www.msksemi.com
AO3402
Semiconductor
Compiance
Features
30V, 4.0 A, RDS(ON) =47mΩ@VGS = 4.5V
Improved dv/dt capability
D
Fast switching
Green Device Available
G
Applications
S
Notebook
SOT-23-3L
Load Switch
LED applications
D
BVDSS
G
RDSON
30V
ID
4.0A
47m
S
Absolute Maximum Ratings Tc=25
Symbol
unless otherwise noted
Rating
Units
VDS
Drain-Source Voltage
30
V
VGS
Gate-Source Voltage
±12
V
Drain Current – Continuous (TC=25℃)
4.0
A
Drain Current – Continuous (TC=100℃)
3.0
A
Drain Current – Pulsed1
16
A
Power Dissipation (TC=25℃)
1.4
W
0.012
W/℃
ID
IDM
PD
Parameter
Power Dissipation – Derate above 25℃
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Characteristics
Symbol
RθJA
Parameter
Thermal Resistance Junction to ambient
Typ.
---
Max.
Unit
80
℃/W
www.msksemi.com
AO3402
Semiconductor
Compiance
Min.
Typ.
Max.
Unit
VGS=0V , ID=250uA
30
---
V
Reference to 25℃ , ID=1mA
---
--0.06
V/℃
VDS=30V , VGS=0V , TJ=25℃
---
---
--1
VDS=24V , VGS=0V , TJ=125℃
---
---
10
uA
VGS= ±12V , VDS=0V
---
---
±100
nA
VGS=4.5V , ID=4A
---
47
60
VGS=2.5V , ID=3A
--0.5
60
85
0.9
1.4
V
---
-3
---
mV/℃
---
7
---
S
---
8.4
---
---
1
---
---
2.2
---
---
4.5
---
---
13
---
---
27
---
---
8.3
---
---
695
---
---
45
---
---
36
---
---
1.5
---
Min.
Typ.
Max.
Unit
---
---
4.0
A
---
---
8.0
A
---
---
1.2
V
Off Characteristics
Symbol
BVDSS
Parameter
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
Conditions
uA
On Characteristics
RDS(ON)
Static Drain-Source On-Resistance
VGS(th)
Gate Threshold Voltage
△VGS(th)
gfs
VGS(th) Temperature Coefficient
Forward Transconductance
VGS=VDS , ID =250uA
VDS=10V , IS=3A
m
Dynamic and switching Characteristics
Qg
Total Gate Charge2 , 3
Qgs
Gate-Source Charge2 , 3
Qgd
Gate-Drain Charge2 , 3
Td(on)
Turn-On Delay Time2 , 3
Tr
Td(off)
Tf
Rise
VDD=10V , VGS=4.5V , RG=25
Time2 , 3
Turn-Off Delay Time2 , 3
ID=1A
Fall Time2 , 3
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
VDS=10V , VGS=4.5V , ID=3A
Gate resistance
VDS=10V , VGS=0V , F=1MHz
VGS=0V, VDS=0V, F=1MHz
nC
nS
pF
Drain-Source Diode Characteristics and Maximum Ratings
Symbol
Parameter
IS
Continuous Source Current
ISM
Pulsed Source Current
VSD
Diode Forward Voltage
Conditions
VG=VD=0V , Force Current
VGS=0V , IS=1A , TJ=25℃
Note :
1. Repetitive Rating : Pulsed width limited by maximum junction temperature.
2.
The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%.
3. Essentially independent of operating temperature.
www.msksemi.com
AO3402
Semiconductor
Compiance
PACKAGE MECHANICAL DATA
Symbol
A
A1
A2
b
c
D
E1
E
e
e1
L
Dimensions In Millimeters
Max.
Min.
1.050
1.250
0.000
0.100
1.050
1.150
0.300
0.500
0.100
0.200
2.820
3.020
1.500
1.700
2.650
2.950
0.950(BSC)
1.800
2.000
0.300
0.600
0°
8°
Dimensions In Inches
Min.
Max.
0.041
0.049
0.000
0.004
0.041
0.045
0.012
0.020
0.004
0.008
0.111
0.119
0.059
0.067
0.104
0.116
0.037(BSC)
0.071
0.079
0.012
0.024
0°
8°
REEL SPECIFICATION
P/N
AO3402
PKG
SOT-23-3L
QTY
3000
www.msksemi.com
AO3402
Semiconductor
Compiance
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications
that can handle applications that require extremely high levels of reliability, such as life-support systems,
aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious
physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you
before using any MSKSEMI Semiconductor products described or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described
orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not
guarantees of the performance, characteristics, and functions of the described products as mounted in the
customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent
device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment.
■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all
semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to
accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause
damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents
or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention
circuitsfor safedesign, redundant design, and structural design.
■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described
or contained herein are controlled under any of applicable local export control laws and regulations, such
products must not be exported without obtaining the export license from theauthorities concerned in
accordance with the above law.
■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise,
without the prior written permission of MSKSEMI Semiconductor.
■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not
guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and
reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property
rights or other rightsof third parties.
■ Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the
MSKSEMI Semiconductor productthat you intend to use.
www.msksemi.com