AP-CF512MRHNS-NRK

Halogen-free & RoHS Recast Compliant CS710-CF Industrial CF Product Specifications March 17, 2021 Version 1.9 Apacer Technology Inc. 1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C Tel: +886-2-2267-8000 www.apacer.com Fax: +886-2-2267-2261 Specifications Overview:      CompactFlash Association Specification Revision 6.1 Standard Interface – ATA command set compatible – ATA transfer mode supports: PIO Mode 6, Multiword DMA Mode 4, Ultra DMA Mode 6 in True-IDE mode  – Operating: Standard: 0°C to 70°C Wide: -40°C to 85°C –  Capacity Temperature Range Storage: -40°C to 100°C Supply Voltage – 128, 256, 512 MB – 3.3V ± 5% – 1, 2, 4, 8, 16, 32, 64 GB – 5.0V ± 10% Performance*  Power Consumption* – Sequential read: Up to 55 MB/sec Operating Voltage: 3.3V – Sequential write: Up to 55 MB/sec – Active mode: 145 mA – Random read (4K): Up to 2,000 IOPS – Standby mode: 10 mA – Random write (4K): Up to 1,000 IOPS Operating Voltage: 5.0V Flash Management – Global Wear Leveling – Built-in BCH ECC capable of correcting up to 96 bits in 1KB data – Supports S.M.A.R.T commands – Flash Block Management – Flash Translation Layer: Page Mapping – Power Failure Management – Active mode: 145 mA – Standby mode: 10 mA  NAND Flash Type: SLC  MTBF: >3,000,000 hours  Connector Type –  Endurance (in Terabytes Written: TBW) 50 pins female Form Factor – 36.4mm x 42.8mm x 3.3mm – Net Weight: 9.79 g ± 5% – 128 MB: 2 TBW – 256 MB: 3 TBW – 512 MB: 7 TBW – 1 GB: 12 TBW – 2 GB: 25 TBW – 4 GB: 52 TBW  Halogen Free – 8 GB: 125 TBW  RoHS Recast Compliant – 16 GB: 192 TBW – 32 GB: 423 TBW – 64 GB: 773 TBW  Reliability – – Supply voltage power-down detection for full power-down robustness Complies with 2011/65/EU Standard *Varies from capacities. The values for performances and power consumptions presented are typical and may vary depending on flash configurations or platform settings. 1 © 2021 Apacer Technology Inc. Table of Contents 1. General Descriptions ........................................................................4 1.1 Intelligent Endurance Design ..................................................................................................... 4 1.1.1 Error Correction Code (ECC) .................................................................................................. 4 1.1.2 Global Wear Leveling ............................................................................................................. 4 1.1.3 S.M.A.R.T. Technology........................................................................................................... 4 1.1.4 Flash Block Management ....................................................................................................... 5 1.1.5 Flash Translation Layer – Page Mapping ............................................................................... 5 1.1.6 Power Failure Management.................................................................................................... 6 2. Functional Block ...............................................................................7 3. Pin Assignments ................................................................................8 4. Product Specifications ....................................................................10 4.1 Capacity ...................................................................................................................................... 10 4.2 Performance ............................................................................................................................... 10 4.3 Environmental Specifications .................................................................................................. 11 4.4 Mean Time Between Failures (MTBF) ...................................................................................... 11 4.5 Certification and Compliance ................................................................................................... 11 4.6 Endurance .................................................................................................................................. 12 5. Software Interface ..........................................................................13 5.1 CF-ATA Command Set .............................................................................................................. 13 6. Electrical Specifications.................................................................16 6.1 Operating Voltage ...................................................................................................................... 16 6.2 Power Consumption .................................................................................................................. 16 6.3 AC/DC Characteristics .............................................................................................................. 17 6.3.1 DC Characteristics ................................................................................................................ 17 6.3.2 AC Characteristics ................................................................................................................ 19 7. Physical Characteristics .................................................................23 7.1 Dimensions ................................................................................................................................ 23 7.2 Net Weight .................................................................................................................................. 23 8. Product Ordering Information .........................................................24 8.1 Product Code Designations ..................................................................................................... 24 2 © 2021 Apacer Technology Inc. 8.2 Valid Combinations ................................................................................................................... 25 3 © 2021 Apacer Technology Inc. 1. General Descriptions Apacer’s value-added Industrial CompactFlash Card offers high performance, high reliability and power-efficient storage. Regarding standard compliance, this CompactFlash Card complies with CompactFlash specification revision 6.1, supporting transfer modes up to Programmed Input Output (PIO) Mode 6, Multi-word Direct Memory Access (DMA) Mode 4, Ultra DMA Mode 6 in True-IDE Mode. Apacer’s value-added CFC provides complete PCMCIA – ATA functionality and compatibility. Apacer‘s CompactFlash technology is designed for applications in Point of Sale (POS) terminals, telecom, IP-STB, medical instruments, surveillance systems, industrial PCs and handheld applications such as the new generation of Digital Single Lens Reflex (DSLR) cameras. 1.1 Intelligent Endurance Design 1.1.1 Error Correction Code (ECC) The CompactFlash card is programmed with BCH Error Detection Code (EDC) and Error Correction Code (ECC) algorithms capable of correcting up to 96 random bits in 1KB bytes data. High performance is achieved through hardware-based error detection and correction. 1.1.2 Global Wear Leveling Flash memory devices differ from Hard Disk Drives (HDDs) in terms of how blocks are utilized. For HDDs, when a change is made to stored data, like erase or update, the controller mechanism on HDDs will perform overwrites on blocks. Unlike HDDs, flash blocks cannot be overwritten and each P/E cycle wears down the lifespan of blocks gradually. Repeatedly program/erase cycles performed on the same memory cells will eventually cause some blocks to age faster than others. This would bring flash storages to their end of service term sooner. Global Wear leveling is an important mechanism that levels out the wearing of blocks so that the wearing-down of all blocks can be almost evenly distributed. This will increase the lifespan of SSDs. 1.1.3 S.M.A.R.T. Technology S.M.A.R.T. is an acronym for Self-Monitoring, Analysis and Reporting Technology, an open standard allowing disk drives to automatically monitor their own health and report potential problems. It protects the user from unscheduled downtime by monitoring and storing critical drive performance and calibration parameters. Ideally, this should allow taking proactive actions to prevent impending drive failure. Apacer SMART feature adopts the standard SMART command B0h to read data from the drive. When the Apacer SMART Utility running on the host, it analyzes and reports the disk status to the host before the device is in critical condition. Code SMART Subcommand D0h READ DATA D1h READ ATTRIBUTE THRESHOLDS D2h Enable/Disable Attribute Autosave D4h Execute Off-line Immediate D5h Read Log (optional) D6h Write Log (optional) D8h Enable Operations 4 © 2021 Apacer Technology Inc. Code SMART Subcommand D9h Disable operations DAh Return Status General SMART attribute structure Byte Description 0 ID (Hex) 1–2 Status flag 3 Value 4 Worst 5*-11 Raw Data *Byte 5: LSB SMART attribute ID list ID (Hex) Attribute Name 12 (0x0C) Power cycle count 160 (0xA0) Initial bad block count 161 (0xA1) Bad block count 162 (0xA2) Spare block count 163 (0xA3) Max. erase count 164 (0xA4) Avg. erase count 241 (0xF1) Total LBAs written 242 (0xF2) Total LBAs read 1.1.4 Flash Block Management Current production technology is unable to guarantee total reliability of NAND flash memory array. When a flash memory device leaves factory, it comes with a minimal number of initial bad blocks during production or out-of-factory as there is no currently known technology that produce flash chips free of bad blocks. In addition, bad blocks may develop during program/erase cycles. Since bad blocks are inevitable, the solution is to keep them in control. Apacer flash devices are programmed with ECC, block mapping technique and S.M.A.R.T to reduce invalidity or error. Once bad blocks are detected, data in those blocks will be transferred to free blocks and error will be corrected by designated algorithms. 1.1.5 Flash Translation Layer – Page Mapping Page mapping is an advanced flash management technology whose essence lies in the ability to gather data, distribute the data into flash pages automatically, and then schedule the data to be evenly written. Page-level mapping uses one page as the unit of mapping. The most important characteristic is that each logical page can be mapped to any physical page on the flash memory device. This mapping algorithm allows different sizes of data to be written to a block as if the data is written to a data pool and it does not need to take extra operations to process a write command. Thus, page mapping is adopted to increase random access speed and improve SSD lifespan, reduce block erase frequency, and achieve optimized performance and lifespan. 5 © 2021 Apacer Technology Inc. 1.1.6 Power Failure Management Power Failure Management plays a crucial role when power supply becomes unstable. Power disruption may occur when users are storing data into the SSD, leading to instability in the drive. However, with Power Failure Management, a firmware protection mechanism will be activated to scan pages and blocks once power is resumed. Valid data will be transferred to new blocks for merging and the mapping table will be rebuilt. Therefore, data reliability can be reinforced, preventing damage to data stored in the NAND Flash. 6 © 2021 Apacer Technology Inc. 2. Functional Block The CompactFlash Card (CFC) includes a controller and flash media, as well as the CompactFlash standard interface. Figure 2-1 shows the functional block diagram. Figure 2-1 Functional Block Diagram 7 © 2021 Apacer Technology Inc. 3. Pin Assignments Table 3-1 lists the pin assignments with respective signal names for the 50-pin configuration. A “#” suffix indicates the active low signal. The pin type can be input, output or input/output. Table 3-1 Pin Assignments Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 Memory card mode Signal name GND D3 D4 D5 D6 D7 #CE1 A10 #OE A9 A8 A7 VCC A6 A5 A4 A3 A2 A1 A0 D0 D1 D2 WP #CD2 #CD1 D11 D12 D13 D14 D15 #CE2 #VS1 #IORD #IOWR #WE RDY/-BSY VCC #CSEL #VS2 RESET #WAIT #INPACK #REG BVD2 BVD1 Pin I/O type I/O I/O I/O I/O I/O I I I I I I I I I I I I I I/O I/O I/O O O O I/O I/O I/O I/O I/O I O I I I O I O I O O I O O I/O card mode Signal name GND D3 D4 D5 D6 D7 #CE1 A10 #OE A9 A8 A7 VCC A6 A5 A4 A3 A2 A1 A0 D0 D1 D2 #IOIS16 #CD2 #CD1 D11 D12 D13 D14 D15 #CE2 #VS1 #IORD #IOWR #WE #IREQ VCC #CSEL #VS2 RESET #WAIT #INPACK #REG #SPKR #STSCHG Pin I/O type I/O I/O I/O I/O I/O I I I I I I I I I I I I I I/O I/O I/O O O O I/O I/O I/O I/O I/O I O I I I O I O I O O I O O True IDE mode Signal name GND D3 D4 D5 D6 D7 #CS0 A101 #ATA SEL A91 A81 A71 VCC A61 A51 A41 A31 A2 A1 A0 D0 D1 D2 #IOCS16 #CD2 #CD1 D11 D12 D13 D14 D15 #CS1 #VS1 #IORD #IOWR #WE INTRQ VCC #CSEL #VS2 #RESET IORDY DMARQ2 DMACK2 #DASP #PDIAG Pin I/O type I/O I/O I/O I/O I/O I I I I I I I I I I I I I I/O I/O I/O O O O I/O I/O I/O I/O I/O I O I I I O I O I O O I I/O I/O 8 © 2021 Apacer Technology Inc. Pin No. 47 48 49 50 1. 2. Memory card mode Signal name D8 D9 D10 GND Pin I/O type I/O I/O I/O - I/O card mode Signal name D8 D9 D10 GND Pin I/O type I/O I/O I/O - True IDE mode Signal name D8 D9 D10 GND Pin I/O type I/O I/O I/O - The signal should be grounded by the host. Connection required when UDMA is in use. 9 © 2021 Apacer Technology Inc. 4. Product Specifications 4.1 Capacity Capacity specifications of the Compact Flash Card series (CFC) are available as shown in Table 4-1. It lists the specific capacity and the default numbers of heads, sectors and cylinders for each product line. Table 4-1 Capacity Specifications Capacity Total bytes* Cylinders Heads Sectors Total LBA 128 MB 127,696,896 433 16 36 249,408 256 MB 250,961,920 557 16 55 490,160 512 MB 510,787,584 1,732 16 36 997,632 1 GB 1,011,032,064 1,959 16 63 1,974,672 2 GB 2,011,226,112 3,897 16 63 3,928,176 4 GB 4,011,614,208 7,773 16 63 7,835,184 8 GB 8,012,390,400 15,525 16 63 15,649,200 16 GB 16,013,942,784 16,383 16 63 31,277,232 32 GB 32,017,047,552 16,383 16 61 62,533,296 64 GB 64,023,257,088 65,535 16 63 125,045,424 Note: Display of total bytes varies from operating systems. Cylinders, heads or sectors are not applicable for these capacities. Only LBA addressing applies. Notes: 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes. LBA count addressed in the table above indicates total user storage capacity and will remain the same throughout the lifespan of the device. However, the total usable capacity of the SSD is most likely to be less than the total physical capacity because a small portion of the capacity is reserved for device maintenance usages. 4.2 Performance Performance of the CompactFlash Card is listed in Table 4-2. Table 4-2 Performance Specifications Capacity 128 MB 256 MB 512 MB 1 GB 2 GB 4 GB 8 GB 16 GB 32 GB 64 GB Sequential Read* (MB/s) 24 28 38 55 55 55 55 55 55 55 Sequential Write* (MB/s) 4 8 16 24 42 45 44 55 55 55 Random Read IOPS** (4K) 2,000 2,000 2,000 2,000 2,000 2,000 2,000 2,000 2,000 2,000 Random Write IOPS** (4K) 90 200 400 800 1,000 1,000 1,000 1,000 1,000 1,000 Performance Note: Results may differ from various flash configurations or host system setting. *Sequential performance is based on CrystalDiskMark 5.2.1 with file size 1,000MB. **Random performance measured using IOMeter with Queue Depth 32. 10 © 2021 Apacer Technology Inc. 4.3 Environmental Specifications Environmental specifications of the Compact Flash Card are shown in Table 4-3. Table 4-3 Environmental Specifications Item Specifications Operating temp. 0°C to 70°C (Standard); -40°C to 85°C (Wide) Non-operating temp. -40°C to 100°C Operating vibration 7.69 GRMS, 20~2000 Hz/random (compliant with MIL-STD-810G) Non-operating vibration 4.02 GRMS, 15 ~ 2000 Hz/sine (compliant with MIL-STD-810G) Operating shock 50G, 11ms, half-sine wave Non-operating shock 1,500G, 0.5ms, half-sine wave 4.4 Mean Time Between Failures (MTBF) Mean Time Between Failures (MTBF) is predicted based on reliability data for the individual components in the CompactFlash card. The prediction result for the CompactFlash card is more than 3,000,000 hours. Note: The MTBF is predicated and calculated based on “Telcordia Technologies Special Report, SR332, Issue 3” method. 4.5 Certification and Compliance The CompactFlash Card complies with the following global standards:      CE FCC Halogen-free EMC RoHS Recast (2011/65/EU) 11 © 2021 Apacer Technology Inc. 4.6 Endurance The endurance of a storage device is predicted by TeraBytes Written based on several factors related to usage, such as the amount of data written into the drive, block management conditions, and daily workload for the drive. Thus, key factors, such as Write Amplifications and the number of P/E cycles, can influence the lifespan of the drive. Table 4-4 Endurance Specifications Capacity TeraBytes Written 128 MB 2 256 MB 3 512 MB 7 1 GB 12 2 GB 25 4 GB 52 8 GB 125 16 GB 192 32 GB 423 64 GB 773 Note:     This estimation complies with JEDEC JESD-219, enterprise endurance workload of sequential data with payload size distribution. Flash vendor guaranteed SLC P/E cycle: 60K WAF may vary from capacity, flash configurations and writing behavior on each platform. 1 Terabyte = 1,024 GB 12 © 2021 Apacer Technology Inc. 5. Software Interface 5.1 CF-ATA Command Set Table 5-1 summarizes the CF-ATA command set with the paragraphs that follow describing the individual commands and the task file for each. Table 5-1 CFC-ATA Command Set Command Set Command CFA Feature Set General Feature Set Code Protocol Request Sense 03h Non-data Write Sectors Without Erase 38h PIO data-out Erase Sectors C0h Non-data Write Multiple Without Erase CDh PIO data-out Translate Sector 87h PIO data-in Write Multiple w/o erase CDh PIO Write sector(s) w/o erase 38h PIO Execute Drive Diagnostic 90h Device diagnostic Flush Cache E7h Non-data Identify Device ECh PIO data-in Read DMA C8h DMA Read Multiple C4h PIO data-in Read Sector(s) 20h or 21h PIO data-in Read Verify Sector(s) 40h or 41h Non-data Set Feature EFh Non-data Set Multiple Mode C6h Non-data Write DMA CAh DMA Write Multiple C5h PIO data-out 30h or 31h PIO data-out NOP 00h Non-data Read Buffer E4h PIO data-in Write Buffer E8h PIO data-out Set Feature EFh Non-data Check Power Mode E5h or 98h Non-data Idle E3h or 97h Non-data Idle Immediate E1h or 95h Non-data Set sleep mode E6h or 99h Non-data Sleep E6h or 99h Non-data Standby E2h or 96h Non-data Write Sector(s) Power Management Feature Set 13 © 2021 Apacer Technology Inc. Command Set Command Code Protocol E0h or 94h Non-data Security Set Password F1h PIO data-out Security Unlock F2h PIO data-out Security Erase Prepare F3h Non-data Security Erase Unit F4h PIO data-out Security Freeze Lock F5h Non-data Security Disable Password F6h PIO data-out Media Lock DEh Non-data Media Unlock DFh Non-data SMART Disable Operations B0h Non-data SMART Enable/Disable Autosave B0h Non-data SMART Enable Operations B0h Non-data SMART Return Status B0h Non-data SMART Execute Off-line Immediate B0h Non-data SMART Read Data B0h PIO data-in Data Set Management 06h DMA Read Native Max Address F8h Non-data Read native max addr Ext 27h Non-data Set Max Address F9h Non-data Format Track 50h PIO data-out Initialize Drive Parameters 91h Non-data Recalibrate 1Xh Non-data Seek 7Xh Non-data Write Verify 3Ch PIO data-out Download Microcode 92h PIO data-in Download Microcode DMA 93h DMA Read Sector Ext 24h PIO data-in Read DMA Ext 25h DMA Read Multiple Ext 29h PIO data-in Write Sector Ext 34h PIO data-out Write DMA Ext 35h DMA Read Verify Sector Ext 42h Non-data Write Multiple FUA Ext CEh PIO data-out Flush Cache Ext EAh Non-data Read Log Ext 2Fh PIO Read Log DMA Ext 57h DMA Standby Immediate Security Mode Feature Set SMART Feature Set Host Protected Area Feature Set Others 48-bit Address Feature Set 14 © 2021 Apacer Technology Inc. Command Set Command Code Protocol Write DMA FUA Ext 3Dh DMA Write Log Ext 3Fh PIO Write Log DMA Ext 57h DMA Write Multiple Ext 39h PIO Set max address Ext 37h Non-data 15 © 2021 Apacer Technology Inc. 6. Electrical Specifications 6.1 Operating Voltage Table 6-1 lists the supply voltage for the CompactFlash Card. Table 6-1 Operating Range Item Range Supply voltage at 3.3V 3.135 to 3.465 V Supply voltage at 5V 4.75 to 5.25 V 6.2 Power Consumption Table 6-2 and 6-3 list the power consumption for the CompactFlash Card. Table 6-2 Power Consumption @3.3V Capacity 128 MB 256 MB 512 MB 1 GB 2 GB 4 GB 8 GB 16 GB 32 GB 64 GB Active (mA) 70 70 100 120 125 130 135 120 125 145 Standby (mA) 10 10 10 10 10 10 10 10 10 10 Mode Table 6-3 Power Consumption @5V Capacity 128 MB 256 MB 512 MB 1 GB 2 GB 4 GB 8 GB 16 GB 32 GB 64 GB Active (mA) 70 75 105 115 120 130 135 125 125 145 Standby (mA) 10 10 10 10 10 10 10 10 10 10 Mode Note: *All values are typical and may vary depending on flash configurations or host system settings. **Active power is an average power measurement performed using CrystalDiskMark with 128KB sequential read/write transfers. 16 © 2021 Apacer Technology Inc. 6.3 AC/DC Characteristics The following section provides general AC/DC characteristics of this CompactFlash card. 6.3.1 DC Characteristics    Absolute Maximum Ratings Parameter Remark Supply voltage on 3.3V supply pins Supply voltage on 1.2V supply pins Voltage on CF/PATA pins with respect to ground Voltage on flash pins with respect to ground Voltage on GPIO8..15 pins with respect to ground Voltage on other pins with respect to ground Storage temperature -0.5V to 3.63V -0.5V to 1.32V -0.5V to 6.7V -0.5V to VDDF + 0.5V -0.5V to + 0.5V -0.5V to VCC + 0.5V -40°C to 125°C DC Parameters Parameter Remark Supply Voltage VCC, AVCC Supply Voltage VDDF Supply Voltage VDDC, AVDDC Temperature (ambient) 3.30V ± 5% 3.30V ± 5%, 1.80V ± 5% 1.2V ± 5% -40°C to 85°C (industrial) General DC characteristics Symbol Parameter VIL, H VIH, H VIL VIH VOL VOH, H VOH ILI ILO IPURB33 IPURB18 IPU IPD CIO ESD Input LOW Voltage Input HIGH Voltage Input LOW Voltage Input HIGH Voltage Output LOW Voltage Output HIGH Voltage Output HIGH Voltage Input Leakage Current Output Leakage Current Pull-Up Current Pull-Up Current Pull-Up Current Pull-Down Current Input/Output Capacitance ESD Protection Min Max Unit -0.3 2.0 -0.3 0.7*VDD 0.8 5.5 0.3*VDD *VDD+0.3 0.4 V V V V V V V μA μA mA mA μA μA pF kV VCC-0.51 VDD-0.4 -5 -5 1.5 0.6 15 20 5 5 2.5 1.4 110 160 10 2 Remark CF/PATA host interface VDD is VDDF (flash IF) or VCC (other pins) at 4mA (12mA for DASP) at 6mA, CF/PATA pins at 4mA, other pins if not pull-up/pull-down if not pull-up/pull-down FnRB0..3 pins, at 3.3V FnRB0..3 pins, at 1.8V other pins HBM 17 © 2021 Apacer Technology Inc.  Operating Currents Symbol IVCC IVDDC Parameter VCC current Sleep mode Operating VDDC current Sleep mode Operating Typ Max Unit 3.0 15 4.5 85 mA mA 1 50 6 80 mA mA 8 15 0.4 25 60 0.6 mA mA mA 20 4.5 200 14.0 μA mA Remark in UDMA6 mode at 25°C at 160 MHz CPU clock at 80 MHz flash clock, typical CF card PCB VDDF current IVDDF IAVCC IAVDDC  at 1.8V at 3.3V AVCC current AVDDC current Sleep mode Operating typ for 400 MHz PLL Voltage Regulator Parameters 1.2V switching regulator (supply for VDDC) Symbol Parameter Min Typ Max Unit VI VO IO VR20 Ton LO CO ESR ESL Input voltage (CIN) Output voltage Average load current Output ripple 20 MHz BW Startup time Output filtering inductor Output filtering capacitor Output capacitor ESR Output capacitor ESL 3.00 1.15 3.30 1.20 3.60 1.25 600 15 V V mA mV μS μH μF mΩ 50 2.2 2x10 2 200 4 Remark 2 capacitors nH 1.8V linear regulator (supply for VDDF)  Symbol Parameter Min Typ Max Unit VI VO IO Ton CO ESR Input voltage (FIN) Output voltage (FOUT) Average load current Startup time Output filtering capacitor Output capacitor ESR 3.00 1.72 3.30 1.80 3.60 1.88 150 200 V V mA μS μF mΩ ESL Output capacitor ESL 4 nH 10 2.2 4 Remark SLEVCC Switchable ISO7816 Power Supply Output Parameters Symbol Parameter Min VSLE SLEVCC Output Voltage VCC -0.2 ISLE TSLE CSLE SLEVCC Output Current SLEVCC Ramp Up Time SLEVCC Output Capacitor Typ Max Unit VCC V 30 mA μS μF 10 0.1 Remark When enabled 18 © 2021 Apacer Technology Inc.  Supply Voltage Monitor Parameters Symbol Parameter Res1.2R Res3.3R Res3.3F S5VH S5VL S3V 1.2V Reset rising threshold 3.3V Reset rising threshold 3.3V Reset falling threshold 5V sense high threshold 5V sense low threshold 3.3V sense threshold Min Typ 2.23 2.15 4.31 3.01 2.84 95 2.35 2.20 4.40 3.07 2.90 Max Unit 2.47 2.25 4.49 3.13 2.96 % V V V V V Remark of 1.2V regulator output at VCC pin at VCC pin at SENSE5V pin at SENSE5V pin at SENSE3V pin The Res1.2R and Res3.3R thresholds are used by the reset logic to release the internal reset signal on a system power-on. The Res3.3L threshold is used to assert the internal reset signal on a system power down. The S3V and S5V threshold comparators generate interrupts to the firmware. The S 3V comparator normally monitors the 3.3V VCC supply, the S5V comparator normally monitors the 5V or 3.3V module supply. The S3V interrupt can be used to stop accesses to the flash memory early on a system power down event. The S5V interrupt can be used to implement a supply hold-up functionality when a backup energy source is available. In packages that do not have the SENSE3V pin, SENSE3V is internally connected to VCC. 6.3.2 AC Characteristics The AC Characteristics reference the timing diagrams of the CompactFlash Specification Revision 4.1 and the symbols in these timing diagrams. The AC characteristics are valid for a supply voltage of 3.3V ± 5%.  Attribute Memory Read and Write Characteristics See figures 25 and 26 in the CF Specification Revision 4.1. Symbol Parameter Min tc(R) ta(A) ta(CE) ta(OE) tdis(CE) tdis(OE) ten(CE) ten(OE) tv(A) tsu(A) tc(W) tw(WE) trec(WE) tsu(D-WEH) th(D) Read cycle time Address access time Card Enable access time Output Enable access time Output disable time from CE Output disable time from OE Output enable time from CE Output enable time from OE Data valid time from address change Address setup time Write cycle time Write pulse time Address hold time from WE Data setup time for WE Data hold time 250 Max 250 250 125 100 100 5 5 0 30 250 150 30 80 30 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 19 © 2021 Apacer Technology Inc.  Common Memory Read and Write Characteristics See figures 27 and 28 in the CF Specification Revision 4.1. The wait functionality is not used. Symbol Parameter tc ta(OE) tdis(OE) tsu(A) th(A) tsu(CE) th(CE) tw(WE) tsu(A) tsu(CE) tsu(D-WEH) th(D) trec(WE) Cycle time Output Enable access time Output disable time from OE Address setup time Address hold time Card Enable setup time Card Enable hold time Write pulse time Address setup time for WE Card Enable setup time for WE Data setup time for WE Data hold time Write recovery time  Min Max 80 45 45 10 10 0 10 55 10 0 30 10 15 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns I/O Access Read and Write Characteristics See figures 29 and 30 in the CF Specification Revision 4.1. The wait functionality is not used. Symbol Parameter td(IORD) th(IORD) tw(IORD) tsuA(IORD) thA(IORD) tsuCE(IORD) thCE(IORD) tsuREG(IORD) thREG(IORD) tdfINPACK(IORD) tdrINPACK(IORD) tdfIOIS16(ADR) tdrIOIS16(ADR) tsu(IOWR) th(IOWR) tw(IOWR) tsuA(IOWR) thA(IOWR) tsuCE(IOWR) thCE(IOWR) tsuREG(IOWR) thREG(IOWR) Data delay after IORD Data hold following IORD IORD pulse width Address setup time for IORD Address hold time from IORD Card Enable setup time for IORD Card Enable hold time from IORD REG setup time for IORD REG hold time from IORD INPACK delay falling from IORD INPACK delay rising from IORD IOIS16 delay falling from address IOIS16 delay rising from address Data setup time for IOWR Data hold time from IOWR IOWR pulse width Address setup time for IOWR Address hold time from IOWR Card Enable setup time for IOWR Card Enable hold time from IOWR REG setup time for IOWR REG hold time from IOWR Min 5 55 15 10 5 10 5 0 0 15 5 55 15 10 5 10 5 0 Max Unit 45 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 45 45 35 35 20 © 2021 Apacer Technology Inc.  True-IDE PIO Mode Read and Write Characteristics See figure 31 in the CF Specification Revision 4.1. The IORDY functionality is not used. Symbol Parameter t0 t1 t9 t2 t2i t5 t6 t6z t3 t4 Cycle time Address setup time for IORD/IOWR Address hold time from IORD/IOWR IORD/IOWR pulse width IORD/IOWR recovery time Data setup time for IORD Data hold following IORD Output disable time from IORD Data setup time for IOWR Data hold following IOWR  Min Max 80 10 10 55 20 10 5 20 15 5 Unit ns ns ns ns ns ns ns ns ns ns True-IDE MDMA Mode Read and Write Characteristics See figure 32 in the CF Specification Revision 4.1. Symbol Parameter tO tD tE tF tG tH tI tJ tKR, tKW tLR, tLW tM tN tZ Cycle time IORD/IOWR pulse width IORD data access Data hold following IORD Data setup time for IORD/IOWR Data hold following IOWR DMACK setup time for IORD/IOWR DMACK hold following IORD/IOWR IORD/IOWR recovery time IORD/IOWR to DMARQ delay CS0, CS1 setup for IORD/IOWR CS0, CS1 hold following IORD/IOWR Output disable time from DMACK  Min Max 80 55 45 5 10 5 0 5 20 35 5 10 25 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns True-IDE UDMA Mode Read and Write Characteristics The interface timing in the True-IDE UDMA modes is not only depending on the interface hardware, but also on the correct setup of the UDMA registers in the firmware, according to the UDMA transfer mode selected by the host. With a correct register setup, the interface timing complies to the UDMA Mode 0 to Mode 7 timing specifications of the CF Specification Revision 6.1, and to the UDMA Mode 0 to Mode 6 timing specifications of the ATA/ATAPI-7 Standard.  Toggle Mode Flash Memory Interface Characteristics The AC Characteristics for the flash memory interface are based on the F9 flash interface clock cycle time. τ is ½ of the flash interface clock cycle time configured in the preformat. In Toggle mode, the valid range for τ is 5ns to 10ns. The table lists the flash memory interface timing based on τ, valid for a load of not more than 45pF on the flash interfacepins. 21 © 2021 Apacer Technology Inc. Symbol Parameter tCALS tCALH tCS tCH tCAS tCAH tWC tWP tWH tDSC tDQSH tDQSL tDS tDH tRC tRP tREH tDQSQ tQH CLE, ALE setup time CLE, ALE hold time CE# setup time CE# hold time Data (command/address) setup time Data (command/address) hold time Write cycle time WE# low pulse width WE# high pulse width DQS cycle time DQS high time DQS low time Data output setup time to DQS Data output hold time from DQS Read cycle time RE# low pulse width RE# high pulse width DQS to input data skew Input data hold from DQS Min Typ Max 6τ–2 1.5 τ – 2 6τ–2 1.5 τ – 2 2.5 τ – 2 1.5 τ – 2 7.5 τ 4τ–2 4τ–2 2τ 0.94 τ 0.94 τ 0.5 τ – 1.5 0.5 τ – 1.5 2τ 0.94 τ 0.94 τ 0.5 τ – 1.6 0.5 τ + 0.8 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ONFI-2 Mode Flash Memory Interface Characteristics  The AC Characteristics for the flash memory interface are based on the F9 flash interface clock cycle time. τ is ½ of the flash interface clock cycle time configured in the preformat. In ONFI-2 mode, the valid range for τ is 5ns to 10ns. The table lists the flash memory binterface timing based on τ, valid for a load of not more than 45pF on the flash interface pins. Symbol Parameter Min Typ Max tCK Average clock cycle time tCKH tCKL tCALS tCALH tCS tCH tCAS tCAH tDQSS tDQSH tDQSL tDS tDH tDQSQ tQH Clock high time 0.94 τ 1.06 τ ns Clock low time 0.94 τ 1.06 τ ns ALE, CLE, W/R# setup time to CLK τ–3 ns ALE, CLE, W/R# hold time from CLK τ–3 ns 2τ Unit ns 5τ–3 ns CE# hold time from CLK τ–3 ns Data output setup time to CLK τ–3 ns Data output hold time from CLK τ–3 CE# setup time to CLK ns DQS phase 2τ–2 2τ+2 ns DQS high time 0.94 τ 1.06 τ ns DQS low time 0.94 τ 1.06 τ ns Data output setup time to DQS 0.5 τ – 1.5 Data output hold time from DQS 0.5 τ – 1.5 ns 0.5 τ – 1.6 DQS to input data skew Input data hold from DQS ns 0.5 τ + 0.8 ns ns 22 © 2021 Apacer Technology Inc. 7. Physical Characteristics 7.1 Dimensions Figure 7-1 Physical Dimensions Unit: mm 7.2 Net Weight Capacity Net Weight (g ± 5%) 128 MB 8.32 256 MB 8.32 512 MB 8.32 1 GB 8.32 2 GB 9.61 4 GB 8.32 8 GB 8.32 16 GB 8.32 32 GB 9.79 64 GB 8.32 23 © 2021 Apacer Technology Inc. 8. Product Ordering Information 8.1 Product Code Designations AP – CF xxxX R H N S – XX NR K FW Specification NR: Non-Removable Operating Temperature Blank: Standard Temperature ET: Wide Temperature Halogen Free Compliant Configuration CTL Type CFC Type R: Standard CF Capacity 128M = 128MB 256M = 256MB 512M = 512MB 001G = 1GB 002G = 2GB 004G = 4GB 008G = 8GB 016G= 16GB 032G= 32GB 064G = 64GB Model Name Apacer Product Code 24 © 2021 Apacer Technology Inc. 8.2 Valid Combinations Capacity Standard Temperature Wide Temperature 128MB AP-CF128MRHNS-NRK AP-CF128MRHNS-ETNRK 256MB AP-CF256MRHNS-NRK AP-CF256MRHNS-ETNRK 512MB AP-CF512MRHNS-NRK AP-CF512MRHNS-ETNRK 1GB AP-CF001GRHNS-NRK AP-CF001GRHNS-ETNRK 2GB AP-CF002GRHNS-NRK AP-CF002GRHNS-ETNRK 4GB AP-CF004GRHNS-NRK AP-CF004GRHNS-ETNRK 8GB AP-CF008GRHNS-NRK AP-CF008GRHNS-ETNRK 16GB AP-CF016GRHNS-NRK AP-CF016GRHNS-ETNRK 32GB AP-CF032GRHNS-NRK AP-CF032GRHNS-ETNRK 64GB AP-CF064GRHNS-NRK AP-CF064GRHNS-ETNRK Note: Valid combinations are those products in mass production or will be in mass production. Consult your Apacer sales representative to confirm availability of valid combinations and to determine availability of new combinations. 25 © 2021 Apacer Technology Inc. Revision History Revision 0.1 Description Date Preliminary release 8/10/2018 - Added Net Weight to Form Factor on Specifications Overview page 0.2 - Updated the functional block diagram at 2. Functional Block 8/15/2018 - Added 7.2 Net Weight - Updated Supply Voltage on Specifications Overview page 1.0 1.1 Official release 9/3/2018 - Updated product photo on the cover page - Added extended temperature support 10/9/2018 - Renamed extended temperature to wide temperature 1.2 - Revised SMART attribute ID list at 1.1.3 S.M.A.R.T. Technology 2/20/2019 - Renamed Power Failure Management to DataDefender at Flash Management on Specifications Overview page and 1.1.5 section and updated the technology description 1.3 1.4 Added ID 241 and 242 to SMART attribute ID list at 1.1.3 S.M.A.R.T. Technology - Replaced DataDefender with Power Failure Management at Flash Management on Specifications Overview - Updated technology description for 1.1.5 Power Failure Management 3/19/2019 4/19/2019 - Added Endurance to Specifications Overview page 1.5 - Added 4.6 Endurance 8/2/2019 - Updated technology description for 1.1.5 Power Failure Management 1.6 1.7 Revised the typo appearing in the capacity at Endurance on Specifications Overview page - Added Page Mapping to Flash Management on Specifications Overview page 8/6/2019 8/7/2019 - Added 1.1.5 Flash Translation Layer – Page Mapping 1.8 Removed VDDG from 6.3.1 DC Characteristics 8/24/2020 1.9 Updated MTBF to >3,000,000 hours on Specifications Overview page and at 4.4 Mean Time Between Failures (MTBF) 3/17/2021 26 © 2021 Apacer Technology Inc. Global Presence Taiwan (Headquarters) U.S.A. Apacer Technology Inc. 1F., No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City 236, Taiwan R.O.C. Tel: 886-2-2267-8000 Fax: 886-2-2267-2261 amtsales@apacer.com Apacer Memory America, Inc. 46732 Lakeview Blvd., Fremont, CA 94538 Tel: 1-408-518-8699 Fax: 1-510-249-9551 sa@apacerus.com Japan Europe Apacer Technology Corp. 6F, Daiyontamachi Bldg., 2-17-12, Shibaura, Minato-Ku, Tokyo, 108-0023, Japan Tel: 81-3-5419-2668 Fax: 81-3-5419-0018 jpservices@apacer.com Apacer Technology B.V. Science Park Eindhoven 5051 5692 EB Son, The Netherlands Tel: 31-40-267-0000 Fax: 31-40-290-0686 sales@apacer.nl China India Apacer Electronic (Shanghai) Co., Ltd Room D, 22/FL, No.2, Lane 600, JieyunPlaza, Tianshan RD, Shanghai, 200051, China Tel: 86-21-6228-9939 Fax: 86-21-6228-9936 sales@apacer.com.cn Apacer Technologies Pvt Ltd, 1874, South End C Cross, 9th Block Jayanagar, Bangalore-560069, India Tel: 91-80-4152-9061/62 Fax: 91-80-4170-0215 sales_india@apacer.com 27 © 2021 Apacer Technology Inc.