TJ-S2835B05HQ88DL-A3

GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD 承 認 書 Specification For Approval Customer: (客戶) Description: (產品描述) Part number:(產品型號) Date: SMDLED2835 0.5W 蓝光 TJ-S2835B05HQ88DL-A3 (日期) Approved By: (客戶承認) Prepared By:(我司承認) Approval 核准 Check Design 審核 製作 Sales 業務 Customer Service Hotline：400-676-8616 TEL：0769-8662 5999 0769-8200 2226 E-MIAL∶dg@togialed.com FAX：0769-8200 2227 WEB：www.togialed.com GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD Package Dimensions（封装尺寸） Recommended Soldering Patter (n 推荐焊盘式样) Note ： 1：All dimensions are in millimeters (inches). 2：Tolerance is ±0.25mm (.010”) unless otherwise noted. 3: Specifications are subject to change without notices. 4：This specification is for reference only for one year GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD 极限参数 Absolute maximum ratings 参数 Parameter （Ta=25°C） 符号 Symbol 正向电流 Forward current 数值 Value 单位 Unit If 150 反向耐压 Reverse voltage Vr 5 V 耗散功率 Power dissipation 工作环境温度 Operating temperature range Pd 540 mW Top -40~+80 °C 贮藏温度 Storage temperature range Tstg -40~+80 °C 峰 值 脉 冲 电 流 Peak pulsing current （ 1/8 duty f=1KHz） Ifp 300 mA Tj 105 ℃/W ESD 2000 V 结温 Junction Temperature 静电 Electrostatic Discharge(HBM) 光电特性 Electro-Optical characteristics (TA=25°C) 测试条件 Test Condition 符号 Symbo l 颜色 色温 Color Temperature 正向电压 Forward voltage IF=60mA CCT IF=60mA 光通量 luminous flux 参数 Parameter mA 数值 Value 单位 Unit Min Typ Max -- -- -- -- K Vf B 2.8 -- 3.6 V IF=60mA φ B 6 -- 15 LM 视角 Viewing angle at 50% IV IF=60mA 2θ1/2 B -- 120 -- Deg 主波长 Dominant wavelength IF=60mA λd B 460 -- 470 nm 反向电流 Reverse current 显色性指数 Color Rendering Index Vr=5V Ir B -- 5 -- μA IF=60mA CRI -- -- -- -- Ra GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD 典型的光电特性曲线图表 Typical photo-electricity characteristic curve chart Forward Current VS Forward Voltage Forward ） Current (mA Relative Luminous Lntensity Forward Current VS. Relative Intensity Forward Current(mA) Forward Voltage(V) Ambient Temperature VS Relative Intensity Forward ） Current (mA Relative Luminous Lntensity Ambient Temperature VS Forward Current Ambient Temperature Ta(℃） Ambient Temperature Ta(℃） 0° 30° 90° 50 0 50 90° 100 60° 60° 30° 100 Relative Luminous Intensity(%) GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD 可靠性实验项目 Test items and results of reliability Operation Sequence Environmental Sequence 类 别 Typ e 测试项目 Test item 参照标准 Standard 测试条件 Test Conditions 高低温循环 Temperature Cycle JIS C 7021 (1977)A-4 热冲击 Thermal Shock MIL-SLD-107D 高温度热循环 High Humidity Heat Cycle JIS C 7021 (1977)A-5 高温存储 High Temperature Storage 高温高湿存储 Humidity Heat Storage 低温存储 Low Temperature Storage -25°C 30min ↑↓5min 80°C 30min -25°C 15min ↑↓5min 80°C 15min 备注 Note 数量 Quantity 不良数量 Number of Damaged 100 cycle 22 0 50 cycle 22 0 30°C〈=〉65°C 90%RH 24hrs/1cycle 10 cycle 22 0 JIS C 7021 (1977)B-10 Ta=80°C 1000hrs 22 0 JIS C 7021 (1977)B-11 Ta=60°C RH=90% 1000hrs JIS C 7021 (1977)B-12 Ta=－30°C 1000hrs 常温寿命测试 Life Test JIS C 7035 (1985) Ta=25°C IF= 6 0mA 1000hrs 22 0 高温高湿寿命测试 High Humidity Heat Life Test  60°C RH=90% IF= 6 0mA 500hrs 22 0 低温寿命测试 Low Temperature Life Test  Ta=-25°C IF= 6 0mA 1000hrs 22 0 22 22 0 0 请参考可靠性测试标准规范。Refer to reliability test standard specification for in this line. 失效判定标准 Criteria For Judging Damage 测试项目 符号 测试条件 正向电压 Forward Voltage VF IF=IFT 反向电流 Reverse Current IR VR=5V IR≦10μA IF=IFT 平均 IV 衰减≦30℅，单个平均 IV 衰减≦50℅ Average IV degradation≦30℅ Single LED IV degradation≦50℅ -- 材料无内部裂痕、无材料间爆裂、剥离、无死灯 Meterial without internal cracks, no material between stripped, no deaded light. 光强 Luminous Intensity 耐焊接热 Resistance to Soldering Heat IV -- 判定标准 初始值±10℅ Initial Data±10℅ *数据工作表中所示的技术信息仅限于典型特征和电路实例引用的产品.它既不构成工业特性的保证,也不构成任何许可的授权 The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD 焊接指导 Guideline for Soldering 1、 回流焊接：推荐以下无铅回流焊接温度图进行。 Reflow Soldering: Use the conditions shown in the under Figure of Pb-Free Reflow Soldering. SMD-Reflow Soldering Profile for lead free soldering( Acc.to J-STD-020B) 300 ℃ T 255℃ 240℃ 250 Maximum Solder Profile Recommended Solder Profile Minimum Solder Profile 217℃ 200 +0℃ 260℃ -5℃ 245℃ ±5℃ 235℃ +5℃ -0℃ 10s min 30s max Ramp Down 6K/s(max) 150 120s max 100s max 100 Ramp Up 3 K/s(max) 50 25℃ 0 0 50 100 150 200 250 s 300 t Remark: If not lead free soldering, the recommended solder profile is 230℃and max solder profile is 245℃. 2、 使用烙铁人手焊接 Hand Soldering 1)、 推荐使用低功率于 20W 的烙铁，焊接时烙铁的温度必须保持在 360℃以下，且每个电极只能进行一次焊 接，每次焊接的持续时间不得超过 3 秒。 A soldering iron of less than 20W is recommended to be used in Hand Soldering Please keep the temperature of the soldering iron under 360℃ while soldering Each terminal of the LED is to go for less than 3 second and for onetime only. 2)、 人手焊接过程中的不慎操作易引起 LED 产品的损坏，应当小心谨慎。 Be careful because the damage of the product is often started at the time of the hand soldering. 3、 清洗 Cleaning 1） 、在焊接后推荐使用酒精进行清洗，在温度不高于 30℃的条件下持续 3 分钟，不高于 50℃的条件下持续 30 秒，使用其他类似溶剂清洗前，请先确认使用的溶剂不会对 LED 的封装和环氧树脂造成损伤。 It is recommended that alcohol be used as a solvent for cleaning after soldering. Cleaning is to go under 30℃ for 3 minutes or 50℃ for 30 seconds. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. 2）、超声波清洗也是有效的方法，一般最大功率不应超过 300W，否则可能对 LED 造成损伤，请根据具 体的情况预先测试清洗条件是否会对 LED 造成损伤。 Ultrasonic cleaning is also an effective way for cleaning. But the influence of Ultrasonic cleaning on LED depends on factors such an ultrasonic power. Generally, the ultrasonic power should not be higher than 300W.Before cleaning, a pre-test should be done to confirm whether any damage to LEDs will occur. GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD 编带和包装 Tape and Packaging 1、带盘 Tape leader and reel M oisture Resistant Packaging 2. 2、防潮袋包装 防潮带包装 Moisture Resistant Packaging Lable A lum inum m oisture-proof bag D esiccant Lable 3、注意事项 Cautions 1)、LED 封装为硅胶，故 LED 胶体表面较软，用力按压胶体表面会影响 LED 可靠性，因此应有预防措施避免在 封装的零件上的强大压力，当使用吸嘴时，胶体表面的压力应是恰当的。 The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle, the pressure on the silicone resin should be proper. 2)、SMD 吸嘴的外径不应超过 LED 的尺寸以避免漏气。吸嘴的内径应尽可能大。 吸嘴头建议使用柔软的材料以避免 LED 硅胶表面划伤或损坏。 The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. GUANGDONGTONGJIA OPTOELECTRONICS TECHNOLOGY CO., LTD 处理防备措施 Handling Precautions 1、 通过使用适当的工具从材料侧面夹取，不可直接用手或尖锐金属压胶体表面，它可能会损坏内部电路. Handle the component along the side surface by using forceps or appropriate tools; do not directly touch or Handle the silicone lens surface, it may damage the internal circuitry. 2、 不可将模组材料堆积在一起，它可能会损坏内部电路 Do not stack together assembled PCBs containing LEDs. PH