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SS1045 THRU SS10100
Semiconductor
Compiance
EATURES
• Metal silicon junction, majority carrier conduction
• For surface mounted applications
• Low power loss, high efficiency
• High forward surge current capability
• For use in low voltage, high frequency inverters,
free wheeling, and polarity protection applications
MECHANICAL DATA
• Case: SMC
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 0.22g / 0.0077oz
SMC
Absolute Maximum Ratings and Electrical characteristics
Ratings at 25 °C ambient temperature unless otherwise specified.Single phase, half wave, 60Hz resistive or inductive load, for
capacitive load, derate by 20 %
SS10100
Units
60
100
V
32
42
70
V
45
60
100
V
Symbols
SS1045
Maximum Repetitive Peak Reverse Voltage
VRRM
45
Maximum RMS voltage
VRMS
Maximum DC Blocking Voltage
VDC
Maximum Average Forward Rectified Current
IF(AV)
10.0
A
Peak Forward Surge Current,8.3ms
Single Half Sine-wave Superimposed on
Rated Load (JEDEC method)
IFSM
150
A
Max Instantaneous Forward Voltage @10.0 A
VF
Maximum DC Reverse Current Tj = 25°C
at Rated DC Reverse Voltage
Tj =100°C
IR
0.5
50
RθJA
20
Tj
-55 ~ +150
Tstg
-55 ~ +150
Parameter
Typical Thermal Resistance
Operating Junction Temperature Range
Storage Temperature Range
(1)P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas.
0.55
SS1060
0.75
0.90
V
mA
°C/W
°C
°C
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SS1045 THRU SS10100
Semiconductor
Fig.1 Forward Current Derating Curve
Fig.2 Typical Reverse Characteristics
1000
10.0
8.0
6.0
4.0
2.0
0.0
25
50
75
100
125
150
Instaneous Reverse Current ( mA)
Average Forward Current (A)
12.0
100
10
0
1
SS1045C
SS1060C
SS10100C
1.5
2.0
Instaneous Forward Voltage (V)
Transient Thermal Impedance(°C/W)
Instaneous Forward Current (A)
10
1.0
0
20
40
60
80
100
Fig.4- Typical Transient Thermal Impedance
20
0.5
T J=25°C
Percent of Rated Peak Reverse Voltage(%)
Fig.3 Typical Forward Characteristic
0
T J=100°C
1
Case Temperature (°C)
0.1
Compiance
100
10
1
0.01
0.1
1
10
100
t, Pulse Duration(sec)
Peak Forward Surage Current (A)
Fig.5 Maximum Non-Repetitive Peak
Forward Surage Current
180
175
150
125
100
75
50
25
00
8.3 ms Single Half Sine Wave
(JEDEC Method)
1
10
100
Number of Cycles at 60Hz
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SS1045 THRU SS10100
Semiconductor
Compiance
PACKAGE MECHANICAL DATA
B
Dimensions
H
F
A
C
Ref.
D
K
J
L
J
G
E
Millimeters
Min.
Max.
Min.
Max.
A
5.75
6.25
0.226
0.246
B
6.90
7.40
0.272
0.291
C
2.75
3.25
0.108
0.128
D
0.95
1.52
0.037
0.060
E
7.70
8.20
0.303
0.323
F
0.051
0.203
0.002
0.008
G
0.15
0.31
0.006
0.012
H
2.15
2.62
0.085
0.103
J
2.40
L
0.094
0.165
4.20
K
DO-214AB (SMC)
Inches
3.30
0.130
REEL SPECIFICATION
P/N
SS1045 THRU SS10100
PKG
QTY
SMC
3000
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SS1045 THRU SS10100
Semiconductor
Compiance
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you
before using any MSKSEMI Semiconductor products described or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described
orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent
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reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property
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■ Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the
MSKSEMI Semiconductor productthat you intend to use.
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