RoHS Compliant
PCI Express Flash Drive
PT220-M242 BiCS5 Product Specifications
October 28, 2022
Version 1.1
Apacer Technology Inc.
1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C
Tel: +886-2-2267-8000
www.apacer.com
Fax: +886-2-2267-2261
Specifications Overview:
PCIe Interface
Temperature Range
–
Compliant with PCI Express 3.1
–
Operating: 0°C to 70°C
–
Compliant with NVMe 1.3
–
Storage: -55°C to 100°C
–
Compatible with PCIe Gen3 x4 interface
–
Capacity
–
128, 256, 512 GB
–
1 TB
Performance
Supply Voltage
1
3.3 V ± 5%
Power Consumption1
–
Active mode (Max.): 1,235 mA
–
Idle mode: 255 mA
Connector Type
–
Interface burst read/write: 4 GB/sec
–
Sequential read: up to 2,400 MB/sec
–
Sequential write: up to 2,100 MB/sec
–
Random read (4K): up to 158,000 IOPS
–
Supports APST
–
Random write (4K): up to 303,000 IOPS
–
Supports ASPM L1.2
Flash Management
–
75-pin M.2 module pinout
Power Management
Form Factor
–
Low-Density Parity-Check (LDPC) Code
–
Form Factor: M.2 2242 double side, M Key
–
Global Wear Leveling
–
Dimensions: 22.00 x 42.00 x 4.08(max.), unit: mm
–
Flash bad-block management
–
Net weight: 4.2g ± 5%
–
Flash Translation Layer: Page Mapping
–
S.M.A.R.T.
Security
–
TM
AES 256-bit hardware encryption
–
DataDefender
–
TRIM
–
Thermal Sensor
–
Hyper Cache Technology
–
Thermal Throttling
–
NVMe Secure Erase
Reliability
–
End-to-End Data Protection
NVMe Features2
–
Sidefill
–
–
Heatsink design
Supports HMB (Host Memory Buffer)
NAND Flash Type: 3D TLC (BiCS5)
LED Indicators for Drive Behavior
MTBF: >3,000,000 hours
RoHS Compliant
Endurance (in drive writes per day : DWPD)
–
128 GB: 2.38 DWPD
–
256 GB: 1.99 DWPD
–
512 GB: 2.25 DWPD
–
1 TB: 1.96 DWPD
Notes:
1. Varies from capacities. The values for performances and power consumptions presented are typical and may vary
depending on flash configurations or platform settings. The term idle refers to the standby state of the device.
2. Windows 10 (version 1703) onwards supports the HMB (Host Memory Buffer) function.
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© 2022 Apacer Technology Inc.
Table of Contents
1. General Description ..........................................................................4
2. Functional Block ...............................................................................4
3. Pin Assignments ................................................................................5
4. Product Specifications ......................................................................8
4.1 Capacity ......................................................................................................................................... 8
4.2 Performance .................................................................................................................................. 8
4.3 Environmental Specifications ........................................................................................................ 9
4.4 Mean Time Between Failures (MTBF) .......................................................................................... 9
4.5 Certification and Compliance......................................................................................................... 9
4.6 Endurance ..................................................................................................................................... 9
4.7 LED Indicator Behavior ................................................................................................................ 10
5. Flash Management ..........................................................................11
5.1 Error Correction/Detection ........................................................................................................... 11
5.2 Bad Block Management .............................................................................................................. 11
5.3 Global Wear Leveling .................................................................................................................. 11
5.4 DataDefenderTM ........................................................................................................................... 11
5.5 TRIM ............................................................................................................................................ 11
5.6 Flash Translation Layer – Page Mapping.................................................................................... 12
5.7 Hyper Cache Technology ............................................................................................................ 12
5.8 NVMe Secure Erase .................................................................................................................... 12
6. NVMe Support Features ..................................................................13
6.1 Host Memory Buffer..................................................................................................................... 13
7. Security and Reliability Features ...................................................14
7.1 Advanced Encryption Standard ................................................................................................... 14
7.2 Thermal Sensor ........................................................................................................................... 14
7.3 Thermal Throttling ....................................................................................................................... 14
7.4 End-to-End Data Protection......................................................................................................... 14
7.5 Sidefill .......................................................................................................................................... 14
7.6 Heatsink Design .......................................................................................................................... 15
8. Software Interface ..........................................................................16
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8.1 Command Set .............................................................................................................................. 16
8.2 S.M.A.R.T. ................................................................................................................................... 17
9. Electrical Specifications.................................................................19
9.1 Operating Voltage ........................................................................................................................ 19
9.2 Power Consumption .................................................................................................................... 19
10. Mechanical Specifications ...........................................................20
10.1 Dimensions ................................................................................................................................ 20
10.2 Net Weight ................................................................................................................................. 21
11. Product Ordering Information .......................................................22
11.1 Product Code Designations ....................................................................................................... 22
11.2 Valid Combinations .................................................................................................................... 23
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© 2022 Apacer Technology Inc.
1. General Description
Apacer PT220-M242 is the fastest SSD designed as M.2 2242 mechanical dimensions which provides
full compliance with PCIe Gen3 x4 interface and NVMe 1.3 specifications, allowing it to operate in
power management modes and greatly save on power consumption. Built with a powerful PCIe
controller that supports on-the-module ECC as well as efficient wear leveling scheme, PT220-M242
delivers exceptionally low latency and outstanding performance in data transfer, reaching up to
158,000/303,000 and 2,400/2,100 MB/s in IOPS and sequential read/write. With the compact and
high-speed storage, PT220-M242 is the ideal choice for larger, faster hosts deployed in a wide range
of applications that require outstanding performance.
PT220-M242 utilizes 3D NAND for higher capacity up to 1TB and provides more power efficiency than
2D NAND. The PCIe SSD is not only implemented with LDPC (Low Density Parity Check) ECC
engine to extend SSD endurance and increase data reliability, but also equipped with a built-in
thermal sensor to monitor the temperature of the SSD via S.M.A.R.T commands and configured with
thermal throttling to dynamically adjust frequency scaling to enhance data reliability and provide
sustained performance while overheating. To ensure that products continue to operate normally in
high vibration and under extreme environmental changes, Apacer also provides Sidefill technology to
increase product reliability and resistance to various thermal and mechanical shocks as well as
heatsink design to help keep an SSD cool and functioning correctly. For highly-intensive applications,
End-to-End Data Protection ensures that data integrity can be assured at multiple points in the path to
enable reliable delivery of data transfers.
In terms of security, Advanced Encryption Standard (AES) ensures data security and provides users
with peace of mind knowing their data is safeguarded at all times. PT220-M242 also adopts the latest
page mapping file translation layer and comes with various implementations including power saving
modes, flash block management, TRIM, Hyper Cache technology and DataDefenderTM.
With exceptional performance, trustable reliability and cost effectiveness, PT220-M242 is definitely
the ideal storage or cache solution for a variety of applications ranging from industrial, imaging,
computing to enterprise markets.
2. Functional Block
Figure 2-1 Functional Block Diagram
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3. Pin Assignments
This connector does not support hot plug capability. There are a total of 75 pins. 12 pin locations are
used for mechanical key locations; this allows such a module to plug into Key M connectors.
Figure 3-1 Pin Connectors
Table 3-1 Pin Assignments
Pin
Type
Description
1
GND
Ground
2
3.3 V
3.3V source
3
GND
Ground
4
3.3 V
3.3V source
5
PETn3
PCIe TX Differential signal defined by the PCI Express M.2 spec
6
PWRDIS (I)(0/1.8/3.3V)
No connect
7
PETp3
PCIe TX Differential signal defined by the PCI Express M.2 spec
8
PLN# (I)(0/1.8/3.3V)
No connect
9
GND
10
LED1#
11
PERn3
Ground
Open drain, active low signal. These signals are used to allow the
add-in card to provide status indicators via LED devices that will
be provided by the system.
PCIe RX Differential signal defined by the PCI Express M.2 spec
12
3.3 V
3.3V source
13
PERp3
PCIe RX Differential signals defined by the PCI Express M.2 spec
14
3.3 V
3.3V source
15
GND
Ground
16
3.3 V
3.3V source
17
PETn2
PCIe TX Differential signal defined by the PCI Express M.2 spec
18
3.3 V
3.3V source
19
PETp2
PCIe TX Differential signal defined by the PCI Express M.2 spec
20
NC
No connect
21
GND
Ground
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© 2022 Apacer Technology Inc.
Table 3-1 Pin Assignments
Pin
Type
Description
22
VIO 1.8 V
No connect
23
PERn2
PCIe RX Differential signal defined by the PCI Express M.2 spec
24
NC
No connect
25
PERp2
PCIe RX Differential signal defined by the PCI Express M.2 spec
26
NC
No connect
27
GND
Ground
28
NC
Reserved for Apacer use only1
29
PETn1
PCIe TX Differential signal defined by the PCI Express M.2 spec
30
PLA_S3# (O)(0/1.8/3.3V)
Reserved for Apacer use only1
31
PETp1
PCIe TX Differential signal defined by the PCI Express M.2 spec
32
GND
No connect
33
GND
Ground
34
USB_D+
No connect
35
PERn1
PCIe RX Differential signal defined by the PCI Express M.2 spec
36
USB_D-
No connect
37
PERp1
PCIe RX Differential signal defined by the PCI Express M.2 spec
38
GND
No connect
39
GND
Ground
40
SMB_CLK (I/O)(0/1.8V)
No connect
41
PETn0
PCIe TX Differential signal defined by the PCI Express M.2 spec
42
SMB_DATA (I/O)(0/1.8V)
No connect
43
PETp0
PCIe TX Differential signal defined by the PCI Express M.2 spec
44
ALERT# (O)(0/1.8V)
No connect
45
GND
Ground
46
NC
No connect
47
PERn0
PCIe RX Differential signal defined by the PCI Express M.2 spec
48
NC
No connect
49
PERp0
50
PERST# (I)(0/1.8V/3.3V)
51
GND
52
CLKREQ# (I/O)(0/1.8V/3.3V)
53
REFCLKn
54
PEWAKE# (I/O)(0/1.8V/3.3V)
55
REFCLKp
56
Reserved for MFG_DATA
PCIe RX Differential signal defined by the PCI Express M.2 spec
PE-Reset is a functional reset to the card as specification. defined
by the PCIe Mini CEM
Ground
Clock Request is a reference clock request signal as defined by
the PCIe Mini CEM specification; Also used by L1 PM Substates.
PCIe Reference Clock signals (100 MHz) spec. defined by the PCI
Express M.2
No connect
PCIe Reference Clock signals (100 MHz) spec. defined by the PCI
Express M.2
Reserved for Apacer use only1
57
GND
Ground
58
Reserved for MFG_CLOCK
Reserved for Apacer use only1
59
Module Key M
Module Key
60
Module Key M
Module Key
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© 2022 Apacer Technology Inc.
Table 3-1 Pin Assignments
Pin
Type
Description
61
Module Key M
Module Key
62
Module Key M
Module Key
63
Module Key M
Module Key
64
Module Key M
Module Key
65
Module Key M
Module Key
66
Module Key M
Module Key
67
NC
Reserved for Apacer use only1
68
SUSCLK (I)(0/1.8V/3.3V)
No connect
69
PEDET
No connect
70
3.3 V
3.3V source
71
GND
Ground
72
3.3 V
3.3V source
73
VIO_CFG (O)
Ground
74
3.3 V
3.3V source
75
GND
Ground
Note:
1.
Reserved by Apacer, please do not connect to a host.
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© 2022 Apacer Technology Inc.
4. Product Specifications
4.1 Capacity
Capacity specifications of PT220-M242 are available as shown in Table 4-1. It lists the specific
capacity and the default numbers of heads, sectors and cylinders for each product line.
Table 4-1 Capacity Specifications
Capacity
Total bytes
Total LBA
128 GB
120,034,123,776
234,441,648
256 GB
240,057,409,536
468,862,128
512 GB
480,103,981,056
937,703,088
1 TB
960,197,124,096
1,875,385,008
Notes:
Display of total bytes varies from operating systems.
1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes.
LBA count addressed in the table above indicates total user storage capacity and will remain the same throughout the
lifespan of the device. However, the total usable capacity of the SSD is most likely to be less than the total physical
capacity because a small portion of the capacity is reserved for device maintenance usages.
4.2 Performance
Performance of PT220-M242 is listed below in Table 4-2.
Table 4-2 Performance Specifications
Capacity
128 GB
256 GB
512 GB
1 TB
Sequential Read (MB/s)
1,145
2,240
2,400
2,345
Sequential Write (MB/s)
550
1,065
2,100
1,925
Random Read IOPS (4K)
43,000
81,000
158,000
151,000
Random Write IOPS (4K)
115,000
184,000
303,000
289,000
Performance
Notes:
Results may differ from various flash configurations or host system setting.
Sequential read/write is based on CrystalDiskMark 8.0.4 with file size 1,000MB.
Random read/write is measured using IOMeter with Queue Depth 128.
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4.3 Environmental Specifications
Environmental specifications of PT220-M242 are shown in Table 4-3.
Table 4-3 Environmental Specifications
Item
Specifications
Operating temp.
0°C to 70°C
Non-operating temp.
-55°C to 100°C
Operating vibration
7.69 GRMS, 20~2000 Hz/random (compliant with MIL-STD-810G)
Non-operating vibration
4.02 GRMS, 15~2000 Hz/random (compliant with MIL-STD-810G)
Operating shock
50(G)/11ms/half sine (compliant with MIL-STD-202G)
Non-operating shock
1,500(G)/0.5(ms)/half sine (compliant with MIL-STD-883K)
Note: This Environmental Specification table indicates the conditions for testing the device. Real world usages may affect the
results.
4.4 Mean Time Between Failures (MTBF)
Mean Time Between Failures (MTBF) is predicted based on reliability data for the individual
components in PT220-M242. The prediction result for PT220-M242 is more than 3,000,000 hours.
Note: The MTBF is predicated and calculated based on “Telcordia Technologies Special Report, SR-332, Issue
3” method.
4.5 Certification and Compliance
PT220-M242 complies with the following standards:
CE
FCC
RoHS
MIL-STD-810G
4.6 Endurance
The endurance of a storage device is predicted by Drive Writes Per Day based on several factors
related to usage, such as the amount of data written into the drive, block management conditions, and
daily workload for the drive. Thus, key factors, such as Write Amplifications and the number of P/E
cycles, can influence the lifespan of the drive.
Table 4-4 Endurance Specifications
Capacity
Drive Writes Per Day
128 GB
2.38
256 GB
1.99
512 GB
2.25
1 TB
1.96
Notes:
This estimation complies with JEDEC JESD-219, enterprise endurance workload of random data with payload size
distribution.
Flash vendor guaranteed 3D NAND TLC P/E cycle: 3K
WAF may vary from capacity, flash configurations and writing behavior on each platform.
1 Terabyte = 1,024GB
DWPD (Drive Writes Per Day) is calculated based on the number of times that user overwrites the entire capacity of an
SSD per day of its lifetime during the warranty period. (3D NAND TLC warranty: 3 years)
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4.7 LED Indicator Behavior
The behavior of the PT220-M280 LED indicators is described in Table 4-5.
Table 4-5 LED Behavior
Location
LED
Description
LED A
DAS
LED blinks when the drive is being accessed
A
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5. Flash Management
5.1 Error Correction/Detection
PT220-M242 implements a hardware ECC scheme, based on the Low Density Parity Check (LDPC).
LDPC is a class of linear block error correcting code which has apparent coding gain over BCH code
because LDPC code includes both hard decoding and soft decoding algorithms. With the error rate
decreasing, LDPC can extend SSD endurance and increase data reliability while reading raw data
inside a flash chip.
5.2 Bad Block Management
Current production technology is unable to guarantee total reliability of NAND flash memory array.
When a flash memory device leaves factory, it comes with a minimal number of initial bad blocks
during production or out-of-factory as there is no currently known technology that produce flash chips
free of bad blocks. In addition, bad blocks may develop during program/erase cycles. Since bad
blocks are inevitable, the solution is to keep them in control. Apacer flash devices are programmed
with ECC, page mapping technique and S.M.A.R.T to reduce invalidity or error. Once bad blocks are
detected, data in those blocks will be transferred to free blocks and error will be corrected by
designated algorithms.
5.3 Global Wear Leveling
Flash memory devices differ from Hard Disk Drives (HDDs) in terms of how blocks are utilized. For
HDDs, when a change is made to stored data, like erase or update, the controller mechanism on
HDDs will perform overwrites on blocks. Unlike HDDs, flash blocks cannot be overwritten and each
P/E cycle wears down the lifespan of blocks gradually. Repeatedly program/erase cycles performed
on the same memory cells will eventually cause some blocks to age faster than others. This would
bring flash storages to their end of service term sooner. Global wear leveling is an important
mechanism that levels out the wearing of all blocks so that the wearing-down of all blocks can be
almost evenly distributed. This will increase the lifespan of SSDs.
5.4 DataDefenderTM
Apacer’s DataDefender is an advanced technology of power failure management which combines
both firmware and hardware mechanisms to ensure data integrity. When power disruption occurs, the
low voltage detector will be triggered. When this happens, the SSD’s protection mechanism is
activated and cuts off data transmission from the host. Once the power supply is resumed, the
firmware protection mechanism will ensure the integrity of the firmware as well as the data already
written into the NAND flash media.
5.5 TRIM
TRIM is a feature which helps improve the read/write performance and speed of solid-state drives
(SSD). Unlike hard disk drives (HDD), SSDs are not able to overwrite existing data, so the available
space gradually becomes smaller with each use. With the TRIM command, the operating system can
inform the SSD which blocks of data are no longer in use and can be removed permanently. Thus, the
SSD will perform the erase action, which prevents unused data from occupying blocks all the time.
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© 2022 Apacer Technology Inc.
5.6 Flash Translation Layer – Page Mapping
Page mapping is an advanced flash management technology whose essence lies in the ability to
gather data, distribute the data into flash pages automatically, and then schedule the data to be
evenly written. Page-level mapping uses one page as the unit of mapping. The most important
characteristic is that each logical page can be mapped to any physical page on the flash memory
device. This mapping algorithm allows different sizes of data to be written to a block as if the data is
written to a data pool and it does not need to take extra operations to process a write command. Thus,
page mapping is adopted to increase random access speed and improve SSD lifespan, reduce block
erase frequency, and achieve optimized performance and lifespan.
5.7 Hyper Cache Technology
Apacer proprietary Hyper Cache technology uses a portion of the available capacity as SLC (1bit-percell) NAND flash memory, called Hyper cache mode. When data is written to SSD, the firmware will
direct the data to Hyper Cache mode, providing excellent performance to handle various scenarios in
industrial use.
5.8 NVMe Secure Erase
NVMe Secure Erase is an NVMe drive sanitize command currently embedded in most of the storage
drives. Defined in NVMe specifications, NVMe Secure Erase is part of Format NVM command that
allows storage drives to erase all user data areas. The erase process usually runs on the firmware
level as most of the NVMe-based storage media currently in the market are built-in with this command.
NVMe Secure Erase can securely wipe out the user data in the drive and protects it from malicious
attack.
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6. NVMe Support Features
6.1 Host Memory Buffer
Host Memory Buffer (HMB) allows HOST to allocate system memory for SSD’s exclusive use in order
to provide better performance and endurance, especially for DRAMless solutions.
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7. Security and Reliability Features
7.1 Advanced Encryption Standard
Advanced Encryption Standard (AES) is a specification for the encryption of electronic data. AES has
been adopted by the U.S. government since 2001 to protect classified information and is now widely
implemented in embedded computing applications. The AES algorithm used in software and hardware
is symmetric so that encrypting/decrypting requires the same encryption key. Without the key, the
encrypted data is inaccessible to ensure information security.
Notably in flash memory applications, AES 256-bit hardware encryption is the mainstream to protect
sensitive or confidential data. The hardware encryption provides better performance, reliability, and
security than software encryption. It uses a dedicated processor, which is built inside the controller, to
process the encryption and decryption. This enormously shortens the processing time and makes it
efficient.
7.2 Thermal Sensor
Apacer Thermal Sensor is a digital temperature sensor with serial interface. By using designated pins
for transmission, storage device owners are able to read temperature data.
7.3 Thermal Throttling
Thermal throttling can monitor the temperature of the SSD equipped with a built-in thermal sensor via
S.M.A.R.T. commands. This method can ensure the temperature of the device stays within
temperature limits by drive throttling, i.e. reducing the speed of the drive when the device temperature
reaches the threshold level, so as to prevent overheating, guarantee data reliability, and prolong
product lifespan. When the temperature exceeds the maximum threshold level, thermal throttling will
be triggered to reduce performance step by step to prevent hardware components from being
damaged. Performance is only permitted to drop to the extent necessary for recovering a stable
temperature to cool down the device’s temperature. Once the temperature decreases to the minimum
threshold value, transfer speeds will rise back to its optimum performance level.
7.4 End-to-End Data Protection
End-to-End Data Protection is a feature implemented in Apacer SSD products that extends error
control to cover the entire path from the host computer to the drive and back, and that ensures data
integrity at multiple points in the path to enable reliable delivery of data transfers. Unlike ECC which
does not exhibit the ability to determine the occurrence of errors throughout the process of data
transmission, End-to-End Data Protection allows SSD controller to identify an error created anywhere
in the path and report the error to the host computer before it is written to the drive. This errorchecking and error-reporting mechanism therefore guarantees the trustworthiness and reliability of the
SSD.
7.5 Sidefill
Apacer’s sidefill technology strengthens the connections between solder joints and their board,
making them more robust and vibration-resistant. It also allows for heat dissipation to offset thermal
damage.
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7.6 Heatsink Design
In many applications, SSDs are subject to challenging conditions. If the working environment is
already hot, and the SSD’s operation causes it to increase in temperature as well, the result could be
damage to the hardware or corrupted data. For this reason, Apacer’s heatsink design is developed for
heat dissipation to cool both the NAND Flash and the Controller IC, while still allowing an SSD to
deliver high-speed performance, as well as prevent heat-related damage from occurring.
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© 2022 Apacer Technology Inc.
8. Software Interface
8.1 Command Set
Table 8-1 summarizes the commands supported by PT220-M242.
Table 8-1 Admin Commands
Opcode
Command Description
00h
Delete I/O Submission Queue
01h
Create I/O Submission Queue
02h
Get Log Page
04h
Delete I/O Completion Queue
05h
Create I/O Completion Queue
06h
Identify
08h
Abort
09h
Set Features
0Ah
Get Features
0Ch
Asynchronous Event Request
10h
Firmware Activate
11h
Firmware Image Download
14h
Device Self-test
Table 8-2 Admin Commands – NVM Command Set Specific
Opcode
Command Description
80h
Format NVM
84h
Sanitize
Table 8-3 NVM Commands
Opcode
Command Description
00h
Flush
01h
Write
02h
Read
04h
Write Uncorrectable
05h
Compare
08h
Write Zeroes
09h
Dataset Management
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8.2 S.M.A.R.T.
SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is an open standard
that allows a hard disk drive to automatically detect its health and report potential failures. When a
failure is recorded by SMART, users can choose to replace the drive to prevent unexpected outage or
data loss. Moreover, SMART can inform users of impending failures while there is still time to perform
proactive actions, such as copy data to another device.
Table 8-4 SMART (02h)
Byte
Length
Description
0
1
Critical Warning
1-2
2
Composite Temperature (PCB Sensor)
3
1
Available Spare
4
1
Available Spare Threshold
5
1
Percentage Used (Average Erase Count / P/E Cycle Count)
6-31
26
Reserved
32-47
16
Data Units Read
48-63
16
Data Units Written
64-79
16
Host Read Commands
80-95
16
Host Write Commands
96-111
16
Controller Busy Time
112-127
16
Power Cycles
128-143
16
Power On Hours
144-159
16
Unsafe Shutdowns
160-175
16
Media and Data Integrity Errors
176-191
16
Number of Error Information Log Entries
192-195
4
Warning Composite Temperature Time
196-199
4
Critical Composite Temperature Time
200-201
2
Temperature Sensor 1: Controller Temperature
202-203
2
Temperature Sensor 2: PCB Temperature
204-205
2
Temperature Sensor 3: NAND Flash Temperature
206-207
2
Temperature Sensor 4
208-209
2
Temperature Sensor 5
210-211
2
Temperature Sensor 6
212-213
2
Temperature Sensor 7
214-215
2
Temperature Sensor 8
216-511
296
Reserved
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Table 8-5 SMART (C0h)
Byte
Length
Description
0-255
256
256-257
2
SSD Protect Mode
258-261
4
Host Read UNC Count
262-265
4
Reserved
266-269
4
CRC Error Count
270-273
4
Total Early Bad Block Count
274-277
4
Total Later Bad Block Count
278-281
4
Max Erase Count
282-285
4
Average Erase Count
286-289
4
Program Fail Count
290-293
4
Erase Fail Count
294-301
8
Flash Write Sector
302-305
4
Total Spare Block
306-309
4
Current Spare Block
310-313
4
Read Retry Count
314-511
210
Reserved
Reserved
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9. Electrical Specifications
9.1 Operating Voltage
Table 9-1 lists the supply voltage for PT220-M242.
Table 9-1 Operating Range
Item
Range
Supply Voltage
3.3V ± 5%
9.2 Power Consumption
Table 9-2 lists the power consumption for PT220-M242.
Table 9-2 Power Consumption (Unit: mA)
Capacity
128 GB
256 GB
512 GB
1 TB
Active (Max.)
825
1,215
1,235
1,210
Idle
245
255
250
250
Mode
Notes:
All values are typical and may vary depending on flash configurations or host system settings.
Power consumption is measured using CrystalDiskMark 8.0.4.
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© 2022 Apacer Technology Inc.
10. Mechanical Specifications
10.1 Dimensions
Unit: mm
Figure 10-1 Physical Dimensions
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10.2 Net Weight
Table 10-1 Net Weight
Capacity
Net Weight (g ± 5%)
128GB
3.5
256GB
3.9
512GB
4.1
1TB
4.2
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© 2022 Apacer Technology Inc.
11. Product Ordering Information
11.1 Product Code Designations
Apacer’s PT220-M242 SSD is available in different configurations and densities. See the chart below
for a comprehensive list of options for the PT220-M242 series devices.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
B
7
2
.
2
2
C
X
G
U
.
X
X
X
X
X
Code
Code 1-3
(Product Line & Form Factor)
Code 5-6
(Model/Solution)
Code 7-8
(Product Capacity)
Code 9
(Flash Type & Product Temp)
Code 10
(Product Spec)
Code 12-14
(Version Number)
Code 15-16
(Firmware Version)
PCIe M.2 2242
PT220-M242
CH: 128GB
CJ: 256GB
CK: 512GB
CL: 1TB
3D TLC Standard temperature
Double side M key with graphene
Random numbers generated by system
24: 128GB with thermal sensor
21: 256GB/512GB/1TB with thermal sensor
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© 2022 Apacer Technology Inc.
11.2 Valid Combinations
The following table lists the available models of the PT220-M242 series which are in mass production
or will be in mass production. Consult your Apacer sales representative to confirm availability of valid
combinations and to determine availability of new combinations.
Capacity
Valid Combination
128GB
B72.22CHGU.00124
256GB
B72.22CJGU.00121
512GB
B72.22CKGU.00121
1TB
B72.22CLGU.00121
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© 2022 Apacer Technology Inc.
Revision History
Revision
Description
Date
1.0
Initial release
10/5/2022
1.1
Updated 10.1 Dimensions
10/28/2022
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© 2022 Apacer Technology Inc.
Global Presence
Taiwan (Headquarters)
U.S.A.
Apacer Technology Inc.
1F., No.32, Zhongcheng Rd., Tucheng Dist.,
New Taipei City 236, Taiwan R.O.C.
Tel: 886-2-2267-8000
Fax: 886-2-2267-2261
amtsales@apacer.com
Apacer Memory America, Inc.
46732 Lakeview Blvd., Fremont, CA 94538
Tel: 1-408-518-8699
Fax: 1-510-249-9551
sa@apacerus.com
Japan
Europe
Apacer Technology Corp.
6F, Daiyontamachi Bldg., 2-17-12, Shibaura, Minato-Ku,
Tokyo, 108-0023, Japan
Tel: 81-3-5419-2668
Fax: 81-3-5419-0018
jpservices@apacer.com
Apacer Technology B.V.
Science Park Eindhoven 5051 5692 EB Son,
The Netherlands
Tel: 31-40-267-0000
Fax: 31-40-290-0686
sales@apacer.nl
China
India
Apacer Electronic (Shanghai) Co., Ltd
Room D, 22/FL, No.2, Lane 600, JieyunPlaza,
Tianshan RD, Shanghai, 200051, China
Tel: 86-21-6228-9939
Fax: 86-21-6228-9936
sales@apacer.com.cn
Apacer Technologies Pvt Ltd,
1874, South End C Cross, 9th Block Jayanagar,
Bangalore-560069, India
Tel: 91-80-4152-9061/62
Fax: 91-80-4170-0215
sales_india@apacer.com
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