TN2404K-T1-E3
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N-Channel 200 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
200
RDS(on) ()
ID (A)
1.4 at V GS = 10 V
0.6
• Halogen-free According to IEC 61249-2-21
Definition
• 100 % Rg and UIS Tested
• TrenchFET® Power MOSFET
• Compliant to RoHS Directive 2002/95/EC
D
TO-236
(SOT-23)
G
1
G
3
S
D
2
S
Top View
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Symbol
5s
Steady State
Drain-Source Voltage
VDS
200
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 150 °C)a
TA = 25 °C
TA = 70 °C
Pulsed Drain Currentb
Avalanche Currentb
Single Avalanche Energy
L = 0.1 mH
Continuous Source Current (Diode Conduction)a
Power Dissipationa
TA = 25 °C
TA = 70 °C
ID
0.45
0.5
0.35
2.5
IAS
2.5
EAS
50
IS
0.6
A
mJ
A
1.55
1.03
1.20
0.87
TJ, Tstg
Operating Junction and Storage Temperature Range
V
0.6
IDM
PD
Unit
- 55 to 150
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta
Maximum Junction-to-Foot
Symbol
t5s
Steady State
Steady State
RthJA
RthJF
Typical
Maximum
80
100
130
170
45
55
Unit
°C/W
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. Pulse width limited by maximum junction temperature.
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SPECIFICATIONS (TA = 25 °C, unless otherwise noted)
Limits
Parameter
Symbol
Test Conditions
Min.
200
Unit
Max.
Typ.
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-Resistancea
Forward Transconductancea
Diode Forward Voltage
VDS
VGS = 0 V, ID = 1 mA
VGS(th)
VDS = VGS, ID = 250 µA
IGSS
VDS = 0 V, VGS = ± 20 V
± 100
VDS = 100 V, VGS = 0 V
1
VDS = 100 V, VGS = 0 V, TJ = 70 °C
75
IDSS
1.5
V
3.5
nA
µA
ID(on)
VDS 15 V, VGS = 10 V
RDS(on)
VGS = 10 V, ID = 0.5 A
1.4
gfs
VDS = 15 V, ID = 0.5 A
4
S
VSD
IS = 1 A, VGS = 0 V
0.8
VDS = 100 V, VGS = 10 V, ID = 0.5 A
0.37
2.5
A
1.2
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
3
5
nC
1.45
0.5
1.3
2.4
7
11
Switching
Turn-On Delay Time
td(on)
Rise Time
VDD = 100 V, RL = 33
ID 0.2 A, VGEN = 10 V, Rg = 6
tr
Turn-Off Delay Time
td(off)
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
10
15
9
15
11
15
ns
IF = 0.5 A, dI/dt = 100 A/µs50100
Notes:
a. Pulse test: PW 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
4
4
VGS = 10 V, 9 V, 8 V
7V
3
I D - Drain Current (A)
I D - Drain Current (A)
3
6V
2
5V
1
2
TC = 125 °C
1
25 °C
3 V, 2 V, 1 V
4V
- 55 °C
0
0
0
2
4
6
8
VDS - Drain-to-Source Voltage (V)
Output Characteristics
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10
0
2
4
6
VGS - Gate-to-Source Voltage (V)
8
Transfer Characteristics
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TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
250
3.0
R DS(on) - On-Resistance ()
2.5
200
C - Capacitance (pF)
2.0
VGS = 10 V
1.5
1.0
Ciss
150
100
50
0.5
Coss
Crss
0
0.0
0
3
6
ID - Drain Current (A)
9
40
0
12
On-Resistance vs. Drain Current
200
2.5
VDS = 50 V
ID = 0.5 A
RDS(on) - On-Resistance (Normalized)
VGS - Gate-to-Source Voltage (V)
160
Capacitance
20
16
12
8
4
0
0
1
2
3
4
Qg - Total Gate Charge (nC)
5
VGS = 10 V
ID = 0.5 A
2.0
1.5
1.0
0.5
0.0
- 50
6
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
0.6
10
RDS(on) - On-Resistance ()
0.5
IS - Source Current (A)
120
80
VDS - Drain-to-Source Voltage (V)
TJ = 150 °C
1
0.1
TJ = 25 °C
ID = 0.5 A
0.4
0.3
0.2
0.1
0.01
0.0
0.0
0.2
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
1.2
0
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
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0.6
12
0.3
10
ID = 250 µA
8
0.0
Power (W)
V GS(th) Variance (V)
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
- 0.3
TA = 25 °C
6
- 0.6
4
- 0.9
2
- 1.2
- 50
- 25
0
25
50
75
100
125
150
0
0.01
0.1
1
10
100
600
Time (s)
TJ - Temperature (°C)
Threshold Voltage
Single Pulse Power
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = R thJA = 176 °C/W
3. T JM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10- 4
10- 3
10- 2
10- 1
1
Square Wave Pulse Duration (s)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
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SOT-23 (TO-236): 3-LEAD
b
3
E1
1
E
2
e
S
e1
D
0.10 mm
A
C
0.004"
A2
C
q
Gauge Plane
Seating Plane
Seating Plane
C
A1
Dim
0.25 mm
L
L1
MILLIMETERS
INCHES
Min
Max
Min
Max
A
0.89
1.12
0.035
0.044
A1
0.01
0.10
0.0004
0.004
A2
0.88
1.02
0.0346
0.040
b
0.35
0.50
0.014
0.020
c
0.085
0.18
0.003
0.007
D
2.80
3.04
0.110
0.120
E
2.10
2.64
0.083
0.104
E1
1.20
1.40
0.047
0.055
e
0.95 BSC
0.0374 Ref
e1
1.90 BSC
0.0748 Ref
L
0.40
L1
S
q
0.60
0.016
0.64 Ref
0.50 Ref
3°
0.024
0.025 Ref
0.020 Ref
8°
3°
8°
ECN: S-03946-Rev. K, 09-Jul-01
DWG: 5479
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0.049
(1.245)
0.029
0.022
(0.559)
(0.724)
0.037
(0.950)
(2.692)
0.106
RECOMMENDED MINIMUM PADS FOR SOT-23
0.053
(1.341)
0.097
(2.459)
Recommended Minimum Pads
Dimensions in Inches/(mm)
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