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RK809-1

RK809-1

  • 厂商:

    ROCKCHIP(瑞芯微)

  • 封装:

    QFN68_7X7MM_EP

  • 描述:

    电源管理(PMIC) QFN68_7X7MM_EP

  • 数据手册
  • 价格&库存
RK809-1 数据手册
RK809 Datasheet Rev 2.3 Rockchip RK809 Datasheet Revision 2.3 March.2023 Copyright ©2023 Rockchip Electronics Co., Ltd. 1 RK809 Datasheet Rev 2.3 Revision History Date Revision 2023-03-17 2.3 1,Add the RC oscillator and start up sequence information of DC Characteristics 2022-11-14 2.2 1, Update power sequence description of the RK809-7A 2, Update the Description of the Reg38 3, Update the detail Description of the Power down 4, Update the Power on Description of the VDC 5,Update power sequence description of the RK809-7 6,Add the MSL and lead finish information 2022-03-13 2.1 1, Update the description of RK809-1A ,RK8095A,RK809-6A 2021-12-27 2.0 1, Update the description of RK809-7 1.9 1, Update power sequence description for SWOUT1 and SWOUT2 of RK809-6 2,Update power on description of the EXT_EN 2021-11-23 1.8 1,Update power sequence description for default voltage of the OFF channel 2,Update the Electrical Characteristics Table 3,Update the description of RegF0 4, Update the description of RK809-6 5, Update BUCKn_ILPK and BUCKn_ILVL informatiom 2020-10-14 1.7 Update VB_OK and RK809-5 description, figure description, note of SLEEP pin active, Power Sequence Description 2020-02-26 1.6 Add Functional Block Diagram 2019-10-09 1.5 Update register description 1.4 Update the header 2019-02-15 1.3 Add more detail description. 2018-12-29 1.2 RK809_1 LDO1 power up sequence modification 2018-08-28 1.1 Spec change @ power up sequence 2018-04-02 1.0 Initial release 2021-12-02 2019-06-18 Description Copyright ©2023 Rockchip Electronics Co., Ltd. 2 RK809 Datasheet Rev 2.3 Table of Content Table of Content .................................................................................................. 3 Figure Index ....................................................................................................... 5 Table Index 6 Warranty Disclaimer ............................................................................................. 7 Chapter 1 Introduction ....................................................................................... 8 1.1 Overview ............................................................................................. 8 1.2 Feature ................................................................................................ 9 1.3 Block Diagram .................................................................................... 10 1.4 Typical Application Diagrams ................................................................... 11 Chapter 2 Package information ........................................................................... 13 2.1 Ordering information ........................................................................... 13 2.2 Top Marking ....................................................................................... 13 2.3 Pin Assignment ................................................................................... 16 2.4 MSL Information ................................................................................. 16 2.5 Lead Finish/Pin Material Information ...................................................... 16 2.6 Pinout Number Order ........................................................................... 18 Chapter 3 Electrical Characteristics ...................................................................... 20 3.1 Absolute Maximum Ratings .................................................................. 20 3.2 Recommended Operating Conditions ..................................................... 20 2.7 Dimension .......................................................................................... 16 3.3 DC Characteristics ............................................................................... 20 Chapter 4 Function Description ........................................................................... 28 4.1 Top State Machine ............................................................................... 28 4.1.1 State Machine Description .................................................................... 28 4.1.2 Power on Description ........................................................................... 28 4.1.3 Power down Description ....................................................................... 29 4.1.4 Reset Description ................................................................................ 30 4.1.5 Power Sequence Description ................................................................. 32 4.1.6 Sleep Description ................................................................................ 39 4.2 Power Channels .................................................................................. 39 4.2.1 Buck Description ................................................................................. 39 4.2.2 LDO Description .................................................................................. 42 4.3 Battery Gas Gauge .............................................................................. 43 4.4 Audio System ..................................................................................... 44 Copyright ©2023 Rockchip Electronics Co., Ltd. 3 RK809 Datasheet Rev 2.3 4.4.1 General Description ............................................................................. 44 4.4.2 Audio Recording Path Description .......................................................... 44 4.4.3 Head-Phone Path Description ................................................................ 45 4.4.4 Speaker Path Description ..................................................................... 46 4.4.5 I2S Description ................................................................................... 47 4.4.6 RC Oscillator Description ...................................................................... 47 4.5 Others ............................................................................................... 47 4.5.1 Real Time Clock (RTC) Description......................................................... 47 Chapter 5 Register Description............................................................................ 48 5.1 Register Summary .............................................................................. 48 5.2 Register Description ............................................................................ 53 Chapter 6 Thermal Management ....................................................................... 125 6.1 Overview .......................................................................................... 125 6.2 Package Thermal Characteristics .......................................................... 125 Copyright ©2023 Rockchip Electronics Co., Ltd. 4 RK809 Datasheet Rev 2.3 Figure Index Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. Fig. 1-1 RK809 Functional Block Diagram ........................................................... 10 1-2 RK809 Typical Application Diagram for no battery .................................... 11 1-3 RK809 Typical Application Diagram for two battery .................................. 12 2-1 Pin Assignment QFN7x7-68(Pitch=0.35mm) ........................................... 18 3-1 QFN687mm X 7mm ............................................................................. 17 4-1 State Machine .................................................................................... 28 4-2 Press “PWRON” key to turn on the PMIC ................................................. 28 4-3 VDC voltage Rising-edge to turn on the PMIC .......................................... 29 4-4 Long press “PWRON” key to turn off the PMIC ......................................... 29 4-5 VCC under-voltage to turn off the PMIC .................................................. 30 4-6 Long press “PWRON” key to restart the PMIC .......................................... 31 4-7 VCC under-voltage to restart the PMIC ................................................... 32 4-8 BUCK1 load transient rising edge........................................................... 40 4-9 BUCK1 load transient falling edge .......................................................... 40 4-10 BUCK1 load transient rising edge 2 ...................................................... 40 4-11 BUCK1 load transient falling edge 2 ..................................................... 41 4-12 BUCK1 efficiency curve when different input voltage............................... 41 4-13 BUCK2 efficiency curve when different input voltage............................... 41 4-14 BUCK3 efficiency curve when different input voltage............................... 42 4-15 BUCK4 efficiency curve when different input voltage............................... 42 4-16 BUCK5 efficiency curve when different input voltage,Vout=3.3V ............... 42 4-17 Gas gauge architecture ...................................................................... 43 4-18 Current ADC Relative Error Curve ........................................................ 44 4-19 Voltage ADC Relative Error Curve ........................................................ 44 4-20 Audio system architecture .................................................................. 44 4-21 Audio recording path THD+N ratio at differential mode ........................... 45 4-22 Head-phone path THD+N ratio ............................................................ 46 4-23 Speaker path THD+N ratio.................................................................. 47 Copyright ©2023 Rockchip Electronics Co., Ltd. 5 RK809 Datasheet Rev 2.3 Table Index Table 4-1 RK809-1 Power up/down sequence(x:BUCK3 voltage determined by external divided resistor;LDO3 start up later than LDO1 for about 200uS ) ,Short press PWRON key time is 100ms. .................................................................................... 32 Table 4-2 RK809-2 Power up/down sequence(x:BUCK3 voltage determined by external divided resistor; LDO3 start up later than LDO1 for about 200uS) ,Short press PWRON key time is 100ms. .................................................................................... 33 Table 4-3 RK809-3 Power up/down sequence(x:BUCK3 voltage determined by external divided resistor; LDO3 start up later than LDO1 for about 200uS) ,Short press PWRON key time is 100ms. .................................................................................... 34 Table 4-4 RK809-5 Power up/down sequence(x:BUCK3 voltage determined by external divided resistor;LDO3 start up later than LDO2 for about 200uS ) ,Short press PWRON key time is 100ms. .................................................................................... 35 Table 4-5 RK809-6 Power up/down sequence(x:BUCK3 voltage determined by external divided resistor; LDO3 start up later than LDO1 for about 200uS) ,Short press PWRON key time is 100ms. .................................................................................... 35 Table 4-6 RK809-7 Power up/down sequence(x:BUCK3 voltage determined by external divided resistor;) ,Short press PWRON key time is 100ms. .............................. 36 Table 4-7 RK809-1A Power up/down sequence(x:BUCK3 voltage determined by external divided resistor;LDO3 start up later than LDO1 for about 200uS ) ,Short press PWRON key time is 100ms. .................................................................................... 37 Table 4-8 RK809-5A Power up/down sequence(x:BUCK3 voltage determined by external divided resistor;LDO3 start up later than LDO2 for about 200uS ) ,Short press PWRON key time is 100ms. .................................................................................... 38 Table 4-9 RK809-6A Power up/down sequence(x:BUCK3 voltage determined by external divided resistor; LDO3 start up later than LDO1 for about 200uS) ,Short press PWRON key time is 100ms. .................................................................................... 38 Table 4-10 RK809-7A Power up/down sequence(x:BUCK3 voltage determined by external divided resistor) ,Short press PWRON key time is 100ms. ............................... 39 Table 6-1 Thermal Resistance Characteristics .................................................... 125 Copyright ©2023 Rockchip Electronics Co., Ltd. 6 RK809 Datasheet Rev 2.3 Warranty Disclaimer Rockchip Electronics Co., Ltd makes no warranty, representation or guarantee (expressed, implied, statutory, or otherwise) by or with respect to anything in this document, and shall not be liable for any implied warranties of non-infringement, merchantability or fitness for a particular purpose or for any indirect, special or consequential damages. Information furnished is believed to be accurate and reliable. However, Rockchip Electronics Co., Ltd assumes no responsibility for the consequences of use of such information or for any infringement of patents or other rights of third parties that may result from its use. Rockchip Electronics Co., Ltd’s products are not designed, intended, or authorized for using as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Rockchip Electronics Co., Ltd’s product could create a situation where personal injury or death may occur, should buyer purchase or use Rockchip Electronics Co., Ltd’s products for any such unintended or unauthorized application, buyers shall indemnify and hold Rockchip Electronics Co., Ltd and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, expenses, and reasonable attorney fees arising out of, either directly or indirectly, any claim of personal injury or death that may be associated with such unintended or unauthorized use, even if such claim alleges that Rockchip Electronics Co., Ltd was negligent regarding the design or manufacture of the part. Copyright and Patent Right Information in this document is provided solely to enable system and software implementers to use Rockchip Electronics Co., Ltd ’s products. There are no expressed or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Rockchip Electronics Co., Ltd does not convey any license under its patent rights nor the rights of others. All copyright and patent rights referenced in this document belong to their respective owners and shall be subject to corresponding copyright and patent licensing requirements. Trademarks Rockchip and RockchipTM logo and the name of Rockchip Electronics Co., Ltd’s products are trademarks of Rockchip Electronics Co., Ltd. and are exclusively owned by Rockchip Electronics Co., Ltd. References to other companies and their products use trademarks owned by the respective companies and are for reference purpose only. Confidentiality The information contained herein (including any attachments) is confidential. The recipient hereby acknowledges the confidentiality of this document, and except for the specific purpose, this document shall not be disclosed to any third party. Reverse engineering or disassembly is prohibited. ROCKCHIP ELECTRONICS CO., LTD. RESERVES THE RIGHT TO MAKE CHANGES IN ITS PRODUCTS OR PRODUCT SPECIFICATIONS WITH THE INTENT TO IMPROVE FUNCTION OR DESIGN AT ANY TIME AND WITHOUT NOTICE AND IS NOT REQUIRED TO UNDATE THIS DOCUMENTATION TO REFLECT SUCH CHANGES. Copyright ©2023 Rockchip Electronics Co., Ltd. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior written consent of Rockchip Electronics Co., Ltd. Copyright ©2023 Rockchip Electronics Co., Ltd. 7 RK809 Datasheet Rev 2.3 Chapter 1 Introduction 1.1 Overview The RK809 is a complex power-management integrated circuit (PMIC) integrated CODEC for multi-core system applications powered by an external power supply. The RK809 can provide a complete power management solution with very few external components. The RK809 provides five fast load transient synchronous step-down converters. The device also contains 9 LDO regulators, two switches and a battery fuel gauge. Powerup/power-down controller is configurable and can support any customized powerup/power-down sequences (OTP based). A real-time clock (RTC) is also integrated to provide a 32.768-kHz output buffer, and real time function. The RK809 supports 32.768kHz clock generation based on a crystal oscillator. It also includes Audio CODEC , real ground Head phone driver and ClassD driver. The RK809 integrates four channels step-down DC-DC converters. All of them adopt ripple base control to achieve very fast load transient response. Meanwhile, all of them can dynamically adjust the output voltage, as required by the processor based on the processor’s operation status so as to maximize the system efficiency. The output voltages of most channels can be configured through the I2C interface. The inputs of all channels have soft start function, which greatly reduces the inrush current at the startup. 2.5MHz switching frequency and good control method decrease the external inductance and capacitance. The RK809 also integrate a peak current mode control high efficiency buck converter, maximum current up to 2.5A, it’s usually used to power LDOs. The RK809 integrates nine channels LDO regulators. The LDO3 is high PSRR (75dB @1Khz) high accuracy low drop-out regulator. The inputs of all LDO regulators could be decrease to 2V for high convert efficiency. The output voltages of all LDO regulators can be configured through the I2C interface. A “battery fuel gauge” is integrated in the RK809. Using the proprietary algorithms and the sensed battery current and voltage, the gauge can accurately calculate the battery capacity based on the charging/discharging characteristics of the battery preloaded in the system. The gauge then sends the battery capacity information to the processor through the I2C interface. The RK809 also integrates complete audio system. The single end or differential mode Micro-phone can be connected to RK809 through two AC-couple capacitors. 24bits ADC and gain adjustable PGA would convert the micro-phone signal to digital signal. The sound recording path has very low THD (-75dB @1KHz@580mV source). 24 bits DAC would convert digital signal to analog signal, and Class-AB driver adopt real-ground structure for Head-phone application, has very low THD (-90dB @1KHz@-3dBFS source). Meanwhile, Class-D driver integrated for speaker application. The speaker and headphone can be used at the same time. I2S interface is integrated to communicate with processor. The RK809 is available in a QFN68 7.0 mm x 7.0 mm package, with a 0.35-mm pin pitch. Copyright ©2023 Rockchip Electronics Co., Ltd. 8 RK809 Datasheet Rev 2.3 1.2 Feature  Input range: 2.7V - 5.5V  Low standby current of 35uA  Power channels:  BUCK1: 0.5V~2.4V, 2.5A max, very fast transient response  BUCK2: 0.5V~2.4V, 2.5A max, very fast transient response  BUCK3: 0.5V~2.4V (or resistor divider), 1.5A max, very fast transient response  BUCK4: 0.5V~3.4V, 1.5A max, very fast transient response  BUCK5: 1.5V~3.6V, 2.5 A max, fast transient response  LDO1~LDO2,LDO4~LDO9: 0.6V~3.4V, 400mA max  LDO3: high PSRR (75dB @ 1KHz), 0.6V~3.4V, 100mA max  Switch1: 2.1 A max, Rdson=90mΩ  Switch2: 2.1 A max, Rdson=100mΩ  OTP Programmable power up/down sequences and voltage  Accurate battery fuel gauge with two separate battery voltage and current ADC  16 bits ADC for battery voltage, battery temperature, USB/SYS voltage sense  16 bits ADC for battery current sense  OCV algorithm combine with Coulom-counter algorithm  Real time clock(RTC)  Audio System  Audio codec: 24bits for both ADC and DAC  Support single end or differential mode Micro-phone input  Support real ground class-AB PA to drive Head-phone, 32Ohm Load  Support class-D PA to drive speaker, 1.3W  Support I2S as the digital signal interface for both DAC and ADC  Support programmable digital and analog gains  Sample rate: 48KHz~192KHz  Integrates internal PLL  Support PDM mode(external input PCLK)  Package:7mmx7mm QFN68 Copyright ©2023 Rockchip Electronics Co., Ltd. 9 RK809 Datasheet Rev 2.3 1.3 Block Diagram VCC9 LDO1 VLDO1 400mA VLDO2 400mA Switch 1 VSWOUT1 LDO2 VCC5 VLDO3 BUCK5 Step-Down 2.5A 1.5~3.6V DAC LDO3 (low noise) 100mA LDO3 FB5 VCC1 BUCK1 Step-Down 2.5A 0.5~2.4V VLDO4 BUCK5 SW5 LDO4 400mA DAC SW1 BUCK1 FB1 VCC2 BUCK2 Step-Down 2.5A 0.5~2.4V LDO5 VLDO5 400mA DAC SW2 BUCK2 FB2 VCC3 VCC6 LDO6 VLDO6 400mA VLDO7 400mA VLDO8 LDO8 400mA BUCK3 Step-Down 1.5A 0.5~2.4V DAC LDO7 VFB=0.8V VLDO9 VCC8 BUCK3 VBUCK3 VFB3 VCC4 BUCK4 Step-Down 1.5A 0.5~3.4V DAC VCC7 SW3 LDO9 400mA SW4 BUCK4 FB4 INT SLEEP PWRON EXT_EN RESETB VDC Power Sequence Switch 2 Audio VSWOUT2 CP_-2V3 CPP CPN VCC_CPVSS LDO_2V3 VCC_1P8A VCC_CPVDD VCC_SPK_HP SPKP_OUT DAC/ HP/ CLASS-D VCC_1P8D VCC_RTC ADC XIN PLL 32K OSC RTC XOUT VLDO4 CLK32K SCL SDA I2S I2C SPKN_OUT HPR_OUT HP_SNS HPL_OUT MIC1P MIC1N MCLK BCLK LRCLK SDI SDO/PDMDATA PDMCLK Battery Fuel Gauge REFGND R eference VREF IADC VADC SNSP SNSN BATDIV Note: 1. The detail audio block diagram is shown at chapter “4.4 2. The I2S interface is internal pull high to VLDO4. Fig. 1-1 RK809 Functional Block Diagram Copyright ©2023 Rockchip Electronics Co., Ltd. Audio System”. 10 RK809 Datasheet Rev 2.3 2.1 1.4 Typical Application Diagrams 1uF VSWOUT1 VSWOUT2 VSWOUT2 VSWOUT1 VCC_SYS BUCK5 1uF VCC9 VCC8 1uF 10uF BUCK5 0.47uH/4A 1uF SW5 VCC_SYS 33uF VFB5 VCC5 VLDO1 1uF VCC_SYS VLDO1 VCC1 VLDO2 1uF VLDO2 SW1 VLDO3 VCC_SYS VCC6 VCC2 VLDO4 1uF VLDO4 VLDO5 VCC_SYS VCC3 BUCK5 VCC7 VLDO7 22uF VBUCK3 VLDO8 82K VFB3 VLDO9 1uF 120K VLDO9 VCC_SYS 1uF VCC4 VREF GNDREF 22pF 10uF BUCK4 0.47uH/3A SW4 22pF Optional BUCK3 SW3 VLDO8 1uF 10uF 0.47uH/3A VLDO7 1uF 33uF VFB2 VLDO6 1uF BUCK2 0.47uH/4A VLDO6 1uF 10uF SW2 VLDO5 1uF 33uF VFB1 BUCK5 1uF BUCK1 0.47uH/4A VLDO3 1uF 10uF XIN 22uF VFB4 32.7 68K XOUT PWRON PWRON BUCK4 100nF RK809 Optional 1 ADP_12V 10uF Exposed GND 10uF 100K Normal ADP_5V 10K SLEEP INT CLK32K RESETB VDC 22K 10K BUCK4 100nF AP 100nF BATDIV OVP Option 4.7K SNSP SNSN VLDO4 100nF 4.7K SCL SCL SDA PDMCLK MCLK BCLK LRCLK SDI SDO/PDMDATA SDA 10uF 2.2K 10K EXT_EN VCC_SYS BUCK 12V-5V VCC_IO MIC1P 100nF MIC1N CPP 2.2K HPR_OUT HPL_OUT HP_SNS 2.2uF VCC_SYS CPN 2.2uF 1uF 1uF 1uF VCC_CPVSS VCC_CPVDD 10uF VCC_SPK SPKR_OUT VCC_1P8A SPKL_OUT VCC_1P8D VCC_RTC VCC_SYS 1uF VCC_RTC must be the highest voltage in the RK809 Fig. 1-2 RK809 Typical Application Diagram for no battery Copyright ©2023 Rockchip Electronics Co., Ltd. 11 RK809 Datasheet Rev 2.3 VSWOUT2 1uF VSWOUT1 VSWOUT2 VSWOUT1 BUCK5 1uF VCC_SYS VCC9 VCC8 1uF 10uF BUCK5 0.47uH/4A SW5 VCC_SYS 1uF 33uF VFB5 VCC5 VLDO1 1uF VCC_SYS VLDO1 VCC1 VLDO2 1uF VLDO2 SW1 VLDO3 VCC_SYS VCC6 VCC2 VLDO4 1uF VLDO4 VLDO5 VCC_SYS VCC3 BUCK5 VCC7 22uF VBUCK3 VLDO8 VLDO8 82K VFB3 VLDO9 1uF 120K VLDO9 VCC_SYS 1uF VCC4 VREF GNDREF 22pF 10uF BUCK4 0.47uH/3A SW4 22pF Optional BUCK3 SW3 VLDO7 1uF 10uF 0.47uH/3A VLDO7 1uF 33uF VFB2 VLDO6 1uF BUCK2 0.47uH/4A VLDO6 1uF 10uF SW2 VLDO5 1uF 33uF VFB1 BUCK5 1uF BUCK1 0.47uH/4A VLDO3 1uF 10uF XIN 22uF VFB4 32.768 K XOUT PWRON VCC_RTC 1uF PWRON VCC_SYS BUCK4 100nF 22uF HVLDO BUCK 5V 5V RK809 10uF 10K Power path / Charger Exposed GND 220K VDC 22K SLEEP INT CLK32K RESETB 10K BUCK4 100nF 100nF BATDIV 100nF 20K Close to RK809 SNSP SNSN 10 mohm VLDO4 2.2K AP 4.7K 140K Battery pack 10K EXT_EN ADP_12V ADP_12V VCC_IO 100nF 4.7K SCL SCL SDA PDMCLK MCLK BCLK LRCLK SDI SDO/PDMDATA SDA MIC1P 100nF MIC1N CPP 2.2K HPR_OUT HPL_OUT HP_SNS 2.2uF VCC_SYS CPN 2.2uF 1uF 1uF 1uF VCC_CPVSS VCC_CPVDD VCC_SPK 10uF SPKR_OUT VCC_1P8A SPKL_OUT VCC_1P8D VCC_RTC VCC_RTC 1uF VCC_RTC must be the highest voltage in the RK809 Fig. 1-3 RK809 Typical Application Diagram for two battery Copyright ©2023 Rockchip Electronics Co., Ltd. 12 RK809 Datasheet Rev 2.3 Chapter 2 Package information 2.2 Ordering information Orderable Device RoHS status Package Package Detail RK809-1 RoHS QFN68 (7X7) 2000 pcs/ tape, 5 tapes/box,by reel RK809-2 RoHS QFN68 (7X7) 2000 pcs/ tape, 5 tapes/box,by reel RK809-3 RoHS QFN68 (7X7) 2000 pcs/ tape,5 tapes/box,by reel RK809-5 RoHS QFN68 (7X7) 2000 pcs/ tape,5 tapes/box,by reel RK809-6 RoHS QFN68 (7X7) 2000 pcs/ tape,5 tapes/box,by reel RK809-7 RoHS QFN68 (7X7) 2000 pcs/ tape,5 tapes/box,by reel RK809-1A RoHS QFN68 (7X7) 2000 pcs/ tape,5 tapes/box,by reel RK809-5A RoHS QFN68 (7X7) 2000 pcs/ tape,5 tapes/box,by reel RK809-6A RoHS QFN68 (7X7) 2000 pcs/ tape,5 tapes/box,by reel 2.3 Top Marking Rockchip Rockchip : Brand Name RK809-1 RKXXXX : Chip Name ABCXXXXXX DEFG ABC : Subcontractor Code XXXXXX : Die Lot NO # DEFG : Date Code The first pin Copyright ©2023 Rockchip Electronics Co., Ltd. 13 RK809 Datasheet Rev 2.3 Rockchip Rockchip : Brand Name RK809-2 RKXXXX : Chip Name ABCXXXXXX DEFG ABC : Subcontractor Code XXXXXX : Die Lot NO # DEFG : Date Code The first pin Rockchip Rockchip : Brand Name RK809-3 RKXXXX : Chip Name ABCXXXXXX DEFG ABC : Subcontractor Code XXXXXX : Die Lot NO # DEFG : Date Code The first pin Rockchip Rockchip : Brand Name RK809-5 RKXXXX : Chip Name ABCXXXXXX DEFG ABC : Subcontractor Code XXXXXX : Die Lot NO # DEFG : Date Code The first pin Copyright ©2023 Rockchip Electronics Co., Ltd. 14 RK809 Datasheet Rev 2.3 Rockchip Rockchip : Brand Name RK809-6 RKXXXX : Chip Name ABCXXXXXX DEFG ABC : Subcontractor Code XXXXXX : Die Lot NO # DEFG : Date Code The first pin Rockchip Rockchip : Brand Name RK809-7 RKXXXX : Chip Name ABCXXXXXX DEFG ABC : Subcontractor Code XXXXXX : Die Lot NO # DEFG : Date Code The first pin Rockchip Rockchip : Brand Name RK809-1A RKXXXX : Chip Name ABCXXXXXX DEFG ABC : Subcontractor Code XXXXXX : Die Lot NO # DEFG : Date Code The first pin Copyright ©2023 Rockchip Electronics Co., Ltd. 15 RK809 Datasheet Rev 2.3 Rockchip Rockchip : Brand Name RK809-5A RKXXXX : Chip Name ABCXXXXXX DEFG ABC : Subcontractor Code XXXXXX : Die Lot NO # DEFG : Date Code The first pin Rockchip Rockchip : Brand Name RK809-6A RKXXXX : Chip Name ABCXXXXXX DEFG ABC : Subcontractor Code XXXXXX : Die Lot NO # DEFG : Date Code The first pin 2.4 MSL Information Moisture sensitivity Level :MSL3 2.5 Lead Finish/Pin Material Information Lead Finish/Pin Material :Sn 2.6 Dimension Copyright ©2023 Rockchip Electronics Co., Ltd. 16 RK809 Datasheet Rev 2.3 Fig. 2-1 QFN687mm X 7mm DESCRIPTION SYMBOL TOTAL THICKNESS STAND OFF MOLD THICKNESS MATERIAL THICKNESS A A1 A2 A3 D E D1 E1 L e b aaa bbb ccc ddd eee fff PACKAGE SIZE EP SIZE LEAD LENGTH LEAD PITCH LEAD WIDTH LEAD OSITION OFFSET LEAD COPLANARITY PACKAGE EDGE PROFILE MOLD FLATNESS EP POSITION OFFSET MIN 0.70 0 5.39 5.39 0.30 0.1 MILLIMETER NOM 0.75 0.035 0.55 0.203REF 7BSC 7BSC 5.49 5.49 0.4 0.35BSC 0.15 0.07 0.08 0.10 0.10 0.10 0.05 MAX 0.80 0.05 0.57 5.59 5.59 0.50 0.2 Note: 1. Coplanarity applies to leads, corner leads and die attach pad. 2. Dimension b applies to metalized terminal and is measured between 0.15mm and 0.30mm from the Copyright ©2023 Rockchip Electronics Co., Ltd. 17 RK809 Datasheet Rev 2.3 terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension b should not be measure in that radius area. VCC8 BATDIV SWOUT1 VCC9 SW5 PWRON RESETB VCC4 SW4 FB4 SNSN SNSP VDC EXT_EN FB5 SWOUT2 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 CLK32K 2.7 Pin Assignment 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 QFN68 7×7 ePAD XOUT XIN SLEEP VCC_1P8D GNDREF VREF VCC_RTC VCC_1P8A MIC1P MIC1N HPR_OUT HP_SNS HPL_OUT VCC_CPVDD CPP CPN VCC_CPVSS SDO/PDMDATA 18 PDMCLK 19 LDO3 20 LDO2 21 VCC5 22 LDO1 23 VCC3 24 SW3 25 VBUCK3 26 FB3 27 LDO4 28 LDO5 29 VCC6 30 LDO6 31 SPKP_OUT 32 VCC_SPK_HP 33 SPKN_OUT 34 SCL SDA LDO7 VCC7 LDO8 LDO9 INT FB2 SW2 VCC2 VCC1 SW1 FB1 LRCLK BCLK MCLK SDI Fig. 2-2 Pin Assignment QFN7x7-68(Pitch=0.35mm) 2.8 Pinout Number Order PIN NO 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 PIN NAME SCL SDA LDO7 VCC7 LDO8 LDO9 INT FB2 SW2 VCC2 VCC1 SW1 FB1 LRCLK BCLK MCLK SDI SDO/PDMDATA PDMCLK LDO3 LDO2 VCC5 LDO1 PIN DESCRIPTION I2C clock input I2C data input and output LDO7 output Power supply of LDO7/8/9 LDO8 output LDO9 output Interrupt request pin, open drain Output feedback voltage of buck2 Switching node of buck2 Power supply of buck2 Power supply of buck1 Switching node of buck1 Output feedback voltage of buck1 The I2S framing clock The I2S bit clock The I2S main clock input pin The I2S DAC input data The I2S ADC output data/PDM Data for the DSADC PDM CLK for the DSADC OUTPUT LDO3 output LDO2 output Power supply of LDO1/2/3 LDO1 output Copyright ©2023 Rockchip Electronics Co., Ltd. 18 RK809 Datasheet PIN NO 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 PIN NAME VCC3 SW3 VBUCK3 FB3 LDO4 LDO5 VCC6 LDO6 SPKP_OUT VCC_SPK_HP SPKN_OUT VCC_CPVSS CPN CPP VCC_CPVDD HPL_OUT HP_SNS HPR_OUT MICIN MICIP VCC_1P8A VCC_RTC VREF GNDREF VCC_1P8D SLEEP XIN XOUT PWRON 53 54 55 56 57 58 59 60 61 SW5 VCC9 SWOUT1 BATDIV VCC8 SWOUT2 FB5 EXT_EN VDC 62 63 64 65 66 67 68 Exposed pad SNSP SNSN FB4 SW4 VCC4 RESETB CLK32K Exposed ground Rev 2.3 PIN DESCRIPTION Power supply of buck3 Switching node of buck3 Output voltage of buck3 Output feedback voltage of buck3 LDO4 output LDO5 output Power supply of LDO4/5/6 LDO6 output Positive speaker driver output Power supply for speaker and charger pump Negative speaker driver output. Negative power supply for the headphone Negative switching node of the charger pump Positive switching node of the charger pump. Positive power supply for the headphone Left channel output of the headphone Reference ground for the headphone Right channel output of the headphone Negative input of the Microphone Positive input of the Microphone Power supply for internal 1.8V analog circuit Power supply filter Internal reference voltage Reference ground Power supply for internal 1.8V digital circuit Sleep mode control input 32.768KHz crystal oscillator input 32.768KHz crystal oscillator output Power on key input, active low, internal 17k resistor pull high to VCC_RTC Switching node of BUCK5 Power supply of buck5 and SWOUT1 Power switch out 1 Divided voltage of positive battery Power supply of SWOUT2 Power switch out 2 Output feedback voltage of buck5 Enable Signal for external high voltage BUCK If it exceeds 0.55V for the first time, it will start the PMIC(rising edge triggering start).And it is connected to the divider of external power supply generally. Bat charging and discharging sense current positive pin Bat charging and discharging sense current negative pin Output feedback voltage of buck4 Switching node of buck4 Power supply of buck4 Reset pin after power on, active low 32.768KHz clock output, open drain Ground Copyright ©2023 Rockchip Electronics Co., Ltd. 19 RK809 Datasheet Rev 2.3 Chapter 3 Electrical Characteristics 3.1 Absolute Maximum Ratings Parameter Voltage range on pins SWOUTx, SWx, VCC1~9,VCC_RTC,VCC_SPK_HP,LDOx, BATDIV, FBx,VBUCK3,SPKP_OUT,SPKN_OUT Voltage range on pin CLK32K,RESETB, SLEEP,SCL,SDA,INT,PWRON,XIN,SOUT, VDC,EXT_EN Voltage range on pins LRCLK,BCLK,MCLK,SDI,SDO/PDMCLK,PDMCLK, Voltage range on pins SNSP,SNSN,VREF,VCC_1P8D,VCC_1P8A,MIC1N,MIC1P Voltage range on pins HP_SNS,HPR_OUT,HPL_OUT Voltage range on pins VCC_CPVDD,CPP Voltage range on pins VCC_CPVSS,CPN Storage temperature range, TS Operating temperature range, TJ Min -0.3 Max 6.5 Units V -0.3 6.5 V -0.3 6.5 V -0.2 1.98 V -2.7 -0.3 -2.7 -40 2.7 2.7 0.3 150 V V V ℃ -40 125 ℃ 300 ℃ Maximum Soldering Temperature, TSOLDER Note: Exposure to the conditions exceeded absolute maximum ratings may cause the permanent damages and affect the reliability and safety of both device and systems using the device. The functional operations cannot be guaranteed beyond specified values in the recommended conditions. 3.2 Recommended Operating Conditions Parameter Voltage range on pins VCC9 Power Dissipation Min TYP Max Units 3 5 5.5 2 V W 3.3 DC Characteristics Test conditions: VCC9=5.0V,TA=25°C for typical values, unless otherwise noted. PARAMETERS SYMBOL Note MIN TYP MAX UNIT Power dissipation Shut down Current Power on current 1: All bucks, LDOs, ADC power on, Null load Power on current 2: buck1/buck4, LDO1/ldo2 power on, Null load Power on and sleep current: buck1/buck4, LDO1/ldo2 power on, low power mode, sleep mode, Null load Isd 35 40 uA Iq1 1.9 mA Iq2 0.65 mA Isleep 0.19 mA System Characteristics VB_OK threshold, the VCC9 voltage should be Vok 2.8V~3.6V by Copyright ©2023 Rockchip Electronics Co., Ltd. VB_OK_SEL[1:0] =0b01 2.744 2.8 2.856 V 20 RK809 Datasheet PARAMETERS Rev 2.3 SYMBOL higher than it to power on the PMIC. VB_UV threshold, when the VCC9 voltage is lower than it, The PMIC would be shutdown. Vuv VB_LO threshold, when the VCC9 voltage is lower than it, The PMIC would be shut down or interrupt happen. Vlo VB_OV threshold, when the VCC9 voltage is higher than it, The PMIC would be shutdown. Vov TSD threshold, when the temperature is higher than it, The PMIC would be shutdown. T warning threshold, when the temperature is higher than it, interrupt happen. Long press PWRON key time Short press PWRON key time Note OTP programmed . Tsd Twa Tlp Tst 2.7V~3.4V by I2C programmed . Typical is 2.7V. 2.8V~3.5V by I2C programmed . Typical is 3.2V. 140/160℃ by I2C programmed . Typical is 160℃. 85~115℃ by I2C programmed . Typical is 115℃. 6s~12s by I2C programmed . Typical is 6s. 100ms/500m s by I2C programmed and OTP programed. Typical is 500ms. MIN TYP MAX UNIT VB_OK_SEL[1:0] =0b00 2.94 3.0 3.06 V VB_OK_SEL[1:0] =0b10 3.332 3.4 3.468 V VB_OK_SEL[1:0] =0b11 3.546 3.6 3.654 V 2.646 2.7 2.754 V 2.94 3.0 3.06 V 3.332 3.4 3.468 V 2.744 2.8 2.856 V 3.136 3.2 3.264 V 3.43 3.5 3.57 V 5.8 6 6.2 V TSD_TEMP=0b0 135 140 145 ℃ TSD_TEMP=0b1 155 160 165 ℃ 80 85 90 ℃ 90 95 100 ℃ 100 105 110 ℃ 110 115 120 ℃ VB_UV_SEL[2:0] =0b000 VB_UV_SEL[2:0] =0b011 VB_UV_SEL[2:0] =0b111 VB_LO_SEL[2:0] = 0b000 VB_LO_SEL[2:0] = 0b100 VB_LO_SEL[2:0] = 0b111 HOTDIE_TEMP[1 :0]=0b00 HOTDIE_TEMP[1 :0]=0b01 HOTDIE_TEMP[1 :0]= 0b10 HOTDIE_TEMP[1 :0]= 0b11 PWRON_LP_OFF _TIME[1:0]=0b0 0 PWRON_LP_OFF _TIME[1:0]=0b0 1 PWRON_LP_OFF _TIME[1:0]=0b1 0 PWRON_LP_OFF _TIME[1:0]=0b1 1 6 s 8 s 10 s 12 s PWRON_ON_TIM E=0b0 500 ms PWRON_ON_TIM E=0b1 100 ms Test conditions: VCCx=5.0V,TA=25°C for typical values, unless otherwise noted. PARAMETERS SYMBOL Note MIN TYP MAX UNIT BUCK1: Fast load transient response step-down converter Input supply voltage range Output Voltage Accuracy @ Vcc1 Vfb1 2.7 0.5V~2.4V by I2C programmed. Copyright ©2023 Rockchip Electronics Co., Ltd. 0.98 1.0 5.5 V 1.02 V 21 RK809 Datasheet PARAMETERS Rev 2.3 SYMBOL Load Transient Response L=0.47uH, Cout=32uF. Rated output current Switching Frequency when CCM mode Note Vdrop1 Typical is 1.0V. Step=12.5mV(0.5V~1.5V) Step=100mV(1.5V~2.4V) 0.25A to 2.5A, 0.5A/uS, Vout=1V Imax1 Fsw1 Vin-Vout>1.5V all load @ all input voltage range Conversion Efficiency (Vin=4.2V,Vout=1V) MIN TYP MAX 20 2.5 2.25 2.5 Iout=2A 75 Iout=1A 82 Iout=0.3A 85 UNIT mV 2.75 A MHz % BUCK2: Fast load transient response step-down converter Input supply voltage range Output Voltage Accuracy @ all load @ all input voltage range Load Transient Response L=0.47uH, Cout=32uF. Rated output current Switching Frequency when CCM mode Vcc2 Vfb2 2.7 Vdrop2 0.5V~2.4V by I2C programmed. Typical is 1.0V. Step=12.5mV(0.5V~1.5V) Step=100mV(1.5V~2.4V) 0.25A to 2.5A, 0.5A/uS, Vout=1V Imax2 Fsw2 Vin-Vout>1.5V Conversion Efficiency (Vin=4.2V,Vout=1V) 0.98 1.0 5.5 V 1.02 V 20 2.5 2.25 2.5 Iout=2A 75 Iout=1A 82 Iout=0.3A 85 mV 2.75 A MHz % BUCK3: Fast load transient response step-down converter Input supply voltage range Feedback Voltage, Default Output Voltage Accuracy @ all load @ all input voltage range Load Transient Response L=0.47uH, Cout=22uF. Rated output current Switching Frequency when CCM mode Conversion Efficiency (Vin=4.2V,Vout=1.25V) Vcc3 Vfb3 2.7 Vdrop3 Selection of external resistor divider If internal divide mode selected: 0.5V~2.4V by I2C programmed. Typical is 1.25V. Step=12.5mV (0.5V~1.5V) Step=100mV (1.5V~2.4V) 0.15A to 1.5A, 0.5A/uS, Vout=1.25V Imax3 Fsw3 Vin-Vout>1.5V Vbuck3 5.5 V 0.784 0.8 0.816 V 1.225 1.25 1.275 V 17 1.5 2.25 2.5 Iout=1A 82 Iout=0.3A 83 mV 2.75 A MHz % BUCK4: Fast load transient response step-down converter Input supply voltage range Output Voltage Accuracy @ all load @ all input voltage range Load Transient Response L=0.47uH, Cout=22uF. Rated output current Switching Frequency when CCM mode Conversion Efficiency, (Vin=4.2V,Vout=3V) Vcc4 Vfb4 2.7 Vdrop4 0.5V~3.4V by I2C programmed. Typical is 3V. Step=12.5mV (0.5V~1.5V) Step=100mV (1.5V~3.4V) 0.15A to 1.5A, 0.5A/uS, Vout=3V Imax4 Fsw4 Vin-Vout>1.5V 2.94 3 5.5 V 3.06 V 22 1.5 2.25 2.5 Iout=1A 92 Iout=0.3A 93 mV 2.75 A MHz % LDO1 Copyright ©2023 Rockchip Electronics Co., Ltd. 22 RK809 Datasheet Rev 2.3 PARAMETERS SYMBOL Input supply voltage range Output Voltage Accuracy @ all load @ all input voltage range Rated output current Vcc5 Vldo1 Imaxl1 PSRR@ 1KHz PSRR@ 10KHz Note MIN TYP 2 0.6V~3.4V by I2C programmed. Typical is 1V. Step=25mV Vcc5- Vldo1>0.4V Vcc5- Vldo1>0.2V Vin rms=200mV Vin rms=200mV 0.98 1 MAX UNIT 5.5 V 1.02 V 400 200 mA mA dB dB 65 60 LDO2 Input supply voltage range Output Voltage Accuracy @ all load @ all input voltage range Rated output current Vcc5 Vldo2 Imaxl2 PSRR@ 1KHz PSRR@ 10KHz 2 0.6V~3.4V by I2C programmed. Typical is 1.8V. Step=25mV Vcc5- Vldo2>0.4V Vcc5- Vldo2>0.2V Vin rms=200mV Vin rms=200mV 1.764 1.8 5.5 V 1.836 V 400 200 mA mA dB dB 65 60 LDO3: High PSRR LDO Input supply voltage range Output Voltage Accuracy @ all load @ all input voltage range Rated output current Vcc5 Vldo3 Imaxl3 PSRR@ 1KHz PSRR@ 10KHz 2 0.6V~3.4V by I2C programmed. Typical is 1V. Step=25mV Vcc5- Vldo3>0.4V Vcc5- Vldo3>0.2V Vin rms=200mV Vin rms=200mV 0.98 1 5.5 V 1.02 V 100 50 mA mA dB dB 75 70 LDO4 Input supply voltage range Output Voltage Accuracy @ all load @ all input voltage range Rated output current Vcc6 Vldo4 Imaxl4 PSRR@ 1KHz PSRR@ 10KHz 2 0.6V~3.4V by I2C programmed. Typical is 3V. Step=25mV Vcc6- Vldo4>0.4V Vcc6- Vldo4>0.2V Vin rms=200mV Vin rms=200mV 2.94 3 5.5 V 3.06 V 400 200 mA mA dB dB 65 60 LDO5 Input supply voltage range Output Voltage Accuracy @ all load @ all input voltage range Rated output current Vcc6 Vldo5 Imaxl5 PSRR@ 1KHz PSRR@ 10KHz 2 0.6V~3.4V by I2C programmed. Typical is 3V. Step=25mV Vcc6- Vldo5>0.4V Vcc6- Vldo5>0.2V Vin rms=200mV Vin rms=200mV 2.94 3 5.5 V 3.06 V 400 200 mA mA dB dB 65 60 LDO6 Input supply voltage range Output Voltage Accuracy @ all load @ all input voltage range Rated output current Vcc6 Vldo6 Imaxl6 PSRR@ 1KHz PSRR@ 10KHz 2 0.6V~3.4V by I2C programmed. Typical is 3V. Step=25mV Vcc6- Vldo6>0.4V Vcc6- Vldo6>0.2V Vin rms=200mV Vin rms=200mV 2.94 3 5.5 V 3.06 V 400 200 mA mA dB dB 65 60 LDO7 Input supply voltage range Vcc7 Copyright ©2023 Rockchip Electronics Co., Ltd. 2 5.5 V 23 RK809 Datasheet Rev 2.3 PARAMETERS SYMBOL Note MIN TYP MAX UNIT Output Voltage Accuracy @ all load @ all input voltage range Rated output current Vldo7 0.6V~3.4V by I2C programmed. Typical is 2.8V. Step=25mV Vcc7- Vldo7>0.4V Vcc7- Vldo7>0.2V Vin rms=200mV Vin rms=200mV 2.744 2.8 2.856 V Imaxl7 PSRR@ 1KHz PSRR@ 10KHz 400 200 65 60 mA mA dB dB LDO8 Input supply voltage range Output Voltage Accuracy @ all load @ all input voltage range Rated output current Vcc7 Vldo8 Imaxl8 PSRR@ 1KHz PSRR@ 10KHz 2 0.6V~3.4V by I2C programmed. Typical is 1.8V. Step=25mV Vcc7- Vldo8>0.4V Vcc7- Vldo8>0.2V Vin rms=200mV Vin rms=200mV 1.764 1.8 5.5 V 1.836 V 400 200 mA mA dB dB 65 60 LDO9 Input supply voltage range Output Voltage Accuracy @ all load @ all input voltage range Rated output current Vcc7 Vldo9 Imaxl9 PSRR@ 1KHz PSRR@ 10KHz 2 0.6V~3.4V by I2C programmed. Typical is 1.5V. Step=25mV Vcc7- Vldo9>0.4V Vcc7- Vldo9>0.2V Vin rms=200mV Vin rms=200mV 1.47 1.5 5.5 V 1.53 V 400 200 mA mA dB dB 65 60 BUCK5: High efficiency step-down converter Input supply voltage range Output Voltage Accuracy @ all load @ all input voltage range Load Transient Response L=0.47uH, Cout=44uF. Rated output current Switching Frequency when CCM mode Conversion Efficiency, (Vin=4.2V,Vout=3.3V) Vcc9 Vfb5 2.7 1.5V~3.6V by I2C programmed. Typical is 3.3V. Vdrop5 0.25A to 2.5A, 0.5A/uS, Vout=3V Imax5 Fsw5 Vin-Vout>1.5V 3.234 2.5 1.8 3.3 2 Iout=2A 90 Iout=0.3A 92 5.5 V 3.366 V 40 mV 2.2 A MHz % Swicth1 Input supply voltage range Rdson Rated output current Vcc9 2.7 5 90 Imax6 1A~2.1A by I2C programmed. Typical is 2.1A. SW1_ILIM[1:0]= 0b00 SW1_ILIM[1:0]= 0b01 SW1_ILIM[1:0]= 0b10 SW1_ILIM[1:0]= 0b11 V mΩ 1 A 1.5 A 1.8 A 2.1 A Swicth2 Input supply voltage range of Boost Rdson Rated output current Vcc8 2.7 100 Imax7 1A~2.1A by I2C programmed. Typical is 2.1A. Copyright ©2023 Rockchip Electronics Co., Ltd. SW2_ILIM[1:0]= 0b00 SW2_ILIM[1:0]= 0b01 SW2_ILIM[1:0]= 0b10 5 V 120 mΩ 1 A 1.5 A 1.8 A 24 RK809 Datasheet PARAMETERS Rev 2.3 SYMBOL Note MIN SW2_ILIM[1:0]= 0b11 TYP MAX UNIT A 2.1 Test conditions: VCC9=5V, BAT_DIV=1.0V, TA=25°C for typical values, unless otherwise noted. A/D CONVERTER Voltage measuring ADC resolution Voltage measuring ADC accuracy Range of SWOUT1 voltage measurement Range of BAT_DIV voltage measurement Range of SWOUT2 voltage measurement Range of TS voltage measurement Current measuring ADC resolution Current measuring ADC accuracy Range of Current ADC measurement Coulom-counter range Coulom-counter accuracy 16 bits -0.5% +0.5% % 1 6 V 0 1.2 V 1 6 V 0 1.2 V 16 MSB is sign bit bits ABS(Ibat)>0.2A -0.5% +0.5% % SNSP/SNSN sense resistor=10mOhm -5.625 5.625 A +1 bits % 32 ABS(Ibat)>0.2A -1 Test conditions: VCC_SPK=5V, VCC9=5.0V, TA=25°C for typical values, unless otherwise noted. PARAMETERS ClassD Audio PA Input supply voltage range THD+N SYMBOL Note MIN Vccspk VCC_SPK_HP 1KHz, Po=0.4Wrms, VCC_SPK_HP =3.8V 8 ohm load, VCC_SPK_HP =3.8V, THD+N=1% 8 ohm load, VCC_SPK_HP =5V, THD+N=1% 8 ohm load, VCC_SPK_HP =5V, THD+N=10% 217Hz, VCC_SPK_HP =200mVpkpk+3.8V, VCC_SPK_HP =3.8V VCC_SPK_HP =3.8V 0dB Gain, 8ohm, A-weighted VCC_SPK_HP =3.8V,0.4W,8ohm 2.7 RMS Power PSRR Output Offset Voltage Noise Level Efficiency Copyright ©2023 Rockchip Electronics Co., Ltd. TYP MAX UNIT 5.5 0.1 V % 700 mW 1100 mW 1300 mW 65 dB - 15 + 15 mV 100 uV 88 % 25 RK809 Datasheet PARAMETERS Rev 2.3 SYMBOL Note MIN with 68uH, 1KHz No load, VCC_SPK_HP =3.8 Quiescent current DAC to Head phone outputs Full scale output level Signal to Noise Ratio SNR Total Harmonic Distortion + Noise THD+N RL=32ohm RL=300ohm A-weighted RL=32ohm,60dBFS, Fs=48KHz A-weighted RL=32ohm 3dBFS Fs=48KHz Micro-phone to ADC stereo input Full sale input voltage Input common voltage VCOMN A-weighted,60dBFS,Fs=48KH z A-weighted 997Hz -3dBFS Differential input signal, Fs=48KHz SNR THD+N TYP MAX UNIT 4 mA 0.5 0.8 97 Vrms Vrms dB -75 dB 0.8 Vrms 0.9 V 88 dB -75 dB Test conditions: BAT=4.0V, TA=25°C for typical values, unless otherwise noted. PARAMETERS SYMBOL Note MIN TYP MAX UNIT I2C interface (7bits I2C address is 0x20) SCL clock frequency fSCL 1000 KHz VLDO4* 0.7 0.4 VCC_RT C V V VCC_1P 8D*0.7 VCC_RT C V 0.4 V LOGIC INPUT Input LOW-Level Voltage Input HIGH-Level Voltage: LRCLK,BCLK,MCLK,SDI,PDMCL K Input HIGH-Level Voltage: SCL,SDA,SLEEP,PWRON,TS/GPI O,GATE/GPIO,RESETB VIL VIH1 VIH2 LOGIC OUTPUT LOW-Level Output Voltage, VOL Voltage, VOH1 3.0 mA sink current HIGH-Level Output 3.0 mA source current: V VLDO40.4 VLDO4 LRCLK,BCLK,SDO/PDMDATA HIGH-Level Output Voltage, VOH2 3.0 mA source current: C-0.4 TS/GPIO,GATE/GPIO INTERNAL RC CLOCK The frequency of RC oscillator is 32.768 kHz START UP SEQUE 2mS intervals between the channels to start up OPEN DRAIN OUTPUT PIN Copyright ©2023 Rockchip Electronics Co., Ltd. V VCC_RT VCC_RT V -20% +20% -20% +20% 26 RK809 Datasheet PARAMETERS Rev 2.3 SYMBOL Note MIN TYP MAX UNIT CLK32K,RESETB,INT,SDA Copyright ©2023 Rockchip Electronics Co., Ltd. 27 RK809 Datasheet Rev 2.3 Chapter 4 Function Description 4.1 Top State Machine 4.1.1 State Machine Description SLEEP POWER ON disabled Sleep disabled OFF POWER ON disabled POWER ON enabled Sleep enabled ACTIVE Fig. 4-1 State Machine The RK809 state machine shown as above. The state shift by “power on”, “power down”, “reset”, “active to sleep” and “sleep to active”. 4.1.2 Power on Description There are three kinds of method to power on the PMIC. Note that: When EXT_EN rising edge comes, the voltage of VCC9 must be higher than VB_OK threshold during 1.5mS. 1. Press “PWRON” key PWRON T=500mS/100mS EXT_EN T=40mS Vbuckx / Vldox Vbuckx / Vldox T=2mS RESETB Fig. 4-2 Press “PWRON” key to turn on the PMIC When the PMIC powered by VCC9 which voltage is higher than “VB_OK” threshold, keeping low level at “PWRON” pin for 500/100mS would turn on the PMIC. The “PWRON” pin de-bounce time (500mS/100mS) can be adjusted by I2C. All the power channels start up at the default output voltages with a preset power up sequence, which has 2mS intervals between the channels. When the power up process is Copyright ©2023 Rockchip Electronics Co., Ltd. 28 RK809 Datasheet Rev 2.3 done, the RESETB turns to high logic level to inform the processor that all the power rails are up and stable. 2. RTC Alarm When the PMIC powered by VCC9 which voltage is higher than “VB_OK” threshold (typical 3.4V), Setting RTC alarm would turn on the PMIC. The power on sequence is the same with the first one. For example, set RTC alarm registers: 0x07, 0x08, 0x09, 0x0A, 0x0B, 0x0C. And then set register 0x0F=2FH. 3. VDC voltage Rising-edge When the PMIC powered by VCC9/VCC8, and then VDC plug in for 140mS, the PMIC would be turn on. The power on sequence shown as below. VDC T=140mS EXT_EN T=40mS Vbuckx / Vldox Vbuckx / Vldox T=2mS RESETB Fig. 4-3 VDC voltage Rising-edge to turn on the PMIC 4.1.3 Power down Description There are 7 kinds of method to power down the PMIC. 1. Long press “PWRON” key PWRON T=6/8/10/12S RESETB T=2mS Vbuckx / Vldox Vbuckx / Vldox …… Vbuckx / Vldox T=6mS Vsys Fig. 4-4 Long press “PWRON” key to turn off the PMIC When the PMIC work in the “ON” state or “SLEEP” state, Writing register bit 0xF7=”0”, and then keeping low level at “PWRON” pin for 6/8/10/12S would turn off the PMIC. The “PWRON” pin de-bounce time (6/8/10/12S) can be adjusted by I2C. When power down enable, The RESETB pin would be pulled low to reset the processor. And then 2ms later, the power channels start to be turned off at the same time. 2. Write shutdown Register When the PMIC work in the “ON” state or “SLEEP” state, writing register bit 0xF4=”1” would turn off the PMIC. The power off sequence is the same with the first one. Copyright ©2023 Rockchip Electronics Co., Ltd. 29 RK809 Datasheet Rev 2.3 3. SYS over-voltage When the PMIC work in the “ON” state or “SLEEP” state, if VCCRTC /VCC9 higher than 6V, the PMIC would be turn off. The power off sequence is the same with the first one. 4. SYS under-voltage When the PMIC work in the “ON” state or “SLEEP” state, if VCCRTC/VCC9 lower than VB_UV threshold (typical 2.7V) for 2mS, the PMIC would be turn off. For safe attention, the buck converter would be shut down immediately when detect VB_UV. VCCRTC/VCC9 V=2.7V T=2mS RESETB T=60uS T=2mS Vbuckx Vbuckx Vldox Vldox T=2mS EXT_EN Fig. 4-5 VCC under-voltage to turn off the PMIC This would lead to processor system halted. So, Writing register bit 0xC6=”1” can fix this issue. The detail sequence will be found in “reset Description” chapter. 5. SYS low-voltage When the PMIC work in the “ON” state or “SLEEP” state, if VCCRTC /VCC9 lower than VB_LO threshold (typical 3.2V) for 2mS and Register bit 0XF1=”0”, the PMIC would be turn off. The power off sequence is the same with the first one. 6. SLEEP pin active When the PMIC work in the “ON” state or “SLEEP” state, if Register bit 0XF4=”10”, and “SLEEP” pin active (the polarity can be programmed by Register bit 0XF4), the PMIC would be turn off. The power off sequence is the same with the first one. 7. TSD protection When the PMIC work in the “ON” state or “SLEEP” state, if the temperature is higher than TSD threshold (typical 160 degree), the PMIC would be turn off. The power off sequence is the same with the first one. 4.1.4 Reset Description There are 4 kinds of method to reset the PMIC. If register bits 0xF4=”00”, reset function means restart PMIC. If register bits 0xF4=”01”, reset function means reset registers, all channels of power would be reset to default state. 1. Long press “PWRON” key Copyright ©2023 Rockchip Electronics Co., Ltd. 30 RK809 Datasheet Rev 2.3 PWRON T=6/8/10/12S RESETB T=2mS T=2mS Vbuckx / Vldox T=2mS Vbuckx / Vldox …… Vbuckx / Vldox T=2mS T=40mS EXT_EN Fig. 4-6 Long press “PWRON” key to restart the PMIC When the PMIC work in the “ON” state or “SLEEP” state, Writing register bit 0xF7=”1”, and then keeping low level at “PWRON” pin for 6/8/10/12S would restart the PMIC. The “PWRON” pin de-bounce time (6/8/10/12S) can be adjusted by I2C. Note: If the VCC9 voltage is lower than VB_OK threshold, the PMIC would be shut down but restart. 2. SLEEP pin active When the PMIC work in the “ON” state or “SLEEP” state, if Register bit 0XF4=”11”, and “SLEEP” pin active (the polarity can be programmed by Register bit 0XF4), the PMIC would restart. The restart sequence is the same with the first one. Note: If the VCC8/VCC9 voltage is lower than VB_OK threshold, the PMIC would be shut down but restart. Note: It should delay about 66uS after changing the “SLEEP” pin active each time. 3. RESETB pin pull low When the PMIC work in the “ON” state or “SLEEP” state, if “RESETB” pin is pull down, the PMIC would restart immediately. The restart sequence is the same with the first one. Note: If the VCC9 voltage is lower than VB_OK threshold, the PMIC would be shut down but restart. 4. SYS under-voltage When the PMIC work in the “ON” state or “SLEEP” state, if VCC8/VCC9 lower than VB_UV threshold (typical 2.7V) for 2mS, the PMIC would be turn off. But if register bit 0xC6=”1”, the “RESET” pin would be pull down when VB_UV happen. So, the PMIC would restart. Note: If the VCC9 voltage is lower than VB_OK threshold, the PMIC would be shut down but restart. Note: Users must NOT set register bits 0xF4=”01” at this case. V=2.7V VCC8/VCC9 T=60uS T=40mS RESETB T=2mS T=2mS T=2mS Vbuckx …… Vbuckx Vldox …… T=2mS EXT_EN Copyright ©2023 Rockchip Electronics Co., Ltd. 31 RK809 Datasheet Rev 2.3 Fig. 4-7 VCC under-voltage to restart the PMIC 4.1.5 Power Sequence Description RK809-1 Maximum output Default Start up Range of output voltage current voltage seque BUCK1 0.5V-2.4V 2.5A 1.1V 2 BUCK2 0.5V-2.4V 2.5A 1.1V 2 1.5A x 4 X(external divided resistor) BUCK3 Or 0.5V-2.4v(internal divided resistor) BUCK4 0.5V-3.4V 1.5A 3.0V 5 LDO1 0.6V-3.4V 400mA 1.0V 2 LDO2 0.6V-3.4V 400mA 1.8V 3 LDO3 0.6V-3.4V 100mA 1.0V 2 LDO4 0.6V-3.4V 400mA 3.0V 5 LDO5 0.6V-3.4V 400mA 3.0V 5 LDO6 0.6V-3.4V 400mA 3.0V 5 LDO7 0.6V-3.4V 400mA 0.6V OFF LDO8 0.6V-3.4V 400mA 0.6V OFF LDO9 0.6V-3.4V 400mA 0.6V OFF BUCK5 1.5V-3.6V 2.5A 3.3V 1 SWOUT1 OFF SWOUT2 OFF VB_OK 2.8V-3.6V x 2.8V x Table 4-1 RK809-1 Power up/down sequence(x:BUCK3 voltage determined by external divided resistor;LDO3 start up later than LDO1 for about 200uS ) ,Short press PWRON key time is 100ms. RK809-2 Maximum output Default Start up Range of output voltage current voltage sequence BUCK1 0.5V-2.4V 2.5A 0.8V 2 BUCK2 0.5V-2.4V 2.5A 0.8V 2 1.5A x 3 X(external divided resistor) BUCK3 Or 0.5V-2.4v(internal divided resistor) Copyright ©2023 Rockchip Electronics Co., Ltd. 32 RK809 Datasheet Rev 2.3 RK809-2 Maximum output Default Start up Range of output voltage current voltage sequence BUCK4 0.5V-3.4V 1.5A 3.3V 4 LDO1 0.6V-3.4V 400mA 0.8V 2 LDO2 0.6V-3.4V 400mA 1.8V 3 LDO3 0.6V-3.4V 100mA 0.8V 2 LDO4 0.6V-3.4V 400mA 1.8V 3 LDO5 0.6V-3.4V 400mA 0.6V OFF LDO6 0.6V-3.4V 400mA 0.6V OFF LDO7 0.6V-3.4V 400mA 0.6V OFF LDO8 0.6V-3.4V 400mA 3.3V 4 LDO9 0.6V-3.4V 400mA 3.3V 4 BUCK5 1.5V-3.6V 2.5A 3.3V 1 SWOUT1 OFF SWOUT2 4 VB_OK 2.8V-3.6V x 2.8V x Table 4-2 RK809-2 Power up/down sequence(x:BUCK3 voltage determined by external divided resistor; LDO3 start up later than LDO1 for about 200uS) ,Short press PWRON key time is 100ms. RK809-3 Maximum output Default Start up Range of output voltage current voltage sequence BUCK1 0.5V-2.4V 2.5A 0.9V 2 BUCK2 0.5V-2.4V 2.5A 0.9V 4 1.5A x 3 X(external divided resistor) BUCK3 Or 0.5V-2.4v(internal divided resistor) BUCK4 0.5V-3.4V 1.5A 3.3V 5 LDO1 0.6V-3.4V 400mA 0.9V 2 LDO2 0.6V-3.4V 400mA 1.8V 3 LDO3 0.6V-3.4V 100mA 0.9V 2 LDO4 0.6V-3.4V 400mA 1.8V 3 LDO5 0.6V-3.4V 400mA 0.6V OFF LDO6 0.6V-3.4V 400mA 1.5V 3 Copyright ©2023 Rockchip Electronics Co., Ltd. 33 RK809 Datasheet Rev 2.3 RK809-3 Maximum output Default Start up Range of output voltage current voltage sequence LDO7 0.6V-3.4V 400mA 3.0V 5 LDO8 0.6V-3.4V 400mA 3.3V 5 LDO9 0.6V-3.4V 400mA 3.3V 5 BUCK5 1.5V-3.6V 2.5A 3.3V 1 SWOUT1 OFF SWOUT2 5 VB_OK 2.8V-3.6V x 2.8V x Table 4-3 RK809-3 Power up/down sequence(x:BUCK3 voltage determined by external divided resistor; LDO3 start up later than LDO1 for about 200uS) ,Short press PWRON key time is 100ms. RK809-5 Range of output Maximum output Default Start up voltage current voltage sequence BUCK1 0.5V-2.4V 2.5A 0.9V 1 BUCK2 0.5V-2.4V 2.5A 0.9V 2 1.5A x 3 X(external divided BUCK3 resistor) Or 0.5V-2.4v(internal divided resistor) BUCK4 0.5V-3.4V 1.5A 0.5V OFF BUCK5 1.5V-3.6V 2.5A 1.8V 2 LDO1 0.6V-3.4V 400mA 0.6V OFF LDO2 0.6V-3.4V 400mA 0.9V 1 LDO3 0.6V-3.4V 100mA 0.9V 1 LDO4 0.6V-3.4V 400mA 0.6V OFF LDO5 0.6V-3.4V 400mA 3.3V 4 LDO6 0.6V-3.4V 400mA 3.3V 2 LDO7 0.6V-3.4V 400mA 1.8V 2 LDO8 0.6V-3.4V 400mA 1.8V 2 LDO9 0.6V-3.4V 400mA 0.6V OFF SWOUT1 3.3V 4 SWOUT2 3.3V 4 3.0V x VB_OK 2.8V-3.6V Copyright ©2023 Rockchip Electronics Co., Ltd. x 34 RK809 Datasheet Rev 2.3 Table 4-4 RK809-5 Power up/down sequence(x:BUCK3 voltage determined by external divided resistor;LDO3 start up later than LDO2 for about 200uS ) ,Short press PWRON key time is 100ms. RK809-6 Range of output Maximum output Default Start up voltage current voltage sequence BUCK1 0.5V-2.4V 2.5A 0.9V 2 BUCK2 0.5V-2.4V 2.5A 0.9V 2 1.5A x 4 X(external divided BUCK3 resistor) Or 0.5V-2.4v(internal divided resistor) BUCK4 0.5V-3.4V 1.5A 3.3V 5 BUCK5 1.5V-3.6V 2.5A 3.3V 1 LDO1 0.6V-3.4V 400mA 0.9V 2 LDO2 0.6V-3.4V 400mA 1.8V 3 LDO3 0.6V-3.4V 100mA 0.9V 2 LDO4 0.6V-3.4V 400mA 3.3V 5 LDO5 0.6V-3.4V 400mA 3.3V 5 LDO6 0.6V-3.4V 400mA 3.3V 5 LDO7 0.6V-3.4V 400mA 0.6V OFF LDO8 0.6V-3.4V 400mA 0.6V OFF LDO9 0.6V-3.4V 400mA 0.6V OFF SWOUT1 OFF SWOUT2 OFF VB_OK 2.8V-3.6V x 3.0V 10 Table 4-5 RK809-6 Power up/down sequence(x:BUCK3 voltage determined by external divided resistor; LDO3 start up later than LDO1 for about 200uS) ,Short press PWRON key time is 100ms. RK809-7 Range of output Maximum output Default Start up voltage current voltage sequence BUCK1 0.5V-2.4V 2.5A 0.8V 3 BUCK2 0.5V-2.4V 2.5A 0.8V 3 1.5A x 1 1.5A 1.8V 1 X(external divided BUCK3 resistor) Or 0.5V-2.4v(internal divided resistor) BUCK4 0.5V-3.4V Copyright ©2023 Rockchip Electronics Co., Ltd. 35 RK809 Datasheet Rev 2.3 RK809-7 Range of output Maximum output Default Start up voltage current voltage sequence BUCK5 1.5V-3.6V 2.5A 3.3V 1 LDO1 0.6V-3.4V 400mA 0.8V 2 LDO2 0.6V-3.4V 400mA 1.8V 4 LDO3 0.6V-3.4V 100mA 0.6V 4 LDO4 0.6V-3.4V 400mA 1.8V 5 LDO5 0.6V-3.4V 400mA 0.8V 4 LDO6 0.6V-3.4V 400mA 1.8V 5 LDO7 0.6V-3.4V 400mA 3.3V 4 LDO8 0.6V-3.4V 400mA 2.8V 5 LDO9 0.6V-3.4V 400mA 3.3V 5 SWOUT1 OFF SWOUT2 OFF VB_OK 2.8V-3.6V x 2.8V 10 Table 4-6 RK809-7 Power up/down sequence(x:BUCK3 voltage determined by external divided resistor;) ,Short press PWRON key time is 100ms. RK809-1A Maximum output Start up Range of output voltage current Default voltage sequence BUCK1 0.5V-2.4V 2.5A 1.1V 2 BUCK2 0.5V-2.4V 2.5A 1.1V 2 1.5A x 4 X(external divided resistor) BUCK3 Or 0.5V-2.4v(internal divided resistor) BUCK4 0.5V-3.4V 1.5A 3.0V 5 LDO1 0.6V-3.4V 400mA 1.0V 2 LDO2 0.6V-3.4V 400mA 1.8V 3 LDO3 0.6V-3.4V 100mA 1.0V 2 LDO4 0.6V-3.4V 400mA 3.0V 5 LDO5 0.6V-3.4V 400mA 3.0V 5 LDO6 0.6V-3.4V 400mA 3.0V 5 LDO7 0.6V-3.4V 400mA 0.6V OFF Copyright ©2023 Rockchip Electronics Co., Ltd. 36 RK809 Datasheet Rev 2.3 RK809-1A Maximum output Start up Range of output voltage current Default voltage sequence LDO8 0.6V-3.4V 400mA 0.6V OFF LDO9 0.6V-3.4V 400mA 0.6V OFF BUCK5 1.5V-3.6V 2.5A 3.3V 1 SWOUT1 OFF SWOUT2 OFF VB_OK 2.8V-3.6V x 2.8V x Table 4-7 RK809-1A Power up/down sequence(x:BUCK3 voltage determined by external divided resistor;LDO3 start up later than LDO1 for about 200uS ) ,Short press PWRON key time is 100ms. RK809-5A Range of output Maximum output Default Start up voltage current voltage sequence BUCK1 0.5V-2.4V 2.5A 0.9V 1 BUCK2 0.5V-2.4V 2.5A 0.9V 2 1.5A x 3 X(external divided BUCK3 resistor) Or 0.5V-2.4v(internal divided resistor) BUCK4 0.5V-3.4V 1.5A 0.5V OFF BUCK5 1.5V-3.6V 2.5A 1.8V 2 LDO1 0.6V-3.4V 400mA 0.6V OFF LDO2 0.6V-3.4V 400mA 0.9V 1 LDO3 0.6V-3.4V 100mA 0.9V 1 LDO4 0.6V-3.4V 400mA 0.6V OFF LDO5 0.6V-3.4V 400mA 3.3V 4 LDO6 0.6V-3.4V 400mA 3.3V 2 LDO7 0.6V-3.4V 400mA 1.8V 2 LDO8 0.6V-3.4V 400mA 1.8V 2 LDO9 0.6V-3.4V 400mA 0.6V OFF SWOUT1 3.3V 4 SWOUT2 3.3V 4 3.0V x VB_OK 2.8V-3.6V Copyright ©2023 Rockchip Electronics Co., Ltd. x 37 RK809 Datasheet Rev 2.3 Table 4-8 RK809-5A Power up/down sequence(x:BUCK3 voltage determined by external divided resistor;LDO3 start up later than LDO2 for about 200uS ) ,Short press PWRON key time is 100ms. RK809-6A Range of output Maximum output Default Start up voltage current voltage sequence BUCK1 0.5V-2.4V 2.5A 0.9V 2 BUCK2 0.5V-2.4V 2.5A 0.9V 2 1.5A x 4 X(external divided BUCK3 resistor) Or 0.5V-2.4v(internal divided resistor) BUCK4 0.5V-3.4V 1.5A 3.3V 5 BUCK5 1.5V-3.6V 2.5A 3.3V 1 LDO1 0.6V-3.4V 400mA 0.9V 2 LDO2 0.6V-3.4V 400mA 1.8V 3 LDO3 0.6V-3.4V 100mA 0.9V 2 LDO4 0.6V-3.4V 400mA 3.3V 5 LDO5 0.6V-3.4V 400mA 3.3V 5 LDO6 0.6V-3.4V 400mA 3.3V 5 LDO7 0.6V-3.4V 400mA 0.6V OFF LDO8 0.6V-3.4V 400mA 0.6V OFF LDO9 0.6V-3.4V 400mA 0.6V OFF SWOUT1 OFF SWOUT2 OFF VB_OK 2.8V-3.6V x 3.0V 10 Table 4-9 RK809-6A Power up/down sequence(x:BUCK3 voltage determined by external divided resistor; LDO3 start up later than LDO1 for about 200uS) ,Short press PWRON key time is 100ms. RK809-7A Range of output Maximum output Default Start up voltage current voltage sequence BUCK1 0.5V-2.4V 2.5A 0.9V 1 BUCK2 0.5V-2.4V 2.5A 0.9V 2 1.5A X 3 X(external divided BUCK3 resistor) Or 0.5V-2.4v(internal divided resistor) Copyright ©2023 Rockchip Electronics Co., Ltd. 38 RK809 Datasheet Rev 2.3 RK809-7A Range of output Maximum output Default Start up voltage current voltage sequence BUCK4 0.5V-3.4V 1.5A 0.5V OFF BUCK5 1.5V-3.6V 2.5A 3.3V 1 LDO1 0.6V-3.4V 400mA 0.6V OFF LDO2 0.6V-3.4V 400mA 0.9V 1 LDO3 0.6V-3.4V 100mA 0.6V OFF LDO4 0.6V-3.4V 400mA 0.6V OFF LDO5 0.6V-3.4V 400mA 0.6V OFF LDO6 0.6V-3.4V 400mA 3.3V 2 LDO7 0.6V-3.4V 400mA 1.8V 2 LDO8 0.6V-3.4V 400mA 1.8V 2 LDO9 0.6V-3.4V 400mA 0.6V OFF SWOUT1 OFF SWOUT2 4 VB_OK 2.8V-3.6V x 2.8V 9 Table 4-10 RK809-7A Power up/down sequence(x:BUCK3 voltage determined by external divided resistor) ,Short press PWRON key time is 100ms. 4.1.6 Sleep Description The RK809 could be set to SLEEP mode by two kinds of way. 1. Register bits 0xF4=”01”, and then Register bit 0xF4=”1”. 2. Register bits 0xF4=”01”, and then “SLEEP” pin active (the polarity can be programmed by Register bit 0XF4) When sleep mode, the power dissipation of RK809M would be decreased. Writing register bits 0xB9=”11111”, 0xB9=”1”, 0xF3=”1”, 0xE3=”1” would be decrease quiescent current further. 4.2 Power Channels 4.2.1 Buck Description The RK809 provides four high current synchronous buck converters, which deliver up to 3A, 3A, 1.5A and 1.5A, respectively. An enhanced COT architecture is used, which improves the transient response significantly. 2.5MHz switching frequency and good control method decrease the external inductance and capacitance. All output voltages can be adjusted dynamically during operation through DVS (Dynamic Voltage Scaling), which guarantees a linear and gradual voltage ramping up and down. A complete set of protection functions, such as short circuit protection, is implemented in the buck converters too. For example, the BUCK1: Vout=1V, Vin=4V, L=0.47uH, Cout=32uF. Load Current transient from 0.01A to 3A, the current slew rate is 3A/uS (using MOSFET transition). The output voltage drop when load current rising edge is about 38mV, that is very good Copyright ©2023 Rockchip Electronics Co., Ltd. 39 RK809 Datasheet Rev 2.3 characteristics. The other bucks has the same architecture with BUCK1, so they have the same load transient response characteristics. Fig. 4-8 BUCK1 load transient rising edge Fig. 4-9 BUCK1 load transient falling edge If decreasing inductance to 0.33uH and increasing output capacitance to 44uF, the load transient response characteristics would be better. Fig. 4-10 BUCK1 load transient rising edge 2 Copyright ©2023 Rockchip Electronics Co., Ltd. 40 RK809 Datasheet Rev 2.3 Fig. 4-11 BUCK1 load transient falling edge 2 Meanwhile, bucks converters have good efficiency characteristics. The test data shown as below. All channels of buck output voltage set to default. Efficiency @ Vout=1000mV 90.00% Efficiency (%) 84.00% 78.00% 3300mV PFM 72.00% 4200mV PFM 5000mV PFM 66.00% 60.00% 0 500 1000 1500 2000 2500 Load Current (mA) Fig. 4-12 BUCK1 efficiency curve when different input voltage Efficiency @ Vout=1000mV 90.00% Efficiency (%) 84.00% 78.00% 3300mV PFM 72.00% 4200mV PFM 66.00% 5000mV PFM 60.00% 0 500 1000 1500 2000 2500 Load Current (mA) Fig. 4-13 BUCK2 efficiency curve when different input voltage Copyright ©2023 Rockchip Electronics Co., Ltd. 41 RK809 Datasheet Rev 2.3 Efficiency @ Vout=1250mV 90.00% Efficiency (%) 86.00% 82.00% 3300mV 78.00% 4200mV 5000mV 74.00% 70.00% 0 500 1000 1500 Load Current (mA) Fig. 4-14 BUCK3 efficiency curve when different input voltage Efficiency @ Vout=3000mV 100.00% Efficiency (%) 96.00% 92.00% 3300mV 88.00% 4200mV 5000mV 84.00% 80.00% 0 500 1000 1500 Load Current (mA) Fig. 4-15 BUCK4 efficiency curve when different input voltage The RK809 also integrates a buck5, adopt peak current mode control, which has good performance in load transient response and efficiency. Fig. 4-16 BUCK5 efficiency curve when different input voltage,Vout=3.3V 4.2.2 LDO Description Copyright ©2023 Rockchip Electronics Co., Ltd. 42 RK809 Datasheet Rev 2.3 The RK809 also integrates nine LDOs, with 8 LDOs (LDO1, LDO2, LDO4~LDO9) capable of providing up to 400mA and one LDO3 providing maximum 100mA. The LDO3 is a low noise, high PSRR (75dB) LDO. All channels of LDO output capacitance could be 1.0uF that decreases the system cost. The parameters such as output voltage in the different operating modes can be adjusted through the I2C interface. 4.3 Battery Gas Gauge The RK809M provides an accurate battery fuel gauge. A 16-bits battery voltage ADC and a 16-bits battery current ADC are integrated in the RK809M to collect the information on the battery, such as battery voltage, etc. Using the proprietary algorithms and the information collected by the ADC, the battery fuel gauge can accurately calculate the battery capacity based on the charging/discharging characteristics of the battery preloaded in the system. The gauge then sends the battery capacity information to the processor through the I2C interface. Q 0   idt Coulomb SOC  Counter Q max Current Sense ΔQ SOC T?=ΔV/Δt main clk 1->main clk/2 PLL_OUTDIV_EN enable PLL VCO output clock divide 0:disable 1:enable PLL_VCO_BANDSEL PLL VCO working band select CODEC_APLL_CFG1 Address: Operational Base + offset (0x0043) Copyright ©2023 Rockchip Electronics Co., Ltd. 72 RK809 Datasheet Rev 2.3 Bit Attr Reset Value 7:6 RW 0x0 5:3 RW 0x0 2:0 RW 0x0 Description PLL_RES_SEL PLL filter resistor value select PLL_CUR_SEL PLL charge-pump working current select PLL_POSDIV_L3 PLL feedback clock divide value select low 3 bits CODEC_APLL_CFG2 Address: Operational Base + offset (0x0044) Bit Attr Reset Value 7:0 RW 0x30 Description PLL_POSDIV_H8 PLL feedback clock divide value select high 8 bits CODEC_APLL_CFG3 Address: Operational Base + offset (0x0045) Bit Attr Reset Value 7:0 RW 0x19 Description PLL_PREDIV_BIT PLL input clock pre-divide value select CODEC_APLL_CFG4 Address: Operational Base + offset (0x0046) Bit Attr Reset Value 7:4 RW 0x6 3:0 RW 0x5 Description PLL_OUTDIV PLL VCO output clock divide value select outdiv: 00-> divide 5 01-> divide 10 10-> divide 3 11-> divide 6 outdiv: 00-> divide 3 01-> divide 1 10-> divide 2 11-> divide 1" PLL_CLK_DIV PLL divided ratio of PLL_HIGH_clk, 0000->divded 1 and 1111->divided 15 CODEC_APLL_CFG5 Address: Operational Base + offset (0x0047) Bit Attr Reset Value 7:3 RW 0x00 2 RW 0x0 1 RW 0x0 Description RESV Reserved PLL_RESET reset the total PLL register 0:release reset 1:set reset PLL_TEST check the PLL internal VCO control voltage 0:disable 1:enable Copyright ©2023 Rockchip Electronics Co., Ltd. 73 RK809 Datasheet Rev 2.3 Bit Attr Reset Value 0 RW 0x1 Description PLL_PWD pll power down 0: PLL power up 1:PLL power down CODEC_DI2S_CKM Address: Operational Base + offset (0x0048) Bit Attr Reset Value 7:4 RW 0x0 3 RW 0x0 2 RW 0x0 1 RW 0x0 0 RW 0x1 Description SCK_DIV F(mclk2x)/F(sclk) - 1 PDM_EN I2S SDO output delta-sigma ADC 1bit data. 0:disable; 1:enable. SCK_EN i2ssclk clock enable, active in master mode. 0:disable 1:enable SCK_P sclk polarity 0: normal 1:inverted I2S_TX_MST I2S TX module as 0: slave mode 1: master mode CODEC_DI2S_RSD Address: Operational Base + offset (0x0049) Bit Attr Reset Value 7:4 RW 0x0 3 RW 0x0 2:1 RW 0x0 0 RW 0x0 Description RESV Reserved PDM_LR_SEL 0:L; 1:R SCKD_RX sclk divider for rxlrck generator 00:64 01:128 10:256(01 valid only if lrclk
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