HX8631/HX8632/HX8634
HX8631/HX8632/HX8634
470µA, 6MHz, Rail-to-Rail I/O CMOS Operational Amplifier
FEATURES
PRODUCT DESCRIPTION
y Low Cost
y Rail-to-Rail Input and Output
The HX8631(single),
HX8632(dual), and HX8634
(quad) are low noise, low voltage, and low power
power operational amplifiers, that can be designed into
a wide range of applications. The HX8631/2/4
have a high gain-bandwidth product of 6MHz,
a slew rate of 3.7V/ μs, and a quiescent current of
470μA/amplifier at 5V.
0.8mV Typical VOS
y High Gain-Bandwidth Product: 6MHz
y High Slew Rate: 3.7V/µs
y Settling Time to 0.1% with 2V Step: 2.1µs
y Overload Recovery Time: 0.9µs
y Low Noise : 12 nV/ Hz
y Operates on 2.5 V to 5.5V Supplies
y Input Voltage Range = - 0.1 V to +5.6 V with VS = 5.5 V
y Low Power
The HX8631/2/4 are designed to provide optimal
performance in low voltage and low noise systems. They
provide rail-to-rail output swing into heavy loads. The
input common-mode voltage range includes ground, and
the maximum input offset voltage are 3.5mV for
HX8631/2/4. They are sp
ecified over the extended
industrial temperature range (−40°C to +85°C). The
operating range is from 2.5V to 5.5V.
470μA/Amplifier Typical Supply Current
y Small Packaging
HX8631 Available in SC70-5, SOT23-5
HX8632 Available in MSOP-8 and SO-8
HX8634 Available in TSSOP-16 and SO-16
The single version, HX8631, is available in SC70-5,
and SOT23-5 packages. The dual version HX8632
is available in SO-8 and MSOP-8 packages. The quad
PIN CONFIGURATIONS (Top View)
version HX8634 is available in SO-16 and TSSOP-16
packages.
HX8632
HX8631
APPLICATIONS
OUT
1
-VS
2
5
8
+VS
2
7
OUT B
+IN A 3
6
-IN B
-VS 4
5
+IN B
OUT A 1
-IN A
+IN 3
Sensors
Audio
Active Filters
A/D Converters
Communications
Test Equipment
Cellular and Cordless Phones
Laptops and PDAs
Photodiode Amplification
Battery-Powered Instrumentation
+VS
4
-IN
SOT23-5 / SC70-5
SO-8 / MSOP-8
HX8634
OUT A
16 OUT D
1
-IN A
2
15 -IND
+IN A
3
14 +IND
+VS
4
13 -VS
+INB
5
12 +INC
-INB
6
11
OUT B
7
10
NC
8
9
NC = NO CONNECT
-INC
OUT C
NC
TSSOP-16 / SO-16
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2022 JAN
HX8631/HX8632/HX8634
ORDERING INFORMATION
DEVICE
Package Type
MARKING
Packing
Packing Qty
HX8631IDBVRG
SOT23-5
C8631
REEL
3000pcs/reel
HX8631IDCKRG
SC70-5
C8631
REEL
3000pcs/reel
HX8632IDRG
SOP-8L
C8632
REEL
2500pcs/reel
HX8632IDGKRG
MSOP-8L
C8632
REEL
2500pcs/reel
HX8634IDRG
SOP-16L
HX8634
REEL
2500pcs/reel
C8634
REEL
2500pcs/reel
HX8634IPWRG
TSSOP-16L
ABSOLUTE MAXIMUM RATINGS
CAUTION
Supply Voltage, V+ to V- ............................................ 7.5 V
Common-Mode Input Voltage
.................................... (–VS) – 0.5 V to (+VS) +0.5V
Storage Temperature Range..................... –65℃ to +150℃
Junction Temperature.................................................160℃
Operating Temperature Range.................–40℃ to +85 ℃
Package Thermal Resistance @ TA = 25℃
SC70-5, θJA................................................................ 333℃/W
SOT23-5, θJA.............................................................. 190℃/W
SO-8, θJA......................................................................125℃/W
MSOP-8, θJA.............................................................. 216℃/W
SO-16, θJA..................................................................... 82℃/W
TSSOP-16, θJA............................................................ 105℃/W
Lead Temperature Range (Soldering 10 sec)
.....................................................260℃
ESD Susceptibility
HBM................................................................................1500V
MM....................................................................................400V
This integrated circuit can be damaged by ESD.
Shengbang Micro-electronics recommends that all
integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance
degradation to complete device failure. Precision
integrated circuits may be more susceptible to
damage because very small parametric changes could
cause the device not to meet its published
specifications.
NOTES
1. Stresses above those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is
a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
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2022 JAN
HX8631/HX8632/HX8634
ELECTRICAL CHARACTERISTICS :VS = +5V
(At TA = +25℃,VCM = Vs/2, RL = 600Ω, unless otherwise noted)
HX8631/2/4
PARAMETER
TYP
CONDITION
MIN/MAX OVER TEMPERATURE
+25℃
+25℃
0℃ to
70℃
-40℃
to 85℃
UNITS
MIN/
MAX
0.8
3.5
3.9
4.3
INPUT CHARACTERISTICS
Input Offset Voltage (VOS)
mV
MAX
Input Bias Current (IB)
1
pA
TYP
Input Offset Current (IOS)
1
pA
TYP
-0.1 to +5.6
V
TYP
dB
MIN
dB
MIN
dB
MIN
Common-Mode Voltage Range (VCM)
VS = 5.5V
Common-Mode Rejection Ratio(CMRR)
VS = 5.5V, VCM = - 0.1V to 4 V
90
VS = 5.5V, VCM = - 0.1V to 5.6 V
83
Open-Loop Voltage Gain( AOL)
75
74
74
RL = 600Ω ,Vo = 0.15V to 4.85V
97
RL =10KΩ ,Vo = 0.05V to 4.95V
108
dB
MIN
2.4
µV/℃
TYP
RL = 600Ω
0.1
V
TYP
RL = 10KΩ
0.015
V
Input Offset Voltage Drift (∆VOS/∆T)
90
87
86
OUTPUT CHARACTERISTICS
Output Voltage Swing from Rail
53
49
45
40
mA
MIN
3
Ω
TYP
Turn-On Time
4
µs
TYP
Turn-Off Time
1.2
µs
TYP
Output Current (IOUT)
Closed-Loop Output Impedance
POWER-DOWN
DISABLE
DISABLE
F = 200KHz, G = 1
DISABLE
Voltage-Off
0.8
V
MAX
Voltage-On
2
V
MIN
POWER SUPPLY
Operating Voltage Range
2.5
2.5
2.5
V
MIN
5.5
5.5
5.5
V
MAX
Power Supply Rejection Ratio (PSRR)
Vs = +2.5 V to + 5.5 V
VCM = (-VS) + 0.5V
91
80
78
78
dB
MIN
Quiescent Current/ Amplifier (IQ)
IOUT = 0
470
590
660
680
µA
MAX
nA
MAX
MHz
TYP
Supply Current when Disabled
90
(SGM8633 only)
DYNAMIC PERFORMANCE
Gain-Bandwidth Product (GBP)
RL = 10KΩ
6
60
Phase Margin(φO)
degrees TYP
Full Power Bandwidth(BWP)
＜1% distortion, RL = 600Ω
250
KHz
TYP
Slew Rate (SR)
G = +1 , 2V Step, RL = 10KΩ
3.7
V/µs
TYP
Settling Time to 0.1%( tS)
G = +1, 2 V Step, RL = 600Ω
2.1
µs
TYP
Overload Recovery Time
VIN ·Gain = Vs, RL = 600Ω
0.9
µs
TYP
Voltage Noise Density (en)
f = 1kHz
12
nV/
Hz
TYP
Current Noise Density( in)
f = 1kHz
3
fA/
Hz
TYP
NOISE PERFORMANCE
Specifications subject to change without notice.
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2022 JAN
HX8631/HX8632/HX8634
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃,VCM = Vs/2, RL = 600Ω, unless otherwise noted.
Closed-Loop Output Voltage Swing
Output Impedance vs.Frequency
6
Vs = 5V
VIN = 4.9VP-P
TA = 25℃
RL = 10KΩ
G=1
4
Vs = 5V
120
Output Impedance(Ω)
5
Output Voltage(Vp-p)
140
3
2
1
100
80
60
40
G = 100
G = 10
20
G =1
0
0
10
100
1000
Frequency(kHz)
1
10000
10
Positive Overload Recovery
Vs = ±2.5V
VIN = 50mV
RL = 10KΩ
G = 100
100
Frequency(kHz)
1000
10000
Negative Overload Recovery
2.5V
2.5V
0V
0V
0V
0V
-50mV
Vs = ±2.5V
VIN = 50mV
RL = 10KΩ
G = 100
-50mV
Time(2µs/div)
Time(500ns/div)
Large-Signal Step Response
Small-Signal Step Response
Vs = 5V
G = +1
CL = 100pF
RL = 10KΩ
Voltage(1V/div)
Voltage(50mV/div)
Vs = 5V
G = +1
CL = 100pF
RL = 10KΩ
Time(1µs/div)
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Time(1µs/div)
4
2022 JAN
HX8631/HX8632/HX8634
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃,VCM = Vs/2, RL = 600Ω, unless otherwise noted.
CMRR vs.Frequency
PSRR vs.Frequency
120
120
Vs = 5V
Vs = 5V
100
100
CMRR(dB)
PSRR(dB)
80
80
60
60
40
40
20
20
0.01
0.1
1
10
Frequency(kHz)
100
0
0.01
1000
Small-Signal Overshoot vs.Load Capacitance
1
10
Frequency(kHz)
1000
Vs = 5V
RL = 10kΩ
TA = 25℃
G=1
60
50
Channel Separation(dB)
140
+OS
40
-OS
30
20
10
0
VS = 5V
RL = 620Ω
TA = 25℃
G=1
130
120
110
100
90
1
10
100
Load Capacitance(pF)
1000
0.1
1
10
Frequency(kHz)
100
1000
PSRR vs.Temperature
CMRR vs.Temperature
130
120
VS = 5.5V
110
VS = 2.5V to 5.5V
120
VCM = - 0.1V to 4 V
110
PSRR(dB)
100
CMRR(dB)
100
Channel Separation vs.Frequency
70
Small-Signal Overshoot(%)
0.1
90
100
90
80
VCM = - 0.1V to 5.6V
70
80
60
70
-50 -30 -10
10 30 50 70
Temperature(℃)
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90
110 130
-50 -30 -10
5
10 30 50 70
Temperature(℃)
90
110 130
2022 JAN
HX8631/HX8632/HX8634
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃,VCM = Vs/2, RL = 600Ω, unless otherwise noted.
Shutdown Current vs.Temperature
210
600
180
Shutdown Current(nA)
Supply Current(μA)
Supply Current vs.Temperature
650
550
500
450
VS = 2.5V
400
VS = 3V
350
VS = 5V
VS = 5V
150
VS = 3V
VS = 2.5V
120
90
60
30
300
250
0
-50 -30 -10
10 30 50 70
Temperature(℃)
90
110 130
-50 -30 -10
Open-Loop Gain vs.Temperature
90
110 130
Output Voltage Swing vs.Output Current
120
5
Sourcing Current
RL = 10KΩ
110
Output Voltage(V)
Open–Loop Gain(dB)
10 30 50 70
Temperature(℃)
100
RL = 600Ω
90
80
4
135℃
VS = 5V
3
25℃
2
25℃
135℃
-50℃
-50℃
1
Sinking Current
0
70
-50 -30 -10
10 30 50 70
Temperature(℃)
90
0
110 130
10
30
40
50
60
70
80
Output Current(mA)
Small-Signal Overshoot vs.Load Capacitance
Output Voltage Swing vs.Output Current
3
70
Small-Signal Overshoot(%)
Sourcing Current
Output Voltage(V)
20
VS = 3V
2
25℃
135℃
-50℃
1
Sinking Current
0
0
10
20
30
40
50
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50
40
+OS
30
-OS
20
10
0
60
1
Output Current(mA)
http://www.hanschip.com
Vs = 2.7V
RL = 10kΩ
TA = 25℃
G=1
60
6
10
100
Load Capacitance(pF)
1000
2022 JAN
HX8631/HX8632/HX8634
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃,VCM = Vs/2, RL = 600Ω, unless otherwise noted.
Closed-Loop Output Voltage Swing
Output Impedance vs.Frequency
3
140
Vs = 2.7V
2.5
Output Voltage(Vp-p)
Output Impedance(Ω)
120
100
80
60
40
G = 100
G = 10
G =1
20
2
1.5
1
0.5
0
1
10
100
1000
Frequency(kHz)
Vs = 2.7V
VIN = 2.6VP-P
TA = 25℃
RL = 10KΩ
G=1
0
10000
10
Large-Signal Step Response
Voltage(50mV/div)
Vs = 2.7V
G = +1
CL = 100pF
RL = 10KΩ
Time(1µs/div)
Time(1µs/div)
Input Voltage Noise Spectral Density
vs.Frequency
Channel Separation vs.Frequency
1000
VS = 2.7V
RL = 620Ω
TA = 25℃
G=1
Voltage Noise(nV/√Hz)
Channel Separation(dB)
140
130
10000
Small-Signal Step Response
Vs = 2.7V
G = +1
CL = 100pF
RL = 10KΩ
Voltage(500mV/div)
100
1000
Frequency(kHz)
120
110
100
Vs = 5V
100
10
1
90
0.1
1
10
100
10
1000
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100
1000
10000
Frequency(Hz)
Frequency(kHz)
7
2022 JAN
HX8631/HX8632/HX8634
TYPICAL PERFORMANCE CHARACTERISTICS
At TA = +25℃,VCM = Vs/2, RL = 600Ω, unless otherwise noted.
Offset Voltage Production Distribution
Percent of Amplifiers(%)
50
45
40
Typical production
distribution of
packaged units.
35
30
25
20
15
10
5
3
2
2.5
1
1.5
0.5
0
-1
-0.5
-2
-1.5
-3
-2.5
0
Offset Voltage(mV)
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HX8631/HX8632/HX8634
Power-Supply Bypassing and Layout
APPLICATION NOTES
The HX863x family operates from either a single +2.5V to
+5.5V supply or dual ±1.25V to ±2.75V supplies. For
single-supply operation, bypass the power supply VDD with a
0.1µF ceramic capacitor which should be placed close to the
VDD pin. For dual-supply operation, both the VDD and the VSS
supplies should be bypassed to ground with separate 0.1µF
ceramic capacitors. 2.2µF tantalum capacitor can be added for
better performance.
Driving Capacitive Loads
The HX863x can directly drive 1000pF in unity-gain without
oscillation. The unity-gain follower (buffer) is the most sensitive
configuration to capacitive loading. Direct capacitive loading
reduces the phase margin of amplifiers and this results in
ringing or even oscillation. Applications that require greater
capacitive drive capability should use an isolation resistor
between the output and the capacitive load like the circuit in
Figure 1. The isolation resistor RISO and the load capacitor CL
form a zero to increase stability. The bigger the RISO resistor
value, the more stable VOUT will be. Note that this method
results in a loss of gain accuracy because RISO forms a voltage
divider with the RLOAD.
Good PC board layout techniques optimize performance by
decreasing the amount of stray capacitance at the op amp’s
inputs and output. To decrease stray capacitance, minimize
trace lengths and widths by placing external components as
close to the device as possible. Use surface-mount
components whenever possible.
For the operational amplifier, soldering the part to the board
directly is strongly recommended. Try to keep the high
frequency big current loop area small to minimize the EMI
(electromagnetic interfacing).
RISO
HX8631
VOUT
VIN
CL
VDD
VDD
Figure 1. Indirectly Driving Heavy Capacitive Load
10µF
10µF
0.1µF
0.1µF
An improvement circuit is shown in Figure 2. It provides DC
accuracy as well as AC stability. RF provides the DC accuracy
by connecting the inverting signal with the output. CF and RIso
serve to counteract the loss of phase margin by feeding the
high frequency component of the output signal back to the
amplifier’s inverting input, thereby preserving phase margin in
the overall feedback loop.
Vn
Vn
HX8631
VOUT
Vp
10µF
Vp
CF
0.1µF
VSS(GND)
RF
VOUT
HX8631
RISO
HX8631
VIN
VOUT
CL
VSS
RL
Figure 3. Amplifier with Bypass Capacitors
Grounding
Figure 2. Indirectly Driving Heavy Capacitive Load with DC
Accuracy
A ground plane layer is important for HX863x circuit design.
The length of the current path speed currents in an inductive
ground return will create an unwanted voltage noise. Broad
ground plane areas will reduce the parasitic inductance.
For no-buffer configuration, there are two others ways to
increase the phase margin: (a) by increasing the amplifier’s
gain or (b) by placing a capacitor in parallel with the feedback
resistor to counteract the parasitic capacitance associated with
inverting node.
Input-to-Output Coupling
To minimize capacitive coupling, the input and output signal
traces should not be parallel. This helps reduce unwanted
positive feedback.
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2022 JAN
HX8631/HX8632/HX8634
Typical Application Circuits
C
Differential Amplifier
The circuit shown in Figure 4 performs the difference function.
If the resistors ratios are equal ( R4 / R3 = R2 / R1 ), then
VOUT = ( Vp – Vn ) × R2 / R1 + Vref.
VIN
VOUT
HX8631
R2
Vn
R2
R1
R1
HX8631
R3=R1//R2
VOUT
Vp
R3
Figure 6. Low Pass Active Filter
R4
Vref
Figure 4. Differential Amplifier
Instrumentation Amplifier
The circuit in Figure 5 performs the same function as that in
Figure 4 but with the high input impedance.
R2
R1
HX8631
Vn
HX8631
Vp
R3
VOUT
R4
HX8631
Vref
Figure 5. Instrumentation Amplifier
Low Pass Active Filter
The low pass filter shown in Figure 6 has a DC gain of (-R2/R1)
and the –3dB corner frequency is 1/2πR2C. Make sure the filter
is within the bandwidth of the amplifier. The Large values of
feedback resistors can couple with parasitic capacitance and
cause undesired effects such as ringing or oscillation in
high-speed amplifiers. Keep resistors value as low as possible
and consistent with output loading consideration.
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2022 JAN
HX8631/HX8632/HX8634
PACKAGE
SOT23-5
Dimensions In Millimeters
Symbol
Min
Max
A
1.050
1.150
Symbol
D
Min
0.300
Max
0.600
A1
0.000
0.100
Q
B
2.820
3.020
a
0.400
C
2.650
2.950
b
0.950
C1
1.500
1.700
e
1.900
SC70-5
Dimensions In Millimeters
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Symbol
Min
Max
A
0.900
1.000
Symbol
D
Min
0.260
Max
0.460
A1
0.000
0.100
Q
B
2.000
2.200
a
0.250
C
2.150
2.450
b
0.650
C1
1.150
1.350
e
1.300
2022 JAN
HX8631/HX8632/HX8634
PACKAGE
SOP8
Dimensions In Millimeters
Symbol
Min
Max
Symbol
Min
Max
A
1.225
1.570
D
A1
Q
B
a
C
b
C1
A
A2
MSOP8
D
E
E1
A1
e
b
©
L
深圳市汉芯半导体有限公司
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0.25
12
2022 JAN
HX8631/HX8632/HX8634
PACKAGE
SOP16
Q
A
C1
C
B
D
A1
a
0.25
b
Dimensions In Millimeters
Symbol：
Min：
Max：
Symbol：
Min：
Max：
A
1.225
1.570
D
0.400
0.950
A1
0.100
0.250
Q
0°
8°
B
9.800
10.00
a
0.420 TYP
C
5.800
6.250
b
1.270 TYP
C1
3.800
4.000
TSSOP16
Dimensions In Millimeters
Symbol：
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Min：
Max：
Symbol：
Min：
Max：
A
0.800
1.000
D
0.400
0.850
A1
0.050
0.150
Q
0°
8°
B
4.900
5.100
a
0.240 TYP
C
6.250
6.550
b
0.650 TYP
C1
4.300
4.500
2022 JAN
HX8631/HX8632/HX8634
Important statement:
Shenzhen Hanschip semiconductor co.,ltd. reserves the right to
change the products and services provided without notice. Customers
should obtain the latest relevant information before ordering, and
verify the timeliness and accuracy of this information.
Customers are responsible for complying with safety standards and
taking safety measures when using our products for system design
and machine manufacturing to avoid potential risks that may result in
personal injury or property damage.
Our products are not licensed for applications in life support, military,
aerospace, etc., so we do not bear the consequences of the
application of these products in these fields.
Our documentation is only permitted to be copied without any
tampering with the content, so we do not accept any responsibility or
liability for the altered documents.
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2022 JAN
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