B72.22CJGU.00121

RoHS Compliant PCI Express Flash Drive PT220-M242 BiCS5 Product Specifications October 28, 2022 Version 1.1 Apacer Technology Inc. 1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C Tel: +886-2-2267-8000 www.apacer.com Fax: +886-2-2267-2261 Specifications Overview:       PCIe Interface Temperature Range – Compliant with PCI Express 3.1 – Operating: 0°C to 70°C – Compliant with NVMe 1.3 – Storage: -55°C to 100°C – Compatible with PCIe Gen3 x4 interface  – Capacity – 128, 256, 512 GB – 1 TB Performance Supply Voltage  1  3.3 V ± 5% Power Consumption1 – Active mode (Max.): 1,235 mA – Idle mode: 255 mA Connector Type – Interface burst read/write: 4 GB/sec – Sequential read: up to 2,400 MB/sec – Sequential write: up to 2,100 MB/sec – Random read (4K): up to 158,000 IOPS – Supports APST – Random write (4K): up to 303,000 IOPS – Supports ASPM L1.2 Flash Management –   75-pin M.2 module pinout Power Management Form Factor – Low-Density Parity-Check (LDPC) Code – Form Factor: M.2 2242 double side, M Key – Global Wear Leveling – Dimensions: 22.00 x 42.00 x 4.08(max.), unit: mm – Flash bad-block management – Net weight: 4.2g ± 5% – Flash Translation Layer: Page Mapping – S.M.A.R.T.  Security – TM AES 256-bit hardware encryption – DataDefender – TRIM – Thermal Sensor – Hyper Cache Technology – Thermal Throttling – NVMe Secure Erase  Reliability – End-to-End Data Protection NVMe Features2 – Sidefill – – Heatsink design Supports HMB (Host Memory Buffer)  NAND Flash Type: 3D TLC (BiCS5)  LED Indicators for Drive Behavior  MTBF: >3,000,000 hours  RoHS Compliant  Endurance (in drive writes per day : DWPD) – 128 GB: 2.38 DWPD – 256 GB: 1.99 DWPD – 512 GB: 2.25 DWPD – 1 TB: 1.96 DWPD Notes: 1. Varies from capacities. The values for performances and power consumptions presented are typical and may vary depending on flash configurations or platform settings. The term idle refers to the standby state of the device. 2. Windows 10 (version 1703) onwards supports the HMB (Host Memory Buffer) function. 1 © 2022 Apacer Technology Inc. Table of Contents 1. General Description ..........................................................................4 2. Functional Block ...............................................................................4 3. Pin Assignments ................................................................................5 4. Product Specifications ......................................................................8 4.1 Capacity ......................................................................................................................................... 8 4.2 Performance .................................................................................................................................. 8 4.3 Environmental Specifications ........................................................................................................ 9 4.4 Mean Time Between Failures (MTBF) .......................................................................................... 9 4.5 Certification and Compliance......................................................................................................... 9 4.6 Endurance ..................................................................................................................................... 9 4.7 LED Indicator Behavior ................................................................................................................ 10 5. Flash Management ..........................................................................11 5.1 Error Correction/Detection ........................................................................................................... 11 5.2 Bad Block Management .............................................................................................................. 11 5.3 Global Wear Leveling .................................................................................................................. 11 5.4 DataDefenderTM ........................................................................................................................... 11 5.5 TRIM ............................................................................................................................................ 11 5.6 Flash Translation Layer – Page Mapping.................................................................................... 12 5.7 Hyper Cache Technology ............................................................................................................ 12 5.8 NVMe Secure Erase .................................................................................................................... 12 6. NVMe Support Features ..................................................................13 6.1 Host Memory Buffer..................................................................................................................... 13 7. Security and Reliability Features ...................................................14 7.1 Advanced Encryption Standard ................................................................................................... 14 7.2 Thermal Sensor ........................................................................................................................... 14 7.3 Thermal Throttling ....................................................................................................................... 14 7.4 End-to-End Data Protection......................................................................................................... 14 7.5 Sidefill .......................................................................................................................................... 14 7.6 Heatsink Design .......................................................................................................................... 15 8. Software Interface ..........................................................................16 2 © 2022 Apacer Technology Inc. 8.1 Command Set .............................................................................................................................. 16 8.2 S.M.A.R.T. ................................................................................................................................... 17 9. Electrical Specifications.................................................................19 9.1 Operating Voltage ........................................................................................................................ 19 9.2 Power Consumption .................................................................................................................... 19 10. Mechanical Specifications ...........................................................20 10.1 Dimensions ................................................................................................................................ 20 10.2 Net Weight ................................................................................................................................. 21 11. Product Ordering Information .......................................................22 11.1 Product Code Designations ....................................................................................................... 22 11.2 Valid Combinations .................................................................................................................... 23 3 © 2022 Apacer Technology Inc. 1. General Description Apacer PT220-M242 is the fastest SSD designed as M.2 2242 mechanical dimensions which provides full compliance with PCIe Gen3 x4 interface and NVMe 1.3 specifications, allowing it to operate in power management modes and greatly save on power consumption. Built with a powerful PCIe controller that supports on-the-module ECC as well as efficient wear leveling scheme, PT220-M242 delivers exceptionally low latency and outstanding performance in data transfer, reaching up to 158,000/303,000 and 2,400/2,100 MB/s in IOPS and sequential read/write. With the compact and high-speed storage, PT220-M242 is the ideal choice for larger, faster hosts deployed in a wide range of applications that require outstanding performance. PT220-M242 utilizes 3D NAND for higher capacity up to 1TB and provides more power efficiency than 2D NAND. The PCIe SSD is not only implemented with LDPC (Low Density Parity Check) ECC engine to extend SSD endurance and increase data reliability, but also equipped with a built-in thermal sensor to monitor the temperature of the SSD via S.M.A.R.T commands and configured with thermal throttling to dynamically adjust frequency scaling to enhance data reliability and provide sustained performance while overheating. To ensure that products continue to operate normally in high vibration and under extreme environmental changes, Apacer also provides Sidefill technology to increase product reliability and resistance to various thermal and mechanical shocks as well as heatsink design to help keep an SSD cool and functioning correctly. For highly-intensive applications, End-to-End Data Protection ensures that data integrity can be assured at multiple points in the path to enable reliable delivery of data transfers. In terms of security, Advanced Encryption Standard (AES) ensures data security and provides users with peace of mind knowing their data is safeguarded at all times. PT220-M242 also adopts the latest page mapping file translation layer and comes with various implementations including power saving modes, flash block management, TRIM, Hyper Cache technology and DataDefenderTM. With exceptional performance, trustable reliability and cost effectiveness, PT220-M242 is definitely the ideal storage or cache solution for a variety of applications ranging from industrial, imaging, computing to enterprise markets. 2. Functional Block Figure 2-1 Functional Block Diagram 4 © 2022 Apacer Technology Inc. 3. Pin Assignments This connector does not support hot plug capability. There are a total of 75 pins. 12 pin locations are used for mechanical key locations; this allows such a module to plug into Key M connectors. Figure 3-1 Pin Connectors Table 3-1 Pin Assignments Pin Type Description 1 GND Ground 2 3.3 V 3.3V source 3 GND Ground 4 3.3 V 3.3V source 5 PETn3 PCIe TX Differential signal defined by the PCI Express M.2 spec 6 PWRDIS (I)(0/1.8/3.3V) No connect 7 PETp3 PCIe TX Differential signal defined by the PCI Express M.2 spec 8 PLN# (I)(0/1.8/3.3V) No connect 9 GND 10 LED1# 11 PERn3 Ground Open drain, active low signal. These signals are used to allow the add-in card to provide status indicators via LED devices that will be provided by the system. PCIe RX Differential signal defined by the PCI Express M.2 spec 12 3.3 V 3.3V source 13 PERp3 PCIe RX Differential signals defined by the PCI Express M.2 spec 14 3.3 V 3.3V source 15 GND Ground 16 3.3 V 3.3V source 17 PETn2 PCIe TX Differential signal defined by the PCI Express M.2 spec 18 3.3 V 3.3V source 19 PETp2 PCIe TX Differential signal defined by the PCI Express M.2 spec 20 NC No connect 21 GND Ground 5 © 2022 Apacer Technology Inc. Table 3-1 Pin Assignments Pin Type Description 22 VIO 1.8 V No connect 23 PERn2 PCIe RX Differential signal defined by the PCI Express M.2 spec 24 NC No connect 25 PERp2 PCIe RX Differential signal defined by the PCI Express M.2 spec 26 NC No connect 27 GND Ground 28 NC Reserved for Apacer use only1 29 PETn1 PCIe TX Differential signal defined by the PCI Express M.2 spec 30 PLA_S3# (O)(0/1.8/3.3V) Reserved for Apacer use only1 31 PETp1 PCIe TX Differential signal defined by the PCI Express M.2 spec 32 GND No connect 33 GND Ground 34 USB_D+ No connect 35 PERn1 PCIe RX Differential signal defined by the PCI Express M.2 spec 36 USB_D- No connect 37 PERp1 PCIe RX Differential signal defined by the PCI Express M.2 spec 38 GND No connect 39 GND Ground 40 SMB_CLK (I/O)(0/1.8V) No connect 41 PETn0 PCIe TX Differential signal defined by the PCI Express M.2 spec 42 SMB_DATA (I/O)(0/1.8V) No connect 43 PETp0 PCIe TX Differential signal defined by the PCI Express M.2 spec 44 ALERT# (O)(0/1.8V) No connect 45 GND Ground 46 NC No connect 47 PERn0 PCIe RX Differential signal defined by the PCI Express M.2 spec 48 NC No connect 49 PERp0 50 PERST# (I)(0/1.8V/3.3V) 51 GND 52 CLKREQ# (I/O)(0/1.8V/3.3V) 53 REFCLKn 54 PEWAKE# (I/O)(0/1.8V/3.3V) 55 REFCLKp 56 Reserved for MFG_DATA PCIe RX Differential signal defined by the PCI Express M.2 spec PE-Reset is a functional reset to the card as specification. defined by the PCIe Mini CEM Ground Clock Request is a reference clock request signal as defined by the PCIe Mini CEM specification; Also used by L1 PM Substates. PCIe Reference Clock signals (100 MHz) spec. defined by the PCI Express M.2 No connect PCIe Reference Clock signals (100 MHz) spec. defined by the PCI Express M.2 Reserved for Apacer use only1 57 GND Ground 58 Reserved for MFG_CLOCK Reserved for Apacer use only1 59 Module Key M Module Key 60 Module Key M Module Key 6 © 2022 Apacer Technology Inc. Table 3-1 Pin Assignments Pin Type Description 61 Module Key M Module Key 62 Module Key M Module Key 63 Module Key M Module Key 64 Module Key M Module Key 65 Module Key M Module Key 66 Module Key M Module Key 67 NC Reserved for Apacer use only1 68 SUSCLK (I)(0/1.8V/3.3V) No connect 69 PEDET No connect 70 3.3 V 3.3V source 71 GND Ground 72 3.3 V 3.3V source 73 VIO_CFG (O) Ground 74 3.3 V 3.3V source 75 GND Ground Note: 1. Reserved by Apacer, please do not connect to a host. 7 © 2022 Apacer Technology Inc. 4. Product Specifications 4.1 Capacity Capacity specifications of PT220-M242 are available as shown in Table 4-1. It lists the specific capacity and the default numbers of heads, sectors and cylinders for each product line. Table 4-1 Capacity Specifications Capacity Total bytes Total LBA 128 GB 120,034,123,776 234,441,648 256 GB 240,057,409,536 468,862,128 512 GB 480,103,981,056 937,703,088 1 TB 960,197,124,096 1,875,385,008 Notes:  Display of total bytes varies from operating systems.  1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes.  LBA count addressed in the table above indicates total user storage capacity and will remain the same throughout the lifespan of the device. However, the total usable capacity of the SSD is most likely to be less than the total physical capacity because a small portion of the capacity is reserved for device maintenance usages. 4.2 Performance Performance of PT220-M242 is listed below in Table 4-2. Table 4-2 Performance Specifications Capacity 128 GB 256 GB 512 GB 1 TB Sequential Read (MB/s) 1,145 2,240 2,400 2,345 Sequential Write (MB/s) 550 1,065 2,100 1,925 Random Read IOPS (4K) 43,000 81,000 158,000 151,000 Random Write IOPS (4K) 115,000 184,000 303,000 289,000 Performance Notes:  Results may differ from various flash configurations or host system setting.  Sequential read/write is based on CrystalDiskMark 8.0.4 with file size 1,000MB.  Random read/write is measured using IOMeter with Queue Depth 128. 8 © 2022 Apacer Technology Inc. 4.3 Environmental Specifications Environmental specifications of PT220-M242 are shown in Table 4-3. Table 4-3 Environmental Specifications Item Specifications Operating temp. 0°C to 70°C Non-operating temp. -55°C to 100°C Operating vibration 7.69 GRMS, 20~2000 Hz/random (compliant with MIL-STD-810G) Non-operating vibration 4.02 GRMS, 15~2000 Hz/random (compliant with MIL-STD-810G) Operating shock 50(G)/11ms/half sine (compliant with MIL-STD-202G) Non-operating shock 1,500(G)/0.5(ms)/half sine (compliant with MIL-STD-883K) Note: This Environmental Specification table indicates the conditions for testing the device. Real world usages may affect the results. 4.4 Mean Time Between Failures (MTBF) Mean Time Between Failures (MTBF) is predicted based on reliability data for the individual components in PT220-M242. The prediction result for PT220-M242 is more than 3,000,000 hours. Note: The MTBF is predicated and calculated based on “Telcordia Technologies Special Report, SR-332, Issue 3” method. 4.5 Certification and Compliance PT220-M242 complies with the following standards:     CE FCC RoHS MIL-STD-810G 4.6 Endurance The endurance of a storage device is predicted by Drive Writes Per Day based on several factors related to usage, such as the amount of data written into the drive, block management conditions, and daily workload for the drive. Thus, key factors, such as Write Amplifications and the number of P/E cycles, can influence the lifespan of the drive. Table 4-4 Endurance Specifications Capacity Drive Writes Per Day 128 GB 2.38 256 GB 1.99 512 GB 2.25 1 TB 1.96 Notes:  This estimation complies with JEDEC JESD-219, enterprise endurance workload of random data with payload size distribution.  Flash vendor guaranteed 3D NAND TLC P/E cycle: 3K  WAF may vary from capacity, flash configurations and writing behavior on each platform.  1 Terabyte = 1,024GB  DWPD (Drive Writes Per Day) is calculated based on the number of times that user overwrites the entire capacity of an SSD per day of its lifetime during the warranty period. (3D NAND TLC warranty: 3 years) 9 © 2022 Apacer Technology Inc. 4.7 LED Indicator Behavior The behavior of the PT220-M280 LED indicators is described in Table 4-5. Table 4-5 LED Behavior Location LED Description LED A DAS LED blinks when the drive is being accessed A 10 © 2022 Apacer Technology Inc. 5. Flash Management 5.1 Error Correction/Detection PT220-M242 implements a hardware ECC scheme, based on the Low Density Parity Check (LDPC). LDPC is a class of linear block error correcting code which has apparent coding gain over BCH code because LDPC code includes both hard decoding and soft decoding algorithms. With the error rate decreasing, LDPC can extend SSD endurance and increase data reliability while reading raw data inside a flash chip. 5.2 Bad Block Management Current production technology is unable to guarantee total reliability of NAND flash memory array. When a flash memory device leaves factory, it comes with a minimal number of initial bad blocks during production or out-of-factory as there is no currently known technology that produce flash chips free of bad blocks. In addition, bad blocks may develop during program/erase cycles. Since bad blocks are inevitable, the solution is to keep them in control. Apacer flash devices are programmed with ECC, page mapping technique and S.M.A.R.T to reduce invalidity or error. Once bad blocks are detected, data in those blocks will be transferred to free blocks and error will be corrected by designated algorithms. 5.3 Global Wear Leveling Flash memory devices differ from Hard Disk Drives (HDDs) in terms of how blocks are utilized. For HDDs, when a change is made to stored data, like erase or update, the controller mechanism on HDDs will perform overwrites on blocks. Unlike HDDs, flash blocks cannot be overwritten and each P/E cycle wears down the lifespan of blocks gradually. Repeatedly program/erase cycles performed on the same memory cells will eventually cause some blocks to age faster than others. This would bring flash storages to their end of service term sooner. Global wear leveling is an important mechanism that levels out the wearing of all blocks so that the wearing-down of all blocks can be almost evenly distributed. This will increase the lifespan of SSDs. 5.4 DataDefenderTM Apacer’s DataDefender is an advanced technology of power failure management which combines both firmware and hardware mechanisms to ensure data integrity. When power disruption occurs, the low voltage detector will be triggered. When this happens, the SSD’s protection mechanism is activated and cuts off data transmission from the host. Once the power supply is resumed, the firmware protection mechanism will ensure the integrity of the firmware as well as the data already written into the NAND flash media. 5.5 TRIM TRIM is a feature which helps improve the read/write performance and speed of solid-state drives (SSD). Unlike hard disk drives (HDD), SSDs are not able to overwrite existing data, so the available space gradually becomes smaller with each use. With the TRIM command, the operating system can inform the SSD which blocks of data are no longer in use and can be removed permanently. Thus, the SSD will perform the erase action, which prevents unused data from occupying blocks all the time. 11 © 2022 Apacer Technology Inc. 5.6 Flash Translation Layer – Page Mapping Page mapping is an advanced flash management technology whose essence lies in the ability to gather data, distribute the data into flash pages automatically, and then schedule the data to be evenly written. Page-level mapping uses one page as the unit of mapping. The most important characteristic is that each logical page can be mapped to any physical page on the flash memory device. This mapping algorithm allows different sizes of data to be written to a block as if the data is written to a data pool and it does not need to take extra operations to process a write command. Thus, page mapping is adopted to increase random access speed and improve SSD lifespan, reduce block erase frequency, and achieve optimized performance and lifespan. 5.7 Hyper Cache Technology Apacer proprietary Hyper Cache technology uses a portion of the available capacity as SLC (1bit-percell) NAND flash memory, called Hyper cache mode. When data is written to SSD, the firmware will direct the data to Hyper Cache mode, providing excellent performance to handle various scenarios in industrial use. 5.8 NVMe Secure Erase NVMe Secure Erase is an NVMe drive sanitize command currently embedded in most of the storage drives. Defined in NVMe specifications, NVMe Secure Erase is part of Format NVM command that allows storage drives to erase all user data areas. The erase process usually runs on the firmware level as most of the NVMe-based storage media currently in the market are built-in with this command. NVMe Secure Erase can securely wipe out the user data in the drive and protects it from malicious attack. 12 © 2022 Apacer Technology Inc. 6. NVMe Support Features 6.1 Host Memory Buffer Host Memory Buffer (HMB) allows HOST to allocate system memory for SSD’s exclusive use in order to provide better performance and endurance, especially for DRAMless solutions. 13 © 2022 Apacer Technology Inc. 7. Security and Reliability Features 7.1 Advanced Encryption Standard Advanced Encryption Standard (AES) is a specification for the encryption of electronic data. AES has been adopted by the U.S. government since 2001 to protect classified information and is now widely implemented in embedded computing applications. The AES algorithm used in software and hardware is symmetric so that encrypting/decrypting requires the same encryption key. Without the key, the encrypted data is inaccessible to ensure information security. Notably in flash memory applications, AES 256-bit hardware encryption is the mainstream to protect sensitive or confidential data. The hardware encryption provides better performance, reliability, and security than software encryption. It uses a dedicated processor, which is built inside the controller, to process the encryption and decryption. This enormously shortens the processing time and makes it efficient. 7.2 Thermal Sensor Apacer Thermal Sensor is a digital temperature sensor with serial interface. By using designated pins for transmission, storage device owners are able to read temperature data. 7.3 Thermal Throttling Thermal throttling can monitor the temperature of the SSD equipped with a built-in thermal sensor via S.M.A.R.T. commands. This method can ensure the temperature of the device stays within temperature limits by drive throttling, i.e. reducing the speed of the drive when the device temperature reaches the threshold level, so as to prevent overheating, guarantee data reliability, and prolong product lifespan. When the temperature exceeds the maximum threshold level, thermal throttling will be triggered to reduce performance step by step to prevent hardware components from being damaged. Performance is only permitted to drop to the extent necessary for recovering a stable temperature to cool down the device’s temperature. Once the temperature decreases to the minimum threshold value, transfer speeds will rise back to its optimum performance level. 7.4 End-to-End Data Protection End-to-End Data Protection is a feature implemented in Apacer SSD products that extends error control to cover the entire path from the host computer to the drive and back, and that ensures data integrity at multiple points in the path to enable reliable delivery of data transfers. Unlike ECC which does not exhibit the ability to determine the occurrence of errors throughout the process of data transmission, End-to-End Data Protection allows SSD controller to identify an error created anywhere in the path and report the error to the host computer before it is written to the drive. This errorchecking and error-reporting mechanism therefore guarantees the trustworthiness and reliability of the SSD. 7.5 Sidefill Apacer’s sidefill technology strengthens the connections between solder joints and their board, making them more robust and vibration-resistant. It also allows for heat dissipation to offset thermal damage. 14 © 2022 Apacer Technology Inc. 7.6 Heatsink Design In many applications, SSDs are subject to challenging conditions. If the working environment is already hot, and the SSD’s operation causes it to increase in temperature as well, the result could be damage to the hardware or corrupted data. For this reason, Apacer’s heatsink design is developed for heat dissipation to cool both the NAND Flash and the Controller IC, while still allowing an SSD to deliver high-speed performance, as well as prevent heat-related damage from occurring. 15 © 2022 Apacer Technology Inc. 8. Software Interface 8.1 Command Set Table 8-1 summarizes the commands supported by PT220-M242. Table 8-1 Admin Commands Opcode Command Description 00h Delete I/O Submission Queue 01h Create I/O Submission Queue 02h Get Log Page 04h Delete I/O Completion Queue 05h Create I/O Completion Queue 06h Identify 08h Abort 09h Set Features 0Ah Get Features 0Ch Asynchronous Event Request 10h Firmware Activate 11h Firmware Image Download 14h Device Self-test Table 8-2 Admin Commands – NVM Command Set Specific Opcode Command Description 80h Format NVM 84h Sanitize Table 8-3 NVM Commands Opcode Command Description 00h Flush 01h Write 02h Read 04h Write Uncorrectable 05h Compare 08h Write Zeroes 09h Dataset Management 16 © 2022 Apacer Technology Inc. 8.2 S.M.A.R.T. SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is an open standard that allows a hard disk drive to automatically detect its health and report potential failures. When a failure is recorded by SMART, users can choose to replace the drive to prevent unexpected outage or data loss. Moreover, SMART can inform users of impending failures while there is still time to perform proactive actions, such as copy data to another device. Table 8-4 SMART (02h) Byte Length Description 0 1 Critical Warning 1-2 2 Composite Temperature (PCB Sensor) 3 1 Available Spare 4 1 Available Spare Threshold 5 1 Percentage Used (Average Erase Count / P/E Cycle Count) 6-31 26 Reserved 32-47 16 Data Units Read 48-63 16 Data Units Written 64-79 16 Host Read Commands 80-95 16 Host Write Commands 96-111 16 Controller Busy Time 112-127 16 Power Cycles 128-143 16 Power On Hours 144-159 16 Unsafe Shutdowns 160-175 16 Media and Data Integrity Errors 176-191 16 Number of Error Information Log Entries 192-195 4 Warning Composite Temperature Time 196-199 4 Critical Composite Temperature Time 200-201 2 Temperature Sensor 1: Controller Temperature 202-203 2 Temperature Sensor 2: PCB Temperature 204-205 2 Temperature Sensor 3: NAND Flash Temperature 206-207 2 Temperature Sensor 4 208-209 2 Temperature Sensor 5 210-211 2 Temperature Sensor 6 212-213 2 Temperature Sensor 7 214-215 2 Temperature Sensor 8 216-511 296 Reserved 17 © 2022 Apacer Technology Inc. Table 8-5 SMART (C0h) Byte Length Description 0-255 256 256-257 2 SSD Protect Mode 258-261 4 Host Read UNC Count 262-265 4 Reserved 266-269 4 CRC Error Count 270-273 4 Total Early Bad Block Count 274-277 4 Total Later Bad Block Count 278-281 4 Max Erase Count 282-285 4 Average Erase Count 286-289 4 Program Fail Count 290-293 4 Erase Fail Count 294-301 8 Flash Write Sector 302-305 4 Total Spare Block 306-309 4 Current Spare Block 310-313 4 Read Retry Count 314-511 210 Reserved Reserved 18 © 2022 Apacer Technology Inc. 9. Electrical Specifications 9.1 Operating Voltage Table 9-1 lists the supply voltage for PT220-M242. Table 9-1 Operating Range Item Range Supply Voltage 3.3V ± 5% 9.2 Power Consumption Table 9-2 lists the power consumption for PT220-M242. Table 9-2 Power Consumption (Unit: mA) Capacity 128 GB 256 GB 512 GB 1 TB Active (Max.) 825 1,215 1,235 1,210 Idle 245 255 250 250 Mode Notes:  All values are typical and may vary depending on flash configurations or host system settings.  Power consumption is measured using CrystalDiskMark 8.0.4. 19 © 2022 Apacer Technology Inc. 10. Mechanical Specifications 10.1 Dimensions Unit: mm Figure 10-1 Physical Dimensions 20 © 2022 Apacer Technology Inc. 10.2 Net Weight Table 10-1 Net Weight Capacity Net Weight (g ± 5%) 128GB 3.5 256GB 3.9 512GB 4.1 1TB 4.2 21 © 2022 Apacer Technology Inc. 11. Product Ordering Information 11.1 Product Code Designations Apacer’s PT220-M242 SSD is available in different configurations and densities. See the chart below for a comprehensive list of options for the PT220-M242 series devices. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 B 7 2 . 2 2 C X G U . X X X X X Code Code 1-3 (Product Line & Form Factor) Code 5-6 (Model/Solution) Code 7-8 (Product Capacity) Code 9 (Flash Type & Product Temp) Code 10 (Product Spec) Code 12-14 (Version Number) Code 15-16 (Firmware Version) PCIe M.2 2242 PT220-M242 CH: 128GB CJ: 256GB CK: 512GB CL: 1TB 3D TLC Standard temperature Double side M key with graphene Random numbers generated by system 24: 128GB with thermal sensor 21: 256GB/512GB/1TB with thermal sensor 22 © 2022 Apacer Technology Inc. 11.2 Valid Combinations The following table lists the available models of the PT220-M242 series which are in mass production or will be in mass production. Consult your Apacer sales representative to confirm availability of valid combinations and to determine availability of new combinations. Capacity Valid Combination 128GB B72.22CHGU.00124 256GB B72.22CJGU.00121 512GB B72.22CKGU.00121 1TB B72.22CLGU.00121 23 © 2022 Apacer Technology Inc. Revision History Revision Description Date 1.0 Initial release 10/5/2022 1.1 Updated 10.1 Dimensions 10/28/2022 24 © 2022 Apacer Technology Inc. Global Presence Taiwan (Headquarters) U.S.A. Apacer Technology Inc. 1F., No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City 236, Taiwan R.O.C. Tel: 886-2-2267-8000 Fax: 886-2-2267-2261 amtsales@apacer.com Apacer Memory America, Inc. 46732 Lakeview Blvd., Fremont, CA 94538 Tel: 1-408-518-8699 Fax: 1-510-249-9551 sa@apacerus.com Japan Europe Apacer Technology Corp. 6F, Daiyontamachi Bldg., 2-17-12, Shibaura, Minato-Ku, Tokyo, 108-0023, Japan Tel: 81-3-5419-2668 Fax: 81-3-5419-0018 jpservices@apacer.com Apacer Technology B.V. Science Park Eindhoven 5051 5692 EB Son, The Netherlands Tel: 31-40-267-0000 Fax: 31-40-290-0686 sales@apacer.nl China India Apacer Electronic (Shanghai) Co., Ltd Room D, 22/FL, No.2, Lane 600, JieyunPlaza, Tianshan RD, Shanghai, 200051, China Tel: 86-21-6228-9939 Fax: 86-21-6228-9936 sales@apacer.com.cn Apacer Technologies Pvt Ltd, 1874, South End C Cross, 9th Block Jayanagar, Bangalore-560069, India Tel: 91-80-4152-9061/62 Fax: 91-80-4170-0215 sales_india@apacer.com 25 © 2022 Apacer Technology Inc.