深 圳 市 深 宏 电 子 有 限 公 司
SHENZHEN SHENHONG OPTOELECTRONICS CO;LTD
承认书
SPECIFICATION FOR APPROVAL
客户名称 Customer name:
深圳市立创电子商务有限公司
产品名称 Product name:
产品型号 The product model
3MM 绿发绿雾状无边
91102015
:
样品编号 Sample Numbers:
客户编号 Customer Numbers:
日
期 Date:
2023-4-21
深圳市深宏电子有限公司
SHENZHEN SHENHONG OPTO ELECTRONICS CO;LTD
品质部
Quality Dept
工程部
Engineering Dept
市场部
Marketing Dept
说明:
致执事者:兹提供敝公司产品之有关详细规格及图面资料,敬请给予办理测试确定,同时敬
请送返一份有贵司签认之测试确认后样品确认书。
客户确认签名
Customers confirmation signature
工程部
Engineering Dept
品质部
Quality Dept
地址:
广东省深圳市宝安区松岗街道朗下社区沙江路 314 号稳丰工业园 A 栋 3 楼
3rd Floor, Building A, Wenfeng Industrial Park, No. 314 Shajiang Road, Langxia
Community, Songgang Street,Bao'an District, Shenzhen City, Guangdong Province
电话(Tel):0755-81766501/29719689/29719996
Http://www.shenhongled.com
传真(Fax):0755-81766538
E-mail:shenhongled@126.com
Production Specification
(生产规格)
91102015
型号 Model:
Outline Dimensions(外形尺寸)
单位
圖面未注公差
胶体外观公差
Units
Encapsulation Tolerance
Encapsulation tolerance
胶体伸出尺寸(NOTE)
Dimensions of protruded flange
mm
±0.25
※备注:承认书编号和型号可用于查询,客户如有需要,请提供相应的编号和型号名。
Remark:P/N & Model in samples approval sheet can be used to inquire'please provide corresponding
P/N & Model if customer need.
§封装标准 Packaging Standard 3 mm.
項目
ITEM
封装外形样式
PACKAGE TYPE
樹脂模 Resin(Mold)
A
環氧樹脂 Epoxy
白色扩散
White Diffused
環氧樹脂 Epoxy
水透明
Water Transparent
環氧樹脂 Epoxy
環氧樹脂 Epoxy
H
彩色透明
Colored Transparent
--
银色 silver
Ag Plating Iron Alloy
--
方片 Dice
GaAsP/GaP
B
Yellow
C
Blue
W
Green
R
White
S
F
支架(引線)Lead Frame
芯片材料 Die material
物料
MATERIALS
彩色扩散
Colored Diffused
Red
顏色代碼
Lens Color Code
透镜外表
Lens appearance
色素 pigment
扩散剂 Diffuser agent
-----
色素 pigment
※封装外形样式 PACKAGE TYPE:A:联式 Array、B:圆头 Round head 、C:;圆柱形(含内凹)Cylindrical、w:椭圆形 Oval、R:方形 Rectangular、s:塔形 Tower、F:
食人鱼 LED Piranha LED 、 H:贴片 LED SMD LED 。
§ 最大额定值 Absolute Maximum Ratings(Ta=25℃).
(环境温度 Ambient temperature:25℃
项目
Item
温度 humidity:RH60%
符号
Symbol
数值
Value
单位
Unit
备注
Remark
功率消耗(Power Dissipation)
Pd
80
mW
---
正向电流(Forward Current)
IF
30
mA
---
峰值电流(Peak Forward Current* )
IFP
100
mA
F=1KHZ, 占空比(duty cycle)1/10
逆向电压(Reverse Voltage)
VR
5
V
---
操作溫度(Operating Temperature)
Topr
-30℃~+80℃
℃
---
贮存溫度(Storage Temperature)
Tstg
-40℃~+100℃
℃
---
焊接溫度(Soldering Temperature)
Tsol
260℃(for 5 seconds)
℃
波峰焊,离胶体 3mm 处 5S-10S
1
※Condition for IFP is pulse of 1/10 duty and 0.1msec width.
§可靠性实验项目 Reliability Test Project
描述
項目
测试标准
测试条件
测试时间
数量
失效数量
Description
ITEM
Test criterion
Test condition
Test time
Qty
Fail Qty
寿命测试
常温寿命测试
JIS7021:B4
Ta=25℃±5℃,IF=20mA
1000Hrs
0
Ta=85℃±5℃
1000Hrs
0
JIS7021:B12
Ta=-35℃±5℃
1000Hrs
0
JIS7021:B11
Ta=85℃±5℃
MIL-STD-202:103D
RH=85%
24Hrs
0
JIS7021:B11
30min
50Cycles
0
MIL-STD-202:107D -35℃~25℃~85℃~-35℃ 50Cycles
0
Life test
Life test(room tmperature)
JIS7021:B10
高温存贮
MIL-STD-202:210A
High temperature store
MIL-STD-750:2031
低温存贮
Low temperature store
高湿温测试
环境测试
High temperature/humidity
Ambience test
test
冷热冲击测试
MIL-STD-202:17D -30℃±5℃
Cold/Heat strike test
85℃±5℃
MIL-STD-750:1026 5min
JIS7021:A3
冷热循环测试
Cold and heat cycle test
5min
5min 5min 5min
MIL-STD-705:105E 30min
5min 30min 5min
§光电参数 Electrical and optical characteristics(Ta=25℃)
参数
Parameter
符号
Symbol
测试条件
Test condition
最小值
Min.
典型值
Typ.
最大值
Max.
单位
Unit
正向电压 Forward Voltage
VF
IF=20mA
1.8
-
2.4
V
发光强度 Luminous Intensity
Iv
IF=20mA
20
-
80
mcd
反向电流 Reverse Current
Ir
VR=5V
-
-
5
µA
波长 Peak Wave Length
Nm
IF=20mA
-
-
-
nm
主波长 Dominant Wave Length
Nm
IF=20mA
565
-
575
nm
可视角度 Viewing Angle
2θ1/2
IF=20mA
-
30
-
deg
§典型特性曲线图 Typical photoelectricity characteristic curve chart
§注意事项 Note
(一)引脚成形方式 (LED bracket forming method)
⑴ 必须离胶体 2 毫米才能折弯支架
The pin of LED can be bent where is at 2mm out of LED colloid .
⑵ 支架成形必须用夹具或由专业人员来完成
Must use fixture to deform the LED btacket.
⑶ 支架成形必须在焊接前完成
Finishing the forming of LED bracket must be before soldering.
⑷ 支架成形需保证引脚的间距与线路板一致
Guarantee the gap between two pin of LED tallys with LED pads in PCB when forming.
(二)烙铁焊接(Manual soldering)
烙铁(最高 30W)尖端温度不能超过 300℃;焊接时间不能超过 3 秒;焊枪位置至少离胶体 3
毫米。
The tip temperature of soldering iron don't exceed 300℃; soldering time don't exceed 3s and
soldering position must be 3mm out of LED colloid.
(三)防静电措施(ESD countermeasure)
静电及高压会对 LED 造成损坏,特别是芯片材质为 InGaN 的产品对静电防护要求更衣加严格,
要求在使用和检验产品时戴防护静电手碗带或静电手套,焊接工具及设备外壳需可靠接地,
焊接条件遵循此份规格书中的条件。
Static electricity and high volt can damage LED,The production whose die material is InGaN must
strictly required to prevent ESD, Must put on static glove and static fillet ,soldering tool and the
cover of device must connect the ground ,soldering condition follows the related of production
specification manual.
(四)过电流保护(Protecting countermeasure when over current)
为避免由于电压的变化引起大电流冲击而造成产品损坏,需要加入保护电阻。
Need add the protecting resistor in circuit in order to avoid damaging LED due to big current and
voltage fluctuation.
(五)LED 安装方法(LED installation method)
1)注意各类器件外线的排列以防性能装错,器件不可与发热元件靠得太近,工作条件不要超
过其规定的极限。
Pay attention to the LED polarity and avoid installation wrong .LED close to euthermic component
work condition should with it's specification.
2)务必不要在引脚间距变形的情况下安装 LED
Don't install the LED undet the condition of the LED pin deformation
3)当装配 LED 进入 PCB 或装配孔时,LED 支架不能承受任何压力
The LED bracket don't load any pressure when installing the LED PCB or fitting hole.
4)在焊接温度回到正常以前,必须避免使 LED 受到任何的震动或外力
Must avoid any strike and force on LED before the soldering temperature return to room
temperature return to room temperature.
六)存储时间(Storage time)
1)在温度 5℃~35℃,湿度 RH60%条件下,产品可保存一年,超过保存期的产品需重新检测
后方能使用。
LED can be stored for a year under the condition:the temperature of 5℃~35℃,and
humidity Of RH60%,these production must be re –inspected and tested before use if
their storage time exceed a year.
2)如果打开的产品在 5℃~35℃,RH60%的空气条件下放置一周,则需要将产品在 65℃±5℃
的环境中放置 24 小时以上,并尽量在十五天内使用。
If LED is exposed in air for a week under the condition:the temperature of 5℃~
35℃,humidity Of RH60%, must place the LED in the ambience of 65℃±5℃ for 24 hours
use it in 15 days for best.
(七)清洗(Cleaning)
当用化学用品清洗胶体时必须特别小心,因为有些化学对胶体表面有损伤并引起退色如三氯
乙烯、丙酮等。可用乙醇擦拭、浸渍,时间在常温下不能超过 3 分钟。
Be careful of some chemical results in the LED colloid fades and damage when using chemical the
LED, such as Chloroethylene ,acetone etc. can use ethanol to wash or soak LED but the time don't
exceed 3 minutes.
(八)弯脚(Kinked)
当 LED 成形弯脚时,弯脚模具容易刮花 LED 脚支架镀层,刮伤处容易生锈,特别是空气湿度
大时,为减少生锈机会,建议使用镀锡支架。
The kinked tooling scrape easily the pin of LED , where the LED bracket is rusting easily ,especial
it in moist air. To decrease the LED bracket rust ,advise using plated tin LED bracket
很抱歉,暂时无法提供与“91102015”相匹配的价格&库存,您可以联系我们找货
免费人工找货