SM2363PSA
®
P-Channel Enhancement Mode MOSFET
Features
·
Pin Description
-60V/-1.8A,
D
RDS(ON)= 225mW(max.) @ VGS=-10V
RDS(ON)= 300mW(max.) @ VGS=-4.5V
·
·
·
·
S
ESD Protection
G
100% UIS+Rg Tested
Top View of SOT-23
Reliable and Rugged
Lead Free and Green Devices Available
D
(RoHS Compliant)
Applications
·
·
G
Power Management in DC/DC Converter.
Load switch.
S
P-Channel MOSFET
Ordering and Marking Information
Package Code
A : SOT-23
Operating Junction Temperature Range
C : -55 to 150 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
SM2363PS
Assembly Material
Handling Code
Temperature Range
Package Code
SM2363PS A :
XX - Lot Code
B63XX
Note: SINOPOWER lead-free products contain molding compounds/die attach materials and 100% matte tin plate
termination finish; which are fully compliant with RoHS. SINOPOWER lead-free products meet or exceed the lead-free
requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. SINOPOWER
defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in
homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).
SINOPOWER reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright ã Sinopower Semiconductor, Inc.
Rev. A.1 - November, 2015
1
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SM2363PSA
®
Absolute Maximum Ratings
Symbol
(TA = 25°C Unless Otherwise Noted)
Parameter
Rating
Unit
Common Ratings
V DSS
Drain-Source Voltage
-60
VGSS
Gate-Source Voltage
±20
Maximum Junction Temperature
150
TJ
TSTG
Storage Temperature Range
IS
Diode Continuous Forward Current
ID *
Continuous Drain Current
IDM a
PD
Pulsed Drain Current
Maximum Power Dissipation
R qJA c
IAS b
EAS
-55 to 150
b
Thermal Resistance-Junction to Ambient
TA=25°C
-1
TA=25°C
-1.8
TA=70°C
-1.5
TA=25°C
-7.2
TA=25°C
1.56
TA=70°C
1
t £ 10s
80
Steady State
125
V
°C
A
A
A
W
°C/W
Avalanche Current, Single pulse
L=0.5mH
6
A
Avalanche Energy, Single pulse
L=0.5mH
9
mJ
Note *:t £ 10s.
Note a:Pulse width is limited by maximum junction temperature.
Note b:UIS tested and pulse width limited by maximum junction temperature 150oC (initial temperature Tj=25 oC).
Note c:Surface Mounted on 1in2 pad area.
Copyright ã Sinopower Semiconductor, Inc.
Rev. A.1 - November, 2015
2
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SM2363PSA
®
Electrical Characteristics
Symbol
Parameter
(TA = 25°C Unless Otherwise Noted)
Test Conditions
Min.
Typ.
Max.
Unit
V GS=0V, I DS=250mA
-60
-
-
V
V DS=-48V, VGS=0V
-
-
1
-
-
30
Static Characteristics
BV DSS
Drain-Source Breakdown Voltage
I DSS
Zero Gate Voltage Drain Current
VGS(th)
I GSS
TJ =85°C
mA
Gate Threshold Voltage
V DS=V GS, IDS=250mA
-1
-2
-3
V
Gate Leakage Current
V GS=±20V, VDS=0V
-
-
±10
uA
V GS=-10V, I DS= -1.8A
-
180
225
mW
V GS=-4.5V, IDS = -1.4A
-
220
300
mW
RDS(ON) d Drain-Source On-state Resistance
Diode Characteristics
VSD d
Diode Forward Voltage
I SD =-1A, VGS=0V
-0.5
-0.8
-1
V
trr
Reverse Recovery Time
-
20
-
ns
Qrr
Reverse Recovery Charge
I SD =-1.8A,
dlSD /dt=100A/ms
-
20
-
nC
V GS=0V,VDS=0V,f=1MHz
-
7
-
W
-
290
380
-
31
-
-
17
-
-
7
13
-
5
9
-
17
31
-
8
15
-
3.5
-
-
7.2
10
-
1.3
-
-
1.4
-
Dynamic Characteristics
d
RG
Gate Resistance
C iss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
td(O N)
Turn-on Delay Time
tr
Turn-on Rise Time
t d(OFF)
Turn-off Delay Time
tf
V GS=0V,
V DS=-30V,
Frequency=1.0MHz
V DD =-30V, RL =-30W,
I DS=-1A, VGEN =-10V,
R G=6W
Turn-off Fall Time
Gate Charge Characteristics
pF
ns
e
Qg
Total Gate Charge
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Q gd
Gate-Drain Charge
V DS=-30V, VGS=-4.5V,
I DS=-1.8A
V DS=-30V, VGS=-10V,
I DS=-1.8A
nC
Note d:Pulse test; pulse width£300ms, duty cycle£2%.
Note e:Guaranteed by design, not subject to production testing.
Copyright ã Sinopower Semiconductor, Inc.
Rev. A.1 - November, 2015
3
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SM2363PSA
®
Typical Operating Characteristics
Power Dissipation
Drain Current
1.8
2.0
1.6
-ID - Drain Current (A)
Ptot - Power (W)
1.5
1.2
0.9
0.6
1.2
0.8
0.4
0.3
o
0.0
o
TA=25 C
0
20
40
60
80
0.0
100 120 140 160
0
20
40
60
80
100 120 140 160
Tj - Junction Temperature (°C)
Tj - Junction Temperature (°C)
Safe Operation Area
Thermal Transient Impedance
2
10
n)
(o
s
Rd
Normalized Transient Thermal Resistance
30
-ID - Drain Current (A)
T A=25 C,VG=-10V
it
Lim
1
300ms
1ms
10ms
0.1
100ms
0.01
1s
DC
o
TA=25 C
1E-3
0.1
1
10
100 300
-VDS - Drain - Source Voltage (V)
Copyright ã Sinopower Semiconductor, Inc.
Rev. A.1 - November, 2015
Duty = 0.5
1
0.2
0.1
0.05
0.02
0.1
0.01
0.01
Single Pulse
2
Mounted on 1in pad
1E-3
1E-4 1E-3 0.01
0.1
1
10
100 1000
Square Wave Pulse Duration (sec)
4
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SM2363PSA
®
Typical Operating Characteristics (Cont.)
Output Characteristics
8
Drain-Source On Resistance
400
VGS=-4.5,-5,-6,-7,
-8,-9,-10V
-4V
350
RDS(ON) - On - Resistance (mW)
7
-ID - Drain Current (A)
6
5
-3.5V
4
3
2
-3V
1
0
0.0
-2.5V
0.5
1.0
1.5
2.0
2.5
VGS=-4.5V
200
VGS=-10V
150
100
50
3.0
0
1
2
3
4
5
6
-ID - Drain Current (A)
Gate-Source On Resistance
Gate Threshold Voltage
1.6
IDS=-1.8A
7
IDS = -250mA
1.4
1000
Normalized Threshold Voltage
RDS(ON) - On Resistance (mW)
250
-VDS - Drain-Source Voltage (V)
1200
800
600
400
200
0
300
2
3
4
5
6
7
8
9
1.0
0.8
0.6
0.4
0.2
-50 -25
10
-VGS - Gate - Source Voltage (V)
Copyright ã Sinopower Semiconductor, Inc.
Rev. A.1 - November, 2015
1.2
0
25
50
75
100 125 150
Tj - Junction Temperature (°C)
5
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SM2363PSA
®
Typical Operating Characteristics (Cont.)
Drain-Source On Resistance
2.5
Source-Drain Diode Forward
8
VGS = -10V
2.0
-IS - Source Current (A)
Normalized On Resistance
IDS = -1.8A
1.5
1.0
o
T j=150 C
1
o
T j=25 C
0.5
o
0.0
-50
RON@T j=25 C: 180m W
-25
0
25
50
75
0.1
0.0
100 125 150
0.8
1.0
1.2
Capacitance
Gate Charge
VDS= -30V
9
-VGS - Gate - source Voltage (V)
300
Ciss
250
200
150
100
50
Coss
10
15
20
IDS= -1.8A
8
7
6
5
4
3
2
1
Crss
5
1.4
10
350
C - Capacitance (pF)
0.6
-VSD - Source - Drain Voltage (V)
Frequency=1MHz
0
0.4
Tj - Junction Temperature (°C)
400
0
0.2
25
30
35
0
40
-VDS - Drain - Source Voltage (V)
Copyright ã Sinopower Semiconductor, Inc.
Rev. A.1 - November, 2015
0
1
2
3
4
5
6
7
8
QG - Gate Charge (nC)
6
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SM2363PSA
®
Avalanche Test Circuit and Waveforms
VDS
tAV
L
DUT
EAS
VDD
RG
VDD
IAS
tp
IL
VDS
0.01W
tp
VDSX(SUS)
Switching Time Test Circuit and Waveforms
VDS
RD
td(on) tr
DUT
RG
td(off) tf
VGS
10%
VGS
VDD
tp
90%
VDS
Copyright ã Sinopower Semiconductor, Inc.
Rev. A.1 - November, 2015
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SM2363PSA
®
Disclaimer
Sinopower Semiconductor, Inc. (hereinafter “Sinopower”) has been making
great efforts to development high quality and better performance products to
satisfy all customers’ needs. However, a product may fail to meet customer’s
expectation or malfunction for various situations.
All information which is shown in the datasheet is based on Sinopower’s
research and development result, therefore, Sinopower shall reserve the right
to adjust the content and monitor the production.
In order to unify the quality and performance, Sinopower has been following
JEDEC while defines assembly rule. Notwithstanding all the suppliers
basically follow the rule for each product, different processes may cause
slightly different results.
The technical information specified herein is intended only to show the typical
functions of and examples of application circuits for the products. Sinopower
does not grant customers explicitly or implicitly, any license to use or exercise
intellectual property or other rights held by Sinopower and other parties.
Sinopower shall bear no responsible whatsoever for any dispute arising from
the use of such technical information.
The products are not designed or manufactured to be used with any
equipment, device or system which requires an extremely high level of
reliability, such as the failure or malfunction of which any may result in a direct
threat to human life or a risk of human injury. Sinopower shall bear no
responsibility in any way for use of any of the products for the above special
purposes. If a product is intended to use for any such special purpose, such
as vehicle, military, or medical controller relevant applications, please contact
Sinopower sales representative before purchasing.
Copyright ã Sinopower Semiconductor, Inc.
Rev. A.1 - November, 2015
8
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SM2363PSA
®
Classification Profile
Copyright ã Sinopower Semiconductor, Inc.
Rev. A.1 - November, 2015
9
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SM2363PSA
®
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak
(Tp)*
package
body
Temperature
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness