LY323DC05UL

TVS Diode Arrays LY323DCXXUL Series Description The LY323DCXXUL is a bi-directional TVS diode array, utilizing leading monolithic silicon technology to provide fast response time and low ESD clamping voltage, making this device an ideal solution for protecting voltage sensitive high-speed data lines. It complies with IEC 61000-4-2 (ESD), ±30kV air and ±30kV contact discharge. It is assembled into a lead-free SOD-323 package. The small size, low capacitance and high ESD surge protection make it a ideal choice to protect cell phone, wireless systems, and communication equipment. Features       Low clamping voltage Ultra low leakage current Operating voltage: 3.3V~24V RoHS compliant IEC-61000-4-2 ESD ±30kV Air, ±30kV Contact Packaging: 7 inch reel, 3000pcs/reel Applications     USB Ports Smart Phones Wireless Systems Ethernet 10/100/1000 Bast T Pin Configuration and Marking 1 2 Circuit and Pin Schematic www.liownsemi.com 掌握芯技术Core Technology （V2） TVS Diode Arrays LY323DCXXUL Series Absolute Maximum Ratings (TA=25℃) Parameter Symbol Value Peak Pulse Power (8/20µs) PPP 300W ESD per IEC 61000−4−2 (Air) ESD per IEC 61000−4−2 (Contact) VESD ±30kV ±30kV Ambient Temperature Range TA −55℃ to +125℃ Storage Temperature Range TSTG −55℃ to +150℃ Electrical Characteristics (TA=25℃) Part Number Marking Reverse Working Voltage Reverse Breakdown Voltage @IT=1mA Reverse Leakage Current @VRWM Clamping Voltage @8/20µs Peak Pulse Current Junction Capacitance @VR=0V, f=1MHz VRWM (V) VBR (V) IR (µA) VC (V) IPP (A) CJ (pF) Max. Min. Max. @1A @IPP Max. Max. Typ. LY323DC03UL CC 3.3 4.4 0.2 7 16 21 1 LY323DC05UL AC 5.0 6.0 0.2 10 20 18 1 LY323DC08UL BC 8.0 8.5 0.2 9 19.5 18 1 LY323DC12UL DC 12.0 13.3 0.2 18 25 14 1 LY323DC15UL EC 15.0 16.7 0.2 21 30 10 1 LY323DC24UL HC 24.0 27.0 0.2 36 55 6 1 www.liownsemi.com 掌握芯技术Core Technology （V2） TVS Diode Arrays LY323DCXXUL Series Typical Characteristic Curves (TA=25℃) Figure 1. Peak Pulse Power Rating Curve Figure 2. Pulse Derating Curve 10000 1000 100 10 0.1 1 10 td-Pulse Width (µs) Figure 3. Pulse Waveform (8/20µs) 100 Figure 4. Pulse Waveform (IEC61000-4-2) I 100% % of Peak Pulse Current 90% 10% tr=0.7~1ns 30ns 60ns www.liownsemi.com 掌握芯技术Core Technology t （V2） TVS Diode Arrays LY323DCXXUL Series Soldering Parameters Reflow Soldering Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3℃/second max. Preheat -Temperature Min (TS min) -Temperature Max (TS max) -Time (min to max) ( tS) 150℃ 200℃ 60-180 seconds TS max to TL -Ramp-up Rate 3℃/second max. Time maintained above: -Temperature (TL) -Time (tL) 217℃ 60-150 seconds Peak Temperature (TP) 260℃ Time within 5℃ of actual Peak Temperature (tP) Ramp-down Rate 6℃/second max. Time 25℃ to Peak Temperature www.liownsemi.com 20-40 seconds 8 minutes max. 掌握芯技术Core Technology （V2） TVS Diode Arrays LY323DCXXUL Series Dimensions (SOD-323) Millimeters A D H2 Side View Top View t www.liownsemi.com H H1 Inches Symbol Min. Max. Min. Max. A 2.30 2.80 0.091 0.110 B 1.15 1.40 0.045 0.055 C 0.25 0.40 0.001 0.016 D 1.60 1.80 0.063 0.071 H 0.80 1.10 0.031 0.043 H1 0.80 0.90 0..031 0.035 H2 0.00 0.10 0.000 0.004 t 0.08 0.18 0.003 0.007 掌握芯技术Core Technology （V2）