BUK7V4R2-40H
Dual N-channel 40 V, 4.2 mOhm standard level MOSFET in
LFPAK56D (half-bridge configuration)
9 May 2023
Product data sheet
1. General description
Dual, standard level N-channel MOSFET in an LFPAK56D package
(half-bridge configuration), using Trench 9 TrenchMOS technology. This
product has been designed and qualified to AEC-Q101.
An internal connection is made between the source (S1) of the highside FET to the drain (D2) of the low-side FET, making the device ideal
to use as a half-bridge switch in high-performance automotive PWM
applications.
D1
G1
S1, D2
G2
S2
aaa-028081
2. Features and benefits
•
•
•
•
LFPAK56D package with half-bridge configuration enables:
• Reduced PCB layout complexity
• PCB shrinkage through reduced component footprint for 3-phase motor drive
• Improved system level Rth(j-amb) due to optimized package design
• Lower parasitic inductance to support higher efficiency
• Footprint compatibility with LFPAK56D Dual package
Advanced AEC-Q101 grade Trench 9 silicon technology:
• Low power losses, high power density
• Superior avalanche performance
• Repetitive avalanche rated
LFPAK copper clip packaging provides high robustness and reliability
Gull wing leads support high manufacturability and Automated Optical Inspection (AOI)
3. Applications
•
•
•
•
•
12 V automotive systems
Powertrain, chassis, body and infotainment applications
Brushless or brushed DC motor drive
DC-to-DC systems
LED lighting
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
-
40
V
-
-
98
A
-
-
85
W
Limiting values FET1 and FET2
VDS
drain-source voltage
25 °C ≤ Tj ≤ 175 °C
ID
drain current
VGS = 10 V; Tmb = 25 °C; Fig. 2
Ptot
total power dissipation
Tmb = 25 °C; Fig. 1
[1]
BUK7V4R2-40H
Nexperia
Dual N-channel 40 V, 4.2 mOhm standard level MOSFET in LFPAK56D (half-bridge configuration)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VGS = 10 V; ID = 20 A; Tj = 25 °C;
Fig. 11
2.5
3.5
4.2
mΩ
-
4.7
9.4
nC
Static characteristics FET1 and FET2
RDSon
drain-source on-state
resistance
Dynamic characteristics FET1 and FET2
QGD
[1]
gate-drain charge
ID = 20 A; VDS = 32 V; VGS = 10 V;
Tj = 25 °C; Fig. 13; Fig. 14
98A continuous current has been successfully demonstrated during application tests. Practically the current will be limited by PCB,
thermal design and operating temperature.
5. Pinning information
Table 2. Pinning information
Pin
Symbol
Description
1
S2
source2
2
G2
gate2
3
S1, D2
source1, drain2
4
G1
gate1
5
D1
drain1
6
D1
drain1
7
S1, D2
source1, drain2
8
S1, D2
source1, drain2
Simplified outline
8
7
6
Graphic symbol
5
D1
G1
S1, D2
G2
1
2
3
4
S2
LFPAK56D; Dual
LFPAK (SOT1205)
aaa-028081
6. Ordering information
Table 3. Ordering information
Type number
Package
BUK7V4R2-40H
Name
Description
Version
LFPAK56D;
Dual LFPAK
plastic, single ended surface mounted package
(LFPAK56D); 8 leads
SOT1205
7. Marking
Table 4. Marking codes
Type number
Marking code
BUK7V4R2-40H
74V240H
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Limiting values FET1 and FET2
VDS
drain-source voltage
25 °C ≤ Tj ≤ 175 °C
-
40
V
VGS
gate-source voltage
DC; Tj = 25 °C
-20
20
V
Ptot
total power dissipation
Tmb = 25 °C; Fig. 1
-
85
W
BUK7V4R2-40H
Product data sheet
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2 / 13
BUK7V4R2-40H
Nexperia
Dual N-channel 40 V, 4.2 mOhm standard level MOSFET in LFPAK56D (half-bridge configuration)
Symbol
Parameter
Conditions
Min
Max
Unit
ID
drain current
VGS = 10 V; Tmb = 25 °C; Fig. 2
-
98
A
VGS = 10 V; Tmb = 100 °C; Fig. 2
-
69.5
A
pulsed; tp ≤ 10 µs; Tmb = 25 °C; Fig. 3
[1]
IDM
peak drain current
-
393
A
Tstg
storage temperature
-55
175
°C
Tj
junction temperature
-55
175
°C
Source-drain diode FET1 and FET2
IS
source current
Tmb = 25 °C
-
85
A
ISM
peak source current
pulsed; tp ≤ 10 µs; Tmb = 25 °C
-
393
A
Avalanche ruggedness FET1 and FET2
EDS(AL)S
non-repetitive drainID = 82.6 A; Vsup ≤ 40 V; RGS = 50 Ω;
source avalanche energy VGS = 10 V; Tj(init) = 25 °C; unclamped;
Fig. 4
[2] [3]
-
42.3
mJ
IAS
non-repetitive avalanche Vsup = 40 V; VGS = 10 V; Tj(init) = 25 °C;
current
RGS = 50 Ω
[4]
-
82.6
A
[1]
[2]
[3]
[4]
98A continuous current has been successfully demonstrated during application tests. Practically the current will be limited by PCB,
thermal design and operating temperature.
Single-pulse avalanche rating limited by maximum junction temperature of 175 °C.
Refer to application note AN10273 for further information.
Protected by 100% test
03aa16
120
aaa-032380
100
ID
(A)
Pder
(%)
80
80
60
40
40
20
0
Fig. 1.
0
50
100
150
Tmb (°C)
0
200
Fig. 2.
Product data sheet
25
50
75
100
125
150 175
Tmb (°C)
200
VGS ≥ 10 V
(1) 98A continuous current has been successfully
demonstrated during application tests. Practically
the current will be limited by PCB, thermal design
and operating temperature.
Normalized total power dissipation as a
function of mounting base temperature
BUK7V4R2-40H
0
Continuous drain current as a function of
mounting base temperature, FET1 and FET2
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3 / 13
BUK7V4R2-40H
Nexperia
Dual N-channel 40 V, 4.2 mOhm standard level MOSFET in LFPAK56D (half-bridge configuration)
ID
(A)
aaa-032382
103
Limit RDSon = VDS / ID
102
tp = 10 µs
100 µs
10
DC
1 ms
10 ms
100 ms
1
10-1
10-1
1
10
VDS (V)
102
Tmb = 25 °C; IDM is a single pulse
Fig. 3.
Safe operating area; continuous and peak drain currents as a function of drain-source voltage, FET1 and
FET2
IAL
(A)
aaa-032381
102
(1)
10
(2)
1
(3)
10-1
10-3
10-2
10-1
1
tAL (ms)
10
(1) Tj (init) = 25 °C; (2) Tj (init) = 150 °C; (3) Repetitive Avalanche
Fig. 4.
Avalanche rating; avalanche current as a function of avalanche time, FET1 and FET2
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Rth(j-mb)
Conditions
thermal resistance from Fig. 5
junction to mounting
base
BUK7V4R2-40H
Product data sheet
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9 May 2023
Min
Typ
Max
Unit
-
1.64
1.76
K/W
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Nexperia B.V. 2023. All rights reserved
4 / 13
BUK7V4R2-40H
Nexperia
Dual N-channel 40 V, 4.2 mOhm standard level MOSFET in LFPAK56D (half-bridge configuration)
aaa-032383
10
Zth(j-mb)
(K/W)
1 δ = 0.5
0.2
0.1
P
10-1 0.05
δ=
tp
T
0.02
single shot
10-2
10-6
Fig. 5.
10-5
t
tp
10-4
10-3
10-2
T
10-1
tp (s)
1
Transient thermal impedance from junction to mounting base as a function of pulse duration, FET1 and
FET2
10. Characteristics
Table 7. Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
ID = 250 µA; VGS = 0 V; Tj = 25 °C
40
43
-
V
ID = 250 µA; VGS = 0 V; Tj = -40 °C
-
40.5
-
V
ID = 250 µA; VGS = 0 V; Tj = -55 °C
36
40
-
V
ID = 1 mA; VDS=VGS; Tj = 25 °C; Fig. 9;
Fig. 10
2.4
3
3.6
V
ID = 1 mA; VDS=VGS; Tj = 175 °C;
Fig. 10
1
-
-
V
ID = 1 mA; VDS=VGS; Tj = -55 °C; Fig. 10
-
-
4.3
V
VDS = 40 V; VGS = 0 V; Tj = 25 °C
-
0.007
1
µA
VDS = 16 V; VGS = 0 V; Tj = 125 °C
-
0.3
10
µA
VDS = 40 V; VGS = 0 V; Tj = 175 °C
-
53
500
µA
VGS = 20 V; VDS = 0 V; Tj = 25 °C
-
2
100
nA
VGS = -10 V; VDS = 0 V; Tj = 25 °C
-
2
100
nA
VGS = 10 V; ID = 20 A; Tj = 25 °C;
Fig. 11
2.5
3.5
4.2
mΩ
VGS = 10 V; ID = 20 A; Tj = 105 °C;
Fig. 12
3.4
5.2
6.4
mΩ
VGS = 10 V; ID = 20 A; Tj = 125 °C;
Fig. 12
3.7
5.8
7.2
mΩ
VGS = 10 V; ID = 20 A; Tj = 175 °C;
Fig. 12
4.5
7.2
8.8
mΩ
f = 1 MHz; Tj = 25 °C
0.72
1.8
4.5
Ω
-
26
37
nC
-
7.8
12
nC
-
4.7
9.4
nC
Static characteristics FET1 and FET2
V(BR)DSS
VGS(th)
IDSS
drain-source
breakdown voltage
gate-source threshold
voltage
drain leakage current
IGSS
gate leakage current
RDSon
drain-source on-state
resistance
RG
gate resistance
Dynamic characteristics FET1 and FET2
QG(tot)
total gate charge
QGS
gate-source charge
QGD
gate-drain charge
BUK7V4R2-40H
Product data sheet
ID = 20 A; VDS = 32 V; VGS = 10 V;
Tj = 25 °C; Fig. 13; Fig. 14
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BUK7V4R2-40H
Nexperia
Dual N-channel 40 V, 4.2 mOhm standard level MOSFET in LFPAK56D (half-bridge configuration)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Ciss
input capacitance
-
1850
2590
pF
Coss
output capacitance
VDS = 25 V; VGS = 0 V; f = 1 MHz;
Tj = 25 °C; Fig. 15
-
565
791
pF
Crss
reverse transfer
capacitance
-
91
200
pF
td(on)
turn-on delay time
-
7
-
ns
tr
rise time
-
9
-
ns
td(off)
turn-off delay time
-
19
-
ns
tf
fall time
-
11.8
-
ns
VDS = 30 V; RL = 1.5 Ω; VGS = 10 V;
RG(ext) = 5 Ω; Tj = 25 °C
Source-drain diode FET1 and FET2
VSD
source-drain voltage
IS = 20 A; VGS = 0 V; Tj = 25 °C; Fig. 16
-
0.81
1
V
trr
reverse recovery time
-
18.6
-
ns
Qr
recovered charge
IS = 20 A; dIS/dt = -100 A/µs; VGS = 0 V;
VDS = 20 V; Tj = 25 °C
-
9.2
-
nC
ID
(A)
aaa-032384
80
VGS = 5.5 V
5V
64
8
48
6
10 V
32
0
Fig. 6.
4
4.5 V
16
2
4V
0
1
2
3
VDS (V)
aaa-032385
10
RDSon
(mΩ)
0
4
0
4
8
12
16
VGS (V)
20
Tj = 25 °C
Tj = 25 °C; ID = 20 A
Output characteristics; drain current as a
Fig. 7.
function of drain-source voltage; typical values,
FET1 and FET2
Drain-source on-state resistance as a function
of gate-source voltage; typical values, FET1 and
FET2
BUK7V4R2-40H
Product data sheet
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BUK7V4R2-40H
Nexperia
Dual N-channel 40 V, 4.2 mOhm standard level MOSFET in LFPAK56D (half-bridge configuration)
aaa-032386
160
ID
(A)
aaa-018138
10-1
ID
(A)
10-2
120
Min
10-3
Typ
Max
80
10-4
40
10-5
175°C
0
0
1
2
3
25°C
Tj = -55°C
4
5
6
VGS (V)
10-6
7
VDS = 8 V
Fig. 8.
VGS(th)
(V)
0
1
2
3
4
VGS (V)
5
Tj = 25 °C; VDS = 5 V
Transfer characteristics; drain current as a
function of gate-source voltage; typical values,
FET1 and FET2
Fig. 9.
aaa-018139
5
Sub-threshold drain current as a function of
gate-source voltage, FET1 and FET2
aaa-032387
20
RDSon
(mΩ)
4
4.5 V
5V
16
Max
3
12
Typ
2
8
5.5 V
Min
1
4
6V
0
-60
-30
0
30
60
90
120 150
Tj (°C)
0
180
ID = 1 mA ; VDS = VGS
Product data sheet
16
32
48
64
ID (A)
80
Tj = 25 °C
Fig. 10. Gate-source threshold voltage as a function of
junction temperature, FET1 and FET2
BUK7V4R2-40H
0
VGS = 10 V
8V
Fig. 11. Drain-source on-state resistance as a function
of drain current; typical values, FET1 and FET2
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BUK7V4R2-40H
Nexperia
Dual N-channel 40 V, 4.2 mOhm standard level MOSFET in LFPAK56D (half-bridge configuration)
a
aaa-032388
2.4
VGS
(V)
aaa-032389
10
8
1.8
6
1.2
32 V
4
VDS = 14 V
0.6
0
-60
2
-30
0
30
60
90
120 150
Tj (°C)
0
180
0
4
8
12
16
20
24
28
QG (nC)
32
Tj = 25 °C; ID = 20 A
Fig. 12. Normalized drain-source on-state resistance
factor as a function of junction temperature,
FET1 and FET2
Fig. 13. Gate-source voltage as a function of gate
charge; typical values, FET1 and FET2
aaa-032390
104
C
(pF)
VDS
ID
Ciss
103
Coss
VGS(pl)
102
VGS(th)
Crss
VGS
Q GS2
QGS1
Q GS
10
10-1
QGD
QG(tot)
BUK7V4R2-40H
Product data sheet
10
VDS (V)
102
VGS = 0 V; f = 1 MHz
003aaa508
Fig. 14. Gate charge waveform definitions
1
Fig. 15. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values, FET1 and FET2
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BUK7V4R2-40H
Nexperia
Dual N-channel 40 V, 4.2 mOhm standard level MOSFET in LFPAK56D (half-bridge configuration)
aaa-032391
160
IS
(A)
128
96
175°C
64
32
Tj = 25°C
-55°C
0
0
0.2
0.4
0.6
0.8
1
VSD (V)
1.2
VGS = 0 V
Fig. 16. Source-drain (diode forward) current as a function of source-drain (diode forward) voltage; typical values,
FET1 and FET2
BUK7V4R2-40H
Product data sheet
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BUK7V4R2-40H
Nexperia
Dual N-channel 40 V, 4.2 mOhm standard level MOSFET in LFPAK56D (half-bridge configuration)
11. Package outline
Plastic single ended surface mounted package LFPAK56D; 8 leads
E
SOT1205
A
A
b1
c1
L1
mounting
base
D
H
D1
D2
L
1
2
3
e
b
(8x)
4
w
X
c
A
E1
E2
A1
C
θ
Lp
detail X
0
2.5
A
max 1.05
nom
min 1.02
mm
5 mm
scale
Dimensions
Unit
y C
D(1) D1(1)
D2
(ref)
E(1) E1(1)
4.4
0.25 0.30 4.70 4.55
3.5
5.30
1.8
0.85
4.1
0.19 0.24 4.45 4.35
3.4
4.95
1.6
0.60
A1
b
b1
0.1
0.50
0.0
0.35
c
c1
E2
e
1.27
H
L
L1
Lp
6.2
1.3
0.55 0.85
5.9
0.8
0.30 0.40
w
y
0.25
0.1
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
Outline
version
References
IEC
JEDEC
JEITA
θ
8°
0°
sot1205_po
European
projection
Issue date
14-08-21
14-10-28
SOT1205
Fig. 17. Package outline LFPAK56D; Dual LFPAK (SOT1205)
BUK7V4R2-40H
Product data sheet
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BUK7V4R2-40H
Nexperia
Dual N-channel 40 V, 4.2 mOhm standard level MOSFET in LFPAK56D (half-bridge configuration)
12. Soldering
Footprint information for reflow soldering of LFPAK56D package
SOT1205
5.85
0.57
0.025
0.57
0.7
1.97
0.65
1.27
1.9
3.325
3.175
3.2
2.0
1.275
0.8
1.875
2.1
2.7
1.0
3.85
3.975
0.025
1.1
1.15
0.65
1.27
1.1
1.44
solder land
solder land plus solder paste
solder paste deposit
solder resist
occupied area
Dimensions in mm
Issue date
0.7
14-07-28
20-04-20
sot1205_fr
Fig. 18. Reflow soldering footprint for LFPAK56D; Dual LFPAK (SOT1205)
BUK7V4R2-40H
Product data sheet
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BUK7V4R2-40H
Nexperia
Dual N-channel 40 V, 4.2 mOhm standard level MOSFET in LFPAK56D (half-bridge configuration)
equipment, nor in applications where failure or malfunction of an Nexperia
product can reasonably be expected to result in personal injury, death or
severe property or environmental damage. Nexperia and its suppliers accept
no liability for inclusion and/or use of Nexperia products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
13. Legal information
Data sheet status
Document status
[1][2]
Product
status [3]
Definition
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Objective [short]
data sheet
Development
This document contains data from
the objective specification for
product development.
Preliminary [short]
data sheet
Qualification
This document contains data from
the preliminary specification.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.
Product [short]
data sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the internet at https://www.nexperia.com.
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Nexperia does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the relevant
full data sheet, which is available on request via the local Nexperia sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
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data sheet shall define the specification of the product as agreed between
Nexperia and its customer, unless Nexperia and customer have explicitly
agreed otherwise in writing. In no event however, shall an agreement be
valid in which the Nexperia product is deemed to offer functions and qualities
beyond those described in the Product data sheet.
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to be accurate and reliable. However, Nexperia does not give any
representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. Nexperia takes no responsibility
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Customers are responsible for the design and operation of their applications
and products using Nexperia products, and Nexperia accepts no liability for
any assistance with applications or customer product design. It is customer’s
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or problem which is based on any weakness or default in the customer’s
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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BUK7V4R2-40H
Product data sheet
All information provided in this document is subject to legal disclaimers.
9 May 2023
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Nexperia B.V. 2023. All rights reserved
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BUK7V4R2-40H
Nexperia
Dual N-channel 40 V, 4.2 mOhm standard level MOSFET in LFPAK56D (half-bridge configuration)
Contents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 2
9. Thermal characteristics............................................... 4
10. Characteristics............................................................ 5
11. Package outline........................................................ 10
12. Soldering................................................................... 11
13. Legal information......................................................12
©
Nexperia B.V. 2023. All rights reserved
For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 9 May 2023
BUK7V4R2-40H
Product data sheet
All information provided in this document is subject to legal disclaimers.
9 May 2023
©
Nexperia B.V. 2023. All rights reserved
13 / 13