B110WS
Product specification
B110WS
FEATURES
APPLICATIONS
Guard ring protection.
Low forward voltage drop.
Low voltage rectification
Reverse polarity protection
For use in low voltage, high frequency inverters .
Low power consumption applications
High surge current capability.
Reference News
PACKAGE OUTLINE
Circuit
Marking
110s
SOD-323
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B110WS
Absolute Maximum Ratings(Ta=25
Symbol
)
Parameter
Limit
Unit
V RRM
Maximum Recurrent Peak Reverse Voltage
100
V
V RMS
Maximum RMS Voltage
70
V
V DC
Maximum DC Blocking Voltage
100
V
1
A
25
A
IF
Continuous ForwardCurrent
Non- repetitive Peak Forward Surge
IFSM
Current@8.3 mS
Ptot
Total Power Dissipation
RΘJA
TJ
TSTG
250
W
400
℃/W
Operation Junction Temperature Range
-40~+ 125
℃
Storage Temperature Range
-55~+ 150
℃
Thermal Resistance From Junction To
Ambient
Electrical Characteristics (Ta=25
unless otherwise specified)
Symbol
Parameter
Test conditions
VF
Forward voltage(1)
IF=1A
IR
Reverse voltage leakage
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current
VR=100V
Min
Typ
0.5
Max
Unit
0.85
V
2.0
A
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B110WS
Typical Characteristics
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B110WS
PACKAGE MECHANICAL DATA
Symbol
Dimensions In Millimeters
Min.
Max.
A
Dimensions In Inches
Min.
Max.
1.000
0.039
A1
0.000
0.100
0.000
0.004
A2
0.800
0.900
0.031
0.035
b
0.250
0.350
0.010
0.014
c
0.080
0.150
0.003
0.006
D
1.200
1 .400
0.047
0.055
E
1.600
1 .800
0.063
0.071
E1
2.550
2.750
0.100
0.108
0.400
8?
0.010
0。
L
L1
e
0.475 REF.
0.250
0°
0.019 REF.
0.016
8:
Suggested Pad Layout
REEL SPECIFICATION
P/N
PKG
QTY
B110WS
SOD-323
3000
Copyright© Msksemi Incorporated
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B110WS
Attention
■ Any and all MSKSEMI Semiconductor products described or contained herein do not
handle applications that require extremely high levels of reliability, such as life-support
have specifications
that can
systems, aircraft's control systems, or
other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with
your MSKSEMI Semiconductor representative
nearest
you before using any MSKSEMI Semiconductor products described
or contained herein in such applications.
■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products
at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in
products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein.
■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the
performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the
performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To
verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test
devices mounted in the customer’sproducts orequipment.
■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor
products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could
endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing
equipment, adopt safety measures so that these kinds of accidents
or events cannot occur. Such measures include but are
not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design.
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mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior
written permission of MSKSEMI Semiconductor.
■
Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume
production. MSKSEMI Semiconductor believes information herein is accurate and
reliable, but no guarantees are made or
implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties.
■
Any and all information described or contained herein are subject to change without notice due to
product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI
Semiconductor productthat you intend to use.
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