TSD3G

TSD3G Taiwan Semiconductor 3A, 400V ESD Capability Rectifier FEATURES ● ● ● ● ● ● ● ● KEY PARAMETERS High ESD capability Glass passivated chip junction Ideal for automated placement Low forward voltage drop High surge current capability Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 PARAMETER VALUE UNIT IF 3 A VRRM 400 V IFSM 100 A TJ MAX 175 °C Package DO-214AB (SMC) Configuration Single die APPLICATIONS ● ● ● ● Switching mode power supply (SMPS) Adapters Lighting application Converter MECHANICAL DATA ● ● ● ● ● ● Case: DO-214AB (SMC) Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.210g (approximately) DO-214AB (SMC) SOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) SYMBOL PARAMETER TSD3G UNIT TSD3G Marking code on the device Repetitive peak reverse voltage VRRM 400 V Reverse voltage, total rms value VR(RMS) 280 V Forward current Surge peak forward current, 8.3ms single half sine-wave superimposed on rated load Junction temperature IF 3 A IFSM 100 A TJ - 55 to +175 °C Storage temperature TSTG - 55 to +175 °C 1 Version: F2102 TSD3G Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-lead thermal resistance RӨJL 21 °C/W Junction-to-ambient thermal resistance RӨJA 59 °C/W Junction-to-case thermal resistance RӨJC 22 °C/W Thermal Performance Note: Units mounted on PCB (16mm x 16mm Cu pad test board) ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL TYP MAX UNIT 0.85 0.95 V 0.89 1.00 V 0.72 0.90 V 0.76 1.00 V - 1 µA - 50 µA 45 - pF IF = 1.5A, TJ = 25°C Forward voltage IF = 3.0A, TJ = 25°C (1) VF IF = 1.5A, TJ = 125°C IF = 3.0A, TJ = 125°C Reverse current @ rated VR (2) Junction capacitance Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms TJ = 25°C IR TJ = 125°C 1MHz, VR = 4.0V CJ IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS (TA = 25°C unless otherwise noted) Standard Test Type AEC-Q101-001 IEC 61000-4-2 ISO 10605 Human body model(contact mode) Contact mode Test Conditions Symbol C=100pF,R=1.5kΩ C=150pF,R=330Ω Vc Class Value Typical H3B ≥8kV N/A 4 ≥8kV 25kV 4 ≥15kV 30kV Air-discharge mode C=150pF,R=330Ω Contact mode C=330pF,R=330Ω L4 ≥15kV 25kV Air-discharge mode C=330pF,R=330Ω L4 ≥25kV 30kV ORDERING INFORMATION ORDERING CODE PACKAGE PACKING TSD3G DO-214AB (SMC) 3,000 / Tape & Reel 2 Version: F2102 TSD3G Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 1000 3 CAPACITANCE (pF) A AVERAGE FORWARD CURRENT (A) 4 2 1 100 10 Heat sink 16mm x 16mm Cu pad test board 0 30 60 f=1.0MHz Vsig=50mVp-p 90 120 150 1 180 1 10 LEAD TEMPERATURE (°C) Fig.4 Typical Forward Characteristics 10 TJ=125°C 0.1 TJ=25°C 0.01 0.001 10 20 30 40 50 60 70 80 90 100 100 10 UF1DLW 1 10 TJ=125°C TJ=125°C 0.1 1 0.01 TJ=25°C 0.001 0.1 0.3 0.4 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) TJ=25°C (A) 100 INSTANTANEOUS FORWARD CURRENT (A) INSTANTANEOUS REVERSE CURRENT (μA) Fig.3 Typical Reverse Characteristics 1 100 REVERSE VOLTAGE (V) 0.4 0.5 0.6 0.6 0.8 0.7 Pulse width Pulse width 300μs 1% duty cycle 0.8 0.9 1 1.1 1 1.2 1.4 FORWARD VOLTAGE (V) 3 Version: F2102 1.2 TSD3G Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AB (SMC) SUGGESTED PAD LAYOUT MARKING DIAGRAM 4 P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Version: F2102 TSD3G Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 5 Version: F2102