PSMN038-100HS
N-channel 100 V, 37.6 mOhm, standard level MOSFET in
LFPAK56D using TrenchMOS technology
26 September 2022
Product data sheet
1. General description
Dual standard level N-channel MOSFET in an LFPAK56D (Dual Power-SO8) package using
TrenchMOS technology.
2. Features and benefits
•
•
•
•
•
High peak drain current IDM
Copper clip and flexible Leads
High operating junction temperature Tj = 175 °C
Superior reliability
Low body diode reverse recovery charge Qr
3. Applications
•
•
•
•
•
Synchronous rectifier
Forward and flyback converter
Industrial drive
Power management system
Uninterruptible Power Supply (UPS)
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDS
drain-source voltage
25 °C ≤ Tj ≤ 175 °C
-
-
100
V
ID
drain current
VGS = 10 V; Tmb = 25 °C; Fig. 2
-
-
21.4
A
Ptot
total power dissipation
Tmb = 25 °C; Fig. 1
-
-
53
W
Tj
junction temperature
-55
-
175
°C
VGS = 10 V; ID = 5 A; Tj = 25 °C; Fig. 11
-
30
37.6
mΩ
VGS = 10 V; ID = 5 A; Tj = 175 °C;
Fig. 11; Fig. 12
-
80
104
mΩ
-
9.7
-
nC
-
25.9
-
nC
-
-
46
mJ
Static characteristics FET1 and FET2
RDSon
drain-source on-state
resistance
Dynamic characteristics FET1 and FET2
QGD
gate-drain charge
QG(tot)
total gate charge
ID = 5 A; VDS = 80 V; VGS = 10 V;
Tj = 25 °C; Fig. 13; Fig. 14
Avalanche Ruggedness FET1 and FET2
EDS(AL)S
non-repetitive drainsource avalanche
energy
ID = 21.4 A; Vsup ≤ 100 V; RGS = 50 Ω;
VGS = 10 V; Tj(init) = 25 °C; unclamped;
Fig. 4
[1] [2]
PSMN038-100HS
Nexperia
N-channel 100 V, 37.6 mOhm, standard level MOSFET in LFPAK56D using TrenchMOS technology
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IS = 5 A; dIS/dt = -100 A/µs; VGS = 0 V;
VDS = 50 V; Tj = 25 °C
-
44
-
nC
Source-drain diode FET1 and FET2
Qr
[1]
[2]
recovered charge
Refer to application note AN10273 for further information
Single-pulse avalanche rating limited by maximum junction temperature of 175 °C
5. Pinning information
Table 2. Pinning information
Pin
Symbol
Description
1
S1
source1
2
G1
gate1
3
S2
source2
4
G2
gate2
5
D2
drain2
6
D2
drain2
7
D1
drain1
8
D1
drain1
Simplified outline
8
7
6
Graphic symbol
5
D1 D1
1
2
3
4
S1
D2 D2
G1
S2
G2
mbk725
LFPAK56D; Dual
LFPAK (SOT1205)
6. Ordering information
Table 3. Ordering information
Type number
Package
PSMN038-100HS
Name
Description
Version
LFPAK56D;
Dual LFPAK
plastic, single ended surface mounted package
(LFPAK56D); 8 leads
SOT1205
7. Marking
Table 4. Marking codes
Type number
Marking code
PSMN038-100HS
38RS10H
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
25 °C ≤ Tj ≤ 175 °C
-
100
V
VDGR
drain-gate voltage
RGS = 20 kΩ
-
100
V
VGS
gate-source voltage
DC; Tj ≤ 175 °C
-20
20
V
Ptot
total power dissipation
Tmb = 25 °C; Fig. 1
-
53
W
ID
drain current
VGS = 10 V; Tmb = 25 °C; Fig. 2
-
21.4
A
VGS = 10 V; Tmb = 100 °C; Fig. 2
-
15
A
PSMN038-100HS
Product data sheet
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PSMN038-100HS
Nexperia
N-channel 100 V, 37.6 mOhm, standard level MOSFET in LFPAK56D using TrenchMOS technology
Symbol
Parameter
Conditions
Min
Max
Unit
IDM
peak drain current
pulsed; tp ≤ 10 µs; Tmb = 25 °C; Fig. 3
-
84
A
Tstg
storage temperature
-55
175
°C
Tj
junction temperature
-55
175
°C
Tsld(M)
peak soldering
temperature
-
260
°C
Source-drain diode FET1 and FET2
IS
source current
Tmb = 25 °C
-
21.4
A
ISM
peak source current
pulsed; tp ≤ 10 µs; Tmb = 25 °C
-
84
A
-
46
mJ
Avalanche Ruggedness FET1 and FET2
EDS(AL)S
[1]
[2]
non-repetitive drainID = 21.4 A; Vsup ≤ 100 V; RGS = 50 Ω;
source avalanche energy VGS = 10 V; Tj(init) = 25 °C; unclamped;
Fig. 4
[1] [2]
Refer to application note AN10273 for further information
Single-pulse avalanche rating limited by maximum junction temperature of 175 °C
03aa16
120
ID
(A)
Pder
(%)
aaa-016742
25
20
80
15
10
40
5
0
0
50
100
150
Tmb (°C)
0
200
0
25
50
75
100
125
150 175
Tmb (°C)
200
VGS ≥ 10 V
Fig. 2.
Fig. 1.
Normalized total power dissipation as a
function of mounting base temperature
PSMN038-100HS
Product data sheet
Continuous drain current as a function of
mounting base temperature
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PSMN038-100HS
Nexperia
N-channel 100 V, 37.6 mOhm, standard level MOSFET in LFPAK56D using TrenchMOS technology
ID
(A)
aaa-016746
103
Limit RDSon = VDS / ID
102
tp = 10 us
10
100 us
DC
1
10-1
1 ms
10 ms
100 ms
1
102
10
VDS (V)
103
Tmb = 25 °C; IDM is a single pulse
Fig. 3.
Safe operating area; continuous and peak drain currents as a function of drain-source voltage
IAL
(A)
aaa-016744
102
10
(1)
(2)
1
(3)
10-1
10-2
10-3
10-2
10-1
1
tAL (ms)
10
(1) Tj (init) = 25 °C; (2) Tj (init) = 150 °C; (3) Repetitive Avalanche
Fig. 4.
Avalanche rating; avalanche current as a function of avalanche time
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-mb)
thermal resistance from Fig. 5
junction to mounting
base
-
-
2.84
K/W
Rth(j-a)
thermal resistance from Minimum footprint; mounted on a
junction to ambient
printed circuit board
-
95
-
K/W
PSMN038-100HS
Product data sheet
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PSMN038-100HS
Nexperia
N-channel 100 V, 37.6 mOhm, standard level MOSFET in LFPAK56D using TrenchMOS technology
003aaj500
10
Zth(j-mb)
(K/W)
1
δ = 0.5
0.2
0.1
0.05
P
0.02
10-1
single shot
δ=
tp
10-2
10-6
Fig. 5.
10-5
10-4
10-3
10-2
10-1
tp
T
t
T
1
tp (s)
Transient thermal impedance from junction to mounting base as a function of pulse duration.
10. Characteristics
Table 7. Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
drain-source
breakdown voltage
ID = 250 µA; VGS = 0 V; Tj = -55 °C
90
-
-
V
ID = 250 µA; VGS = 0 V; Tj = 25 °C
100
-
-
V
gate-source threshold
voltage
ID = 1 mA; VDS=VGS; Tj = 25 °C; Fig. 9;
Fig. 10
2.4
3
4
V
ID = 1 mA; VDS=VGS; Tj = 175 °C;
Fig. 10
1
-
-
V
ID = 1 mA; VDS=VGS; Tj = -55 °C; Fig. 10
-
-
4.5
V
VDS = 100 V; VGS = 0 V; Tj = 25 °C
-
0.02
1
µA
VDS = 100 V; VGS = 0 V; Tj = 175 °C
-
-
500
µA
VGS = -20 V; VDS = 0 V; Tj = 25 °C
-
2
100
nA
VGS = 20 V; VDS = 0 V; Tj = 25 °C
-
2
100
nA
VGS = 10 V; ID = 5 A; Tj = 25 °C; Fig. 11
-
30
37.6
mΩ
VGS = 10 V; ID = 5 A; Tj = 175 °C;
Fig. 11; Fig. 12
-
80
104
mΩ
-
25.9
-
nC
-
4.3
-
nC
-
9.7
-
nC
-
1150
1533
pF
-
122
147
pF
-
84
115
pF
-
6.2
-
ns
Static characteristics FET1 and FET2
V(BR)DSS
VGS(th)
IDSS
IGSS
RDSon
drain leakage current
gate leakage current
drain-source on-state
resistance
Dynamic characteristics FET1 and FET2
QG(tot)
total gate charge
QGS
gate-source charge
QGD
gate-drain charge
Ciss
input capacitance
Coss
output capacitance
Crss
reverse transfer
capacitance
td(on)
turn-on delay time
tr
rise time
-
11.2
-
ns
td(off)
turn-off delay time
-
20.3
-
ns
tf
fall time
-
13.9
-
ns
PSMN038-100HS
Product data sheet
ID = 5 A; VDS = 80 V; VGS = 10 V;
Tj = 25 °C; Fig. 13; Fig. 14
VDS = 25 V; VGS = 0 V; f = 1 MHz;
Tj = 25 °C; Fig. 15
VDS = 80 V; RL = 16 Ω; VGS = 10 V;
RG(ext) = 5 Ω; Tj = 25 °C
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PSMN038-100HS
Nexperia
N-channel 100 V, 37.6 mOhm, standard level MOSFET in LFPAK56D using TrenchMOS technology
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Source-drain diode FET1 and FET2
VSD
source-drain voltage
IS = 5 A; VGS = 0 V; Tj = 25 °C; Fig. 16
-
0.78
1.2
V
trr
reverse recovery time
32.9
-
ns
recovered charge
IS = 5 A; dIS/dt = -100 A/µs; VGS = 0 V;
VDS = 50 V; Tj = 25 °C
-
Qr
-
44
-
nC
ID
(A)
aaa-016747
20
10 V
VGS = 4.5 V
16
80
12
60
8
40
4V
4
0
Fig. 6.
ID
(A)
20
3.5 V
0
1
2
3
VDS (V)
aaa-016753
100
RDSon
(mΩ)
5V
0
4
0
4
8
12
16
VGS (V)
20
Tj = 25 °C; tp = 300 μs
Tj = 25 °C; ID = 5 A
Output characteristics; drain current as a
Fig. 7.
function of drain-source voltage; typical values
Drain-source on-state resistance as a function
of gate-source voltage; typical values
aaa-016773
60
003aah028
10-1
ID
(A)
50
10-2
40
min
10-3
typ
max
30
10-4
20
175°C
Tj = 25°C
10
0
0
1
2
3
4
5
6
VGS (V)
10-5
10-6
7
VDS = 10 V
Fig. 8.
Product data sheet
2
4
VGS (V)
6
Tj = 25 °C; VDS = 5 V
Transfer characteristics; drain current as a
function of gate-source voltage; typical values
PSMN038-100HS
0
Fig. 9.
Sub-threshold drain current as a function of
gate-source voltage
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PSMN038-100HS
Nexperia
N-channel 100 V, 37.6 mOhm, standard level MOSFET in LFPAK56D using TrenchMOS technology
003aah027
5
VGS(th)
(V)
aaa-016774
160
RDSon
(mΩ)
4V
4.5 V
max
4
120
typ
3
80
2
min
5V
40
1
VGS = 10 V
0
-60
0
60
120
T j (°C)
0
180
0
4
8
12
16
ID (A)
20
Tj = 25 °C; tp = 300 μs
ID = 1 mA; VDS = VGS
Fig. 10. Gate-source threshold voltage as a function of
junction temperature
Fig. 11. Drain-source on-state resistance as a function
of drain current; typical values
003aaj819
3
VDS
a
2.4
ID
1.8
VGS(pl)
1.2
VGS(th)
VGS
0.6
0
-60
QGS2
QGS1
0
60
120
Tj ( °C)
QGS
180
QGD
QG(tot)
003aaa508
Fig. 13. Gate charge waveform definitions
Fig. 12. Normalized drain-source on-state resistance
factor as a function of junction temperature
PSMN038-100HS
Product data sheet
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PSMN038-100HS
Nexperia
N-channel 100 V, 37.6 mOhm, standard level MOSFET in LFPAK56D using TrenchMOS technology
VGS
(V)
aaa-016775
10
8
aaa-016776
104
C
(pF)
VDS = 14 V
Ciss
103
6
80 V
4
Coss
102
2
0
Crss
0
5
10
15
20
25
QG (nC)
10
10-1
30
Tj = 25 °C; ID = 5 A
1
10
VDS (V)
102
VGS = 0 V; f = 1 MHz
Fig. 14. Gate-source voltage as a function of gate
charge; typical values
IS
(A)
Fig. 15. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values
aaa-016777
20
16
12
8
175°C
4
0
0
0.2
0.4
Tj = 25°C
0.6
0.8
1
VSD (V)
1.2
VGS = 0 V
Fig. 16. Source (diode forward) current as a function of source-drain (diode forward) voltage; typical values
PSMN038-100HS
Product data sheet
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PSMN038-100HS
Nexperia
N-channel 100 V, 37.6 mOhm, standard level MOSFET in LFPAK56D using TrenchMOS technology
11. Package outline
Plastic single ended surface mounted package LFPAK56D; 8 leads
E
SOT1205
A
A
b1
c1
L1
mounting
base
D
H
D1
D2
L
1
2
3
e
b
(8x)
4
w
X
c
A
E1
E2
A1
C
θ
Lp
detail X
0
2.5
mm
5 mm
scale
Dimensions
Unit
y C
A
max 1.05
nom
min 1.02
D(1) D1(1)
D2
(ref)
E(1) E1(1)
4.4
0.25 0.30 4.70 4.55
3.5
5.30
1.8
0.85
4.1
0.19 0.24 4.45 4.35
3.4
4.95
1.6
0.60
A1
b
b1
0.1
0.50
0.0
0.35
c
c1
E2
e
1.27
H
L
L1
Lp
6.2
1.3
0.55 0.85
5.9
0.8
0.30 0.40
w
y
0.25
0.1
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
Outline
version
References
IEC
JEDEC
JEITA
θ
8°
0°
sot1205_po
European
projection
Issue date
14-08-21
14-10-28
SOT1205
Fig. 17. Package outline LFPAK56D; Dual LFPAK (SOT1205)
PSMN038-100HS
Product data sheet
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PSMN038-100HS
Nexperia
N-channel 100 V, 37.6 mOhm, standard level MOSFET in LFPAK56D using TrenchMOS technology
12. Soldering
Footprint information for reflow soldering of LFPAK56D package
SOT1205
5.85
0.57
0.025
0.57
0.7
1.97
0.65
1.27
1.9
3.325
3.175
3.2
2.0
1.275
0.8
1.875
2.1
2.7
1.0
3.85
3.975
0.025
1.1
1.15
0.65
1.27
1.1
1.44
solder land
solder land plus solder paste
solder paste deposit
solder resist
occupied area
Dimensions in mm
Issue date
0.7
14-07-28
20-04-20
sot1205_fr
Fig. 18. Reflow soldering footprint for LFPAK56D; Dual LFPAK (SOT1205)
PSMN038-100HS
Product data sheet
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PSMN038-100HS
Nexperia
N-channel 100 V, 37.6 mOhm, standard level MOSFET in LFPAK56D using TrenchMOS technology
13. Legal information
injury, death or severe property or environmental damage. Nexperia and its
suppliers accept no liability for inclusion and/or use of Nexperia products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Data sheet status
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Document status
[1][2]
Product
status [3]
Definition
Objective [short]
data sheet
Development
This document contains data from
the objective specification for
product development.
Preliminary [short]
data sheet
Qualification
This document contains data from
the preliminary specification.
Product [short]
data sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the internet at https://www.nexperia.com.
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internal review and subject to formal approval, which may result in
modifications or additions. Nexperia does not give any representations or
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intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the relevant
full data sheet, which is available on request via the local Nexperia sales
office. In case of any inconsistency or conflict with the short data sheet, the
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data sheet shall define the specification of the product as agreed between
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PSMN038-100HS
Product data sheet
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.
Customers are responsible for the design and operation of their applications
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the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
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customer (a) shall use the product without Nexperia’s warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
Nexperia’s specifications such use shall be solely at customer’s own risk,
and (c) customer fully indemnifies Nexperia for any liability, damages or failed
product claims resulting from customer design and use of the product for
automotive applications beyond Nexperia’s standard warranty and Nexperia’s
product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
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PSMN038-100HS
Nexperia
N-channel 100 V, 37.6 mOhm, standard level MOSFET in LFPAK56D using TrenchMOS technology
Contents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 2
9. Thermal characteristics............................................... 4
10. Characteristics............................................................ 5
11. Package outline.......................................................... 9
12. Soldering................................................................... 10
13. Legal information......................................................11
©
Nexperia B.V. 2022. All rights reserved
For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 26 September 2022
PSMN038-100HS
Product data sheet
All information provided in this document is subject to legal disclaimers.
26 September 2022
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Nexperia B.V. 2022. All rights reserved
12 / 12