XL-C4040SYGC

▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ XL-C4040SYGC Technical Data Sheet haracteristics * 外观尺寸（L/W/H）: 4.0*3.95*3.55mm Out line Dimensions (L / w / h): 4.0*3.95*3.55mm * 发光颜色及胶体: 普绿光/透明胶体 Luminous color and colloid: Green light/ water colloid * 环保工艺符合 ROHS 要求 Environmental protection products Complied With ROHS Directive * EIA 规范标准包装 EIA standard packaging * 适用于 SMT 贴片自动化生产 Suitable for SMT automatic production * 适用于红外线回流焊制程 Suitable for infrared reflow soldering process roduct application * 汽车外部照明 Car exterior lighting * 汽车内饰照明 Automotive interior lighting * 户外灯具 Outdoor lighting fixtures * 台阶灯、出口通道灯标志灯 step lights, exit passage lights and sign lights * 白色家电：电冰箱照明、洗衣机、干衣机 Major appliance: refrigerator lighting, washing machine, Clothes dryer * 装饰和娱乐照明 Decoration and entertainment lighting: 1 ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ Catalogue Electrical Characteristics...........................................................................................................................3 Typical Characteristic Curves...................................................................................................................5 Reliability Test Items And Conditions.......................................................................................................6 Outline Dimensions.....................................................................................................................................7 Packaging......................................................................................................................................................8 Guideline for Soldering..............................................................................................................................10 Precautions...................................................................................................................................................12 2 ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ 极限参数（Ta=25℃）Absolute Maximum Rating(ta=25 ℃) 数值 单位 Value Unit 消耗功率 Power Dissipation 脉冲电流 Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse width 正向电流 Forward current 50 mW 80 mA 20 mA 抗静电能力 Electrostatic Discharge 3000 V 参数 parameter 工作温度 Operation Temperature Range 储存温度 Storage Temperature Range -20℃ to +85℃ -40℃ to +85℃ 焊接温度 Lead Soldering Temperature 260℃ ≤ 6S （Ta=25℃） Optical-electrical parameter(ta=25 ℃) 测试条件 最小值 典型值 最大值 单位 Test conditions Min Typ Max Unit IV IF=20mA 100 -- 200 mcd λd IF=20mA 565 - 575 nm λp IF=20mA - 565 - nm 2θ1/2 IF=20mA -- 120 -- deg VF IF=20mA 1.9 -- 2.3 V IR VR=5V -- -- 5 μA 参数 符号 parameter 光强 Luminous Intensity 主波长 Dominant Wavelength 峰值波长 （Peak Wave Length） 发光角度 Viewing Angle 正向电压 Forward Voltage 反向电流 Reverse Current Symbol 3 ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ : Brightness grading Code Min Max P00 100 200 P01 200 300 P02 300 400 Unit mcd Test conditions IF=20mA : Voltage grading Code Min Max F3 1.7 1.9 F4 1.9 2.1 F5 2.1 2.3 Code Min Max HY1 565 570 HY2 570 575 HY3 575 580 Unit Test conditions V IF=20mA : Wavelength grading Unit nm Test conditions IF=20mA 4 ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ 5 ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ *可靠性实验项目 Reliability Test Project 描述 Description 项目 Item 测试标准 Testcriterion 测试条件 Testcondition 寿命测试 Lifetest 常温寿命测试 Lifetest(roomtemperature) JIS7021:B4 Ta=25℃±5℃，IF=20mA 1000Hrs 22 0 高温存储 Hightemperaturestore JIS7021:B10 MIL-STD-202:210A MIL-STD-750:2031 Ta=85℃±5℃ 1000Hrs 22 0 低温存储 Low temperature store JIS7021:B12 Ta=-35℃±5℃ 1000Hrs 22 0 JIS7021:B11 MIL-STD-202:103D Ta=85℃±5℃ RH=85% 1000Hrs 22 0 冷热冲击测试 Cold / Heat strike test JIS7021::B4 MIL-STD-202:107D MIL-STD-750:1026 30min 50Cycles 22 0 冷热循环测试 Cold and heat cycle test JIS7021:A3 MIL-STD-202:107D MIL-STD-705:105E 50Cycles 22 0 高温高湿测试 环境测试 Ambience test High temperature/ humidity test 测试时间 数量 失效数量 Testtime Qty Failqty -10℃±5℃←→100℃±5℃ 5min 5min 5min 5min 5min -35℃～25℃～85℃～-35℃ 30min 5min 30min 5min *判断标准 Judging criterion: 项目 Item Forward Voltage 正向电压 Reverse Current 反向电流 Luminous Intensity 发光强度 符号 Symbol 实验条件 Experiment condition VF 判断标准 Criteria Min. Max. IF=20mA ---- Initial Datex1.1 IR VR=5V ---- 5μA IV IF=20mA Initial Datex0.7 ---- 6 ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ 备注： Remarks: 1.以上尺寸单位均为 mm All dimensions are in millimeters. 2.未特别标注公差的尺寸公差均为±0.25mm Tolerance is ±0.25mm unless otherwise noted 7 ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ 8 ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ 9 ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ 1. Hand Soldering 只建议在修理和重工的情况下使用手工焊接；推荐使用功率低于 3 0 W 的烙铁，焊接时烙铁的温度必须 保 持在 300℃以下，且每个电极只能进行一次焊接，每次焊接的持续时间不得超过 3 秒。 人手焊接过程中的不慎操作易引起 LED 产品的损坏，应当小心谨慎。 Manual welding is recommended only for repair and heavy industry situations. A soldering iron of less than 30W is recommended to be used in Hand Soldering. Please keep the temperature of the soldering iron under 300℃ while soldering. Each terminal of the LED is to go for less than 3 second and for one time only. Be careful because the damage of the product is often started at the time of the hand soldering. 2. 推荐使用以下无铅回流焊接温度图进行。 Reflow Soldering: Use the conditions shown in the under Figure of Pb -Free Reflow Soldering. 有铅制程 Lead process 无铅制程 lead free 回流焊接最多只能进行两次。 Reflow soldering should not be done more than two times. 在回流焊接升温过程中，请不要对 LED 施加任何压力。 Stress on the LEDs should be avoided during heating in soldering process. 在焊接完成后，待产品温度下降到室温之后，再进行其他处理。 After soldering, do not deal with the product before its temperature drop down to room temperature. 10 ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ 3. Cleaning 在焊接后推荐使用酒精进行清洗，在温度不高于 30℃的条件下持续 3 分钟， 不高于 50℃的条件下持 续 30 秒。 使用其他类似溶剂清洗前，请先确认使用的溶剂不会对 LED 的封装和环氧树脂部分造成损伤。 超声波清洗也是有效的方法，一般最大功率不应超过 300W ，否则可能对 LED 造成损伤。请根据 具体的 情况预先测试清洗条件是否会对 LED 造成损伤。 It is recommended that alcohol be used as a solvent for cleaning after soldering. Cleaning is to go under 30℃ for 3 minutes or 50℃ for 30 seconds. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Ultrasonic cleaning cleaning is also an effective way for cleaning. But the influence of Ultrasonic on LED depends on factors such as ultrasonic power. Generally, the ultrasonic power should not be higher than 300W. Before cleaning, a pretest should be done to confirm whether any damage to LEDs will occur. 此一般指导原则并不适用于所有 PCB 设计和焊接设备的配置。具体工艺受到诸多因素的影 响， 请根据特定的 PCB 设计和焊接设备来确定焊接方案。 Note: This general guideline may not apply to all PCB designs and configurations of all soldering equipment. The technics in practise is influenced by many factors, it should be specialized base on the PCB designs and configurations of the soldering equipment.. 11 ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ 1. Storage ·本产品使用密封防潮抗静电袋包装，并附有干燥剂，未开封的产品有一年的保存时间。 Moisture proof and anti-electrostatic package with moisture absorbent material is used, to keep moisture to a minimum. · 开封前，产品须存放在温度不高于 30℃，湿度不高于 60%RH 的环境中。 Before opening the package, the product should be kept at 30℃ or less and humidity less than 60% RH, and be used within a year. · 开封后，产品须存放在温度不高于 30℃，湿度不高于 10%RH 的环境中，且应该在 168 小时（7 天） 内 使 用完。建议工作环境为温度不高于 30℃，湿度不高于 60%RH。 After opening the package, the product should be stored at 30℃ or less and humidity less than 10%RH, and be soldered within 168 hours (7 days). It is recommended that the product be operated at the workshop condition of 30℃ or less and humidity less than 60%RH. · 对于尚未焊接的 LED ，如果吸湿剂或包装失效，或者产品没有符合以上有效存储条件，烘焙可以起到一定 的性能恢复效果。烘焙条件：（ 60±5）℃，持续24 小时。 If the moisture absorbent material has fade away or the LEDs have exceeded the storage time, baking treatment should be performed based on the following condition: (60±5)℃ for 24 hours. 2. Static Electricity 静电和电涌会导致产品特性发生改变，例如正向电压降低等，如果情况严重甚至会损毁产品。所以在使用时必须采取有效的 防静电措施。所有相关的设备和机器都应该正确接地，同时必须采取其他防止静电和电涌的措施。使用防静电 手环，防静电垫子，防静电工作服、工作鞋、手套，防静电容器，都是有效的防止静电和电涌的措施。 Static electricity or surge voltage damages the LEDs. Damaged LEDs will show some unusual characteristic such as the forward voltage becomes lower, or the LEDs do not light at the low current. even not light. All devices, equipment and machinery must be properly grounded. At the same time, it is recommended that wrist bands or anti-electrostatic gloves, anti-electrostatic containers be used when dealing with the LEDs. 12 ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ 3. Design Consideration 设计电路时，通过 LED 的电流不能超过规定的最大值，同时，还需使用保护电阻，否则，微小的电压 变 化将会引起较大的电流变化，可能导致产品损毁。 建议使用以下（A）电路，该电路能够很好的调节通过每个 LED 的电流； 不推荐使用（B）电路，该电路 在 持续的电压驱动下，LED 的正向电压（VF ）发生变化，电流会随之而发生变化，可能使某些 LED 承受高 于规定的电流值。 In designing a circuit, the current through each LED must not exceed the absolute maximum rating specified for each LED. In the meanwhile, resistors for protection should be applied, otherwise slight voltage shift will cause big current change, burn out may happen. It is recommended to use Circuit A which regulates the current flowing through each LED rather than Circuit B. When driving LEDs with a constant voltage in Circuit B, the current through the LEDs may vary due to the variation in Forward Voltage (VF) of the LEDs. In the worst case, some LED may be subjected to stresses in excess of the Absolute Maximum Rating. LED 的特性容易因为自身的发热和环境的温度的改变而发生改变。 温度的升高会降低 LED 的发光效率、 影响发光颜色等，所以在设计时应充分考虑散热的问题。 Thermal Design is paramount importance because heat generation may result in the Characteristics decline, such as brightness decreased, Color changed and so on. Please consider the heat generation of the LEDs when making the system design. 13 ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ ▉ 4. Others 直接用手拿取产品不但会污染封装树脂表面，也可能由于静电等因素导致产品性能的改变。过度的压力也可能直接影响封装内 部的管芯和金线，因此请勿对产品施加过度压力，特别当产品处于高温状态下，例如在回流焊接过程中。 When handling the product, touching the encapsulant with bare hands will not only contaminate its surface, but also affect on its optical characteristics. Excessive force to the encapsulant might result in catastrophic failure of the LEDs due to die breakage or wire deformation. For this reason, please do not put excessive stress on LEDs, especially when the LEDs are heated such as during Reflow Soldering. LED 的环氧树脂封装部分相当脆弱，请勿用坚硬、尖锐的物体刮、擦封装树脂部分。在用镊子夹取的时 候也应当小心注意。 The epoxy resin of encapsulant is fragile, so please avoid scratch or friction over the epoxy resin surface. While handling the product with tweezers, do not hold by the epoxy resin, be careful. 5. Safety Advice For Human Eyes LED 发光时，请勿直视发光光源，特别是对于一些光强较高的 LED ，强光可能伤害你的眼睛。 Viewing direct to the light emitting center of the LEDs, especially those of great Luminous Intensity, will cause great hazard to human eyes. Please be careful. 14