TMPC0402HPV-100MG-Z02 数据手册
Form No: XXXXXX-7-0000-PBM02-180600360
Specification for Approval
Date: 2018/06/15
Customer : 深圳台慶
TMPC0402HPV-Series(G)-Z02
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
pcs
QUANTITY:
REMARK:
Customer Approval Feedback
□西北臺慶科技股份有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148
FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
□Office:
深圳辦公室
11BC,Building B Fortune Plaza,NO.7002, Shennan Avenue, Futian
District Shenzhen
TEL: +86- 755-23972371 FAX: +86-755-23972340
□臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
■慶邦電子元器件(泗洪)有限公司
TAIPAQ ELECTRONICS (SIHONG) CO., LTD
JIN SHA JIANG ROAD , CONOMIC DEVELOPMENT ZONE SIHONG ,
JIANGSU , CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
E-mail: sales@taipaq.cn
Sales Dep.
APPROVED
CHECKED
管哲頎
Eric Kuan
劉璦瑄
Aries Liu
R&D Center
APPROVED
CHECKED
DRAWN
羅宜春
梁周虎
許靜
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TAI-TECH
P1
SMD Power Choke Coil
TMPC0402HPV-Series(G)-Z02
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
18/06/15
新 發 行
羅宜春
梁周虎
許靜
備
註
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TAI-TECH
P2
SMD Power Choke Coil
TMPC0402HPV-Series(G)-Z02
1. Features
1.
2.
3.
4.
5.
6.
7.
Carbonyl powder inductor.
Compact design.
High current,low DCR,high efficiency.
Very low acoustic noise and very low leakage flux noise.
High reliability.
100% Lead(Pb) & Halogen-Free and RoHS compliant.
Halogen
Pb
Halogen-free
Pb-free
High reliability -Reliability test meet AEC-Q200
2. Applications
Note PC power system,incl. IMVP-6
DC/DC converter.
3. Dimensions
Recommend PC Board Pattern
C
L
E
2R2
1R0
B
D
H
A
G
Series
A(mm)
B(mm)
C(mm)
TMPC0402HPV 4.45±0.25 4.06±0.25
D(mm)
E(mm)
0.76±0.30
1.8±0.2
2.0±0.20
4. Part Numbering
TMPC
0402
HPV
A
B
C
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: Control S/N
-
2R2
D
MG E
Z02
F
BxC
H: Carbonyl powder;P: PAD broaden V=Vehicle.
2R2=2.20uH
M=±20%;Y=±30%
印字:黑色,單向印字
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L(mm)
G(mm)
H(mm)
5.2
2.2
2.4
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.12mm and above.
TAI-TECH
P3
5. Specification
Part Number
Inductance
L0 (uH)±20%
@0A
I rms (A)
Typ.
I sat (A)
Typ.
DCR(mΩ)
Typ.@25℃
DCR(mΩ)
Max.@25℃
TMPC0402HPV-R10YG-Z02
0.10±30%
12
35
3.2
4.0
TMPC0402HPV-R18YG-Z02
0.18±30%
13.5
28
4.6
5.4
TMPC0402HPV-R22YG-Z02
0.22±30%
13
24
6.6
7.3
TMPC0402HPV-R33MG-Z02
0.33
10
18
7.8
8.6
TMPC0402HPV-R47MG-Z02
0.47
8.0
12
11.2
14
TMPC0402HPV-R56MG-Z02
0.56
7.3
10
13.5
16
TMPC0402HPV-R68MG-Z02
0.68
7
10
16
19
TMPC0402HPV-1R0MG-Z02
1.00
5.0
8.5
22
27
TMPC0402HPV-1R2MG-Z02
1.20
4.8
7.8
25
30
TMPC0402HPV-1R5MG-Z02
1.50
4.5
7.0
34.8
42
TMPC0402HPV-2R2MG-Z02
2.20
4.0
6.0
51
61
TMPC0402HPV-3R3MG-Z02
3.30
3.5
4.0
69
76
TMPC0402HPV-4R7MG-Z02
4.70
2.6
3.5
95
105
TMPC0402HPV-5R6MG-Z02
5.60
2.2
3.0
112
125
TMPC0402HPV-6R8MG-Z02
6.80
2.1
2.8
150
172
TMPC0402HPV-8R2MG-Z02
8.20
2.0
2.5
158
180
TMPC0402HPV-100MG-Z02
10.0
1.8
2.3
215
243
TMPC0402HPV-150MG-Z02
15.0
1.5
1.9
325
374
TMPC0402HPV-220MG-Z02
22.0
1.2
1.4
470
500
Note:
1. Test frequency : L/Q : 100KHz /1.0V;
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L: HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 20%
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
6. Material List
NO
Items
Materials
1
Core
Carbonyl Powder.
2
Wire
Polyester Wire or equivalent.
3
Clip
100% Pb free solder(Ni+Sn---Plating)
4
paint
Epoxy resin
5
Ink
Halogen-free ketone
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TAI-TECH
P4
7. Reliability and Test Condition
Item
Operating temperature
Storage temperature and
Humidity range
Performance
Test Condition
-55~+125℃(Including self - temperature rise)
1. -10~+40℃,50~60%RH (Product with taping)
2. -55~+125℃(on board)
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation Current (Isat)
Heat Rated Current (Irms)
Approximately △L20%
Saturation DC Current (Isat) will cause L0
to drop △L(%)
Approximately △T40℃
Heat Rated Current (Irms) will cause the coil temperature rise △
T(℃).
1.Applied the allowed DC current
2.Temperature measured by digital surface thermometer
Reliability Test
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Temperature:125±2℃(Inductor)
Duration :1000hrs Min.
Measured at room temperature after placing for 24±2 hrs
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Condition for 1 cycle
Step1:-55±2℃ 30min Min.(Inductor)
Step2:125±2℃ transition time 1min MAX.
Step3:125±2℃ 30min Min.
Step4:Low temp. transition time 1min MAX.
Number of cycles: 1000
Measured at room temperature after placing for 24±2 hrs
High Temperature
Exposure(Storage)
AEC-Q200
Temperature Cycling
AEC-Q200
Moisture Resistance
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
1.Baked at50 ℃ for 25hrs, measured at room temperature after
Appearance:No damage.
placing for 4 hrs.
Impedance:within±15% of initial value
2.Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3
Inductance:within±10% of initial value
hours, cool down to 25℃ in 2.5hrs.
Q:Shall not exceed the specification value.
3.Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3
RDC : within ± 15% of initial value and shall not exceed the hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2hrs then keep
specification value
at -10℃ for 3hrs
4.Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency
of 10 to 55 Hz to 10 Hz, measure at room temperature after placing
for 1~2 hrs.
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification
Reflow Profiles
Humidity :85±3﹪R.H,
Temperature:85℃±2℃
Duration : 1000hrs Min with 100% rated current.
Measured at room temperature after placing for24±2hrs
Biased Humidity
(AEC-Q200)
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Temperature:125±2℃(Inductor)
Duration :1000hrs Min. with 100% rated current.
Measured at room temperature after placing for24±2hrs
High Temperature
Operational Life
(AEC-Q200)
External Visual
Physical Dimension
Resistance to Solvents
Mechanical Shock
Appearance:No damage.
Inspect device construction, marking and workmanship. Electrical
Test not required.
According to the product specification size measurement
According to the product specification size measurement
Appearance:No damage.
Add aqueous wash chemical - OKEM clean or equivalent.
Appearance:No damage.
Peak value
Normal
Wave
Velocity
Type
(g’s)
duration (D) (ms) form change (Vi)ft/sec
Impedance:within±15% of initial value
Inductance:within±10% of initial value
SMD
100
6
Half-sine
12.3
Q:Shall not exceed the specification value.
RDC : within ± 15% of initial value and shall not exceed the
Lead
100
6
Half-sine
12.3
specification value
shocks in each direction along 3 perpendicular axes.
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TAI-TECH
P5
Item
Performance
IPC/JEDEC J-STD-020DClassification Reflow Profiles
Oscillation Frequency: 10~2K~10Hz for 20 minute
Equipment: Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
Test condition :
Vibration
Resistance to Soldering Heat
Appearance:No damage.
Impedance:within±15% of initial value
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC : within ± 15% of initial value and shall not exceed the
specification value
Thermal shock
(AEC-Q200)
ESD
Solderability
Electrical Characterization
Flammability
Test Condition
Temperature(℃)
Time(s)
260±5(solder
temp)
10±1
Temperature
Number of
ramp/immersion
heat cycles
and emersion rate
25mm/s ±6 mm/s
1
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Condition for 1 cycle
Step1:-55±2℃ 15±1min(Inductor)
Step2:125±2℃ within 20Sec.
Step3:125±2℃ 15±1min
Number of cycles: 300
Measured at room fempraturc after placing fo24±2hrs
Appearance:No damage.
Steam Aging: 16 hours ± 15 min
Preheat: 150℃,60sec.
Solder: Sn96.5% Ag3% Cu0. 5%
More than 95% of the terminal electrode should be covered
Temperature: 245±5℃。
with solder。
Flux for lead free: Rosin. 9.5%。
Dip time: 4±1sec.
Depth: completely cover the termination
Refer Specification for Approval
Summary to show Min, Max, Mean and Standard deviation .
Electrical Test not required.
V-0 or V-1 are acceptable.
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Place the 100mm X 40mm board into a fixture similar to the one
shown in below Figure with the component facing down. The
apparatus shall consist of mechanical means to apply a force which
will bend the board (D) x = 2 mm minimum. The duration of the
applied forces shall be 60 (+ 5) sec. The force is to be applied only
once to the board.
Board Flex
Appearance:No damage
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020D Classification Reflow Profiles
With the component mounted on a PCB with the device to be
tested, apply a 17.7 N (1.8 Kg) force to the side of a device being
tested. This force shall be applied for 60 +1 seconds. Also the force
shall be applied gradually as not to apply a shock to the component
being tested.
Terminal Strength(SMD)
Appearance:No damage
Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours of recovery under the standard
condition.
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TAI-TECH
P6
8. Soldering and Mounting
(1) Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. TAI-TECH terminations are suitable for
re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air
soldering tools.
(2) Solder re-flow:
Recommended temperature profiles for re-flow soldering in Figure 1.
(3) Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
‧Preheat circuit and products to 150℃
‧355℃ tip temperature (max)
‧Never contact the ceramic with the iron tip
‧1.0mm tip diameter (max)
‧Use a 20 watt soldering iron with tip diameter of 1.0mm
‧Limit soldering time to 4~5sec.
Reflow Soldering
PRE-HEATING
SOLDERING
Iron Soldering
NATURAL
COOLING
PRE-HEATING
200
150
TEMPERATURE(¢X
C)
TEMPERATURE(¢X
C)
tp(245¢X
C / 20~40s.)
217
SOLDERING
within 4~5s
TP(260 ℃ / 10s max.)
60~150s
60~180s
NATURAL
COOLING
350
150
Gradual cooling
Over 60s
480s max.
25
TIME( sec.)
TIM E(sec.)
Reflow times: 3 times max.
Fig.1
Iron Soldering times: 1 times max.
Fig.2
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TAI-TECH
P7
9. Packaging Information
(1) Reel Dimension
COVER TAPE
C
B
D
2.0∮0.5
A
Type
A(mm)
B(mm)
C(mm)
D(mm)
13”x12mm
12.4+2/-0
100±2
13+0.5/-0.2
330
EMBOSSED CARRIER
(2) Tape Dimension
Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) W(mm) F(mm)
TMPC
0402
5.0±0.1
4.4±0.1
2.3±0.1
8.0±0.1
12±0.3
5.5±0.1
t(mm)
0.35±0.05
(3) Packaging Quantity
TMPC
0402
Chip / Reel
3000
Inner box
6000
Carton
24000
The force for tearing off cover tape is 10 to 130 grams in the arrow
direction under the following conditions(referenced
ANSI/EIA-481-D-2008 of 4.11 standard).
(4) Tearing Off Force
F
Top cover tape
165¢Xto180¢X
Base tape
Room Temp.
(℃)
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
mm/min
5~35
45~85
860~1060
300
Application Notice
‧Storage Conditions(component level)
To maintain the solderability of terminal electrodes:
1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1.
2. Temperature and humidity conditions: Less than 40℃ and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
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TAI-TECH
P8
10. Typical Performance Curves
TMPC0402HP-R10
0.2
100
TMPC0402HP-R18
0.3
150
TMPC0402HP-R22
0.4
80
70
90
0.12
60
0.05
0.3
60
50
0.2
40
30
0.1
20
0.06
TEM P. RISE( o C)
0.18
TEMP. RISE( o C)
40
120
INDUCTANCE (uH)
0.1
TEM P. RISE( o C)
60
0.24
INDUCTANCE (uH)
INDUCTANCE (uH)
80
0.15
20
30
10
0
0
6
12
18
24
0
30
0
0
5.6
11.2
DC CURRENT(A)
22.4
28
4.5
9
100
TMPC0402HP-R47
0.8
70
50
40
30
0.15
60
50
0.4
40
30
0.2
TEM P. RISE( o C)
0.3
0.6
INDUCTANCE (uH)
60
80
70
TEM P. RISE( o C)
INDUCTANCE (uH)
70
18
TMPC0402HP-R56
1.2
80
80
0.45
13.5
DC CURRENT(A)
90
INDUCTANCE (uH)
0
0
DC CURRENT(A)
TMPC0402HP-R33
0.6
16.8
0
20
0.9
60
50
0.6
40
30
0.3
TEMP. RISE(oC)
0
20
20
0
0
4.5
9
13.5
0
18
0
3
DC CURRENT(A)
6
9
12
0
2.2
4.4
80
TMPC0402HP-1R0
2
80
70
6.6
8.8
DC CURRENT(A)
DC CURRENT(A)
TMPC0402HP-R68
1.2
0
0
0
11
TMPC0402HP-1R2
3
120
70
100
0.6
40
30
0.3
20
60
50
1
40
30
0.5
TEM P. RISE( o C)
50
1.5
INDUCTANCE (uH)
60
TEM P. RISE( o C)
INDUCTANCE (uH)
INDUCTANCE (uH)
2.4
0.9
80
1.8
60
1.2
40
20
0.6
10
0
2
4
6
8
0
10
0
0
2
DC CURRENT(A)
4
6
0
8
0
0
2
4
DC CURRENT(A)
TMPC0402HP-1R5
3
20
10
0
0
80
TEMP. RISE( o C)
0
10
10
10
TMPC0402HP-2R2
4
6
8
DC CURRENT(A)
80
70
TMPC0402HP-3R3
6
80
70
70
40
1.2
30
20
60
50
2
40
30
1
20
4.5
60
50
3
40
30
1.5
TEM P. RISE( o C)
50
1.8
3
TEM P. RISE( o C)
INDUCTANCE (uH)
60
TEM P. RISE( o C)
INDUCTANCE (uH)
INDUCTANCE (uH)
2.4
20
0.6
10
0
10
0
0
1.875
3.75
5.625
0
7.5
0
1.5
DC CURRENT(A)
3
4.5
0
6
0
0
1
2
DC CURRENT(A)
TMPC0402HP-4R7
8
10
0
80
TMPC0402HP-5R6
10
3
4
DC CURRENT(A)
80
70
TMPC0402HP-6R8
12
70
80
70
4
40
30
2
50
6
40
4
30
20
20
9
60
50
6
40
30
3
20
2
10
0
0
0
0.7
1.4
2.1
DC CURRENT(A)
2.8
3.5
10
0
0
0
0.7
1.4
2.1
2.8
3.5
DC CURRENT(A)
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10
0
0
0
0.9
1.8
DC CURRENT(A)
2.7
TEM P. RISE( o C)
50
60
TEM P. RISE( o C)
INDUCTANCE (uH)
60
TEM P. RISE( o C)
INDUCTANCE (uH)
INDUCTANCE (uH)
8
6
TAI-TECH
P9
80
TMPC0402HP-100
20
70
30
4
50
12
40
8
30
20
TEM P. RISE( o C)
40
60
20
4
10
0
0.6
1.2
1.8
2.4
0
3
0
0
DC CURRENT(A)
0.575
1.15
1.725
2.3
DC CURRENT(A)
TMPC0402HP-220
40
80
60
50
20
40
30
10
TEMP. RISE(oC)
INDUCTANCE (uH)
70
30
20
10
0
0
0.4
0.8
DC CURRENT(A)
1.2
24
40
18
30
12
20
6
10
10
0
0
INDUCTANCE (uH)
50
8
TEM P. RISE( o C)
INDUCTANCE (uH)
INDUCTANCE (uH)
60
50
70
16
12
TMPC0402HP-150
30
80
0
1.6
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0
0
0.38
0.76
1.14
DC CURRENT(A)
1.52
0
1.9
TEMP. RISE(oC)
TMPC0402HP-8R2
16
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