WSD4066DN
Dual N-Ch MOSFET
Product Summery
General Description
The WSD4066DN is the highest performance
trench Dual N-Ch MOSFET with extreme
high cell density,which provide excellent
RDSON and gate charge for most of the
synchronous buck converter applications .
BVDSS
RDSON
ID
40V
17mΩ
14A
Applications
The WSD4066DN meet the RoHS and
Green Product requirement 100%
EAS guaranteed with full function
reliability approved.
• High Frequency Point-of-Load Synchronous
Buck Converter for MB/NB/UMPC/VGA
• Networking DC-DC Power System
Features
• Load Switch
• Advanced high cell density Trench technology
DFN3.3x3.3-8-EP Pin Configuration
• Super Low Gate Charge
• Excellent CdV/dt effect decline
• 100% EAS Guaranteed
• Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
Rating
Unit
Common Ratings
VDSS
Drain-Source Voltage
40
V
VGSS
Gate-Source Voltage
±20
V
Maximum Junction Temperature
150
°C
TJ
TSTG
Storage Temperature Range
IS
Diode Continuous Forward Current
ID
Continuous Drain Current
IDM a
Pulse Drain Current Tested
PD
Maximum Power Dissipation
-55 to 150
TA=25°C
2
TA=25°C
14
TA=70°C
9.8
TA=25°C
28
TA=25°C
2.5
TA=70°C
1.68
A
A
W
Thermal Resistance-Junction to Lead
RJ A
Thermal Resistance-Junction to Ambient
IAS c
Avalanche Current, Single pulse
L=0.5mH
10
A
Avalanche Energy, Single pulse
L=0.5mH
25
mJ
EAS
10
A
RJL
c
Steady State
°C
t 10s
Steady State
42.5
b
75
°C/W
°C/W
Note a:Pulse width limited by max. junction temperature.
Note b:Surface Mounted on 1in2 pad area, t =999sec.
Note c:UIS tested and pulse width limited by maximum junction temperature 150oC (initial temperature Tj=25oC).
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Page 1
Dec.2014
WSD4066DN
Dual N-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
40
-
-
V
-
-
1
-
-
30
1.0
1.5
2.0
V
nA
Static Characteristics
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
VGS=0V, IDS=250A
VDS=32V, VGS=0V
TJ=85°C
A
VGS(th)
Gate Threshold Voltage
VDS=VGS, IDS=250A
IGSS
Gate Leakage Current
VGS=±20V, VDS=0V
-
-
±100
VGS=10V, IDS=14A
-
14
17
VGS=4.5V, IDS=12 A
-
17
20
ISD=1A, VGS=0V
-
0.75
1.1
V
-
13
-
ns
-
8.7
-
nC
-
2.5
-
-
815
-
-
95
-
-
60
-
-
7.8
-
-
6.9
-
-
22.4
-
-
4.8
-
-
15.7
22
-
7.5
10.5
-
1.85
-
-
3.24
-
-
2.75
-
R DS(ON) c Drain-Source On-state Resistance
m
Diode Characteristics
VSD c
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Dynamic Characteristics
d
RG
Gate Resistance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
td(ON)
Turn-on Delay Time
tr
Turn-on Rise Time
td( OFF)
Turn-off Delay Time
tf
VGS=0V,VDS=0V,F=1MHz
VGS=0V,
VDS=20V,
Frequency=1.0MHz
VDD
=20V,
RL=20, IDS=1A,
VGEN=10V, RG=6
Turn-off Fall Time
Gate Charge Characteristics
Qg
Total Gate Charge
Qg
Total Gate Charge
Qgth
IDS=6A, dlSD /dt=100A/s
pF
ns
d
Threshold Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDS=20V, VGS=10V,
IDS=6A
VDS=20V, VGS=4.5V,
IDS=6A
nC
Note c:Pulse test ; pulse width300s, duty cyc le2%.
Note d:Guaranteed by design, not subject to production testing.
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Page 2
Dec.2014
WSD4066DN
Dual N-Ch MOSFET
Typical Operating Characteristics
Drain Current
Power Dissipation
3.0
16
14
2.5
ID - Drain Current (A)
Ptot - Power (W)
12
2.0
1.5
1.0
10
8
6
4
0.5
2
o
o
0.0
TA=25 C
0
20
40
60
80
0
100 120 140 160
Tj - Junction Temperature (°C)
1ms
10ms
0.1
1s 100ms
TA=25 C
0.01
0.01
DC
0.1
1
10
Normalized Transient Thermal Resistance
im
it
R
ds
(o
n)
L
ID - Drain Current (A)
300ms
o
40
60
80 100 120 140 160
2
Duty = 0.5
1
0.2
0.1
0.05
0.1
0.02
0.01
0.01
Single Pulse
2
1E-3
1E-4 1E-3 0.01
100 300
Mounted on 1in pad
o
RqJA :110 C/W
0.1
1
10
100 1000
Square Wave Pulse Duration (sec)
VDS - Drain - Source Voltage (V)
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20
Thermal Transient Impedance
100
1
0
Tj - Junction Temperature (°C)
Safe Operation Area
10
TA=25 C,VG=10V
Page 3
Dec.2014
WSD4066DN
Dual N-Ch MOSFET
Typical Operating Characteristics (Cont.)
Drain-Source On Resistance
Output Characteristics
30
30
VGS=4,5,6,7,8,9,10V
ID - Drain Current (A)
RDS(ON) - On - Resistance (mW)
3.5V
25
20
15
10
3V
5
0
0.0
0.5
1.0
1.5
2.0
2.5
0
5
10
15
20
25
Gate-Source On Resistance
Gate Threshold Voltage
60
50
40
30
20
10
3
4
5
6
7
8
9
IDS =250mA
1.4
1.2
1.0
0.8
0.6
0.4
0.2
-50 -25
10
0
25
50
75
100 125 150
Tj - Junction Temperature (°C)
VGS - Gate - Source Voltage (V)
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30
1.6
Normalized Threshold Vlotage
RDS(ON) - On - Resistance (mW)
10
ID - Drain Current (A)
IDS=6A
2
VGS=10V
15
5
3.0
VGS=4.5V
20
VDS - Drain - Source Voltage (V)
70
0
25
Page 4
Dec.2014
WSD4066DN
Dual N-Ch MOSFET
Typical Operating Characteristics (Cont.)
Drain-Source On Resistance
2.0
30
VGS = 10V
IDS = 6A
10
1.6
IS - Source Current (A)
Normalized On Resistance
1.8
Source-Drain Diode Forward
1.4
1.2
1.0
0.8
0.6
o
Tj=150 C
o
Tj=25 C
1
0.4
o
0.2
-50 -25
RON@Tj=25 C: 17mW
0
25
50
75
1.0
1.2
Gate Charge
VDS=20V
9 I =6A
DS
VGS - Gate-source Voltage (V)
600
400
200
Coss
10
15
20
8
7
6
5
4
3
2
1
Crss
5
1.4
10
Ciss
800
25
30
35
0
0
40
2
4
6
8
10
12
14
16
QG - Gate Charge (nC)
VDS - Drain - Source Voltage (V)
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0.8
0.6
Capacitance
Frequency=1MHz
0
0.4
VSD - Source - Drain Voltage (V)
1000
0
0.2
Tj - Junction Temperature (°C)
1200
C - Capacitance (pF)
0.1
0.0
100 125 150
Page 5
Dec.2014
WSD4066DN
Dual N-Ch MOSFET
www.winsok.tw
Page 6
Dec.2014
Attention
1, Any and all Winsok power products described or contained herein do not have specifications that can handle
applications that require extremely high levels of reliability, such as life‐support systems, aircraft's control systems, or
other applications whose failure can be reasonably expected to result in serious physical and/or material damage.
Consult with your Winsok power representative nearest you before using any Winsok power products described or
contained herein in such applications.
2,Winsok power assumes no responsibility for equipment failures that result from using products at values that exceed,
even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in
products specifications of any and all Winsok power products described or contained herein.
3, Specifications of any and all Winsok power products described or contained herein stipulate the performance,
characteristics, and functions of the described products in the independent state, and are not guarantees of the
performance, characteristics, and functions of the described products as mounted in the customer’s products or
equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always
evaluate and test devices mounted in the customer’s products or equipment.
4, Winsok power Semiconductor CO., LTD. strives to supply high‐quality high‐reliability products. However, any and all
semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents
or events that could endanger human lives that could give rise to smoke or fire, or that could cause damage to other
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volume production. Winsok power believes information herein is accurate and reliable, but no guarantees are made or
implied regarding its use or any infringements of intellectual property rights or other rights of third parties.
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improvement,etc. When designing equipment, refer to the "Delivery Specification" for the Winsok power product that you
Intend to use.
9, this catalog provides information as of Sep.2014. Specifications and information herein are subject to change without
notice.