CWS1006CM-332T

Sunlord Business categories:Level 0(general confidential) Specifications for Common Mode Chokes Page 1 of 10 S P E C I F I C AT I O N S 时宣 Customer Product Name Common Mode Chokes Sunlord Part Number CWS1006CM-332T Customer Part Number [ New Released, Revised] SPEC No.: CWS0807230001 【This SPEC is total 10 pages including specifications and appendix.】 【ROHS Compliant Parts】 Approved By Checked By Issued By Shenzhen Sunlord Electronics Co., Ltd. Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China 518110 Tel: 0086-755-29832333 Fax: 0086-755-82269029 E-Mail: sunlord@sunlordinc.com 【For Customer approval Only】 Qualification Status: Full Approved By Comments: Verified By Restricted Date: Rejected Re-checked By Checked By Sunlord Business categories:Level 0(general confidential) Specifications for Common Mode Chokes Page 2 of 10 Rev. Effective Date Changed Contents Change reasons Approved By 01 Dec.06,2023 New release / Zeng Sui Sunlord Business categories:Level 0(general confidential) Specifications for Common Mode Chokes Page 3 of 10 Caution： All products listed in this specification are developed, designed and intended for use in general electronics equipment. The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or quality require especially high reliability, or whose failure, malfunction or trouble might directly cause damage to society, person, or property. Please understand that we are not responsible for any damage or liability caused by use of the products in any of the applications below. Please contact us for more details if you intend to use our products in the following applications. 1. Aircraft equipment 2. Aerospace equipment 3. Undersea equipment 4. Nuclear control equipment 5. Military equipment 6. Power plant equipment 7. Medical equipment 8. Transportation equipment (automobiles, trains, ships,etc.) 9. Traffic signal equipment 10. Disaster prevention / crime prevention equipment 11. Applications of similar complexity or with reliability requirements comparable to the applications listed in the above Sunlord Business categories:Level 0(general confidential) Specifications for Common Mode Chokes 1. Scope This specification applies to CWS1006CM-332T Common Mode Chokes 2. Product Description and Identification (Part Number) 1) Description Common Mode Chokes, 2) Product Identification (Part Number) CWS 1006 CM -332 T ① ② ③ ④ ⑤ ①Type Page 4 of 10 ②External Dimensions (mm) CWS Common Mode Chokes 1006 ④Inductance [uH] ③Configuration CM Example CM Type Base Example 332 3300 ⑤Packing Tape Package T 3. Electrical Characteristics Please refer to Appendix A 1) Operating temperature (Including self-generated heat): -40℃~+125℃ 2) Storage temperature and humidity range (product with packing): 0℃~+40℃, RH 70% Max. 4. Shape and Dimensions 1.Dimensions and recommended PCB pattern for reflow soldering: B 3 C XXX A E A XXX 2 4 1 2 D B For 121, 221, 251, 471, 102. E 4 1 3 C D For 222, 332, 392, 472. Electrical Schematic & PAD Layout d 2 4 3 c b 1 a Unit: mm Symbol A B C D E a b c d CWS1006CM 10±0.3 8.7±0.3 6.5Max 6.22±0.2 7.62±0.2 2.7 4.92 2.7 3.52 2. Material List Symbol a b c d e f Components Core Wire Base Adhesive Solder Terminal Material Ferrite core Enamelled copper wire Plastic Epoxy resin Sn、Ag、Cu Cu( plate with Ni、Sn) Sunlord 5. Business categories:Level 0(general confidential) Specifications for Common Mode Chokes Page 5 of 10 Test and Measurement Procedures 5.1 Test Conditions 5.1.1 Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65±20% c. Air Pressure: 86 KPa to 106 KPa 5.1.2 If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2℃ b. Relative Humidity: 65±5% c. Air Pressure: 86KPa to 106 KPa 5.2 Visual Examination a. Inspection Equipment: 20 X magnifier 5.3 Electrical Test 5.3.1 DC Resistance (DCR) a. Refer to Appendix A. b. Test equipment (Analyzer): HIOKI3540 or equivalent. 5.3.2 Rated Current a. Refer to Appendix A. b. Test equipment: Agilent E3633A, NF ZM2355, R2M-2H3 or equivalent.. c. DC current (A) that will cause an approximate ΔT of 40 °C(reference ambient temperature is 25 °C) 5.4 Reliability Test Item 5.4.1 Terminal Strength 5.4.2 Resistance to Flexure Requirements No removal or split of the termination or other defects shall occur. Test Methods and Remarks ① ② ③ ④ ① No visible mechanical damage. ② Impedance change: within ±30%. The test samples shall be soldered to the board by the reflow. Then apply force to X and Y directions. Applied force: 5N . Keep time: 5s Speed: 1.0 mm/s. ①The test samples shall be soldered to the board by the reflow. Then apply force in the direction of the arrow. ②Flexure: 2mm ③Pressurizing Speed: 0.5mm/sec. ④Keep time: ≧5 sec. 20 10 R10 Board Flexure 45±2mm 45±2mm Test Sample 5.4.3 Vibration ① ② No visible mechanical damage. Impedance change: within ±30%. ① The test samples shall be soldered to the board by the reflow. Then it shall be submitted to below test conditions. Fre. Range 10~55Hz Total 1.5mm(May not exceed Amplitude acceleration 196 m/s2) Sweeping 10Hz to 55Hz to 10Hz for 1 min. Method Time For 2 hours on each X,Y,Z axis. ② Recovery: At least 2 hours of recovery under the standard condition after the test, followed by the measurement within 24 hours. Sunlord Business categories:Level 0(general confidential) 5.4.4 Solderability Specifications for Common Mode Chokes 95% or more of mounting terminal side ① shall be covered with fresh solder. ② ③ ④ ⑤ 5.4.5 Resistance to Soldering Heat i. ii. No visible mechanical damage. ① Impedance change : within ± 30%. ② ③ 5.4.6 Thermal Shock ① ② Page 6 of 10 The test samples shall be dipped in flux, and the immersed in molten solder. Solder Temperature: 240±5℃ Keep time: 3±0.5s Immersion depth: all sides of mounting terminal shall by immersed. Flux: 25% Rosin and 75% ethanol in weight. The test sample shall be exposed to reflow oven as below. 230±5℃ 40s Peak tem. at 260±5℃ 5s Reflow time: 2times. Recovery: At least 2 hours of recovery under the standard condition after the test , followed by the measurement within 24 hours. No visible mechanical damage. ① The test samples shall be soldered to the board by Impedance change : within ± 30%. the reflow. Then it shall be placed at specified temperature for specified time by step 1 to step 4 as shown in below table in sequence. Step Temperature(℃) Duration(min) 1 -25 30±3 2 Room temperature Within 3 3 +85 30±3 4 Room temperature Within 3 ② ③ 5.4.7 Damp heat ① ② Item 5.4.8 Loading Under Requirements ① ② Damp Heat 5.4.9 Resistance to Low Temperature Number of cycle: 100cycles. Recovery: At least 2 hours of recovery under the standard condition after the test , followed by the measurement within 24 hours. No visible mechanical damage. ① The test samples shall be soldered to the board by Impedance change : within ± 30% the reflow. Then it shall be submitted to below test conditions. Temperature 60±2℃ Humidity 90~95%RH Time 96hour ② Recovery: At least 2 hours of recovery under the standard condition after the test, followed by the measurement within 24 hours. ① ② No visible mechanical damage. Impedance change : within ± 30% Test Methods and Remarks ① The test samples shall be soldered to the board by the reflow. Then it shall be submitted to below test conditions. Temperature 60±2℃ Humidity 90~95%RH Applied current Rated current Time 96hour ② Recovery: At least 2 hours of recovery under the standard condition after the test, followed by the measurement within 24 hours. No visible mechanical damage. ① The test samples shall be soldered to the board by Impedance change : within ± 30% the reflow. Then it shall be submitted to below test conditions. Temperature -25±3℃ Time 96hour ② Recovery: At least 2 hours of recovery under the standard condition after the test, followed by the measurement within 24 hours. Sunlord Business categories:Level 0(general confidential) 5.4.10 Resistance to High Temperature 5.4.11 Loading at High Temperature (Life Test) 5.4.12 Impedance (Common Mode) 5.4.13 Impedance (Differential Mode) 6. Specifications for Common Mode Chokes Page 7 of 10 No visible mechanical damage. ① The test samples shall be submitted to below test Impedance change : within ± 30%. conditions. Temperature 85±3℃ Time 96hour ② Recovery: At least 2 hours of recovery under the standard condition after the test, followed by the measurement within 24 hours. ① No visible mechanical damage. ① The test samples shall be soldered to the board by ② Impedance change : within ± 30%. the reflow. Then it shall be submitted to below test conditions. Temperature 85±3℃ Applied current Rated current Time 96hour ② Recovery: At least 2 hours of recovery under the standard condition after the test, followed by the measurement within 24 hours. Refer to Electrical Characteristics Test equipment: High Accuracy RF LCR Meter Agilent 4287A/E4991A or equivalent. Common Mode Impedance is tested according to the following circuit. ① ② Refer to Electrical Characteristics Test equipment: High Accuracy RF LCR Meter Agilent 4287A/E4991A or equivalent. Differential Mode Impedance is tested according to the following circuit. Packaging 6.1 Tape Carrier Packaging: Packaging code: T (1) Tape carrier packaging are specified in attached figure Fig.6.1-1~2 (2) Tape carrier packaging quantity: a. Reel Drawings (Unit: mm) Fig.6.1-1 Sunlord Business categories:Level 0(general confidential) Specifications for Common Mode Chokes Page 8 of 10 b.Taping Dimensions (Unit: mm) End Start K0 No component 200mm No component 400mm Fig.6.1-2 Tape dimensions (mm) Type CWS1006CM W P P0 P2 D0 D1 E F A0 B0 K0 24 12 4.0 2.0 1.5 1.5 1.75 11.5 9.1 10.5 6.8 Standard Quantity Type CWS1006CM Reel(Pcs) Middle Carton(Pcs) Big Carton(Pcs) 500 500 2500 c. Peeling off force: 10gf to 130gf in the direction show below. Top tape or cover tape 1650~ 1800 Base tape Fig. 6.1-3 6.2 Storage (1) The solderability of the external electrodes may deteriorate if packages are stored in high humidity. Besides, to ensure packing material’s good state, packages must be stored at -10℃ to 40℃ and 70% RH Max. (2) The solderability of the external electrodes may deteriorate if packages are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H2S). (3) Packaging materials may deform if packages are exposed directly to sunlight. (4) Minimum packages, such as polyvinyl heat-seal packages shall not be opened until they are used. If opened, use the reels as soon as possible. (5) Solderability shall be guaranteed for a period of time from the date of delivery on condition that they are stored at the specified environment. For those parts, which passed more than the time shall be checked solderability before using. (6) For magnetic products, keep clear of anything that may generate magnetic fields to avoid change of products performance. (7) To avoid any damage to products, do not load mechanic force on products or place heavy goods on products, and exclude strong vibration or drop. (8)In case of storage over 12 months, solderability shall be checked before actual usage. 7. Warning and Attentions 7.1 Precautions on Use (1) Always wear static control bands to protect against ESD. (2) Any devices used with the products (soldering irons, measuring instruments) should be properly grounded. (3) Keep bare hands and metal conductors (i.e., metal desk) away from electrodes or conductive areas that lead to electrodes. (4) Preheat when soldering. (5) Don’t apply current in excess of the rated current value. It may reduce the impedance or inductance, or cause damage to components due to over-current. (6) For magnetic products, keep clear of anything that may generate magnetic fields such as speakers and coils. Use non-magnetic tweezers when handing the chips. Sunlord Business categories:Level 0(general confidential) Specifications for Common Mode Chokes Page 9 of 10 (7) When soldering, the electrical characteristics may be varied due to hot energy and mechanical stress. (8) When coating products with resin, the relatively high resin curing stress may change the electrical characteristics. For exterior coating, select resin carefully so that electrical and mechanical performance of the product is not affected. Before using, please evaluate reliability with the product mounted in your application set. (9) When mount chips with adhesive in preliminary assembly, do appropriate check before the soldering stage, i.e., the size of land pattern, type of adhesive, amount applied, hardening of the adhesive on proper usage and amounts of adhesive to use. (10) Mounting density: Add special attention to radiating heat of products when mounting other components nearby. The excessive heat by other products may cause deterioration at joint of this product with substrate. (11) Since some products are constructed like an open magnetic circuit, narrow spacing between components may cause magnetic coupling. (12) Please do not give the product any excessive mechanical shocks in transportation. (13) Please do not touch wires by sharp terminals such as tweezers to avoid causing any damage to wires. (14) Please do not add any shock and power to the soldered product to avoid causing any damage to chip body. (15) Please do not touch the electrodes by naked hand as the solderability of the external electrodes may deteriorate by grease or oil on the skin. 7.2 PCB Bending Design The following shall be considered when designing and laying out PCB’s. (1) PCB shall be designed so that products are not subjected to the mechanical stress from board warp or deflection. Products shall be located in the sideways direction to the mechanical stress (Poor example) (Good example) (2) Products location on PCB separation. C Seam Product shall be located carefully because they may be subjected to the mechanical stress in order of A>C=B>D. B A D (3) When splitting the PCB board, or insert (remove) connector, or fasten thread after mounting components, care is required so as not to give any stress of deflection or twisting to the board. Because mechanical force may cause deterioration of the bonding strength of electrode and solder, even crack of product body. Board separation should not be done manually, but by using appropriate devices. 7.3 Recommended PCB Design for SMT Land-Patterns When chips are mounted on a PCB, the amount of solder used (size of fillet) can directly affect chip performance. Therefore, the following items must be carefully considered in the design of solder land patterns: (1) The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. (2) When more than one part is jointly soldered onto the same land or pad, the pad must be designed that each component’s soldering point is separated by solder-resist. Recommended land dimensions please refer to product specification 8. Recommended Soldering Technologies 8.1 Re-flowing Profile: △ 1~2 ℃/sec. Ramp △ Pre-heating: 150~190℃/90±30 sec. △ Time above 240℃: 20~40sec △ Peak temperature: 260℃ Max./5sec; △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.2 times for Re-flowing Max: 260℃ 260℃ 200℃ 240℃ 190℃ 150℃ 90±30sec. 20~40sec. Gradual Cooling Sunlord Business categories:Level 0(general confidential) Specifications for Common Mode Chokes Page 10 of 10 Appendix A: Electrical Characteristics(@ 25℃) Part Number Inductance ±40% Max. DC Resistance Rated Current Typ Leakage Inductance Typ A nH Units uH mΩ Symbol L - Test Condition 100KHz/0.1V - CWS1006CM-332T 3300 360 Max Impedance Typ Rated Voltage Ω V(DC) Zcom 0.65 1MHz, 1mA 130 8900 Rated Current：∆T≦40℃Typ Max impedance Typ: It refers to the highest impedance reference value of the test full frequency impedance curve Appendix B: ELECTRICAL SCHEMATIC Appendix C: Curve 80