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FT1189FQV2
Module Datasheet
FTY Technology Co.,Ltd
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FT1189FQV2
Module Datasheet
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Office / Factory: 602,Building 1,Edmonto Industrial Park, No.4 Industrial
Zone,Shutianpu Community, Matian Street, Guangming District,
Shenzhen, China
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Website: www.phaten.com
Company
Title
Signature
Date
FTY
FTY Technology Co.,Ltd
Customer Approval
Version Update Record
Revision Content
Editorial Staff
V1.0
2018/07/06
The first version
V2.0
2022/05/26
Size error range update
V3.0
2022/06/13
RM03-FTV(VQ1) Product
name update
Approval
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Date
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Version
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CONTENTS
1 Overview ..................................................................................................................................... 5
1.1 Introduction ........................................................................................................................5
1.2 Features ............................................................................................................................ 5
1.3 Block Diagram ................................................................................................................... 6
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1.4 General Specification ........................................................................................................ 6
1.5 DC Characteristics .............................................................................................................7
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2 RF Specifications ........................................................................................................................ 8
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3 Pin Assignments ......................................................................................................................... 9
3.1 Pin Outline ......................................................................................................................... 9
3.2 Pin Definition ................................................................................................................... 10
4 Dimensions ............................................................................................................................... 12
4.1 Module Picture .................................................................................................................12
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4.2 Module Physical Dimensions ...........................................................................................12
5 Reference Design ..................................................................................................................... 13
6 The Key Material List ................................................................................................................ 14
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7 Recommended Reflow Profile .................................................................................................. 15
8 Package Information ................................................................................................................. 16
8.1 Reel ................................................................................................................................. 16
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8.2 Carrier Tape Detail ...........................................................................................................16
8.3 Packaging Detail ..............................................................................................................17
8.4 Moisture sensitivity .......................................................................................................... 17
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1 Overview
1.1 Introduction
FT1189FQV2 is a highly integrated module, it puts a wireless LAN MAC, a 1
T1R capability of the wireless LAN baseband,and wireless LAN RF set together.Th
is module provides a complete solution for integrated WLAN devices with high thr
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oughput performance.Supports all IEEE 802.11b/g/n data rates,providing support for
traditional data rates, powerful interference detection and suppression offers to pr
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event interference from Bluetooth,cordless phones and microwave ovens.It has syn
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chronous and asynchronous control loop between antennas,antenna diversity functi
on and adaptive transmission power control function to obtain better performance
of the analog part of the transceiver. Provides simple traditional and 20MHz co-exi
stence mechanisms to ensure backward and network compatibility.
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1.2 Features
●Complete 802.11b/g/n solution for 2.4GHz band
20MHz bandwidth
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●72.2Mbps receive PHY rate and 72.2Mbps transmit PHY rate using
●SDIO interface for configurable endian for WLAN
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●Channel management and co-existence
●One Transmit and one Receive path (1T1R)
●DSSS with DBPSK and DQPSK, CCK modulation with long and
short preamble
●OFDM with BPSK, QPSK, 16QAM, and 64QAM modulation.
Convolutional Coding Rate: 1/2, 2/3, 3/4,and 5/6
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Model Name
FT1189FQV2
WIFI4 SDIO Module
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Product Description
Dimension
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1.4 General Specification
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1.3 Block Diagram
Wi-Fi Interface
BT Interface
L x W x H: 12x12x1.4 (±0.3) mm
Support SDIO
N/C
Operating Temperature
- 0℃ to +70℃
Storage Temperature
-55℃ to 125℃
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1.5 DC Characteristics
Power Supply Characteristics
Symbol
Min.
Typ.
Max.
Unit
VCC33
3.15
3.3
3.45
V
VDDIO
1.7
1.8 or 3.3
3.45
V
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VCC33=3.3V(Unit:mA)
Wi-Fi on Mode
120
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120
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RX
(2.4G HT20)
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TX
(2.4G HT20)
Power Consumption
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2 RF Specifications
Features
Description
Number of Channel
2.4~2.4835GHz (2.4GHz ISM Band)
WiFi 2.4GHz:
11: (Ch. 1-11) – United States;
13: (Ch. 1-13) –Europe;
14: (Ch. 1-14) – Japan
TX Power
TX Power
Tolerance
802.11b@11Mbps
17dBm
±2dBm
≤-13dB
802.11g@54Mbps
14dBm
±2dBm
≤-25dB
802.11n@BW20_MCS7
13dBm
≤-28dB
2.4G Receiver Specifications
EVM
PER
802.11b@11Mbps
≤-85dBm
8%
802.11g@54Mbps
≤-70dBm
10%
802.11n@BW20_MCS7
≤-65dBm
10%
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Standard Value
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RX Rate
±2dBm
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Frequency Error:±12PPM
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TX Rate
2.4G Transmitter Specifications
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Frequency Range
802.11b/g/n
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WLAN Standard
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3 Pin Assignments
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3.1 Pin Outline
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3.2 Pin Definition
NO
Name
Type
Description
1
GND
-
2
RF1
I/O
3
GND
-
Ground
4
NC
-
NC
5
NC
-
NC
6
NC
-
NC
7
NC
-
NC
8
NC
-
NC
9
VDD33
P
3.3V
10
NC
-
NC
11
NC
-
NC
12
CS
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13
WL_HOST_
WAKE
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WLAN to wake-up HOST
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SD_D2
I/O
SDIO data line 2
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SD_D3
I/O
16
SD_CMD
I/O
17
SD_CLK
I
18
SD_D0
19
SD_D1
20
GND
Ground
VDDIO
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SDIO command line
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SDIO CLK line
I/O
SDIO data line 0
I/O
SDIO data line 1
NC
VDDIO
P
1.8V / 3.3V
NC
-
NC
NC
-
NC
25
NC
-
NC
26
NC
-
NC
27
NC
-
NC
28
NC
-
NC
29
NC
-
NC
30
NC
-
NC
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GND
-
Ground
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3.3V
SDIO data line 3
NC
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3.3V
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Chip select ,Activity high;Internal pull high to
3.3V at 100KΩ
Ground
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ANT
-
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Voltage
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VDDIO
10
33
GND
-
Ground
34
NC
I
NC
35
NC
-
NC
36
GND
-
Ground
37
NC
-
NC
38
NC
-
NC
39
NC
-
NC
40
NC
-
NC
41
NC
-
NC
42
NC
-
NC
43
NC
-
NC
44
NC
-
NC
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NC
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NC
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4 Dimensions
4.1 Module Picture
LxW:12x12(±0.3)mm
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PIN1
4.2 Module Physical Dimensions
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(Unit: mm)
H:1.4(±0.3)mm
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5 Reference Design
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6 The Key Material List
No.
Parts
Specification
Manufacturer
Note
1
Chipset
RTL8189FTV-VQ1-CG
Realtek Semiconductor Corp
2
PCB
8189FTV-M-V1.0
Xinfeng Fuchangfa Electronics Co., Ltd
3
PCB
8189FTV-M-V1.0
Shenzhen Kexiang Precision Circuit
Technology Co., Ltd
Crystal 3225 26MHZ 10PPM 9PF
oscillator (晶威特/精标) -20 to +85℃
Hefei Jing Wei Te Electronics Co. Ltd
5
26MHZ 晶振
Crystal
10PPM/9PF/3225(精标)-20
oscillator
to +85℃
Zhejiang Lanjing Micro electronics Co.,
Ltd
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7 Recommended Reflow Profile
Constant temperature and reflow soldering
The heating/reflow phase generates liquid phase temperatures above 216-221°C. Sudden
temperature increases need to be prevented as they increase the risk of solder paste collapse.
Liquid phase temperature time above 220°C: 60-90 seconds.
Peak reflow temperature: 235~245°C.
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Constant temperature time (170~220°C): 60~120 seconds.
Temperature ramp: less than 3°C/s.
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Cooling slope: -4~ -1°C/s.
Notes:
The actual soldering temperature depends on other external factors such as the solder paste
selected, the size and thickness of the substrate and the board design. If the maximum soldering
temperature in the recommended soldering profile is exceeded, there is a risk of permanent
damage to the module.
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8 Package Information
8.1 Reel
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A roll of 2000pcs
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8.3 Packaging Detail
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8.4 Moisture sensitivity
The Modules is a Moisture Sensitive Device level 3, in according with standard
IPC/JEDEC J-STD-020, take care all the relatives requirements for using this kind of
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components.
Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at