PMN100EPA
60 V, P-channel Trench MOSFET
16 April 2020
Product data sheet
1. General description
P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT457 (SC-74) SurfaceMounted Device (SMD) plastic package using Trench MOSFET technology.
2. Features and benefits
•
•
•
•
•
Logic-level compatible
Extended temperature range Tj = 175 °C
Very fast switching
Trench MOSFET technology
AEC-Q101 qualified
3. Applications
•
•
•
•
Relay driver
High-speed line driver
High-side load switch
Switching circuits
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDS
drain-source voltage
Tj = 25 °C
-
-
-60
V
VGS
gate-source voltage
-20
-
20
V
ID
drain current
-
-
-2.5
A
-
100
130
mΩ
VGS = -10 V; Tamb = 25 °C
[1]
Static characteristics
RDSon
[1]
drain-source on-state
resistance
VGS = -10 V; ID = -2.5 A; Tj = 25 °C
2
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and mounting pad for drain 6 cm .
PMN100EPA
Nexperia
60 V, P-channel Trench MOSFET
5. Pinning information
Table 2. Pinning information
Pin
Symbol
Description
1
D
drain
2
D
drain
3
G
gate
4
S
source
5
D
drain
6
D
drain
Simplified outline
Graphic symbol
6
5
4
1
2
3
D
G
SC-74; TSOP6 (SOT457)
S
017aaa094
6. Ordering information
Table 3. Ordering information
Type number
Package
Name
PMN100EPA
Description
Version
SC-74; TSOP6 plastic, surface-mounted package (SC-74; TSOP6); 6 leads
SOT457
7. Marking
Table 4. Marking codes
Type number
Marking code
PMN100EPA
3R
PMN100EPA
Product data sheet
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Nexperia
60 V, P-channel Trench MOSFET
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
Tj = 25 °C
-
-60
V
VGS
gate-source voltage
-20
20
V
ID
drain current
VGS = -10 V; Tamb = 25 °C
[1]
-
-2.5
A
VGS = -10 V; Tamb = 100 °C
[1]
-
-1.6
A
-
-10
A
[2]
-
660
mW
[1]
-
1.7
W
IDM
peak drain current
Tamb = 25 °C; single pulse; tp ≤ 10 µs
Ptot
total power dissipation
Tamb = 25 °C
-
7.5
W
Tj
junction temperature
Tsp = 25 °C
-55
175
°C
Tamb
ambient temperature
-55
175
°C
Tstg
storage temperature
-65
175
°C
Source-drain diode
IS
source current
Tamb = 25 °C
[1]
-
-1.7
A
HBM
[3]
-
400
V
-
33
mJ
ESD maximum rating
VESD
electrostatic discharge
voltage
Avalanche ruggedness
EDS(AL)S
[1]
[2]
[3]
non-repetitive drainTj(init) = 25 °C; ID = -1 A; DUT in avalanche
source avalanche energy (unclamped)
2
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and mounting pad for drain 6 cm .
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
Measured between all pins.
aaa-030119
120
Pder
(%)
Ider
(%)
80
80
40
40
0
-75
Fig. 1.
aaa-030120
120
25
125
Tamb (°C)
Normalized total power dissipation as a
function of ambient temperature
PMN100EPA
Product data sheet
0
-75
225
Fig. 2.
125
Tamb (°C)
225
Normalized continuous drain current as a
function of ambient temperature
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Nexperia
60 V, P-channel Trench MOSFET
aaa-031174
-102
ID
(A)
-10
tp =
Limit RDSon = VDS / ID
-1
-10-1
1 ms
DC; Tsp = 25 °C
-10-2
10 ms
DC; Tamb = 25 °C; 6 cm2
-10-3
100 ms
-10-4
-10-5
-10-1
Fig. 3.
-1
-10
-102
VDS (V)
Safe operating area; junction to ambient; continuous and peak drain currents as a function of drainsource voltage
PMN100EPA
Product data sheet
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PMN100EPA
Nexperia
60 V, P-channel Trench MOSFET
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Rth(j-a)
thermal resistance from in free air
junction to ambient
Rth(j-sp)
[1]
[2]
Conditions
thermal resistance from
junction to solder point
Min
Typ
Max
Unit
[1]
-
195
225
K/W
[2]
-
78
90
K/W
-
15
20
K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
2
Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for drain 6 cm .
aaa-029606
103
Zth(j-a)
(K/W)
duty cycle = 1
102
0.75
0.33
0.20
0.50
0.25
0.10
10
0.05
0.02
0.01
0
1
10-3
10-2
10-1
1
10
102
tp (s)
103
FR4 PCB, standard footprint
Fig. 4.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
102
aaa-029607
duty cycle = 1
0.75
0.50
Zth(j-a)
(K/W)
0.33
0.20
0.25
0.10
10
0.05
0.02
0.01
0
1
10-3
10-2
10-1
FR4 PCB, mounting pad for drain 6 cm
Fig. 5.
1
10
102
tp (s)
2
103
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMN100EPA
Product data sheet
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PMN100EPA
Nexperia
60 V, P-channel Trench MOSFET
10. Characteristics
Table 7. Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
V(BR)DSS
drain-source
breakdown voltage
ID = -250 µA; VGS = 0 V; Tj = 25 °C
-60
-
-
V
VGSth
gate-source threshold
voltage
ID = -250 µA; VDS = VGS; Tj = 25 °C
-1.9
-2.5
-3.2
V
IDSS
drain leakage current
VDS = -60 V; VGS = 0 V; Tj = 25 °C
-
-
-1
µA
IGSS
gate leakage current
VGS = -20 V; VDS = 0 V; Tj = 25 °C
-
-
-100
nA
VGS = 20 V; VDS = 0 V; Tj = 25 °C
-
-
100
nA
RDSon
drain-source on-state
resistance
VGS = -10 V; ID = -2.5 A; Tj = 25 °C
-
100
130
mΩ
VGS = -10 V; ID = -2.5 A; Tj = 175 °C
-
217
276
mΩ
VGS = -4.5 V; ID = -2.1 A; Tj = 25 °C
-
130
180
mΩ
gfs
forward
transconductance
VDS = -10 V; ID = -2.1 A; Tj = 25 °C
-
6
-
S
RG
gate resistance
f = 1 MHz
-
11
-
Ω
VDS = -30 V; ID = -2.1 A; VGS = -10 V;
Tj = 25 °C
-
11
17
nC
-
1.9
-
nC
-
2.4
-
nC
-
616
-
pF
-
41
-
pF
-
26
-
pF
-
7
-
ns
-
7
-
ns
Dynamic characteristics
QG(tot)
total gate charge
QGS
gate-source charge
QGD
gate-drain charge
Ciss
input capacitance
Coss
output capacitance
Crss
reverse transfer
capacitance
td(on)
turn-on delay time
tr
rise time
td(off)
turn-off delay time
-
29
-
ns
tf
fall time
-
25
-
ns
VDS = -30 V; f = 1 MHz; VGS = 0 V;
Tj = 25 °C
VDS = -30 V; ID = -2.1 A; VGS = -10 V;
RG(ext) = 6 Ω; Tj = 25 °C
Source-drain diode
VSD
source-drain voltage
IS = -1.7 A; VGS = 0 V; Tj = 25 °C
-
-0.8
-1.2
V
trr
reverse recovery time
-
18
-
ns
Qr
recovered charge
IS = -1.4 A; dIS/dt = 100 A/µs;
VGS = 0 V; VDS = -30 V; Tj = 25 °C
-
13
-
nC
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Product data sheet
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PMN100EPA
Nexperia
60 V, P-channel Trench MOSFET
aaa-031106
-9
-10 V
ID
(A)
aaa-031107
-10-3
-4.5 V
ID
(A)
-6
min
-10-4
-3.6 V
typ
max
-10-5
-3
VGS = -3 V
0
Fig. 6.
0
-1
-2
-3
VDS (V)
-10-6
-4
-2
-3
VGS (V)
-4
Tj = 25 °C
Tj = 25 °C; VDS = -5 V
Output characteristics: drain current as a
Fig. 7.
function of drain-source voltage; typical values
Subthreshold drain current as a function of
gate-source voltage
aaa-031108
500
RDSon
400
400
300
300
VGS = -4.2 V
200
0
-6 V
0
-3
-6
-10 V
ID (A)
0
-9
0
-4
-8
-12
-16
-20
VGS (V)
ID = -2.1 A
Drain-source on-state resistance as a function
of drain current; typical values
Product data sheet
Tj = 25 °C
100
Tj = 25 °C
PMN100EPA
Tj = 175 °C
200
-4.5 V
100
aaa-031109
500
-3.8 V
-3.5 V
RDSon
Fig. 8.
-1
Fig. 9.
Drain-source on-state resistance as a function
of gate-source voltage; typical values
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PMN100EPA
Nexperia
60 V, P-channel Trench MOSFET
aaa-031110
-12
aaa-031111
3
ID
(A)
a
-8
2
Tj = 175 °C
-4
1
Tj = 25 °C
0
0
-2
-4
VGS (V)
0
-60
-6
0
60
120
Tj (°C)
180
VDS = -5 V
Fig. 10. Transfer characteristics: drain current as a
function of gate-source voltage; typical values
Fig. 11. Normalized drain-source on-state resistance
as a function of junction temperature; typical
values
aaa-031112
-4
aaa-031113
103
Ciss
VGS(th)
(V)
max
-3
C
(pF)
typ
-2
102
min
Coss
-1
0
-60
Crss
0
60
120
Tj (°C)
10
-10-1
180
ID = -250 μA; VDS = VGS
Product data sheet
-10
VDS (V)
-102
f = 1 MHz; VGS = 0 V
Fig. 12. Gate-source threshold voltage as a function of
junction temperature
PMN100EPA
-1
Fig. 13. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values
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PMN100EPA
Nexperia
60 V, P-channel Trench MOSFET
aaa-031114
-10
VDS
VGS
(V)
ID
-8
VGS(pl)
-6
VGS(th)
VGS
-4
QGS1
-2
0
QGS2
0
4
8
QG (nC)
QGS
QGD
QG(tot)
003aaa508
Fig. 15. Gate charge waveform definitions
12
VDS = -30 V; ID = -2.1 A; Tj = 25 °C
Fig. 14. Gate-source voltage as a function of gate
charge; typical values
aaa-031115
-6
IS
(A)
-4
Tj = 175 °C
-2
Tj = 25 °C
0
0
-0.4
-0.8
VSD (V)
-1.2
VGS = 0 V
Fig. 16. Source current as a function of source-drain voltage; typical values
PMN100EPA
Product data sheet
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60 V, P-channel Trench MOSFET
11. Test information
P
t2
duty cycle δ =
t1
t2
t1
t
006aaa812
Fig. 17. Duty cycle definition
Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC)
standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in
automotive applications.
PMN100EPA
Product data sheet
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60 V, P-channel Trench MOSFET
12. Package outline
Plastic, surface-mounted package (SC-74; TSOP6); 6 leads
D
SOT457
B
E
y
A
X
HE
6
5
v M A
4
Q
A
pin 1
index
A1
c
1
2
Lp
3
bp
e
detail X
w M B
0
1
2 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
max
nom
min
A
A1
1.1
0.1
0.9
bp
c
D
E
0.40 0.26
3.1
1.7
0.013 0.25 0.10
2.7
1.3
e
0.95
HE
Lp
Q
3.0
0.6
0.33
2.5
0.2
0.23
v
w
y
0.2
0.2
0.1
sot457_po
Outline
version
References
IEC
JEDEC
SOT457
JEITA
European
projection
Issue date
06-03-16
18-11-27
SC-74
Fig. 18. Package outline SC-74; TSOP6 (SOT457)
PMN100EPA
Product data sheet
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60 V, P-channel Trench MOSFET
13. Soldering
3.45
1.95
0.45 0.55
(6×) (6×)
0.95
solder lands
solder resist
3.3 2.825
0.95
solder paste
occupied area
0.7
(6×)
Dimensions in mm
0.8
(6×)
2.4
sot457_fr
Fig. 19. Reflow soldering footprint for SC-74; TSOP6 (SOT457)
5.3
1.5
(4×)
1.475
0.45
(2×)
5.05
1.475
solder lands
solder resist
occupied area
Dimensions in mm
preferred transport
direction during soldering
1.45
(6×)
2.85
sot457_fw
Fig. 20. Wave soldering footprint for SC-74; TSOP6 (SOT457)
PMN100EPA
Product data sheet
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60 V, P-channel Trench MOSFET
14. Revision history
Table 8. Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
PMN100EPA v.1
Product data sheet
-
-
PMN100EPA
Product data sheet
20200416
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PMN100EPA
Nexperia
60 V, P-channel Trench MOSFET
equipment, nor in applications where failure or malfunction of an Nexperia
product can reasonably be expected to result in personal injury, death or
severe property or environmental damage. Nexperia and its suppliers accept
no liability for inclusion and/or use of Nexperia products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
15. Legal information
Data sheet status
Document status
[1][2]
Product
status [3]
Definition
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Objective [short]
data sheet
Development
This document contains data from
the objective specification for
product development.
Preliminary [short]
data sheet
Qualification
This document contains data from
the preliminary specification.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.
Product [short]
data sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the internet at https://www.nexperia.com.
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Nexperia does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the relevant
full data sheet, which is available on request via the local Nexperia sales
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or problem which is based on any weakness or default in the customer’s
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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specifications and product descriptions, at any time and without notice. This
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Suitability for use in automotive applications — This Nexperia product
has been qualified for use in automotive applications. Unless otherwise
agreed in writing, the product is not designed, authorized or warranted to
be suitable for use in life support, life-critical or safety-critical systems or
PMN100EPA
Product data sheet
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60 V, P-channel Trench MOSFET
Contents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 3
9. Thermal characteristics............................................... 5
10. Characteristics............................................................ 6
11. Test information........................................................ 10
12. Package outline........................................................ 11
13. Soldering................................................................... 12
14. Revision history........................................................13
15. Legal information......................................................14
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Nexperia B.V. 2020. All rights reserved
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Date of release: 16 April 2020
PMN100EPA
Product data sheet
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