APA-102-2020-256-6A

PCB LED IC APA 102-2020-256-6A ◆Outline (L* W*H): 2.0*2.0*0.75mm ◆Good thermal dissipation & optical uniformity Features Table of Contents Product Code Method-----------------------------------------2  RoHS2.0 Compliant Maximum Rating-----------------------------------------------2  Packaged in 12mm tape on 7" diameter reels Electrical Characteristics -------------------------------------3  EIA STD package Optical characteristics -----------------------------------------3  Compatible with automatic placement equipment Range of Bins --------------------------------------------------4 and infrared reflow solder process Color Coordinate Comparison -------------------------------4  Preconditioning: accelerate to JEDEC level 3 Function description  Serial data transmission signal by（DATA CLK） ----------------------------------------5 Dimensions -----------------------------------------------------6 PIN Configuration Reflow Profile -------------------------------------------7 -----------------------------------------------8 Test Circuit and Handling Precautions ---------------------9 two line Applications  Telecommunication, office automation, home appliances, industrial equipment Packing-----------------------------------------------------------10  Status indicator Precautions-----------------------------------------------------12  Signal and symbol luminaire Test Items and Results of Reliability-----------------------13  Front panel backlighting  Full-color strip.  Indoor decorative lighting / curtain display Version: IS-1.0 Page 1 of 13 PCB LED IC  Product Code Method ----------------------------------------------------------------------------------------------------------------------------------- APA- 102 - 2020 - 256 - 6A ① ② ③ ④ ⑤⑥ ① ② ③ ④ ⑤ Brand Name Model Number Lead Frame Size Gray Scale Pin Number Company Prefix Model: 102 2020: 2.0*2.0mm 256 gray scales 6 Pins type led  Maximum Rating(Ta=25℃) -----------------------------------------------------------------------------------------------------------------------------------Parameter Symbol Rating IC Power Supply Voltage VDD Logic input voltage VI -0.4~VDD +0.4 V Rate of data signal FCLK 15 MHZ ESD pressure VESD 2000 V The max led output Current IOMAX 18 mA Soldering Temperature*1 TSD 260 -0.4~+5.5 Operating Temperature Range -40℃to+85℃ Storage Temperature Range -40℃to+105℃ Unit V o C Notes 1: The maximum of soldering time is 5 seconds in TSD Version: IS-1.0 Page 2 of 13 PCB LED IC  Typic Electrical Characteristics (Ta=25℃;VDD=5V) -----------------------------------------------------------------------------------------------------------------------------------Characteristics Symbol Supply voltage Condition Min. Typ. Max. Unit Vdd 5.0 5.5 V Rate of data signal FCLK 5 - MHZ Input high voltage VIH 0.7 VDD - - V Input low voltage VIL - - 0.3 VDD V The clock high level widch TCLKH 30 - - ns The clock low level widch TCLKL 30 - - ns Data set up time TSETUP 10 - - ns Data hold time THOLD 5 - - ns The frequency of PWM FPWM 20 KHz Static power consumpiton IDD 0.7 mA  Optical Characteristics(Ta=25℃;VDD=5V) -----------------------------------------------------------------------------------------------------------------------------------Characteristics Luminous Intensity Dominant Wavelength Symbol Min. Typ. Max. R - 360 - G - 510 - B - 100 - W 400 800 - R 615 - 630 G 520 - 535 B 460 - 475 Iv λd x 0.2752 y 0.2705 Unit Test condition mcd IF=18mA nm IF=18mA Color Coordinate View Angle Version: IS-1.0 IF=18mA 2θ1/2 - 120 - deg IF=18mA Page 3 of 13 PCB LED IC  Range of Bins -----------------------------------------------------------------------------------------------------------------------------------1) Luminous Intensity-White (IF = 18mA) Bin Code Min. IV (mcd) Max. IV (mcd) P 400 500 Q 500 630 R 630 800 S 800 1000  Color Coordinate Comparison-White -----------------------------------------------------------------------------------------------------------------------------------0.36 0.34 0.32 A1 0.3 0.28 A2 A3 0.26 0.24 A4 0.22 0.2 0.18 0.16 0.21 0.26 0.31 0.36 Color Rank Version: IS-1.0 BIN 碼 X Y X Y X Y X Y A1 0.2609 0.3332 0.3056 0.3078 0.2752 0.2705 0.2303 0.2923 A2 0.3056 0.3078 0.3504 0.2824 0.3202 0.2487 0.2752 0.2705 A3 0.2303 0.2923 0.2752 0.2705 0.2448 0.2332 0.1996 0.2513 A4 0.2752 0.2705 0.3202 0.2487 0.29 0.212 0.2448 0.2332 Page 4 of 13 PCB LED IC  Function description -----------------------------------------------------------------------------------------------------------------------------------(1) Series data structure Tandem N-LED (2) 5-Bit (level 32) brightness adjustment (simultaneous control of OUTR\OUTG\OUTB three port current) (3) PWM input/output signals relations Maximum serial input data clock PWM :20KHz,frequency 30MHZ (lighting application When the clock frequency is controlled below 2MHz) Version: IS-1.0 Page 5 of 13 PCB LED IC  Dimensions ------------------------------------------------------------------------------------------------------------------------------------ § All dimensions are in millimeters. § Tolerance is ±0.1mm unless other specified § Specifications are subject to change without notice Version: IS-1.0 Page 6 of 13 PCB LED IC  PIN Configuration --------------------------------------------------------------------------------------------------------------------------------- No. Symbol Function description 1 CO Clock output 2 VDD supply voltage 3 CI Clock input 4 DO Data output 5 GND Ground 6 DI Data input Version: IS-1.0 Page 7 of 13 PCB LED IC  Reflow Profile -----------------------------------------------------------------------------------------------------------------------------------1. IR reflow soldering Profile for Lead Free solder 300 ℃ 250 temperature 10sec. max 1-5℃/sec Pre heating 150-180℃ 200 260℃ max 2-5℃/sec 230℃ max 2-5℃/sec 150 120sec.Max 50sec.max 100 50 25℃ 0 0 50 100 Time 150 200 250 300 sec Notes: 1. We recommend the reflow temperature at 240℃ (±5℃), and the maximum soldering temperature should be limited to 260℃. 2. Don’t cause stress to the silicone resin while it is exposed to high temperature. 3. Number of reflow process shall not be more than 1 time. Version: IS-1.0 Page 8 of 13 PCB LED IC  Test Circuit and Precautions for Use -----------------------------------------------------------------------------------------------------------------------------------1. Typical application circuit GND DI 6 5 4 6 5 4 6 5 4 ... ... 3 2 1 3 2 1 3 2 1 CI VDD 2. Precautions for Use 2.1. Over-current-proof Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (Burn-out will happen). 2.2. Storage 1). To store the products is recommended with following conditions: Humidity: 60% R.H. Max. Temperature: 5℃~30℃(41℉~86℉) 2). Shelf life in sealed bag: 12 month at ＜5℃~30℃ and ＜60% R.H. after the package is Opened, the products should be used within 1 week or they should be keeping to stored at ≦20%R.H. with zip-lock sealed. 2.3. Baking If the package has been opened for more than 1 week, it is recommended to bake the products with the following instruction: 1). 60±3℃ X 6hrs and ＜5%RH, for reel 2). 125±3℃ X 2hrs, for single LED It shall be normal to see slight color fading of carrier (light yellow) after baking in process Version: IS-1.0 Page 9 of 13 PCB LED IC  Packing -----------------------------------------------------------------------------------------------------------------------------------  Feeding Direction Dimensions of Reel (Unit: mm) Feeding Direction Dimensions of Tape (Unit: mm) 4±0.1 1.5±0.1 2.39±0.1 2.75 3.5±0.05 2±0.05 8±0.3  0.97±0.1 4±0.1 2.39±0.1  Arrangement of Tape Reel End of tape No Leds LEDs mounting part No LEDs Top cover tape Pull direction Reel Lead Min 160mm(No LEDs) Reel Lead Min 100mm(No LEDs) Embossed carrier tape Reel Lead Min400mm Notes: 1. Empty component pockets are sealed with top cover tape; 2. The max loss number of SMD is 2pcs; 3. The cathode is oriented towards the tape sprocket hole in accordance with ANSI/EIA RS-481 specifications; 4. 4000pcs per reel Version: IS-1.0 Page 10 of 13 PCB LED IC  Packing ----------------------------------------------------------------------------------------------------------------------------------- Packaging Specifications Reel(4000pcs) Moisture-poof bag Label inspection request form Inner box(Max. 8 reels) Label Outer box(Max. 4 inner boxes) Notes: Reeled product (max.4000) is packed in a sealed moisture-proof bag. Seven bags are packed in an inner box (size: about 260 X 230 X 100 mm) and four inner boxes are in an outer box (size: about 480 X 275 X 215mm). On the label of moisture-poof bag, there should be the information of Part No., Lot No. and quantity number; also the total quantity number should be on inspection request form on outer box. Version: IS-1.0 Page 11 of 13 PCB LED IC  Precautions ----------------------------------------------------------------------------------------------------------------------------------1. Abnormal situation caused by improper setting of collet To choose the right collet is the key issue in improving the product’s quality. LED is different from other electronic components, which is not only about electrical output but also for optical output. This characteristic made LED more fragile in the process of SMT. If the collet’s lowering down height is not well set, it will bring damage to the gold wire at the time of collet’s picking up and loading which will cause the LED fail to light up, light up now and then or other quality problems 2. How to choose the collet During SMT, please choose the collet that has larger outer diameter than the lighting area of lens, in case that improper position of collet will damage the gold wire inside the LED. Different collets fit for different products, please refer to the following pictures cross out Outer diameter of collet should be larger than the lighting area Picture 1() Picture 2(X) 3. Other points for attention A. No pressure should be exerted to the epoxy shell of the SMD under high temperature. B. Do not scratch or wipe the lens since the lens and gold wire inside are rather fragile and cross out easy to break. C. LED should be used as soon as possible when being taken out of the original package, and should be stored in anti-moisture and anti-ESD package. 4. This usage and handling instruction is only for your reference. Version: IS-1.0 Page 12 of 13 PCB LED IC  Test Items and Results of Reliability ------------------------------------------------------------------------------------------------------------------------------ Test Item Test Conditions Duration/ Cycle Ac/Re Number of Damage Reference 1008 hrs 0/1 0/22 JESD22 A-108 1008 hrs 0/1 0/22 JESD22 A-108 1008 hrs 0/1 0/22 JESD22 A-108 1008 hrs 0/1 0/22 JESD22 A-104 Ta＝23℃(±5℃) Normal Temperature Life IF=10mA(5bit-level 15) Ta＝85℃(±5℃) High Temperature Life High Humidity Heat Life IF=10mA(5bit-level 15) Ta＝85℃(±5℃) RH=85% IF=10mA(5bit-level 15) -45℃/30min~105℃ Thermal shock /30min (±5℃) Electrostatic Discharge (ESD) Test According to the SPEC 3 cycles 0/1 0/22 AEC Q101-001 Low Temperature Storage Ta=-40℃ 1008 hrs 0/1 0/22 JESD22-A103D High Temperature Storage Ta=105℃ 1008 hrs 0/1 0/22 JESD22-A103D Symbol Condition *Criteria for Judging Criteria for Judgment of Pass Item Luminous Intensity [Note] Iv IF=10mA Min Max LSL*2×0.7 - LSL*2: Lower Specification Level Version: IS-1.0 Page 13 of 13