RoHS Compliant
Industrial Secure Digital Card
Product Specifications
March 2, 2022
Version 1.2
Apacer Technology Inc.
1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C
Tel: +886-2-2267-8000
www.apacer.com
Fax: +886-2-2267-2261
Specifications Overview:
Fully compatible with SD card standard
specification
–
SD Memory Card Specifications, Part 2,
File System Specification, Version 2.00
–
SD Memory Card Specifications, Part 3,
Security Specification, Version 2.00
–
Wide: -40°C to 85°C
–
Standard: 256, 512 MB
SDHC: 4, 8, 16, 32 GB
Storage: -40°C to 100°C
Supply Voltage
–
1, 2 GB
Operating:
Standard: 0°C to 70°C
Capacity
–
Temperature Range
SD Memory Card Specifications, Part 1,
Physical Layer Specification, Version
2.00
–
–
2.7V ~ 3.6V
Power Consumption1
–
Standby: 110 µA
–
Read: 45 mA
–
Write: 55 mA
Performance1
SD-Protocol Compatible
–
Sequential read: Up to 23 MB/sec
Supports SPI Mode
–
Sequential write: Up to 17 MB/sec
Variable Clock Rate 0-50MHz
Intelligent Endurance Design
Physical Dimensions
Flash Management
–
Built-in hardware ECC
–
Global Wear Leveling
–
Flash bad-block management
–
S.M.A.R.T.
NAND Flash Type: SLC
Endurance (in Terabytes Written: TBW)
–
256 MB: 3 TBW
–
512 MB: 6 TBW
–
1 GB: 12 TBW
–
2 GB: 24 TBW
–
4 GB: 49 TBW
–
8 GB: 98 TBW
–
16 GB: 196 TBW
–
32 GB: 383 TBW
–
24.00 x 32.00 x 2.10, unit: mm
RoHS Compliant
Note:
1. Varies from capacities. The values for performances and power consumptions presented are typical and may vary
depending on flash configurations or platform settings. The term idle refers to the standby state of the device.
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© 2022 Apacer Technology Inc.
Table of Contents
1. General Description ..........................................................................3
1.1 Functional Block .......................................................................................................................... 3
1.2 Functional Descriptions.............................................................................................................. 4
1.2.1 Flash Management ................................................................................................................. 4
1.2.2 Powerful ECC Algorithms ....................................................................................................... 4
1.2.3 Power Management ................................................................................................................ 4
1.2.4 S.M.A.R.T ............................................................................................................................... 4
2. Electrical Characteristics .................................................................5
2.1 Card Architecture ........................................................................................................................ 5
2.2 Pin Assignment ........................................................................................................................... 5
2.3 Capacity ........................................................................................................................................ 6
2.4 Performance ................................................................................................................................. 6
2.5 Endurance .................................................................................................................................... 7
2.6 DC Power Supply ......................................................................................................................... 7
2.7 Power Consumption .................................................................................................................... 7
3. Physical Characteristics ...................................................................8
3.1 Physical Dimensions ................................................................................................................... 8
3.2 Durability Specifications........................................................................................................... 10
4. DC Characteristics ..........................................................................11
4.1 SD Interface Timing (Default) ................................................................................................... 11
4.2 SD Interface Timing (High Speed Mode) ................................................................................. 12
4.3 SD Interface Timing (SDR12, SDR25, SDR50 and SDR104 Modes) Input ............................ 14
4.3.1 Clock Timing ......................................................................................................................... 14
4.3.2 Card Input Timing ................................................................................................................. 14
4.3.3 Card Output Timing of Fixed Data Window (SDR12, SDR25 and SDR50) ......................... 15
4.3.4 Output Timing of Variable Window (SDR104) ...................................................................... 15
4.3.5 SD Interface Timing (DDR50 Mode) ..................................................................................... 16
4.3.6 Bus Timings – Parameters Values (DDR50 Mode) .............................................................. 17
5. Product Ordering Information .........................................................18
5.1 Product Code Designations ..................................................................................................... 18
5.2 Valid Combinations ................................................................................................................... 19
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© 2022 Apacer Technology Inc.
1. General Description
As the demand of reliable and high-performance data storage in a small form factor increases,
Apacer’s embedded SD card is designed specifically for rigorous applications by offering maximum
endurance, reliability, and agility, where extreme traceability, enhanced data integrity, and
exceptionally velocity are required.
1.1 Functional Block
The embedded SD contains a flash controller and flash media with SD standard interface.
SD Interface
Flash Array
Clock
Command
Data x4
SD flash
controller
Media
Flash
Media
Flash
Power
input
Figure 1-1 Functional Block Diagram
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1.2 Functional Descriptions
1.2.1 Flash Management
The SD controller contains logic/physical flash block mapping and bad block management system. It
will manage all flash block include user data space and spare block.
The embedded SD also contains a sophisticated defect and error management system. It does a read
after write under margin conditions to verify that the data is written correctly (except in the case of
write pre-erased sectors). In case that a bit is found to be defective, the embedded SD replaces this
bad bit with a spare bit within the sector header. If necessary, the embedded SD will even replace the
entire sector with a spare sector. This is completely transparent to the master (host device) and does
not consume any user data space.
1.2.2 Powerful ECC Algorithms
The powerful ECC algorithms will enhance flash block use rate and whole device life. The SD
controller has an innovative algorithm to recover the data. Built-in BCH-ECC supports correction up to
24 bits data error per 1K bytes data automatically
1.2.3 Power Management
A power saving feature of the embedded SD is automatic entrance and exit from sleep mode. Upon
completion of an operation, the embedded SD will enter the sleep mode to conserve power if no
further commands are received within X seconds, where X is programmable by software. The master
does not have to take any action for this to occur. The embedded SD is in sleep mode except when
the host is accessing it, thus conserving power.
Any command issued by the master to the embedded SD will cause it to exit sleep mode and
response to the master.
1.2.4 S.M.A.R.T
S.M.A.R.T. (SMART), an acronym stands for Self-Monitoring, Analysis and Reporting Technology, is
an open standard allowing an individual disk drive in the ATA/IDE or SCSI interface to automatically
monitor its own health and report potential problems in order to prevent data loss. This failure warning
technology provides predictions from unscheduled downtime by observing and storing critical drive
performance and calibration parameters. Ideally, this should allow taking hands-on actions to keep
from impending drive failure.
Failures are divided into two categories: those that can be predicted and those that cannot.
Predictable failures occur gradually over time, and the decline in performance can be detected; on the
other hand, unpredictable failures happen very sudden without any warning. These failures may be
caused by power surges or related to electronic components. The purpose of the SMART
implementation is to predict near-term failures of each individual disk drive and generate a warning to
prevent unfortunate loss.
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2. Electrical Characteristics
2.1 Card Architecture
Write Protected
Write Enabled
1
2
3
4
5
6
1
7 8
2
3
4
5
6
7 8
9
9
WP
WP
Figure 2-1 Card Architecture
2.2 Pin Assignment
Table 2-1 Pin Assignments
SD Mode
SPI Mode
Pin
Name
Description
Name
Description
1
CD/DAT3
Card detect/Data line[Bit 3]
CS
Chip select
2
CMD
Command/Response
DI
Data in
3
VSS1
Supply voltage ground
VSS
Supply voltage ground
4
VDD
Supply voltage
VDD
Supply voltage
5
CLK
Clock
SCLK
Clock
6
VSS2
Supply voltage ground
VSS2
Supply voltage ground
7
DAT0
Data line[Bit 0]
DO
Data out
8
DAT1
Data line[Bit 1]
Reserved
9
DAT2
Data line[Bit 2]
Reserved
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© 2022 Apacer Technology Inc.
2.3 Capacity
Capacity specifications of the SD card are available as shown in Table 2-2.
Table 2-2 Capacity Specifications
Capacity
Total (LBA) Sectors
Total Partition
Sectors
User Data Sectors
User Data Bytes
256 MB
499,712
499,611
499,456
255,721,472
512 MB
985,088
984,851
984,576
504,102,912
1 GB
2,000,896
2,000,651
2,000,128
1,024,065,536
2 GB
4,009,984
4,009,739
4,009,216
2,052,718,592
4 GB
8,019,968
8,011,776
8,003,584
4,097,835,008
8 GB
16,039,936
16,031,744
16,023,552
8,204,025,856
16 GB
31,719,424
31,711,232
31,703,040
16,231,923,712
32 GB
63,438,848
63,430,656
63,414,272
32,468,074,496
Note: The statistics may vary depending on file systems of various OS. User data bytes do not indicate total useable bytes.
LBA count addressed in the table above indicates total user storage capacity and will remain the same throughout the lifespan
of the device. However, the total usable capacity of the SD is most likely to be less than the total physical capacity because a
small portion of the capacity is reserved for device maintenance usages.
2.4 Performance
Performance of the SD card is listed below in Table 2-3.
Table 2-3 Performance Specifications
Capacity
256
MB
512
MB
1 GB
2 GB
4 GB
8 GB
16 GB
32 GB
Sequential Read (MB/s)
22
23
23
23
23
23
23
23
Sequential Write (MB/s)
11
17
17
18
17
17
16
17
Performance
Notes:
Results may differ from various flash configurations or host system setting.
Sequential read/write is based on CrystalDiskMark 5.2.1 with file size 1,000MB.
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© 2022 Apacer Technology Inc.
2.5 Endurance
The endurance of a storage device is predicted by TeraBytes Written based on several factors related
to usage, such as the amount of data written into the drive, block management conditions, and daily
workload for the drive. Thus, key factors, such as Write Amplifications and the number of P/E cycles,
can influence the lifespan of the drive.
Table 2-4 Endurance Specifications
Capacity
TeraBytes Written
256 MB
3
512 MB
6
1 GB
12
2 GB
24
4 GB
49
8 GB
98
16 GB
196
32 GB
383
Notes:
The measurement assumes the data written to the SSD for test is under a typical and constant rate.
The measurement follows the standard metric: 1 TB (Terabyte) = 1,000 GB.
2.6 DC Power Supply
Table 2-5 DC Power Supply
Symbol
Parameter
Min.
Typ.
Max.
Unit
VDD
Power Supply Voltage
2.7
3.3
3.6
V
2.7 Power Consumption
Table 2-6 Power Consumption
Mode
Value
Unit
Condition
Standby
110
µA
Typical
Read
45
mA
Typical
Write
55
mA
Typical
Notes:
All values are typical and may vary depending on flash configurations or host system settings.
Active power is an average power measurement performed using CrystalDiskMark with 128KB sequential read/write
transfers.
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© 2022 Apacer Technology Inc.
3. Physical Characteristics
3.1 Physical Dimensions
Table 3-1 Mechanical Specifications
Item
Dimensions Card Package
Thickness
Surface
Edges
Dimensions
24 ㎜ x 32 ㎜
Min. 23.9 ㎜ x 31.9 ㎜
Max. 24.1 ㎜ x 32.1 ㎜
2.1 ㎜ ± 0.15 ㎜
Plain (except contact area)
Smooth edges
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© 2022 Apacer Technology Inc.
Figure 3-1 Dimensions
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© 2022 Apacer Technology Inc.
3.2 Durability Specifications
Table 3-2 Durability Specifications
Item
Temperature
Specifications
0°C to 70°C (Standard)
-40°C to 85°C (Wide)
-40°C to 100°C (Storage)
Shock
1,500G, 0.5ms
Vibration
20Hz~80Hz/1.52mm (frequency/displacement)
80Hz~2000Hz/20G (frequency/displacement)
X, Y, Z axis/60mins each
Drop
1.5m free fall, 6 surfaces of each
Bending
≧ 10N, hold 1min/5times
Torque
0.15N-m or 2.5deg, hold 30 seconds/ 5 times
Salt spray
Concentration: 3% NaCl at 35°C (storage for 24 hours)
Waterproof
JIS IPX7 compliance, Water temperature 25°C
Water depth: the lowest point of unit is locating 1000mm below surface
(storage for 30 mins)
X-Ray Exposure
0.1 Gy of medium-energy radiation
(70 KeV to 140 KeV, cumulative dose per year) to both sides of the
card ;storage for 30 mins)
Switch cycle
0.4~0.5N, 1000 times
Durability
10,000 times mating cycle
ESD
Contact: +/-4KV each item 25 times
Air: +/-8KV 10 times
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4. DC Characteristics
4.1 SD Interface Timing (Default)
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© 2022 Apacer Technology Inc.
SYMBOL
PARAMETER
MIN
MAX
UNIT
REMARK
Clock CLK (All values are referred to min(VIH) and max(VIL))
fPP
Clock frequency data transfer
0
25
MHz
fOD
Clock frequency identification
0(1)/100
400
KHz
tWL
Clock low time
10
-
ns
tWH
Clock high time
10
-
ns
tTLH
Clock rise time
-
10
ns
tTHL
Clock fall time
-
10
ns
Ccard ≤ 10 pF
(1 card)
Ccard ≤ 10 pF
(1 card)
Ccard ≤ 10 pF
(1 card)
Ccard ≤ 10 pF
(1 card)
Ccard ≤ 10 pF
(1 card)
Ccard ≤ 10 pF
(1 card)
Inputs CMD, DAT (Referenced to CLK)
tISU
Input setup time
5
-
ns
tTH
Input hold time
5
-
ns
Ccard ≤ 10 pF
(1 card)
Ccard ≤ 10 pF
(1 card)
Outputs CMD, DAT (Referenced to CLK)
tODLY
Output delay time during data transfer
mode
0
14
ns
CL ≤ 40 pF
(1 card)
tOH
Output hold time
0
50
ns
CL ≤ 40 pF
(1 card)
(1)0Hz means to stop the clock. The given minimum frequency range is for cases that require the clock to be continued.
4.2 SD Interface Timing (High Speed Mode)
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© 2022 Apacer Technology Inc.
SYMBOL
PARAMETER
MIN
MAX
UNIT
REMARK
Clock CLK (All values are referred to min(VIH) and max(VIL))
fPP
Clock frequency data transfer
0
50
MHz
tWL
Clock low time
7
-
ns
tWH
Clock high time
7
-
ns
tTLH
Clock rise time
-
3
ns
tTHL
Clock fall time
-
3
ns
Ccard ≤ 10 pF
(1 card)
Ccard ≤ 10 pF
(1 card)
Ccard ≤ 10 pF
(1 card)
Ccard ≤ 10 pF
(1 card)
Ccard ≤ 10 pF
(1 card)
Inputs CMD, DAT (Referenced to CLK)
tISU
Input setup time
6
-
ns
tTH
Input hold time
2
-
ns
tODLY
Outputs CMD, DAT (Referenced to CLK)
Output delay time during data transfer
14
made
ns
tOH
Output hold time
2.5
-
ns
CL
Total system capacitance for each line*
-
40
pF
Ccard ≤ 10 pF
(1 card)
Ccard ≤ 10 pF
(1 card)
CL ≤ 40 pF
(1 card)
CL ≥ 15 pF
(1 card)
1 card
*In order to satisfy severe timing, host shall run on only one card
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4.3 SD Interface Timing (SDR12, SDR25, SDR50 and SDR104 Modes)
Input
4.3.1 Clock Timing
SYMBOL
MIN
MAX
UNIT
tCLK
4.8
-
ns
REMARK
208MHz (Max.), Between rising edge, VCT = 0.975V
tCR, tCF < 2.00ns (max.) at 208MHz, CCARD=10pF
tCR, tCF
-
0.2* tCLK
ns
Clock Duty
30
70
%
tCR, tCF < 2.00ns (max.) at 100MHz, CCARD=10pF
The absolute maximum value of tCR, tCF is 10ns
regardless of clock frequency.
4.3.2 Card Input Timing
SDR104 MODE
SYMBOL
MIN
MAX
UNIT
tIS
1.40
-
ns
CCARD = 10pF, VCT = 0.975V
tIH
0.80
-
ns
CCARD = 5pF, VCT = 0.975V
SYMBOL
MIN
MAX
UNIT
tIS
3.00
-
ns
CCARD = 10pF, VCT = 0.975V
tIH
0.80
-
ns
CCARD = 5pF, VCT = 0.975V
SDR12, SDR25 and SDR50 MODES
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4.3.3 Card Output Timing of Fixed Data Window (SDR12, SDR25 and SDR50)
SYMBOL
tODLY
MIN
-
tODLY
tOH
1.5
MAX
UNIT
7.5
ns
14
ns
-
ns
REMARK
tCLK ≥10.0ns, CL=30pF, using driver Type B,
for SDR50.
tCLK ≥20.0ns, CL=40pF, using driver Type B,
for SDR25 and SDR12.
Hold time at the tODLY (min.). CL=15pF
4.3.4 Output Timing of Variable Window (SDR104)
SYMBOL
MIN
MAX
UNIT
tOP
-
2
UI
△tOP
-350
tODW
0.60
+1550
-
ps
UI
REMARK
Card Output Phase
Delay variation due to temperature change after
tuning
tODW = 2.88ns at 208MHz
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4.3.5 SD Interface Timing (DDR50 Mode)
SYMBOL
tCLK
MIN
20
MAX
-
UNIT
ns
tCR, tCF
-
0.2* tCLK
ns
Clock Duty
45
55
%
REMARK
50MHz (Max.), Between rising edge
tCR, tCF < 4.00ns (max.) at 50MHz,
CCARD=10pF
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4.3.6 Bus Timings – Parameters Values (DDR50 Mode)
Symbol
Parameters
tISU
Input set-up time
6
-
ns
tIH
Input hold time
0.8
-
ns
tODLY
TOH
Min
Max
Unit
Input CMD (referenced to CLK rising edge)
Output CMD (referenced to CLK rising edge)
Output Delay time during
13.7
ns
Data Transfer Mode
Output Hold time
1.5
-
ns
Remark
Ccard≤ 10 pF
(1 card)
Ccard≤ 10 pF
(1 card)
CL≤ 30 pF
(1 card)
CL≥ 15 pF
(1 card)
Inputs DAT (referenced to CLK rising and falling edges)
tISU2x
Input set-up time
3
-
ns
tIH2x
Input hold time
0.8
-
ns
tODLY2x
TOH2x
Ccard≤ 10 pF
(1 card)
Ccard≤ 10 pF
(1 card)
Outputs DAT (referenced to CLK rising and falling edges)
Output Delay time during
CL≤ 25 pF
7.0
ns
Data Transfer Mode
(1 card)
CL≥ 15 pF
Output Hold time
1.5
ns
(1 card)
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© 2022 Apacer Technology Inc.
5. Product Ordering Information
Apacer’s SD card is available in different configurations and densities. See the chart below for a
comprehensive list of options for the SD card series devices.
5.1 Product Code Designations
AP – ISD xxX X X x X – xX T
Flash Type
T: Toshiba SLC
Version Control
CTL Solution
Speed
2: Standard SD
4: SDHC
Configuration
S: Single Chip
D: Dual Chips
Temperature
C: Standard Temperature
I: Wide Temperature
Capacity
256 = 256MB
512 = 512MB
01G = 1GB
02G = 2GB
04G = 4GB
08G = 8GB
16G = 16GB
32G = 32GB
Model Name
Apacer Product Code
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© 2022 Apacer Technology Inc.
5.2 Valid Combinations
The following table lists the available models of the SD card series which are in mass production or
will be in mass production. Consult your Apacer sales representative to confirm availability of valid
combinations and to determine availability of new combinations.
Capacity
Standard Temperature
Wide Temperature
256 MB
AP-ISD256MCC-1AT
AP-ISD256MIC-1AT
512 MB
AP-ISD512CS2A-8T
AP-ISD512IS2B-8T
1 GB
AP-ISD01GCS2A-8T
AP-ISD01GIS2B-8T
2 GB
AP-ISD02GCS2A-8T
AP-ISD02GIS2B-8T
4 GB
AP-ISD04GCS4A-8T
AP-ISD04GIS4B-8T
8 GB
AP-ISD08GCD4A-8T
AP-ISD08GID4B-8T
16 GB
AP-ISD16GCD4A-8T
AP-ISD16GID4B-8T
32 GB
AP-ISD32GCD4A-8T
AP-ISD32GID4B-8T
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© 2022 Apacer Technology Inc.
Revision History
Revision
Description
Date
1.0
Official release
2/25/2017
1.1
Added endurance rating for 32GB at Endurance on
Specifications Overview and 2.5 Endurance
4/19/2018
1.2
Updated 5.1 Product Code Designations by changing version
control code and 5.2 Valid Combinations by changing valid
combination for 256MB
3/2/2022
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© 2022 Apacer Technology Inc.
Global Presence
Taiwan (Headquarters)
U.S.A.
Apacer Technology Inc.
1F., No.32, Zhongcheng Rd., Tucheng Dist.,
New Taipei City 236, Taiwan R.O.C.
Tel: 886-2-2267-8000
Fax: 886-2-2267-2261
amtsales@apacer.com
Apacer Memory America, Inc.
46732 Lakeview Blvd., Fremont, CA 94538
Tel: 1-408-518-8699
Fax: 1-510-249-9551
sa@apacerus.com
Japan
Europe
Apacer Technology Corp.
6F, Daiyontamachi Bldg., 2-17-12, Shibaura, Minato-Ku,
Tokyo, 108-0023, Japan
Tel: 81-3-5419-2668
Fax: 81-3-5419-0018
jpservices@apacer.com
Apacer Technology B.V.
Science Park Eindhoven 5051 5692 EB Son,
The Netherlands
Tel: 31-40-267-0000
Fax: 31-40-290-0686
sales@apacer.nl
China
India
Apacer Electronic (Shanghai) Co., Ltd
Room D, 22/FL, No.2, Lane 600, JieyunPlaza,
Tianshan RD, Shanghai, 200051, China
Tel: 86-21-6228-9939
Fax: 86-21-6228-9936
sales@apacer.com.cn
Apacer Technologies Pvt Ltd,
Unit No.201, “Brigade Corner”, 7th Block
Jayanagar,
Yediyur Circle, Bangalore – 560082, India
Tel: 91-80-4152-9061
Fax: 91-80-4170-0215
sales_india@apacer.com
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