DONGGUAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD
承 認 書
Specification For Approval
Customer: (客戶)
Description:(產品描述)
3连体带座 3MM普绿+2红光
Part number:(產品型號)
TJ-LF3KG12RLT69-A3
Date:
(日期)
Approved By: (客戶承認)
Prepared By:(我司承認)
Approval
核准
Check
Design
Sales
審核
製作
業務
Customer Service Hotline:400-676-8616
TEL:0769-8662 5999
0769-8200 2226
E-MIAL∶ dg@togialed.com
FAX:0769-8200 2227
WEB: www.togialed.com
DONGGUAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD
1.overview
* Low power consumption
* Low power
* General equipment on the PCB board or panel
* with ICSupporting the use/ Low current requirement
2.Product appearance size figure
Unit : mm
3.5(.098)
TYP.
4.5(.170)
R
R
15.5
R
11.7(.461)
11.5(.453)
3.0(.118)
12.7(.50)
7.62(.30)
G
2.54(.10)
0.5(.02)
SQ.TYP
90
CATHODE
7.58(.298)
2.54(.100)
Note:
1:All dimensions are in millimeters (inches).
2:Tolerance is ±0.25mm (.010”) unless otherwise noted.
3: Specifications are subject to change without notices.
4:This specification is for reference only for one year
2.54(.100) 2.54(.100)
5
DONGGUAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD
Absolute maximum ratings (TA=25℃)
Parameter
Value
Symbol
Power dissipation
Pd
R
G
70
72
Unit
mW
Forward current
If
20
mA
Reverse voltage
Vr
5
V
Operating temperature
Top
-40 ~+85
℃
Storage temperature
Tstg
-40 ~+85
℃
Ifp
55
mA
Peak pulsing current (1/8 duty f=1kHz)
Electro-optical characteristics (TA=25℃)
Parameter
Test
Condition
Value
Symbol
Wavelength at peak emission
If=20mA
λp
Spectral half bandwidth
If=20mA
△λ
Dominant wavelength
If=20mA
λd
Forward voltage
If=20mA
Vf
Unit
Min
Typ
Max
G
--
570
--
R
--
625
--
--
20
--
G
565
--
575
R
620
--
630
1.8
--
2.4
G
30
---
50
R
80
---
150
G
R
G
R
nm
nm
nm
V
Luminous intensity
If=20mA
Iv
Viewing angle at 50% Iv
If=10mA
2θ1/2
--
30
--
Deg
Vr=5V
Ir
--
--
10
A
Reverse current
mcd
DONGGUAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD
Optical characteristic curves (Green)
Spectral Radiance (Peak@565nm)
1.0
0.6
0.4
0.2
380 400 420 440 460 480 500 520 540 560 580 600 620 640 660 680 700 720 740 760 780
Wave Length(nm)
Forward Current vs. Forward Voltage
Forward Current (mA)
Directive Characteristics
0°
10°
20°
30°
Relative radiant intensity
0.0
Forward Voltage (V)
Normalized
Response
0.8
40°
1.0
50°
60°
0.8
70°
80°
90°
0.5
0
DONGGUAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD
Optical characteristic curves(Red)
Spectral Radiance (Peak@625nm)
1.0
0.6
0.4
0.2
380 400 420 440 460 480 500 520 540 560 580 600 620 640 660 680 700 720 740 760 780
Wave Length(nm)
Forward Current vs. Forward
Voltage
Voltage
Forward
(mA)
Current
Directive Characteristics
0°
10°
20°
30°
Relative radiant intensity
0.0
Forward
(V)
Normalized
Response
0.8
40°
1.0
50°
60°
0.8
70°
80°
90°
0.5
0
4/9
DONGGUAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD
Reflow Profile
Reflow Temp/Time
300
(℃ )
10 S Max.
260℃ Max.
250
230℃
4℃ /S Max.
200
150~180℃
4℃ /S Max.
Temperature
150
60~120 S
100
30~50 S
50
25℃
0
50
100
150
200
250
Time
300
(sec)
Notes:
1.We recommend the reflow temperature 245℃(±5℃).the maximum soldering
temperature should be limited to 260℃.
2.Don’t cause stress to the epoxy resin while it is exposed to high temperature.
3.Number of reflow process shall be 2 times or less.
Soldering iron
Basic spec is 5sec when 260℃. If temperature is higher, time should be shorter
(+10℃ -1sec ).Power dissipation of iron should be smaller than 20W,
and temperatures should be controllable .Surface temperature of the device should
be under 230℃ .
Rework
1.Customer must finish rework within 5 sec under 260℃.
2.The head of iron can not touch copper foil
3.Twin-head type is preferred.
Correct(
)
Mistake(
)
Avoid rubbing or scraping the resin by any object, during high temperature,
for example reflow solder etc.
Test circuit and handling precautions
DONGGUAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD
Test circuit
+
-
R
V
LED
Handling precautions
1. Over-current-proof
Customer must apply resistors for protection; otherwise slight voltage shift
will cause big current change (Burn out will happen).
2. Storage
2.1 It is recommended to store the products in the following conditions:
Humidity: 60% R.H. Max.
Temperature : 5℃~30℃(41℉~86℉)
2.2 Shelf life in sealed bag: 12 month at <5℃~30℃ and <30% R.H. after
the package is Opened, the products should be used within a week or they
should be keeping to stored at≦20 R.H. with zip-lock sealed.
3. Baking
It is recommended to baking before soldering when the pack is unsealed
after 72hrs. The Conditions are as followings:
3.1 60±3℃ x(12~24hrs) and <5%RH, taped reel type
3.2 100±3℃ x(45min~1hr), bulk type
3.3 130±3℃ x(15~30min), bulk type
Test items and results of reliability
DONGGUAN TONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD
Operation
Sequence
Environmental
Sequence
Type
Number of
Test Item
Test Conditions
Note
Temperature Cycle
-20℃ 30min
↑↓
80℃ 30min
100 cycle
0/22
Thermal Shock
-20℃ 15min
↑↓
80℃ 15min
100 cycle
0/22
High Humidity Heat Cycle
30℃ 65℃
90%RH 24hrs/1cycle
10 cycle
0/22
High Temperature Storage
Ta=80℃
1000 hrs
0/22
Humidity Heat Storage
Ta=60℃
RH=90%
1000 hrs
0/22
Low Temperature Storage
Ta=-30℃
1000 hrs
0/22
Life Test
Ta=25℃
IF=20mA
1000 hrs
0/22
High Humidity Heat Life Test
60℃ RH=90%
IF=10mA
500 hrs
0/22
Low Temperature Life Test
Ta=-20℃
IF=20mA
1000 hrs
0/22
Damaged
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