JK-NSMD025

JK-nSMD025 PPTC DEVICES Edition：A0 Part Number：Q/JKTD-16-025 Page No: 1 OF 3 Terminal pad materials :Tin-Plated Nickle-copper Terminal pad solderability : Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3. Marking : JF=1206(025) Table1 :DIMENTION(Unit : mm) Model Marking JK-nSMD025 JF A B C D E Min. Max. Min. Max. Min. Max Min. Min. 3.00 3.50 1.50 1.80 0.40 0.90 0.15 0.10 Table2 :PERFORMANCE RATINGS: Model Vmax (Vdc) Imax (A) Ihold @25℃ (A) JK-nSMD025 16.0 100 0.25 Itrip @25℃ (A) Pd Typ (W) 0.50 0.6 Maximum Time To Trip Resistance Current (A) Time (Sec) Rimin (Ω) Rityp (Ω) R1max (Ω) 8.0 0.08 0.35 0.70 2.700 Table3:Test Conditons and Standards Item Initial Resistance IH Ttrip .trip Trip endurance Operating Temperature：-40℃ TO Packaging：Bulk ,5000 pcs per bag Test Conditon 25℃ 25℃，0.25A，60min 25℃，8.0A 16V，100A，1hr 85℃ Standard 0.3500～2.7Ω No Trip ≤0.08s No arcing or burning JK-nSMD025 PPTC DEVICES Part Number：Q/JKTD-16-025 Edition：A0 Page No: 2 OF 3 Solder reflow conditions ● Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free. ● Devices are not designed to be wave soldered to the bottom side of the board. ● Recommended maximum paste thickness is 0.25mm (0.010inch). ● Devices can be cleaned using standard industry methods and solvents. ● Soldering temprature profile meets RoHs leadfree process. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements JK-nSMD025 PPTC DEVICES Part Number：Q/JKTD-16-025 Edition：A0 Page No: 3 OF 3 Recommended pad layout (mm) WARNING · Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. · PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated. · Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components. · Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC. · Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space. · Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices.PPTC SMD can be cleaned by standard methods. · Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or reflow profilecould negatively impact solderability performance of our devices.