承
认
书
SPECIFICATION FOR APPROVAL
客 戶
Customer
客
戶 料
号
Customer Part No.
弘 硕
型
号
XMBrightek Part No.
規
格
小蝴蝶黄绿光
Specification
制 表 人
MARK 2017.07.01
Prepared By
审
1SA5624G42A0CAJ1
核
Checkedy
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Customer Comfirmation
说明:一.仅致执事者:兹提供我公司产品之有关详细规格及图面资料,敬请给
预办理测试认定手续.同时敬请送返一份附有贵公司签认之测试认定后之样
品认定书.
We are sending you our specification and drawings for your approval.Please return to
us one copy“For Approval”with your approved signatures.
二、客户意见栏 Customer’S Proposal
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Reason
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原因:
COMMODITY: SURFACE MOUNT LED SMD SPECIFICATION
Part No:
Characters
ITEM
MATERIALS
Lens Color
Water Transparent
Dice
AlGaInP
Emitted Color
GREEN
§ 2.4mm×2.15mm SMT LED ,2.8mm THICKNESS
§ LOW POWER CONSUMPTION.
§ VIEWING ANGLE 20°.
§ VARIOUS COLORS AND LENS TYPES AVAILABLE.
§ PACKAGE:800 PCS/REEL.
Absolute Maximum Ratings(Ta=25℃)
Item
Symbol
Value
Unit
Power Dissipation
PD
60
mW
DC Forward Current
IF
30
mA
Pulsed Forward Current
IFP
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-30~ +80°
℃
Storage Temperature
Tstg
-40 ~ +85°
℃
Soldering Temperature
Tsol
250for5sec△
℃
100
mA
* Duty 1/10 Pulse Width 0.1ms
Electrical-Optical Characteristics(Ta=25℃)
Value
Parameter
Symbol
Min.
Typ.
Max.
Unit
Test condition
Forward Voltage
Vf
1.7
﹍
2.5
V
If=20mA
Luminous intensity
Iv
160
500
﹍
mcd
If=20mA
Wavelength
λd
565
﹍
574
nm
If=20mA
Reverse Current
Ir
﹍
﹍
10
μA
Vr=5V
2θ1/2
﹍
20
﹍
Deg
If=20mA
Viewing angle
2 頁
※Specifications are subject to change 第
without
notice.
Outline Dimensions
此规格因有加滚镀制程,底部的 MARK 标示可能会消失;不影响贵司使用!
§ All dimensions are in millimeters(inches).
§ Tolerance is ±0.25 ㎜ unless otherwise noted.
§ Specifications are subject to change without notice.
第 3 頁
COMMODITY: SURFACE MOUNT LED LAMP SPECIFICATION
Typical Characteristic
The data typical , and the value is not guaranteed.
Fig.1 IF-VF(Ta=25℃)
(Ta=25℃)
Intensity
Relative Luminous
Forward Current IF(mA)
Fig.2 Relative Luminous Intensity-IF
Forward Current IF(mA)
Forward Voltage VF(V)
Fig.3 Wavelength Characteristics
Relative Luminous
Intensity
Relative Luminous
Forward Current IF(mA)
Wavelength λ (nm)
Intensity
Fig.4 Relative Luminous Intensity-Ta
(Ta=25℃)
Ambient Temperature Ta (℃)
Directive Characteristics
Fig.5 IF-Ta
Ambient Temperature Ta (℃)
第 4 頁
Reflow Profile
Reflow Temp/Time
NOTES:
1. We recommend the reflow temperature 245℃(± 5℃).the maximum soldering temperature should be
limited to 260℃.
2. Don’t cause stress to the epoxy/silicone resin while it is exposed to high temperature.
3. Number of reflow process shall be 2 times or less.
Soldering iron
Basic spec is 5sec when 260℃. If temperature is higher, time should be shorter
(+10℃ -1sec ).Power dissipation of iron should be smaller than 15W, and temperatures should be
controllable .Surface temperature of the device should be under 230℃ .
第 5 頁
Test circuit and handling precautions
Test circuit
Handling precautions
1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift will cause
big current change (Burn out will happen).
2.Storage
2.1 It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature : 5℃~30℃(41℉~86℉)
2.2 Shelf life in sealed bag: 12 month at <5℃~30℃ and <30% R.H. after the package is
Opened, the products should be used within a week or they should be keeping to stored at
≦20 R.H. with zip-lock sealed.
3.Baking
It is recommended to baking before soldering when the pack is unsealed after 72hrs. The
Conditions are as followings:
3.1 60±3℃ x(12~24hrs) and <5%RH, taped reel type
3.2 100±3℃ x(45min~1hr), bulk type
3.3 130±3℃ x(15~30min), bulk type
第 6 頁
Test items and results of reliability
Type
Test Item
Test Conditions
Note
Number of
Damaged
-45℃ 30min
Temperature Cycle
↑↓20 min
100 cycle
0/22
100 cycle
0/22
10 cycle
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
1000 hrs
0/22
500 hrs
0/22
1000 hrs
0/22
105℃ 30min
-10℃ 15min
Environmental
Sequence
Thermal Shock
↑↓5min
100℃ 15min
High Humidity Heat Cycle
30℃ 65℃
90%RH 24hrs/1cycle
High Temperature Storage
Humidity Heat Storage
Ta=100℃
Ta=85℃
RH=85%
Low Temperature Storage
Life Test
Ta=-40℃
Ta=25℃
Operation
Sequence
IF=20mA
High Humidity Heat Life Test
85℃ RH=85%
IF=10mA
Low Temperature Life Test
Ta=-20℃
IF=20mA
第 7 頁
Single-Color High Performance SMD Top LEDs Packaging Specifications
Dimensions of Reel (Unit: mm)
Dimensions of Tape (Unit: mm)
Moisture Resistant Packaging
第 8 頁
NOTES
1. Empty component pockets are sealed with top cover tape;
2. The maximum number of missing lamps is two;
3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications;
4. 4,000pcs/Reel
NOTES:
Reeled products (the most numbers of products are 2,000pcs) packed in a seal off moisture-proof bag
along with a desiccant one by one, Seven moisture-proof bag of maximums (total maximum number of products
are 14,000pcs) packed in an inside box (size: about 238mm x about 194mm x about 102mm) and four inside boxes
of maximums are put in the outside box (size: about 410mm x about 254mm x about 229mm) Together with buffer
material, and it is packed. (Part No., Lot No., quantity should appear on the label on the moisture-proof bag, part
No. And quantity should appear on the insertion request form on the cardboard box.) .
LED Usage and Handling Instructions
No.1、A、Manual soldering:
1、Soldering iron & tin wire
A soldering iron of 25-30W is recommended; the diameter of tin wire should
be less than 0.5mm.
2、Temperature adjustment
To adjust the temperature from 280 to 350℃ according to different PCB
board
3、Soldering time
Please control the soldering time within 3-5 seconds. Do not apply any
pressure to the epoxy encapsulation as well as the leads during the soldering
process.
4、Soldering parameters according to different specifications
Parameters
SIDE
VIEW
TOP3020
Soldering iron
25-30W
25-30W
Temperature
280-300℃
300-320℃
Soldering time
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