BUK9K13-40H
Dual N-channel 40 V, 13 mOhm logic level MOSFET in
LFPAK56D
11 February 2021
Product data sheet
1. General description
Dual, Logic level N-channel MOSFET in an LFPAK56D package, using Trench 9 TrenchMOS
technology. This product has been designed and qualified to AEC-Q101 for use in high
performance automotive applications
2. Features and benefits
•
•
•
•
Fully automotive qualified to AEC-Q101 at 175 °C
Trench 9 superjunction technology:
• Low power losses, high power density
LFPAK copper clip package technology:
• High robustness and reliability
• Gull wing leads for high manufacturability and AOI
Repetitive avalanche rated
3. Applications
•
•
•
•
12 V, 24 V and 48 V automotive systems
Motors, lamps and solenoid control
Transmission control
DC-to-DC conversion
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDS
drain-source voltage
25 °C ≤ Tj ≤ 175 °C
-
-
40
V
ID
drain current
VGS = 10 V; Tmb = 25 °C; Fig. 2
-
-
42
A
Ptot
total power dissipation
Tmb = 25 °C; Fig. 1
-
-
46
W
VGS = 4.5 V; ID = 10 A; Tj = 25 °C;
Fig. 11
9.8
14.1
16.9
mΩ
ID = 10 A; VDS = 32 V; VGS = 5 V;
Tj = 25 °C; Fig. 13; Fig. 14
-
1.8
4.2
nC
IS = 10 A; dIS/dt = -100 A/µs; VGS = 0 V; [2]
VDS = 20 V; Tj = 25 °C
-
16.2
-
nC
[1]
Static characteristics FET1 and FET2
RDSon
drain-source on-state
resistance
Dynamic characteristics FET1 and FET2
QGD
gate-drain charge
Source-drain diode FET1 and FET2
Qr
[1]
[2]
recovered charge
42A continuous current has been successfully demonstrated during application tests. Practically the current will be limited by PCB,
thermal design and operating temperature.
Includes capacitive recovery
BUK9K13-40H
Nexperia
Dual N-channel 40 V, 13 mOhm logic level MOSFET in LFPAK56D
5. Pinning information
Table 2. Pinning information
Pin
Symbol
Description
1
S1
source1
2
G1
gate1
3
S2
source2
4
G2
gate2
5
D2
drain2
6
D2
drain2
7
D1
drain1
8
D1
drain1
Simplified outline
8
7
6
Graphic symbol
5
D1 D1
S1
D2 D2
G1
S2
G2
mbk725
1
2
3
4
LFPAK56D; Dual
LFPAK (SOT1205)
6. Ordering information
Table 3. Ordering information
Type number
Package
BUK9K13-40H
Name
Description
Version
LFPAK56D;
Dual LFPAK
plastic, single ended surface mounted package (LFPAK56D); 8
leads
SOT1205
7. Marking
Table 4. Marking codes
Type number
Marking code
BUK9K13-40H
91340HK
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
25 °C ≤ Tj ≤ 175 °C
-
40
V
VGS
gate-source voltage
DC; Tj = 25 °C
-20
20
V
Ptot
total power dissipation
Tmb = 25 °C; Fig. 1
-
46
W
ID
drain current
VGS = 10 V; Tmb = 25 °C; Fig. 2
-
42
A
VGS = 10 V; Tmb = 100 °C; Fig. 2
-
30
A
pulsed; tp ≤ 10 µs; Tmb = 25 °C; Fig. 3
[1]
IDM
peak drain current
-
169
A
Tstg
storage temperature
-55
175
°C
Tj
junction temperature
-55
175
°C
Source-drain diode FET1 and FET2
IS
source current
Tmb = 25 °C
-
42
A
ISM
peak source current
pulsed; tp ≤ 10 µs; Tmb = 25 °C
-
169
A
BUK9K13-40H
Product data sheet
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Nexperia
Dual N-channel 40 V, 13 mOhm logic level MOSFET in LFPAK56D
Symbol
Parameter
Conditions
Min
Max
Unit
Avalanche Ruggedness FET1 and FET2
EDS(AL)S
non-repetitive drainID = 39.9 A; Vsup ≤ 40 V; RGS = 50 Ω;
source avalanche energy VGS = 10 V; Tj(init) = 25 °C; Fig. 4
[2] [3]
-
10.6
mJ
IAS
non-repetitive avalanche Vsup = 40 V; VGS = 10 V; Tj(init) = 25 °C;
current
RGS = 50 Ω; Fig. 4
[4]
-
39.9
A
[1]
[2]
[3]
[4]
42A continuous current has been successfully demonstrated during application tests. Practically the current will be limited by PCB,
thermal design and operating temperature.
Single-pulse avalanche rating limited by maximum junction temperature of 175 °C.
Refer to application note AN10273 for further information.
Protected by 100% test
03aa16
120
ID
(A)
Pder
(%)
aaa-032436
50
40
80
30
20
40
10
0
Fig. 1.
0
50
100
150
Tmb (°C)
0
200
25
50
75
100
125
150 175
Tmb (°C)
Normalized total power dissipation as a
function of mounting base temperature
Continuous drain current as a function of
mounting base temperature, FET1 and FET2
aaa-032438
103
102
200
VGS ≥ 10 V
42A continuous current has been successfully
demonstrated during application tests. Practically
the current will be limited by PCB, thermal design
and operating temperature.
Fig. 2.
ID
(A)
0
Limit RDSon = VDS / ID
tp = 10 µs
100 µs
10
DC
1
1 ms
10 ms
100 ms
10-1
10-1
Fig. 3.
1
10
VDS (V)
102
Safe operating area; continuous and peak drain current as a function of drain-source voltage, FET1 and
FET2
BUK9K13-40H
Product data sheet
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BUK9K13-40H
Nexperia
Dual N-channel 40 V, 13 mOhm logic level MOSFET in LFPAK56D
IAL
(A)
aaa-032437
102
(1)
10
(2)
1
(3)
10-1
10-2
10-3
10-2
10-1
1
tAL (ms)
10
(1) Tj (init) = 25 °C; (2) Tj (init) = 150 °C; (3) Repetitive Avalanche
Fig. 4.
Avalanche rating; avalanche current as a function of avalanche time, FET1 and FET2
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Rth(j-mb)
Conditions
thermal resistance from Fig. 5
junction to mounting
base
Min
Typ
Max
Unit
-
3
3.23
K/W
aaa-032439
10
Zth(j-mb)
(K/W)
δ = 0.5
1
0.2
0.1
0.05
10-1
0.02
P
single shot
δ=
Fig. 5.
10-5
10-4
10-3
10-2
T
t
tp
10-2
10-6
tp
T
10-1
tp (s)
1
Transient thermal impedance from junction to mounting base as a function of pulse duration, FET1 and
FET2
BUK9K13-40H
Product data sheet
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Nexperia
Dual N-channel 40 V, 13 mOhm logic level MOSFET in LFPAK56D
10. Characteristics
Table 7. Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
ID = 250 µA; VGS = 0 V; Tj = 25 °C
40
43
-
V
ID = 250 µA; VGS = 0 V; Tj = -40 °C
-
40.5
-
V
ID = 250 µA; VGS = 0 V; Tj = -55 °C
36
40
-
V
ID = 1 mA; VDS=VGS; Tj = 25 °C; Fig. 9;
Fig. 10
1.5
1.85
2.2
V
ID = 1 mA; VDS=VGS; Tj = 175 °C;
Fig. 10
0.7
-
-
V
ID = 1 mA; VDS=VGS; Tj = -55 °C; Fig. 10
-
-
2.6
V
VDS = 40 V; VGS = 0 V; Tj = 25 °C
-
0.01
5
µA
VDS = 16 V; VGS = 0 V; Tj = 125 °C
-
0.14
10
µA
VDS = 40 V; VGS = 0 V; Tj = 175 °C
-
26
500
µA
VGS = -10 V; VDS = 0 V; Tj = 25 °C
-
2
100
nA
VGS = 16 V; VDS = 0 V; Tj = 25 °C
-
2
100
nA
VGS = 10 V; ID = 10 A; Tj = 25 °C;
Fig. 11
7.9
11.4
13.6
mΩ
VGS = 10 V; ID = 10 A; Tj = 105 °C;
Fig. 12
10.9
16
20.4
mΩ
VGS = 10 V; ID = 10 A; Tj = 125 °C;
Fig. 12
12
17.4
21.9
mΩ
VGS = 10 V; ID = 10 A; Tj = 175 °C;
Fig. 12
14.5
20.9
26.4
mΩ
VGS = 4.5 V; ID = 10 A; Tj = 25 °C;
Fig. 11
9.8
14.1
16.9
mΩ
VGS = 4.5 V; ID = 10 A; Tj = 105 °C;
Fig. 12
13.5
20
25.4
mΩ
VGS = 4.5 V; ID = 10 A; Tj = 125 °C;
Fig. 12
14.8
21.6
27.2
mΩ
VGS = 4.5 V; ID = 10 A; Tj = 175 °C;
Fig. 12
18
26.6
32.8
mΩ
f = 1 MHz; Tj = 25 °C
0.7
1.8
4.2
Ω
ID = 10 A; VDS = 32 V; VGS = 10 V;
Tj = 25 °C; Fig. 13; Fig. 14
-
13
19.4
nC
ID = 10 A; VDS = 32 V; VGS = 5 V;
Tj = 25 °C; Fig. 13; Fig. 14
-
6.8
10.2
nC
-
2.3
3.8
nC
-
1.8
4.2
nC
-
848
1160
pF
-
280
420
pF
-
39
84
pF
-
6.5
-
ns
-
9.7
-
ns
-
10.1
-
ns
Static characteristics FET1 and FET2
V(BR)DSS
VGS(th)
IDSS
IGSS
RDSon
RG
drain-source
breakdown voltage
gate-source threshold
voltage
drain leakage current
gate leakage current
drain-source on-state
resistance
gate resistance
Dynamic characteristics FET1 and FET2
QG(tot)
total gate charge
QGS
gate-source charge
QGD
gate-drain charge
Ciss
input capacitance
Coss
output capacitance
Crss
reverse transfer
capacitance
td(on)
turn-on delay time
tr
rise time
td(off)
turn-off delay time
BUK9K13-40H
Product data sheet
VDS = 25 V; VGS = 0 V; f = 1 MHz;
Tj = 25 °C; Fig. 15
VDS = 32 V; RL = 3.2 Ω; VGS = 5 V;
RG(ext) = 5 Ω; Tj = 25 °C
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BUK9K13-40H
Nexperia
Dual N-channel 40 V, 13 mOhm logic level MOSFET in LFPAK56D
Symbol
Parameter
tf
fall time
Conditions
Min
Typ
Max
Unit
-
7.8
-
ns
Source-drain diode FET1 and FET2
VSD
source-drain voltage
IS = 10 A; VGS = 0 V; Tj = 25 °C; Fig. 16
-
0.81
1
V
trr
reverse recovery time
-
21.5
-
ns
Qr
recovered charge
IS = 10 A; dIS/dt = -100 A/µs; VGS = 0 V;
VDS = 20 V; Tj = 25 °C
[1]
-
16.2
-
nC
[1]
Includes capacitive recovery
ID
(A)
aaa-032440
60
10 V
48
aaa-032441
40
RDSon
(mΩ)
4.5 V
3.5 V
30
36
20
24
VGS = 3 V
12
10
2.8 V
2.6 V
0
Fig. 6.
ID
(A)
0
1
2
3
VDS (V)
0
4
0
4
8
12
20
Tj = 25 °C
Tj = 25 °C; ID = 10 A
Output characteristics; drain current as a
Fig. 7.
function of drain-source voltage; typical values,
FET1 and FET2
Drain-source on-state resistance as a function
of gate-source voltage; typical values. FET1 and
FET2
aaa-032442
60
aaa-029502
10-1
ID
(A)
48
10-2
36
10-3
Min
175°C
12
0
Typ
Max
10-4
24
10-5
Tj = -55°C
25°C
0
1
2
3
4
VGS (V)
10-6
5
VDS = 8 V
Fig. 8.
16
VGS (V)
Product data sheet
0.5
1
1.5
2
2.5
VGS (V)
3
Tj = 25 °C; VDS = 5 V
Transfer characteristics; drain current as a
function of gate-source voltage; typical values,
FET1 and FET2
BUK9K13-40H
0
Fig. 9.
Sub-threshold drain current as a function of
gate-source voltage, FET1 and FET2
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Nexperia
Dual N-channel 40 V, 13 mOhm logic level MOSFET in LFPAK56D
aaa-029503
3
VGS(th)
(V)
2.5
aaa-032443
80
RDSon
(mΩ)
2.8 V
64
Max
3V
2
48
Typ
1.5
Min
32
3.5 V
1
0.5
0
-60
-30
0
30
60
90
120 150
Tj (°C)
0
180
ID = 1 mA ; VDS = VGS
0
5
10
15
20
25
30
35
ID (A)
40
Fig. 11. Drain-source on-state resistance as a function
of drain current; typical values, FET1 and FET2
aaa-029504
2
VGS
(V)
aaa-032444
10
1.7
8
VGS = 4.5 V
1.4
6
10 V
1.1
4
0.8
2
0.5
-60
VGS = 10 V
Tj = 25 °C
Fig. 10. Gate-source threshold voltage as a function of
junction temperature, FET1 and FET2
a
4.5 V
16
-30
0
30
60
90
120 150
Tj (°C)
0
180
32 V
VDS = 14 V
0
4
8
12
16
QG (nC)
20
Tj = 25 °C; ID = 10 A
Fig. 12. Normalized drain-source on-state resistance
factor as a function of junction temperature,
FET1 and FET2
BUK9K13-40H
Product data sheet
Fig. 13. Gate-source voltage as a function of gate
charge; typical values, FET1 and FET2
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Dual N-channel 40 V, 13 mOhm logic level MOSFET in LFPAK56D
aaa-032445
104
C
(pF)
VDS
ID
103
Ciss
VGS(pl)
Coss
102
VGS(th)
VGS
Crss
QGS2
QGS1
QGS
10
10-1
QGD
QG(tot)
10
VDS (V)
102
VGS = 0V; f = 1MHz
003aaa508
Fig. 14. Gate charge waveform definitions
IS
(A)
1
Fig. 15. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values, FET1 and FET2
aaa-032446
60
48
36
24
-55°C
12
0
175°C
0
0.2
0.4
Tj = 25°C
0.6
0.8
1
VSD (V)
1.2
VGS = 0 V
Fig. 16. Source-drain (diode forward) current as a function of source-drain (diode forward) voltage; typical values
FET1 and FET2
BUK9K13-40H
Product data sheet
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BUK9K13-40H
Nexperia
Dual N-channel 40 V, 13 mOhm logic level MOSFET in LFPAK56D
11. Package outline
Plastic single ended surface mounted package LFPAK56D; 8 leads
E
SOT1205
A
A
b1
c1
L1
mounting
base
D
H
D1
D2
L
1
2
3
e
b
(8x)
4
w
X
c
A
E1
E2
A1
C
θ
Lp
detail X
0
2.5
A
max 1.05
nom
min 1.02
mm
5 mm
scale
Dimensions
Unit
y C
D(1) D1(1)
D2
(ref)
E(1) E1(1)
4.4
0.25 0.30 4.70 4.55
3.5
5.30
1.8
0.85
4.1
0.19 0.24 4.45 4.35
3.4
4.95
1.6
0.60
A1
b
b1
0.1
0.50
0.0
0.35
c
c1
E2
e
1.27
H
L
L1
Lp
6.2
1.3
0.55 0.85
5.9
0.8
0.30 0.40
w
y
0.25
0.1
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
Outline
version
References
IEC
JEDEC
JEITA
θ
8°
0°
sot1205_po
European
projection
Issue date
14-08-21
14-10-28
SOT1205
Fig. 17. Package outline LFPAK56D; Dual LFPAK (SOT1205)
BUK9K13-40H
Product data sheet
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Dual N-channel 40 V, 13 mOhm logic level MOSFET in LFPAK56D
12. Soldering
Footprint information for reflow soldering of LFPAK56D package
SOT1205
5.85
0.57
0.025
0.57
0.7
1.97
0.65
1.27
1.9
3.325
3.175
3.2
2.0
1.275
0.8
1.875
2.1
2.7
1.0
3.85
3.975
0.025
1.1
1.15
0.65
1.27
1.1
1.44
solder land
solder land plus solder paste
solder paste deposit
solder resist
occupied area
Dimensions in mm
Issue date
0.7
14-07-28
20-04-20
sot1205_fr
Fig. 18. Reflow soldering footprint for LFPAK56D; Dual LFPAK (SOT1205)
BUK9K13-40H
Product data sheet
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Nexperia
Dual N-channel 40 V, 13 mOhm logic level MOSFET in LFPAK56D
equipment, nor in applications where failure or malfunction of an Nexperia
product can reasonably be expected to result in personal injury, death or
severe property or environmental damage. Nexperia and its suppliers accept
no liability for inclusion and/or use of Nexperia products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
13. Legal information
Data sheet status
Document status
[1][2]
Product
status [3]
Definition
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Objective [short]
data sheet
Development
This document contains data from
the objective specification for
product development.
Preliminary [short]
data sheet
Qualification
This document contains data from
the preliminary specification.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.
Product [short]
data sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the internet at https://www.nexperia.com.
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Nexperia does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the relevant
full data sheet, which is available on request via the local Nexperia sales
office. In case of any inconsistency or conflict with the short data sheet, the
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data sheet shall define the specification of the product as agreed between
Nexperia and its customer, unless Nexperia and customer have explicitly
agreed otherwise in writing. In no event however, shall an agreement be
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beyond those described in the Product data sheet.
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to be accurate and reliable. However, Nexperia does not give any
representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. Nexperia takes no responsibility
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and products using Nexperia products, and Nexperia accepts no liability for
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or problem which is based on any weakness or default in the customer’s
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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BUK9K13-40H
Product data sheet
All information provided in this document is subject to legal disclaimers.
11 February 2021
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Nexperia B.V. 2021. All rights reserved
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BUK9K13-40H
Nexperia
Dual N-channel 40 V, 13 mOhm logic level MOSFET in LFPAK56D
Contents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 2
9. Thermal characteristics............................................... 4
10. Characteristics............................................................ 5
11. Package outline.......................................................... 9
12. Soldering................................................................... 10
13. Legal information......................................................11
©
Nexperia B.V. 2021. All rights reserved
For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 11 February 2021
BUK9K13-40H
Product data sheet
All information provided in this document is subject to legal disclaimers.
11 February 2021
©
Nexperia B.V. 2021. All rights reserved
12 / 12