A18172-05

TpcmTM 7000 High Performance TIM PRODUCT DESCRIPTION Tpcm™ 7000 is newest in Laird’s line of high-performance TIM product offerings. With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics. Softening between 50°C – 70°C, the initial pad thickness can decrease to a bondline as thin as 35µm. Coupled with superior wetting of the mating surfaces and displacing air, Tpcm™ 7000 provides industry leading lowest thermal resistance. Tpcm™ 7000 reliability has been demonstrated though exposure to 2000 hours of various aging tests resulting in proven dependability at an operating temperature of 150°C. The specialty polymeric matrix offers superior pump out resistance when compared to thermally conductive greases and other phase change materials. Tpcm™ 7000 has been formulated to provide just the right tack, remaining on liners yet easily removeable for application. FEATURES & BENEFITS MARKETS • 7.5 W/mK bulk thermal conductivity • Non silicone formulation that provides naturally tacky surface • Fully characterized long term reliability • No pump out • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH • Easy rework • • • • • • AVAILABILITY STORAGE CONDITIONS • Four thickness: 0.125mm, 0.2 mm, 0.25mm, 0.4mm Shelf life: 1 year from date of shipment in sealed bag Storage conditions: 0 to 40C in sealed bag. No humidity requirements. See A18223-00 “Instruction for Use” for more details (Tpcm 7125, Tpcm 7200, Tpcm 7250, Tpcm 7400 respectively) • Sheets and Die Cuts, Die cut on strips w/tabs, Die cut on rolls w/tabs • Designed for use with the TIM Print, Refer to “TIM Print Application Guide” Graphics Card Desktops Servers IGBTs Automotive Memory Modules • Game Consoles TYPICAL PROPERTIES PROPERTY Construction USA: +1.866.928.8181 Europe: +49.8031.24600 Asia: +86.755.2714.1166 www.laird.com Color Thickness Density Bulk Thermal Conductivity Thermal Resistance 10 psi & 70°C 50 psi & 70°C Operating Temperature Range Softening Temperature Range Minimum Bondline Thickness Dielectric Constant Volume Resistivity UL Recognition VALUE Free Standing, Filled, NonSilicone Thermoplastic Grey 0.13mm, 0.20mm, 0.25mm, 0.40mm 2.5 g/cc 7.5 W/m-K TEST METHOD N/A 0.10°C-cm2/W 0.06°C-cm2/W ASTM D5470 -40°C to 125°C 50°C to 70°C 35µm 31.54 @1MHz 5.4x1015 Ω-cm V0 Laird Test Method Laird Test Method Laird Test Method ASTM D150 ASTM D991 UL94 Visual Helium Pycnometer Hot Disk THR-DS-Tpcm 7000-03172023 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2020 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.