AP-ISD256MIC-1AT

RoHS Compliant Industrial Secure Digital Card Product Specifications March 2, 2022 Version 1.2 Apacer Technology Inc. 1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C Tel: +886-2-2267-8000 www.apacer.com Fax: +886-2-2267-2261 Specifications Overview:  Fully compatible with SD card standard specification –  SD Memory Card Specifications, Part 2, File System Specification, Version 2.00 – SD Memory Card Specifications, Part 3, Security Specification, Version 2.00 – Wide: -40°C to 85°C –  Standard: 256, 512 MB  SDHC: 4, 8, 16, 32 GB Storage: -40°C to 100°C Supply Voltage – 1, 2 GB  Operating: Standard: 0°C to 70°C  Capacity – Temperature Range SD Memory Card Specifications, Part 1, Physical Layer Specification, Version 2.00 – –  2.7V ~ 3.6V Power Consumption1 – Standby: 110 µA – Read: 45 mA – Write: 55 mA Performance1  SD-Protocol Compatible – Sequential read: Up to 23 MB/sec  Supports SPI Mode – Sequential write: Up to 17 MB/sec  Variable Clock Rate 0-50MHz  Intelligent Endurance Design  Physical Dimensions Flash Management – Built-in hardware ECC – Global Wear Leveling – Flash bad-block management – S.M.A.R.T.   NAND Flash Type: SLC  Endurance (in Terabytes Written: TBW) – 256 MB: 3 TBW – 512 MB: 6 TBW – 1 GB: 12 TBW – 2 GB: 24 TBW – 4 GB: 49 TBW – 8 GB: 98 TBW – 16 GB: 196 TBW – 32 GB: 383 TBW – 24.00 x 32.00 x 2.10, unit: mm RoHS Compliant Note: 1. Varies from capacities. The values for performances and power consumptions presented are typical and may vary depending on flash configurations or platform settings. The term idle refers to the standby state of the device. 1 © 2022 Apacer Technology Inc. Table of Contents 1. General Description ..........................................................................3 1.1 Functional Block .......................................................................................................................... 3 1.2 Functional Descriptions.............................................................................................................. 4 1.2.1 Flash Management ................................................................................................................. 4 1.2.2 Powerful ECC Algorithms ....................................................................................................... 4 1.2.3 Power Management ................................................................................................................ 4 1.2.4 S.M.A.R.T ............................................................................................................................... 4 2. Electrical Characteristics .................................................................5 2.1 Card Architecture ........................................................................................................................ 5 2.2 Pin Assignment ........................................................................................................................... 5 2.3 Capacity ........................................................................................................................................ 6 2.4 Performance ................................................................................................................................. 6 2.5 Endurance .................................................................................................................................... 7 2.6 DC Power Supply ......................................................................................................................... 7 2.7 Power Consumption .................................................................................................................... 7 3. Physical Characteristics ...................................................................8 3.1 Physical Dimensions ................................................................................................................... 8 3.2 Durability Specifications........................................................................................................... 10 4. DC Characteristics ..........................................................................11 4.1 SD Interface Timing (Default) ................................................................................................... 11 4.2 SD Interface Timing (High Speed Mode) ................................................................................. 12 4.3 SD Interface Timing (SDR12, SDR25, SDR50 and SDR104 Modes) Input ............................ 14 4.3.1 Clock Timing ......................................................................................................................... 14 4.3.2 Card Input Timing ................................................................................................................. 14 4.3.3 Card Output Timing of Fixed Data Window (SDR12, SDR25 and SDR50) ......................... 15 4.3.4 Output Timing of Variable Window (SDR104) ...................................................................... 15 4.3.5 SD Interface Timing (DDR50 Mode) ..................................................................................... 16 4.3.6 Bus Timings – Parameters Values (DDR50 Mode) .............................................................. 17 5. Product Ordering Information .........................................................18 5.1 Product Code Designations ..................................................................................................... 18 5.2 Valid Combinations ................................................................................................................... 19 2 © 2022 Apacer Technology Inc. 1. General Description As the demand of reliable and high-performance data storage in a small form factor increases, Apacer’s embedded SD card is designed specifically for rigorous applications by offering maximum endurance, reliability, and agility, where extreme traceability, enhanced data integrity, and exceptionally velocity are required. 1.1 Functional Block The embedded SD contains a flash controller and flash media with SD standard interface. SD Interface Flash Array Clock Command Data x4 SD flash controller Media Flash Media Flash Power input Figure 1-1 Functional Block Diagram 3 © 2022 Apacer Technology Inc. 1.2 Functional Descriptions 1.2.1 Flash Management The SD controller contains logic/physical flash block mapping and bad block management system. It will manage all flash block include user data space and spare block. The embedded SD also contains a sophisticated defect and error management system. It does a read after write under margin conditions to verify that the data is written correctly (except in the case of write pre-erased sectors). In case that a bit is found to be defective, the embedded SD replaces this bad bit with a spare bit within the sector header. If necessary, the embedded SD will even replace the entire sector with a spare sector. This is completely transparent to the master (host device) and does not consume any user data space. 1.2.2 Powerful ECC Algorithms The powerful ECC algorithms will enhance flash block use rate and whole device life. The SD controller has an innovative algorithm to recover the data. Built-in BCH-ECC supports correction up to 24 bits data error per 1K bytes data automatically 1.2.3 Power Management A power saving feature of the embedded SD is automatic entrance and exit from sleep mode. Upon completion of an operation, the embedded SD will enter the sleep mode to conserve power if no further commands are received within X seconds, where X is programmable by software. The master does not have to take any action for this to occur. The embedded SD is in sleep mode except when the host is accessing it, thus conserving power. Any command issued by the master to the embedded SD will cause it to exit sleep mode and response to the master. 1.2.4 S.M.A.R.T S.M.A.R.T. (SMART), an acronym stands for Self-Monitoring, Analysis and Reporting Technology, is an open standard allowing an individual disk drive in the ATA/IDE or SCSI interface to automatically monitor its own health and report potential problems in order to prevent data loss. This failure warning technology provides predictions from unscheduled downtime by observing and storing critical drive performance and calibration parameters. Ideally, this should allow taking hands-on actions to keep from impending drive failure. Failures are divided into two categories: those that can be predicted and those that cannot. Predictable failures occur gradually over time, and the decline in performance can be detected; on the other hand, unpredictable failures happen very sudden without any warning. These failures may be caused by power surges or related to electronic components. The purpose of the SMART implementation is to predict near-term failures of each individual disk drive and generate a warning to prevent unfortunate loss. 4 © 2022 Apacer Technology Inc. 2. Electrical Characteristics 2.1 Card Architecture Write Protected Write Enabled 1 2 3 4 5 6 1 7 8 2 3 4 5 6 7 8 9 9 WP WP Figure 2-1 Card Architecture 2.2 Pin Assignment Table 2-1 Pin Assignments SD Mode SPI Mode Pin Name Description Name Description 1 CD/DAT3 Card detect/Data line[Bit 3] CS Chip select 2 CMD Command/Response DI Data in 3 VSS1 Supply voltage ground VSS Supply voltage ground 4 VDD Supply voltage VDD Supply voltage 5 CLK Clock SCLK Clock 6 VSS2 Supply voltage ground VSS2 Supply voltage ground 7 DAT0 Data line[Bit 0] DO Data out 8 DAT1 Data line[Bit 1] Reserved 9 DAT2 Data line[Bit 2] Reserved 5 © 2022 Apacer Technology Inc. 2.3 Capacity Capacity specifications of the SD card are available as shown in Table 2-2. Table 2-2 Capacity Specifications Capacity Total (LBA) Sectors Total Partition Sectors User Data Sectors User Data Bytes 256 MB 499,712 499,611 499,456 255,721,472 512 MB 985,088 984,851 984,576 504,102,912 1 GB 2,000,896 2,000,651 2,000,128 1,024,065,536 2 GB 4,009,984 4,009,739 4,009,216 2,052,718,592 4 GB 8,019,968 8,011,776 8,003,584 4,097,835,008 8 GB 16,039,936 16,031,744 16,023,552 8,204,025,856 16 GB 31,719,424 31,711,232 31,703,040 16,231,923,712 32 GB 63,438,848 63,430,656 63,414,272 32,468,074,496 Note: The statistics may vary depending on file systems of various OS. User data bytes do not indicate total useable bytes. LBA count addressed in the table above indicates total user storage capacity and will remain the same throughout the lifespan of the device. However, the total usable capacity of the SD is most likely to be less than the total physical capacity because a small portion of the capacity is reserved for device maintenance usages. 2.4 Performance Performance of the SD card is listed below in Table 2-3. Table 2-3 Performance Specifications Capacity 256 MB 512 MB 1 GB 2 GB 4 GB 8 GB 16 GB 32 GB Sequential Read (MB/s) 22 23 23 23 23 23 23 23 Sequential Write (MB/s) 11 17 17 18 17 17 16 17 Performance Notes:  Results may differ from various flash configurations or host system setting.  Sequential read/write is based on CrystalDiskMark 5.2.1 with file size 1,000MB. 6 © 2022 Apacer Technology Inc. 2.5 Endurance The endurance of a storage device is predicted by TeraBytes Written based on several factors related to usage, such as the amount of data written into the drive, block management conditions, and daily workload for the drive. Thus, key factors, such as Write Amplifications and the number of P/E cycles, can influence the lifespan of the drive. Table 2-4 Endurance Specifications Capacity TeraBytes Written 256 MB 3 512 MB 6 1 GB 12 2 GB 24 4 GB 49 8 GB 98 16 GB 196 32 GB 383 Notes:  The measurement assumes the data written to the SSD for test is under a typical and constant rate.  The measurement follows the standard metric: 1 TB (Terabyte) = 1,000 GB. 2.6 DC Power Supply Table 2-5 DC Power Supply Symbol Parameter Min. Typ. Max. Unit VDD Power Supply Voltage 2.7 3.3 3.6 V 2.7 Power Consumption Table 2-6 Power Consumption Mode Value Unit Condition Standby 110 µA Typical Read 45 mA Typical Write 55 mA Typical Notes:  All values are typical and may vary depending on flash configurations or host system settings.  Active power is an average power measurement performed using CrystalDiskMark with 128KB sequential read/write transfers. 7 © 2022 Apacer Technology Inc. 3. Physical Characteristics 3.1 Physical Dimensions Table 3-1 Mechanical Specifications Item Dimensions Card Package Thickness Surface Edges Dimensions 24 ㎜ x 32 ㎜ Min. 23.9 ㎜ x 31.9 ㎜ Max. 24.1 ㎜ x 32.1 ㎜ 2.1 ㎜ ± 0.15 ㎜ Plain (except contact area) Smooth edges 8 © 2022 Apacer Technology Inc. Figure 3-1 Dimensions 9 © 2022 Apacer Technology Inc. 3.2 Durability Specifications Table 3-2 Durability Specifications Item Temperature Specifications 0°C to 70°C (Standard) -40°C to 85°C (Wide) -40°C to 100°C (Storage) Shock 1,500G, 0.5ms Vibration 20Hz~80Hz/1.52mm (frequency/displacement) 80Hz~2000Hz/20G (frequency/displacement) X, Y, Z axis/60mins each Drop 1.5m free fall, 6 surfaces of each Bending ≧ 10N, hold 1min/5times Torque 0.15N-m or 2.5deg, hold 30 seconds/ 5 times Salt spray Concentration: 3% NaCl at 35°C (storage for 24 hours) Waterproof JIS IPX7 compliance, Water temperature 25°C Water depth: the lowest point of unit is locating 1000mm below surface (storage for 30 mins) X-Ray Exposure 0.1 Gy of medium-energy radiation (70 KeV to 140 KeV, cumulative dose per year) to both sides of the card ;storage for 30 mins) Switch cycle 0.4~0.5N, 1000 times Durability 10,000 times mating cycle ESD Contact: +/-4KV each item 25 times Air: +/-8KV 10 times 10 © 2022 Apacer Technology Inc. 4. DC Characteristics 4.1 SD Interface Timing (Default) 11 © 2022 Apacer Technology Inc. SYMBOL PARAMETER MIN MAX UNIT REMARK Clock CLK (All values are referred to min(VIH) and max(VIL)) fPP Clock frequency data transfer 0 25 MHz fOD Clock frequency identification 0(1)/100 400 KHz tWL Clock low time 10 - ns tWH Clock high time 10 - ns tTLH Clock rise time - 10 ns tTHL Clock fall time - 10 ns Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) Inputs CMD, DAT (Referenced to CLK) tISU Input setup time 5 - ns tTH Input hold time 5 - ns Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) Outputs CMD, DAT (Referenced to CLK) tODLY Output delay time during data transfer mode 0 14 ns CL ≤ 40 pF (1 card) tOH Output hold time 0 50 ns CL ≤ 40 pF (1 card) (1)0Hz means to stop the clock. The given minimum frequency range is for cases that require the clock to be continued. 4.2 SD Interface Timing (High Speed Mode) 12 © 2022 Apacer Technology Inc. SYMBOL PARAMETER MIN MAX UNIT REMARK Clock CLK (All values are referred to min(VIH) and max(VIL)) fPP Clock frequency data transfer 0 50 MHz tWL Clock low time 7 - ns tWH Clock high time 7 - ns tTLH Clock rise time - 3 ns tTHL Clock fall time - 3 ns Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) Inputs CMD, DAT (Referenced to CLK) tISU Input setup time 6 - ns tTH Input hold time 2 - ns tODLY Outputs CMD, DAT (Referenced to CLK) Output delay time during data transfer 14 made ns tOH Output hold time 2.5 - ns CL Total system capacitance for each line* - 40 pF Ccard ≤ 10 pF (1 card) Ccard ≤ 10 pF (1 card) CL ≤ 40 pF (1 card) CL ≥ 15 pF (1 card) 1 card *In order to satisfy severe timing, host shall run on only one card 13 © 2022 Apacer Technology Inc. 4.3 SD Interface Timing (SDR12, SDR25, SDR50 and SDR104 Modes) Input 4.3.1 Clock Timing SYMBOL MIN MAX UNIT tCLK 4.8 - ns REMARK 208MHz (Max.), Between rising edge, VCT = 0.975V tCR, tCF < 2.00ns (max.) at 208MHz, CCARD=10pF tCR, tCF - 0.2* tCLK ns Clock Duty 30 70 % tCR, tCF < 2.00ns (max.) at 100MHz, CCARD=10pF The absolute maximum value of tCR, tCF is 10ns regardless of clock frequency. 4.3.2 Card Input Timing SDR104 MODE SYMBOL MIN MAX UNIT tIS 1.40 - ns CCARD = 10pF, VCT = 0.975V tIH 0.80 - ns CCARD = 5pF, VCT = 0.975V SYMBOL MIN MAX UNIT tIS 3.00 - ns CCARD = 10pF, VCT = 0.975V tIH 0.80 - ns CCARD = 5pF, VCT = 0.975V SDR12, SDR25 and SDR50 MODES 14 © 2022 Apacer Technology Inc. 4.3.3 Card Output Timing of Fixed Data Window (SDR12, SDR25 and SDR50) SYMBOL tODLY MIN - tODLY tOH 1.5 MAX UNIT 7.5 ns 14 ns - ns REMARK tCLK ≥10.0ns, CL=30pF, using driver Type B, for SDR50. tCLK ≥20.0ns, CL=40pF, using driver Type B, for SDR25 and SDR12. Hold time at the tODLY (min.). CL=15pF 4.3.4 Output Timing of Variable Window (SDR104) SYMBOL MIN MAX UNIT tOP - 2 UI △tOP -350 tODW 0.60 +1550 - ps UI REMARK Card Output Phase Delay variation due to temperature change after tuning tODW = 2.88ns at 208MHz 15 © 2022 Apacer Technology Inc. 4.3.5 SD Interface Timing (DDR50 Mode) SYMBOL tCLK MIN 20 MAX - UNIT ns tCR, tCF - 0.2* tCLK ns Clock Duty 45 55 % REMARK 50MHz (Max.), Between rising edge tCR, tCF < 4.00ns (max.) at 50MHz, CCARD=10pF 16 © 2022 Apacer Technology Inc. 4.3.6 Bus Timings – Parameters Values (DDR50 Mode) Symbol Parameters tISU Input set-up time 6 - ns tIH Input hold time 0.8 - ns tODLY TOH Min Max Unit Input CMD (referenced to CLK rising edge) Output CMD (referenced to CLK rising edge) Output Delay time during 13.7 ns Data Transfer Mode Output Hold time 1.5 - ns Remark Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) CL≤ 30 pF (1 card) CL≥ 15 pF (1 card) Inputs DAT (referenced to CLK rising and falling edges) tISU2x Input set-up time 3 - ns tIH2x Input hold time 0.8 - ns tODLY2x TOH2x Ccard≤ 10 pF (1 card) Ccard≤ 10 pF (1 card) Outputs DAT (referenced to CLK rising and falling edges) Output Delay time during CL≤ 25 pF 7.0 ns Data Transfer Mode (1 card) CL≥ 15 pF Output Hold time 1.5 ns (1 card) 17 © 2022 Apacer Technology Inc. 5. Product Ordering Information Apacer’s SD card is available in different configurations and densities. See the chart below for a comprehensive list of options for the SD card series devices. 5.1 Product Code Designations AP – ISD xxX X X x X – xX T Flash Type T: Toshiba SLC Version Control CTL Solution Speed 2: Standard SD 4: SDHC Configuration S: Single Chip D: Dual Chips Temperature C: Standard Temperature I: Wide Temperature Capacity 256 = 256MB 512 = 512MB 01G = 1GB 02G = 2GB 04G = 4GB 08G = 8GB 16G = 16GB 32G = 32GB Model Name Apacer Product Code 18 © 2022 Apacer Technology Inc. 5.2 Valid Combinations The following table lists the available models of the SD card series which are in mass production or will be in mass production. Consult your Apacer sales representative to confirm availability of valid combinations and to determine availability of new combinations. Capacity Standard Temperature Wide Temperature 256 MB AP-ISD256MCC-1AT AP-ISD256MIC-1AT 512 MB AP-ISD512CS2A-8T AP-ISD512IS2B-8T 1 GB AP-ISD01GCS2A-8T AP-ISD01GIS2B-8T 2 GB AP-ISD02GCS2A-8T AP-ISD02GIS2B-8T 4 GB AP-ISD04GCS4A-8T AP-ISD04GIS4B-8T 8 GB AP-ISD08GCD4A-8T AP-ISD08GID4B-8T 16 GB AP-ISD16GCD4A-8T AP-ISD16GID4B-8T 32 GB AP-ISD32GCD4A-8T AP-ISD32GID4B-8T 19 © 2022 Apacer Technology Inc. Revision History Revision Description Date 1.0 Official release 2/25/2017 1.1 Added endurance rating for 32GB at Endurance on Specifications Overview and 2.5 Endurance 4/19/2018 1.2 Updated 5.1 Product Code Designations by changing version control code and 5.2 Valid Combinations by changing valid combination for 256MB 3/2/2022 20 © 2022 Apacer Technology Inc. Global Presence Taiwan (Headquarters) U.S.A. Apacer Technology Inc. 1F., No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City 236, Taiwan R.O.C. Tel: 886-2-2267-8000 Fax: 886-2-2267-2261 amtsales@apacer.com Apacer Memory America, Inc. 46732 Lakeview Blvd., Fremont, CA 94538 Tel: 1-408-518-8699 Fax: 1-510-249-9551 sa@apacerus.com Japan Europe Apacer Technology Corp. 6F, Daiyontamachi Bldg., 2-17-12, Shibaura, Minato-Ku, Tokyo, 108-0023, Japan Tel: 81-3-5419-2668 Fax: 81-3-5419-0018 jpservices@apacer.com Apacer Technology B.V. Science Park Eindhoven 5051 5692 EB Son, The Netherlands Tel: 31-40-267-0000 Fax: 31-40-290-0686 sales@apacer.nl China India Apacer Electronic (Shanghai) Co., Ltd Room D, 22/FL, No.2, Lane 600, JieyunPlaza, Tianshan RD, Shanghai, 200051, China Tel: 86-21-6228-9939 Fax: 86-21-6228-9936 sales@apacer.com.cn Apacer Technologies Pvt Ltd, Unit No.201, “Brigade Corner”, 7th Block Jayanagar, Yediyur Circle, Bangalore – 560082, India Tel: 91-80-4152-9061 Fax: 91-80-4170-0215 sales_india@apacer.com 21 © 2022 Apacer Technology Inc.