1.85
RP130x191x
1.880
1.9
RP130x201x
1.980
2.0
RP130x211x
2.079
2.1
RP130x221x
2.178
2.2
RP130x231x
2.277
2.3
RP130x241x
2.376
2.4
RP130x251x
2.475
2.5
RP130x261x
2.574
2.6
RP130x271x
2.673
2.7
RP130x281x
2.772
2.8
RP130x281x5
2.822
2.85
RP130x291x
2.871
2.9
RP130x301x
2.970
3.0
RP130x311x
3.069
3.1
RP130x321x
3.168
3.2
RP130x331x
3.267
3.3
RP130x341x
3.366
3.4
RP130x341x5
3.416
3.45
RP130x351x
3.465
3.5
RP130x361x
3.564
3.6
RP130x371x
3.663
3.7
RP130x381x
3.762
3.8
RP130x391x
3.861
3.9
RP130x401x
3.960
4.0
RP130x411x
4.059
4.1
RP130x421x
4.158
4.2
RP130x421x5
4.208
4.25
RP130x431x
4.257
4.3
RP130x441x
4.356
4.4
RP130x451x
4.455
4.5
RP130x461x
4.554
4.6
RP130x471x
4.653
4.7
RP130x481x
4.752
4.8
RP130x491x
4.851
4.9
RP130x501x
4.950
5.0
RP130x511x
5.049
5.1
RP130x521x
5.148
5.2
RP130x531x
5.247
5.3
Max.
1.220
1.270
1.320
1.420
1.520
1.620
1.720
1.820
1.870
1.920
2.020
2.121
2.222
2.323
2.424
2.525
2.626
2.727
2.828
2.879
2.929
3.030
3.131
3.232
3.333
3.434
3.485
3.535
3.636
3.737
3.838
3.939
4.040
4.141
4.242
4.293
4.343
4.444
4.545
4.646
4.747
4.848
4.949
5.050
5.151
5.252
5.353
VOUT [V]
(Ta = −40°C to 85°C)
Min.
Typ.
Max.
1.170
1.230
1.2
1.220
1.280
1.25
1.270
1.330
1.3
1.370
1.430
1.4
1.470
1.530
1.5
1.570
1.630
1.6
1.670
1.730
1.7
1.770
1.830
1.8
1.820
1.880
1.85
1.870
1.930
1.9
1.970
2.030
2.0
2.069
2.132
2.1
2.167
2.233
2.2
2.266
2.335
2.3
2.364
2.436
2.4
2.463
2.538
2.5
2.561
2.639
2.6
2.660
2.741
2.7
2.758
2.842
2.8
2.807
2.893
2.85
2.857
2.944
2.9
2.955
3.045
3.0
3.054
3.147
3.1
3.152
3.248
3.2
3.251
3.350
3.3
3.349
3.451
3.4
3.398
3.502
3.45
3.448
3.553
3.5
3.546
3.654
3.6
3.645
3.756
3.7
3.743
3.857
3.8
3.842
3.959
3.9
3.940
4.060
4.0
4.039
4.162
4.1
4.137
4.263
4.2
4.186
4.314
4.25
4.236
4.365
4.3
4.334
4.466
4.4
4.433
4.568
4.5
4.531
4.669
4.6
4.630
4.771
4.7
4.728
4.872
4.8
4.827
4.974
4.9
4.925
5.075
5.0
5.024
5.177
5.1
5.122
5.278
5.2
5.221
5.380
5.3
(Ta = 25°C)
VDIF [V]
Typ.
Max.
0.67
1.00
0.54
0.81
0.46
0.68
0.41
0.60
0.32
0.51
0.24
0.37
8
RP130x
No. EA-173-230725
APPLICATION INFORMATION
TYPICAL APPLICATION
VDD
VOUT
RP130x
C1
CE Control
CE
VOUT
C2
GND
RP130x Typical Application
External Components
Symbol
C1, C2
Descriptions
0.47 µF, Ceramic Capacitor, Murata, GRM155B30J474KE18B
TECHNICAL NOTES
Phase Compensation
In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For
this purpose, use a capacitor C2 with 0.47 µF or more. If a tantalum capacitor is used, and its ESR (Equivalent
Series Resistance) of C2 is large, the loop oscillation may result. Because of this, select C2 carefully
considering its frequency characteristics.
PCB Layout
Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result.
Connect a capacitor C1 with a capacitance value as much as 0.47 µF or more between VDD and GND pin,
and as close as possible to the pins. Set external components, especially the output capacitor C2, as close as
possible to the ICs, and make wiring as short as possible.
9
RP130x
No. EA-173-230725
TYPICAL CHARACTERISTICS
Typical characteristics are intended to be used as reference data, they are not guaranteed.
1) Output Voltage vs. Output Current (C1 = 0.47 µF, C2 = 0.47 µF, Ta = 25°C)
RP130x121x
RP130x281x
RP130x501x
2) Output Voltage vs. Input Voltage (C1 = 0.47 µF, C2 = 0.47 µF, Ta = 25°C)
RP130x121x
RP130x281x
10
RP130x
No. EA-173-230725
RP130x501x
3) Supply Current vs. Input Voltage (C1 = 0.47 µF, C2 = 0.47 µF, Ta = 25°C)
RP130x121x
RP130x281x
RP130x501x
11
RP130x
No. EA-173-230725
4) Output Voltage vs. Temperature (IOUT = 1 mA, C1 = 0.47 µF, C2 = 0.47 µF)
RP130x121x
RP130x281x
RP130x501x
5) Supply Current vs. Temperature (IOUT = 0 mA, C1 = 0.47 µF, C2 = 0.47 µF)
RP130x121x
RP130x281x
12
RP130x
No. EA-173-230725
RP130x501x
6) Dropout Voltage vs. Output Current (C1 = 0.47 µF, C2 = 0.47 µF)
RP130x121x
RP130x281x
RP130x501x
13
RP130x
No. EA-173-230725
7) Dropout Voltage vs. Set Output Voltage (C1 = 0.47 µF, C2 = 0.47 µF)
RP130x501x
8) Ripple Rejection vs. Input Bias Voltage (C1 = none, C2 = 0.47 µF, Ripple = 0.2 Vp-p, Ta = 25°C)
RP130x281x
RP130x281x
9) Ripple Rejection vs. Frequency (C1 = none, C2 = 0.47 µF, Ripple = 0.2 Vp-p, Ta = 25°C)
RP130x121x
RP130x281x
14
RP130x
No. EA-173-230725
RP130x501x
10) Input Transient Response (IOUT = 30 mA, tr = tf = 5 µs, C1 = none, C2 = 0.47 µF, Ta = 25°C)
RP130x121x
RP130x281x
RP130x501x
15
RP130x
No. EA-173-230725
11) Load Transient Response
(tr = tf = 0.5 µs, C1 = 0.47 µF, C2 = 0.47 µF, IOUT = 50mA ↔ 100 mA, Ta = 25°C)
RP130x121x
RP130x281x
RP130x501x
12) Load Transient Response
(tr = tf = 0.5 µs, C1 = 0.47 µF, C2 = 0.47 µF, IOUT = 1 mA ↔ 150mA, Ta = 25°C)
RP130x121x
RP130x281x
16
RP130x
No. EA-173-230725
RP130x501x
13) Turn On Speed with CE pin (C1 = 0.47 µF, C2 = 0.47 µF, Ta = 25°C)
RP130x121x
RP130x121x
RP130x121x
RP130x281x
17
RP130x
No. EA-173-230725
RP130x281x
RP130x281x
RP130x501x
RP130x501x
RP130x501x
18
RP130x
No. EA-173-230725
14) Turn Off Speed with CE pin (RP130xxx1D) (C1 = 0.47 µF, C2 = 0.47 µF, Ta = 25°C)
RP130x121D
RP130x121D
RP130x121D
RP130x281D
RP130x281D
RP130x281D
19
RP130x
No. EA-173-230725
RP130x501D
RP130x501D
RP130x501D
15) Minimum Operating Voltage (C1 = 0.47 µF, C2 = 0.47 µF)
Hatched area is available
for 1.2 V output.
20
RP130x
No. EA-173-230725
ESR vs. Output Current
When using these ICs, consider the following points:
The relations between IOUT (Output Current) and ESR of an output capacitor are shown below.
The conditions when the white noise level is under 40 µV (Avg.) are marked as the hatched area in the graph.
Measurement conditions
Frequency Band : 10 Hz to 3 MHz
Temperature
: −40°C to 85°C
C1, C2
: 0.47 µF
RP130x121x
RP130x281x
RP130x501x
21
POWER DISSIPATION
DFN(PL)1010-4
PD-DFN(PL)1010-4-(85125150)-JE-B
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51.
Measurement Conditions
Item
Environment
Board Material
Board Dimensions
Measurement Conditions
Mounting on Board (Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic (Four-Layer Board)
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
0.2 mm × 21 pcs
Copper Ratio
Through-holes
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
Thermal Resistance (ja)
Thermal Characterization Parameter (ψjt)
800 mW
ja = 125°C/W
ψjt = 58°C/W
ja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
1200
1000
Power Dissipation (mW)
1000
800
800
600
400
200
0
0
25
50
75 85 100
Ambient Temperature (°C)
125
150
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
13,000 hours
Total Years of Use (4 hours/day)
9 years
i
PACKAGE DIMENSIONS
DFN(PL)1010-4
Ver. B
DFN(PL)1010-4 Package Dimensions
∗ The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this
tab be connected to the ground plane on the board but it is possible to leave the tab floating.
i
POWER DISSIPATION
SC-82AB
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following conditions are used in this measurement.
Measurement Conditions
Item
Standard Land Pattern
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Double-Sided Board)
Board Dimensions
40 mm × 40 mm × 1.6 mm
Top Side: Approx. 50%
Copper Ratio
Bottom Side: Approx. 50%
φ 0.5 mm × 44 pcs
Through-holes
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Standard Land Pattern
Power Dissipation
380 mW
Thermal Resistance (θja)
θja = 263°C/W
θja: Junction-to-Ambient Thermal Resistance
40
600
470
400
380
300
40
Power Dissipation (mW)
500
200
100
0
0
25
50
75 85 100
125
Ambient Temperature (°C)
150
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
13,000 hours
Total Years of Use (4 hours/day)
9 years
i
PACKAGE DIMENSIONS
SC-82AB
Ver. A
1.3±0.2
0.9±0.1
0.3±0.1
0.3±0.1
3
+0.2
1.25-0.1
2.1±0.3
4
0 to 0.1
1
0.3±0.1
(0.7)
0.3±0.2
+0.05
1.0-0.2
2±0.2
2
0.4±0.1
+0.1
0.16-0.06
0.05
Unit : mm
SC-82AB Package Dimensions
i
POWER DISSIPATION
SOT-23-5
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Board Material
Mounting on Board (Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
φ 0.3 mm × 7 pcs
Copper Ratio
Through-holes
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
660 mW
Thermal Resistance (θja)
θja = 150°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 51°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
1000
900
830
Power Dissipation (mW)
800
700
600
660
500
400
300
200
100
0
0
25
50
75 85 100 125
Ambient Temperature (°C)
150
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
i
SOT-23-5
PACKAGE DIMENSIONS
Ver. A
2.9±0.2
1.1±0.1
1.9±0.2
0.8±0.1
(0.95)
4
1
2
0～0.1
0.2min.
+0.2
1.6-0.1
5
2.8±0.3
(0.95)
3
0.4±0.1
+0.1
0.15-0.05
SOT-23-5 Package Dimensions
i
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
The products and the product specifications described in this document are subject to change or discontinuation of production without
notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to our sales representatives for the
latest information thereon.
The materials in this document may not be copied or otherwise reproduced in whole or in part without the prior written consent of us.
This product and any technical information relating thereto are subject to complementary export controls (so-called KNOW controls)
under the Foreign Exchange and Foreign Trade Law, and related politics ministerial ordinance of the law. (Note that the complementary
export controls are inapplicable to any application-specific products, except rockets and pilotless aircraft, that are insusceptible to design
or program changes.) Accordingly, when exporting or carrying abroad this product, follow the Foreign Exchange and Foreign Trade
Control Law and its related regulations with respect to the complementary export controls.
The technical information described in this document shows typical characteristics and example application circuits for the products. The
release of such information is not to be construed as a warranty of or a grant of license under our or any third party's intellectual property
rights or any other rights.
The products listed in this document are intended and designed for use as general electronic components in standard applications (office
equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those
customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application
where the failure or misoperation of the product could result in human injury or death should first contact us.
• Aerospace Equipment
• Equipment Used in the Deep Sea
• Power Generator Control Equipment (nuclear, steam, hydraulic, etc.)
• Life Maintenance Medical Equipment
• Fire Alarms / Intruder Detectors
• Vehicle Control Equipment (automotive, airplane, railroad, ship, etc.)
• Various Safety Devices
• Traffic control system
• Combustion equipment
In case your company desires to use this product for any applications other than general electronic equipment mentioned above, make
sure to contact our company in advance. Note that the important requirements mentioned in this section are not applicable to cases
where operation requirements such as application conditions are confirmed by our company in writing after consultation with your
company.
We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail
with certain probability. In order to prevent any injury to persons or damages to property resulting from such failure, customers should be
careful enough to incorporate safety measures in their design, such as redundancy feature, fire containment feature and fail-safe feature.
We do not assume any liability or responsibility for any loss or damage arising from misuse or inappropriate use of the products.
The products have been designed and tested to function within controlled environmental conditions. Do not use products under conditions
that deviate from methods or applications specified in this datasheet. Failure to employ the products in the proper applications can lead
to deterioration, destruction or failure of the products. We shall not be responsible for any bodily injury, fires or accident, property damage
or any consequential damages resulting from misuse or misapplication of the products.
Quality Warranty
8-1. Quality Warranty Period
In the case of a product purchased through an authorized distributor or directly from us, the warranty period for this product shall be
one (1) year after delivery to your company. For defective products that occurred during this period, we will take the quality warranty
measures described in section 8-2. However, if there is an agreement on the warranty period in the basic transaction agreement,
quality assurance agreement, delivery specifications, etc., it shall be followed.
8-2. Quality Warranty Remedies
When it has been proved defective due to manufacturing factors as a result of defect analysis by us, we will either deliver a substitute
for the defective product or refund the purchase price of the defective product.
Note that such delivery or refund is sole and exclusive remedies to your company for the defective product.
8-3. Remedies after Quality Warranty Period
With respect to any defect of this product found after the quality warranty period, the defect will be analyzed by us. On the basis of
the defect analysis results, the scope and amounts of damage shall be determined by mutual agreement of both parties. Then we
will deal with upper limit in Section 8-2. This provision is not intended to limit any legal rights of your company.
Anti-radiation design is not implemented in the products described in this document.
The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristics in the
evaluation stage.
WLCSP products should be used in light shielded environments. The light exposure can influence functions and characteristics of the
products under operation or storage.
Warning for handling Gallium and Arsenic (GaAs) products (Applying to GaAs MMIC, Photo Reflector). These products use Gallium (Ga)
and Arsenic (As) which are specified as poisonous chemicals by law. For the prevention of a hazard, do not burn, destroy, or process
chemically to make them as gas or power. When the product is disposed of, please follow the related regulation and do not mix this with
general industrial waste or household waste.
Please contact our sales representatives should you have any questions or comments concerning the products or the technical
information.
Official website
https://www.nisshinbo-microdevices.co.jp/en/
Purchase information
https://www.nisshinbo-microdevices.co.jp/en/buy/
工商网监
湘ICP备2023018690号
