9L0370G41B0DA0G3

Lamp Series SPECIFICATION FOR APPROVAL Customer ： Customer Part No ： Xmbrightek Part No： 9L0370G41B0DA0G3 Specification ： 3mm 厚帽沿绿色雾状黄绿光（编带） Time ： Customer Confirmation 2020.06.24 Approval Audit Production Lewis Jelly MARK Parameter confirmation: XMBIRGHTEK OPTOELECTRONICS CO.,LTD TEL:0592-5500796/5259496 WWW.XMBRIGHTEK.COM NO：HS-GC-004 第 1 页 共 12 页 Lamp Series 9L0370G41B0DA0G3  Outline (L*H): 3.86*5.3mm  Low flux efficiency & Energy conservation  Good thermal dissipation & Optical uniformity Table of Contents Typical Product Characteristics------------------------------3 Outline Dimensions--------------------------------------------4 Electronic-optical Characteristics ---------------------------5 Features  Forward current: ≦25mA  RoHS and REACH-compliant  Lens color:Colored Diffused  ESD level 2kV Range of Bins --------------------------------------------------6 LED Usage and Handling----------------------------------7-9 Applications Test Items and Results of Reliability ----------------------10  Indoor signage display applications  Indoor decorating and entertainment design  consumer electronics  Others applications Content revision-----------------------------------------------11 XMBIRGHTEK OPTOELECTRONICS CO.,LTD TEL:0592-5500796/5259496 WWW.XMBRIGHTEK.COM NO：HS-GC-004 第 2 页 共 12 页 Lamp Series  Absolute Maximum Ratings（Ta=25℃）  Characteristics Symbol Value Unit Power Dissipation PD 60 mW DC Forward Current IF 25 mA Pulsed Forward Current IFP 100 mA Reverse Voltage VR 5 V Operating Temperature Range Topr -40~ +85° ℃ Storage Temperature Range Tstg -40 ~ +100° ℃ Soldering Temperature Tsol 250for5sec△ ℃ Notes： For other ambient, limited setting of current will be depended on de-rating curves.  1:Electrical-Optical Characteristics（Ta=25℃）  2: Duty 1/10, pulse width 0.1ms Value Characteristics Symbol Min. Typ. Max. Unit Test condition Forward Voltage Vf 1.8 ﹍ 2.4 V If=20mA Luminous intensity Iv 50 70 ﹍ mcd If=20mA Wavelength λd 565 ﹍ 574 nm If=20mA Reverse Current Ir ﹍ ﹍ 10 μA Vr=5V Viewing angle 2θ1/2 ﹍ ﹍ ﹍ Deg If=20mA Notes: 1. Measurement Errors:Forward Voltage: ±0.1V；Luminous Intensity: ±15%；Iv: Dominant Wavelength ±1.0nm； Color Coordinate: ±0.006；Viewing Angle (2θ1/2) ±5% 2. Electrical-Optical Characteristics (Ta=25℃) XMBIRGHTEK OPTOELECTRONICS CO.,LTD TEL:0592-5500796/5259496 WWW.XMBRIGHTEK.COM NO：HS-GC-004 第 3 页 共 12 页 Lamp Series  Outline Dimensions  All dimensions are in millimeters（inches）.  Tolerance is ±0.15 ㎜ unless otherwise noted.  Specifications are subject to change without notice. XMBIRGHTEK OPTOELECTRONICS CO.,LTD TEL:0592-5500796/5259496 WWW.XMBRIGHTEK.COM NO：HS-GC-004 第 4 页 共 12 页 Lamp Series XMBIRGHTEK OPTOELECTRONICS CO.,LTD TEL:0592-5500796/5259496 WWW.XMBRIGHTEK.COM NO：HS-GC-004 第 5 页 共 12 页 Lamp Series  Electrical-Optical Characteristics Fig.2 Relative Luminous Flux（%)-Current Forward Current IF(mA) Relative Luminous Flux(%) Intensity Fig.1 Electrical Characteristics Forward Voltage(V) Forward Current IF(mA) Fig.4 Relative Luminous Flux-Ta Relative Luminous Flux(%) Intensity Relative Luminous Intensity Fig.3 Relative Spectral Distribution Wavelength(nm) Ambient Temperature Ta (℃) Maximum Current(mA) Fig.5 Thermal Design Ambient Temperature Ta (℃) XMBIRGHTEK OPTOELECTRONICS CO.,LTD TEL:0592-5500796/5259496 WWW.XMBRIGHTEK.COM NO：HS-GC-004 第 6 页 共 12 页 Lamp Series  Rang of Bins  Forward Voltage Bins(V) Bin Code Min Max C1 1.7 1.8 C2 1.8 1.9 C3 19 2.0 C4 2.0 2.1 C5 2.1 2.2 C6 2.2 2.3 C7 2.3 2.4 Test Condition IF=20mA  Luminous Intensity Bins(mcd) Bin 51 52 53 54 55 56 57 Iv(mcd) 3-6 6-9 9-13 13-20 20-30 30-40 40-50 Bin 58 59 60 61 62 63 64 Iv(mcd) 50-70 70-90 90-120 120-160 160-200 200-260 260-330 Bin 65 66 67 68 69 70 71 Iv(mcd) 330-400 400-500 500-600 600-780 Bin 72 73 74 75 2200-2800 2800-3600 3600-4600 80 81 82 Iv(mcd) 1700-2200 Bin 79 780-1000 1000-1300 76 1300-1700 77 78 4600-6000 6000-7800 7800-10100 83 84 85 Iv(mcd) 10100-13130 13130-17000 17000-22100 22100-28700  Dominant Wavelength Bins(nm) Bin Code Min Max H1 565 568 H2 568 571 H3 571 574 XMBIRGHTEK OPTOELECTRONICS CO.,LTD TEL:0592-5500796/5259496 WWW.XMBRIGHTEK.COM NO：HS-GC-004 Test Condition IF=20mA 第 7 页 共 12 页 Lamp Series  LED Usage and Handling Dear valued clients: Thank you for choose our LED products. LEDs are delicate semiconductor product that should be handle according to the below instructions. A. Storage: 1. 2. LEDs should be stored in an environment with ambient temperature of 23 ± 5℃ and relative humidity of 40 ~ 70 %. LEDs should be used within three months of being taken out of their original packages to avoid lead frame rusting. B. Cleaning: 1. Do not use any unidentified chemical to clean LEDs, it could damage or crack the LED epoxy surface. If necessary, soak LED in alcohol for a time not exceeding one minute in normal temperature. C. Lead Frames Shaping & Trimming 1. The shaping should be done underneath the wedge point. No pressure should be exerted to the epoxy shell of the LED during shaping. 2. Bending of the leads should be done at a point at least 4 mm from the base of the LED lens. 3. Shaping of the leads should be done before soldering. 4. Lead trimming should only be done at normal temperature. D. Soldering 1. When soldering, the soldering iron needs to be at least 2mm away from the epoxy edge. After soldering, allow at least 3 minutes for LEDs to cool back to normal temperature. Do not apply any pressure to the epoxy encapsulation or the lead frame during the soldering process. 2. When reflow soldering or wave soldering, please solder once for less than 5 seconds at a maximum temperature of 260°C. During the soldering process, if the temperature or timing is not controlled within limits, it would cause the epoxy to deform or cause the die or wires within the LED to be damaged. When using soldering iron, please solder once for less than 5 seconds at a maximum temperature of 300°C. When soldering a row of LED on a PCB, 3. please do not solder both leads of a LED in sequence. (Solder all the positive lead first, then all the negative leads) XMBIRGHTEK OPTOELECTRONICS CO.,LTD TEL:0592-5500796/5259496 WWW.XMBRIGHTEK.COM NO：HS-GC-004 第 8 页 共 12 页 Lamp Series 4. Do not dip the epoxy encapsulation part of LED into any soldering paste liquid. 5. After soldering, do not adjust the location of the LED anymore. 6. When attaching electronic parts to a PCB with LEDs, the curing time for the whole PCB should be less than 60 seconds, at less than a temperature of 120°C. E. Installation 1. During the installation process, do not apply any pressure to the leads. 2. Please make sure the installation holes on the PCB matches the leads of the LED. F. ESD (Electrostatic Discharge) 1. LED is very sensitive to ESD; please make sure during the whole usage and installation process, that no ESD exist to affect the LED. Excessive ESD could damage the LED chip and result in performance degradation. 2. LED can also be damaged by electrical surge, please make sure any driving electrical circuits are equipped with surge protection. 3. During the installation process, please make sure all the equipment and personnel are grounded properly. Make use ESD protection equipment such as anti-static gloves, anti-static wrist bands, anti-static mats, anti-static clothes, anti-static shoes, and anti-static containers. 4. When LED come into contact with low electrical resistance metallic surfaces, the ESD could damage the LED due to sudden discharge of ESD. Please make sure all surfaces that will be in contact with LED are covered with anti-static mats (Surface electrical resistance of 106~~108Ω/sq). LED should be placed in anti-static containers and anti-static bags. 5. All soldering irons should be grounded and production environment should make use of ion-blowers. 6. The diameter of the dip holes on PCB should be at least 0.8mm . The distance between the centers of the two dip holes should be within ±0.02mm of the LED lead pitch (standard LED lead pitch is 2.54mm ). For special LED lead pitch specifications, the distance should be adjusted accordingly. XMBIRGHTEK OPTOELECTRONICS CO.,LTD TEL:0592-5500796/5259496 WWW.XMBRIGHTEK.COM NO：HS-GC-004 第 9 页 共 12 页 Lamp Series G. Recommended Usage Guidelines 1. Please only use 20mA (Lamp LED) and 30mA (High Flux LED) of forward current to drive LEDs whether one LED or multiple LEDs are being used. 2. Circuit connections i. Serial connection ii. Parallel connection 3. Sudden surge could damage the LED interior connections. Please design circuit with care so no sudden voltage surge or current surge will show when turning the circuit on or off. 4. When color or brightness uniformity is required while using multiple LEDs, the LED driver condition is critical. Our company guarantees the uniformity of the LEDs from the same bin when the driver current is 20mA (Lamp LED) and 30mA (High Flux LED) H. Safety 1. Please comply with government electrical safety code while using the LEDs. 2. Do not look directly into a lit LED; it could damage the eyes after only a few seconds. 3. Do not look directly into powered UV LEDs; it could damage the eyes after only a few seconds. (UV LEDs are mainly used in currency validating machines) XMBIRGHTEK OPTOELECTRONICS CO.,LTD TEL:0592-5500796/5259496 WWW.XMBRIGHTEK.COM NO：HS-GC-004 第 10 页 共 12 页 Lamp Series  Test items and results of reliability Operation Sequence Environmental Sequence Type Test Item Test Conditions Note Number of Damaged Temperature shock -45℃ 30min ↑↓20 min 105℃ 30min 1008 hrs 0/22 High Temperature Storage Ta=100℃ 1008 hrs 0/22 High Humidity Heat Storage Ta=85℃ RH=85% 1008 hrs 0/22 Low Temperature Storage Ta=-40℃ 1008 hrs 0/22 Normal Temperature Life Ta=23℃(±5℃) IF=20mA 1008 hrs 0/22 1008 hrs 0/22 1008 hrs 0/22 High Humidity Heat Life Ta=85℃(±5℃) RH=85% IF=20mA High Temperature Life XMBIRGHTEK OPTOELECTRONICS CO.,LTD TEL:0592-5500796/5259496 Ta=85℃(±5℃) IF=20mA WWW.XMBRIGHTEK.COM NO：HS-GC-004 第 11 页 共 12 页 Lamp Series  Content revision NO Date Content revision XMBIRGHTEK OPTOELECTRONICS CO.,LTD TEL:0592-5500796/5259496 Maker WWW.XMBRIGHTEK.COM NO：HS-GC-004 Audit Approved 第 12 页 共 12 页