RoHS Compliant
PCI Express Flash Drive
PV210-M280 Product Specifications
June 23, 2021
Version 1.0
Apacer Technology Inc.
1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C
Tel: +886-2-2267-8000
www.apacer.com
Fax: +886-2-2267-2261
Specifications Overview:
Temperature Range
–
Compliant with PCIe Express 3.1
–
Compliant with NVMe 1.3
Standard: 0°C to 70°C
–
Compatible with PCIe Gen3 x4 interface
Wide: -40°C to 85°C
–
–
Capacity
–
PCIe Interface
240, 480, 960, 1,920 GB
–
Interface burst read/write: 4 GB/sec
–
Sequential read: up to 3,130 MB/sec
–
Sequential write: up to 2,620 MB/sec
–
Random read (4K): up to 565,000 IOPS
–
Random write (4K): up to 521,000 IOPS
3.3 V ± 5%
Power Consumption*
–
Active mode: 1,850 mA
–
Idle mode: 255 mA
Connector Type
–
Flash Management
Storage: -40°C to 100°C
Supply Voltage
–
Performance*
Operating:
75-pin M.2 module pinout
Power Management
–
Low-Density Parity-Check (LDPC) Code
–
Supports APST
–
Global Wear Leveling
–
Supports ASPM L1.2
–
Flash bad-block management
–
Flash Translation Layer: Page Mapping
–
S.M.A.R.T.
–
Power Failure Management
–
TRIM
–
Hyper Cache Technology
–
Thermal Sensor
–
Over-Provisioning
–
Thermal Throttling
–
End-to-End Data Protection
–
CoreGlacierTM***
TM
–
DataRAID
–
NVMe Secure Erase
DRAM Cache for Enhanced Random
Performance
NAND Flash Type: 3D TLC (BiCS3)
MTBF: >3,000,000 hours
Endurance (in drive writes per day : DWPD)
–
240 GB: 3.17 DWPD
–
480 GB: 2.77 DWPD
–
960 GB: 2.92 DWPD
–
1,920 GB: 3.62 DWPD
Security
–
AES 256-bit hardware encryption
–
Trusted Computing Group (TCG) Opal 2.0
(optional)
Reliability
Form Factor
–
Form Factor: M.2 2280-D5-M Key
–
Dimensions (unit: mm):
Double side: 22.00 x 80.00 x 3.88
CoreGlacierTM: 22.00 x 80.00 x 4.08(max)
–
Net Weight: 8.96g ± 5%
LED Indicators for Drive Behavior
RoHS Compliant
*Varies from capacities. The values for performances and power consumptions presented are typical and may vary depending on flash
configurations or platform settings.
**Windows 10 (version 1703) onwards supports the HMB (Host Memory Buffer) function.
***Only supported on wide temperature series
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© 2021 Apacer Technology Inc.
Table of Contents
1. General Descriptions ........................................................................4
2. Functional Block ...............................................................................4
3. Pin Assignments ................................................................................5
4. Product Specifications ......................................................................7
4.1 Capacity ......................................................................................................................................... 7
4.2 Performance .................................................................................................................................. 7
4.3 Environmental Specifications ........................................................................................................ 7
4.4 Mean Time Between Failures (MTBF) .......................................................................................... 8
4.5 Certification and Compliance......................................................................................................... 8
4.6 Endurance ..................................................................................................................................... 8
4.7 LED Indicator Behavior .................................................................................................................. 9
5. Flash Management ..........................................................................10
5.1 Error Correction/Detection ........................................................................................................... 10
5.2 Bad Block Management .............................................................................................................. 10
5.3 Global Wear Leveling .................................................................................................................. 10
5.4 Power Failure Management ........................................................................................................ 10
5.5 TRIM ............................................................................................................................................ 11
5.6 Flash Translation Layer – Page Mapping.................................................................................... 11
5.7 Hyper Cache Technology ............................................................................................................ 11
5.8 Over-Provisioning ........................................................................................................................ 11
5.9 DataRAIDTM ................................................................................................................................. 11
5.10 NVMe Secure Erase .................................................................................................................. 11
6. Security & Reliability Features ......................................................12
6.1 Advanced Encryption Standard ................................................................................................... 12
6.2 TCG Opal (optional) .................................................................................................................... 12
6.3 Thermal Sensor ........................................................................................................................... 12
6.4 Thermal Throttling ....................................................................................................................... 12
6.5 End-to-End Data Protection......................................................................................................... 13
6.6 CoreGlacierTM .............................................................................................................................. 13
7. Software Interface ..........................................................................14
7.1 Command Set .............................................................................................................................. 14
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7.2 S.M.A.R.T. ................................................................................................................................... 15
8. Electrical Specifications.................................................................17
8.1 Operating Voltage ........................................................................................................................ 17
8.2 Power Consumption .................................................................................................................... 17
9. Physical Characteristics .................................................................18
9.1 Double Side ................................................................................................................................. 18
9.2 CoreGlacier ................................................................................................................................. 18
9.3 Net Weight ................................................................................................................................... 19
10. Product Ordering Information .......................................................20
10.1 Product Code Designations ....................................................................................................... 20
10.2 Valid Combinations .................................................................................................................... 21
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© 2021 Apacer Technology Inc.
1. General Descriptions
Apacer PV210-M280 is the fastest SSD designed as M.2 2280 mechanical dimensions, providing full
compliance with PCIe Gen3 x4 interface and NVMe 1.3 specifications. Built with a powerful PCIe
controller, PV210-M280 delivers outstanding performance in data transfer, reaching up to
565,000/521,000 and 3,130/2,620 MB/s in IOPS and sequential read/write. The extreme thin and light
form factor makes PV210-M280 the ideal choice for mobile computing systems, which appears to be
the trend in near future.
In terms of security, Advanced Encryption Standard (AES) and Trusted Computing Group (TCG) Opal
(optional) ensure data security and provide users with a peace of mind knowing their data is
safeguarded against unauthorized use at all times. Furthermore, with End-to-End Data Protection,
data integrity can be assured at multiple points in the path to enable reliable delivery of data transfers.
Regarding reliability, PV210-M280 is built with a powerful PCIe controller that supports on-the-module
ECC as well as efficient wear leveling scheme. In terms of power efficiency, PV210-M280 is compliant
with PCIe Gen3 x4 interface standard so that it can operate on power management modes, which
greatly save on power consumption.
2. Functional Block
DDR4
DRAM
M
Figure 2-1 Functional Block Diagram
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© 2021 Apacer Technology Inc.
3. Pin Assignments
This connector does not support hot plug capability. There are a total of 75 pins. 12 pin locations are
used for mechanical key locations; this allows such a module to plug into Key M connectors.
Table 3-1 Pin Assignments
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Type
GND
3.3V
GND
3.3V
PETn3
N/C
PETp3
N/C
GND
LED1#(O)
PERn3
3.3V
PERp3
3.3V
GND
3.3V
PETn2
3.3V
PETp2
N/C
GND
N/C
PERn2
N/C
PERp2
N/C
GND
N/C
PETn1
N/C
PETp1
N/C
Description
Ground
3.3V source
Ground
3.3V source
PCIe TX Differential signal defined by the PCI Express M.2 spec
No connect*
PCIe TX Differential signal defined by the PCI Express M.2 spec
No connect*
Ground
Status indicators via LED devices
PCIe RX Differential signal defined by the PCI Express M.2 spec
3.3V source
PCIe RX Differential signals defined by the PCI Express M.2 spec
3.3V source
Ground
3.3V source
PCIe TX Differential signal defined by the PCI Express M.2 spec
3.3V source
PCIe TX Differential signal defined by the PCI Express M.2 spec
No connect*
Ground
No connect*
PCIe RX Differential signal defined by the PCI Express M.2 spec
No connect*
PCIe RX Differential signal defined by the PCI Express M.2 spec
No connect*
Ground
No connect*
PCIe TX Differential signal defined by the PCI Express M.2 spec
No connect*
PCIe TX Differential signal defined by the PCI Express M.2 spec
No connect*
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© 2021 Apacer Technology Inc.
Table 3-1 Pin Assignments
Pin
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
Type
GND
N/C
PERn1
N/C
PERp1
N/C
GND
SMB_CLK
PETn0
SMB_DATA
PETp0
ALERT#
GND
I2C_CLK
PERn0
I2C_DATA
PERp0
PERST#(I)(0/3.3V)
GND
CLKREQ#(I/O)(0/3.3V)
REFCLKn
PEWAKE#(I/O)(0/3.3V)
REFCLKp
Reserved for
MFG DATA
GND
Reserved for MFG
CLOCK
Module Key
Module Key
Module Key
Module Key
Module Key
Module Key
Module Key
Module Key
N/C
SUSCLK(32KHz)
(I)(0/3.3V)
PEDET (NC-PCIe)
3.3V
GND
3.3V
GND
3.3V
GND
Description
Ground
No connect*
PCIe RX Differential signal defined by the PCI Express M.2 spec
No connect*
PCIe RX Differential signal defined by the PCI Express M.2 spec
No connect*
Ground
SMBus clock; Open Drain with pull up on platform
PCIe TX Differential signal defined by the PCI Express M.2 spec
SMBus Data; Open Drain with pull up on platform
PCIe TX Differential signal defined by the PCI Express M.2 spec
Alert notification to host system. Open Drain with pull up on platform, Active
low Signals
Ground
I2C clock; Open Drain with pull up on platform
PCIe RX Differential signal defined by the PCI Express M.2 spec
I2C Data; Open Drain with pull up on platform
PCIe RX Differential signal defined by the PCI Express M.2 spec
PE-Reset is a functional reset to the card as specification. defined by the
PCIe Mini CEM
Ground
Clock Request is a reference clock request signal as defined by the PCIe
Mini CEM specification; Also used by L1 PM Substates.
PCIe Reference Clock signals (100 MHz) spec. defined by the PCI Express
M.2
Open Drain with pull up on platform; Active Low. PCIe PME Wake.
PCIe Reference Clock signals (100 MHz) spec. defined by the PCI Express
M.2
Manufacturing Data line. Used for SSD manufacturing only.
Not used in normal operation.
Pins should be left N/C in platform Socket.
Ground
Manufacturing Clock line. Used for SSD manufacturing only.
Not used in normal operation.
Pins should be left N/C in platform Socket.
Module Key
Module Key
Module Key
Module Key
Module Key
Module Key
Module Key
Module Key
No connect*
32.768 kHz clock supply input that is provided by the platform
chipset to reduce power and cost for the module.
Host I/F Indication; No connect for PCIe.
3.3V source
Ground
3.3V source
Ground
3.3V source
Ground
*Reserved by Apacer, please do not connect on a host.
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© 2021 Apacer Technology Inc.
4. Product Specifications
4.1 Capacity
Capacity specifications of PV210-M280 are available as shown in Table 4-1. It lists the specific
capacity and the default numbers of heads, sectors and cylinders for each product line.
Table 4-1 Capacity Specifications
Capacity
Total bytes*
Total LBA
240 GB
240,057,409,536
468,862,128
480 GB
480,103,981,056
937,703,088
960 GB
960,197,124,096
1,875,385,008
1,920 GB
1,920,383,410,176
3,750,748,848
*Display of total bytes varies from file systems, which means not all of the bytes can be used for storage.
**Notes: 1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes.
LBA count addressed in the table above indicates total user storage capacity and will remain the same throughout the lifespan of
the device. However, the total usable capacity of the SSD is most likely to be less than the total physical capacity because a
small portion of the capacity is reserved for device maintenance usages.
4.2 Performance
Performance of PV210-M280 is listed below in Table 4-2.
Table 4-2 Performance Specifications
Capacity
240 GB
480 GB
960 GB
1,920 GB
Sequential Read* (MB/s)
2,735
3,070
3,105
3,130
Sequential Write* (MB/s)
1,040
2,085
2,620
2,565
Random Read IOPS** (4K)
152,000
300,000
565,000
495,000
Random Write IOPS** (4K)
238,000
461,000
521,000
517,000
Performance
Note:
Results may differ from various flash configurations or host system setting.
*Sequential performance is based on CrystalDiskMark 5.2.1 with file size 1,000MB.
**Random performance measured using IOMeter with Queue Depth 64.
4.3 Environmental Specifications
Environmental specifications of PV210-M280 are shown in Table 4-3.
Table 4-3 Environmental Specifications
Item
Specifications
Operating temp.
0°C to 70°C (Standard); -40°C to 85°C (Wide)
Non-operating temp.
-40°C to 100°C
Operating vibration
7.69 GRMS, 20~2000 Hz/random (compliant with MIL-STD-810G)
Non-operating vibration
4.02 GRMS, 15~2000 Hz/random (compliant with MIL-STD-810G)
Operating shock
50(G)/11ms/half sine (compliant with MIL-STD-202G)
Non-operating shock
1,500(G)/0.5(ms)/half sine (compliant with MIL-STD-883K)
Note: Shock and Vibration specifications are subject to change without notice.
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4.4 Mean Time Between Failures (MTBF)
Mean Time Between Failures (MTBF) is predicted based on reliability data for the individual
components in PV210-M280. The prediction result for PV210-M280 is more than 3,000,000 hours.
Note: The MTBF is predicated and calculated based on “Telcordia Technologies Special Report, SR332, Issue 3” method.
4.5 Certification and Compliance
PV210-M280 complies with the following standards:
CE
FCC
RoHS
MIL-STD-810G
4.6 Endurance
The endurance of a storage device is predicted by Drive Writes Per Day based on several factors
related to usage, such as the amount of data written into the drive, block management conditions, and
daily workload for the drive. Thus, key factors, such as Write Amplifications and the number of P/E
cycles, can influence the lifespan of the drive.
Table 4-4 Drive Writes Per Day
Capacity
Drive Writes Per Day
240 GB
3.17
480 GB
2.77
960 GB
2.92
1,920 GB
3.62
Note:
This estimation complies with JEDEC JESD-219, enterprise endurance workload of random data
with payload size distribution.
Flash vendor guaranteed 3D NAND TLC P/E cycle: 3K
WAF may vary from capacity, flash configurations and writing behavior on each platform.
1 Terabyte = 1,024GB
DWPD (Drive Writes Per Day) is calculated based on the number of times that user overwrites
the entire capacity of an SSD per day of its lifetime during the warranty period. (3D NAND TLC
warranty: 2 years)
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© 2021 Apacer Technology Inc.
4.7 LED Indicator Behavior
The behavior of the PV210-M280 LED indicators is described in Table 4-5.
Table 4-5 LED Behavior
Location
LED
Description
LED A
DAS
LED blinks when the drive is being accessed
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© 2021 Apacer Technology Inc.
5. Flash Management
5.1 Error Correction/Detection
PV210-M280 implements a hardware ECC scheme, based on the Low Density Parity Check (LDPC).
LDPC is a class of linear block error correcting code which has apparent coding gain over BCH code
because LDPC code includes both hard decoding and soft decoding algorithms. With the error rate
decreasing, LDPC can extend SSD endurance and increase data reliability while reading raw data
inside a flash chip.
5.2 Bad Block Management
Current production technology is unable to guarantee total reliability of NAND flash memory array.
When a flash memory device leaves factory, it comes with a minimal number of initial bad blocks
during production or out-of-factory as there is no currently known technology that produce flash chips
free of bad blocks. In addition, bad blocks may develop during program/erase cycles. Since bad
blocks are inevitable, the solution is to keep them in control. Apacer flash devices are programmed
with ECC, page mapping technique and S.M.A.R.T to reduce invalidity or error. Once bad blocks are
detected, data in those blocks will be transferred to free blocks and error will be corrected by
designated algorithms.
5.3 Global Wear Leveling
Flash memory devices differ from Hard Disk Drives (HDDs) in terms of how blocks are utilized. For
HDDs, when a change is made to stored data, like erase or update, the controller mechanism on
HDDs will perform overwrites on blocks. Unlike HDDs, flash blocks cannot be overwritten and each
P/E cycle wears down the lifespan of blocks gradually. Repeatedly program/erase cycles performed
on the same memory cells will eventually cause some blocks to age faster than others. This would
bring flash storages to their end of service term sooner. Global wear leveling is an important
mechanism that levels out the wearing of all blocks so that the wearing-down of all blocks can be
almost evenly distributed. This will increase the lifespan of SSDs.
5.4 Power Failure Management
Power Failure Management plays a crucial role when power supply becomes unstable. Power
disruption may occur when users are storing data into the SSD, leading to instability in the drive.
However, with Power Failure Management, a firmware protection mechanism will be activated to scan
pages and blocks once power is resumed. Valid data will be transferred to new blocks for merging
and the mapping table will be rebuilt. Therefore, data reliability can be reinforced, preventing damage
to data stored in the NAND Flash.
Note: The controller unit of this product model is designed with a DRAM as a write cache for improved performance and data
efficiency. Though unlikely to happen in most cases, the data cached in the volatile DRAM might be potentially affected if a
sudden power loss takes place before the cached data is flushed into non-volatile NAND flash memory.
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© 2021 Apacer Technology Inc.
5.5 TRIM
TRIM is a feature which helps improve the read/write performance and speed of solid-state drives
(SSD). Unlike hard disk drives (HDD), SSDs are not able to overwrite existing data, so the available
space gradually becomes smaller with each use. With the TRIM command, the operating system can
inform the SSD which blocks of data are no longer in use and can be removed permanently. Thus, the
SSD will perform the erase action, which prevents unused data from occupying blocks all the time.
5.6 Flash Translation Layer – Page Mapping
Page mapping is an advanced flash management technology whose essence lies in the ability to
gather data, distribute the data into flash pages automatically, and then schedule the data to be
evenly written. Page-level mapping uses one page as the unit of mapping. The most important
characteristic is that each logical page can be mapped to any physical page on the flash memory
device. This mapping algorithm allows different sizes of data to be written to a block as if the data is
written to a data pool and it does not need to take extra operations to process a write command. Thus,
page mapping is adopted to increase random access speed and improve SSD lifespan, reduce block
erase frequency, and achieve optimized performance and lifespan.
5.7 Hyper Cache Technology
Apacer proprietary Hyper Cache technology uses a portion of the available capacity as SLC (1bit-percell) NAND flash memory, called Hyper cache mode. When data is written to SSD, the firmware will
direct the data to Hyper Cache mode, providing excellent performance to handle various scenarios in
industrial use.
5.8 Over-Provisioning
Over-Provisioning (OP) is a certain portion of the SSD capacity exclusively for increasing Garbage
Collection (GC) efficiency, especially when the SSD is filled to full capacity or performs a heavy
mixed-random workload. OP has the advantages of providing extended life expectancy, reliable data
integrity, and high sustained write performance.
5.9 DataRAIDTM
Apacer’s DataRAID algorithm applies an additional level of protection and error-checking. Using this
algorithm, a certain amount of space is given over to aggregating and resaving the existing parity data
used for error checking. So, in the event that data becomes corrupted, the parity data can be
compared to the existing uncorrupted data and the content of the corrupted data can be rebuilt.
5.10 NVMe Secure Erase
NVMe Secure Erase is an NVMe drive sanitize command currently embedded in most of the storage
drives. Defined in NVMe specifications, NVMe Secure Erase is part of Format NVM command that
allows storage drives to erase all user data areas. The erase process usually runs on the firmware
level as most of the NVMe-based storage media currently in the market are built-in with this command.
NVMe Secure Erase can securely wipe out the user data in the drive and protects it from malicious
attack.
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6. Security & Reliability Features
6.1 Advanced Encryption Standard
Advanced Encryption Standard (AES) is a specification for the encryption of electronic data. AES has
been adopted by the U.S. government since 2001 to protect classified information and is now widely
implemented in embedded computing applications. The AES algorithm used in software and hardware
is symmetric so that encrypting/decrypting requires the same encryption key. Without the key, the
encrypted data is inaccessible to ensure information security.
Notably in flash memory applications, AES 256-bit hardware encryption is the mainstream to protect
sensitive or confidential data. The hardware encryption provides better performance, reliability, and
security than software encryption. It uses a dedicated processor, which is built inside the controller, to
process the encryption and decryption. This enormously shortens the processing time and makes it
efficient.
6.2 TCG Opal (optional)
Developed by the Trusted Computing Group (TCG), an organization whose members work together to
formulate industry standards, Opal is a set of security specifications used for applying hardwarebased encryption to storage devices.
Hardware encryption has many advantages. First of all, it transfers the computational load of the
encryption process to dedicated processors, reducing the stress on the host system's CPU. In
addition, storage devices complying with Opal specifications are self-encryption devices. Opal
specifications also feature boot authentication. When the drive is being accessed, the shadow MBR
will request the drive password at boot. The drive will only unlock and decrypt if the correct password
is supplied. The other feature is LBA-specific permissions. Users are assigned different permissions
for LBA ranges created by the device administrator. Each LBA range is password-protected and can
only be accessed by users with the correct key to perform permitted actions (read/write/erase).
6.3 Thermal Sensor
Apacer Thermal Sensor is a digital temperature sensor with serial interface. By using designated pins
for transmission, storage device owners are able to read temperature data.
6.4 Thermal Throttling
Thermal throttling can monitor the temperature of the SSD equipped with a built-in thermal sensor via
S.M.A.R.T. commands. This method can ensure the temperature of the device stays within
temperature limits by drive throttling, i.e. reducing the speed of the drive when the device temperature
reaches the threshold level, so as to prevent overheating, guarantee data reliability, and prolong
product lifespan. When the temperature exceeds the maximum threshold level, thermal throttling will
be triggered to reduce performance step by step to prevent hardware components from being
damaged. Performance is only permitted to drop to the extent necessary for recovering a stable
temperature to cool down the device’s temperature. Once the temperature decreases to the minimum
threshold value, transfer speeds will rise back to its optimum performance level.
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6.5 End-to-End Data Protection
End-to-End Data Protection is a feature implemented in Apacer SSD products that extends error
control to cover the entire path from the host computer to the drive and back, and that ensures data
integrity at multiple points in the path to enable reliable delivery of data transfers. Unlike ECC which
does not exhibit the ability to determine the occurrence of errors throughout the process of data
transmission, End-to-End Data Protection allows SSD controller to identify an error created anywhere
in the path and report the error to the host computer before it is written to the drive. This errorchecking and error-reporting mechanism therefore guarantees the trustworthiness and reliability of the
SSD.
6.6 CoreGlacierTM
In many applications, SSDs are subject to challenging conditions. If the working environment is
already hot, and the SSD’s operation causes it to increase in temperature as well, the result could be
damage to the hardware or corrupted data. In cases like this, leading industrial manufacturers know to
turn to Apacer. Apacer developed CoreGlacier, a heatsink that distributes dissipation in isolated
components with no thermal diffusion, to prevent heat-related damage from occurring.
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© 2021 Apacer Technology Inc.
7. Software Interface
7.1 Command Set
Table 7-1 summarizes the commands supported by PV210-M280.
Table 7-1 Admin Commands
Opcode
Command Description
00h
Delete I/O Submission Queue
01h
Create I/O Submission Queue
02h
Get Log Page
04h
Delete I/O Completion Queue
05h
Create I/O Completion Queue
06h
Identify
08h
Abort
09h
Set Features
0Ah
Get Features
0Ch
Asynchronous Event Request
10h
Firmware Activate
11h
Firmware Image Download
14h
Device Self-test
Table 7-2 Admin Commands – NVM Command Set Specific
Opcode
Command Description
80h
Format NVM
81h
Security Send
82h
Security Receive
84h
Sanitize
Table 7-3 NVM Commands
Opcode
Command Description
00h
Flush
01h
Write
02h
Read
04h
Write Uncorrectable
05h
Compare
08h
Write Zeroes
09h
Dataset Management
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© 2021 Apacer Technology Inc.
7.2 S.M.A.R.T.
SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is an open standard
that allows a hard disk drive to automatically detect its health and report potential failures. When a
failure is recorded by SMART, users can choose to replace the drive to prevent unexpected outage or
data loss. Moreover, SMART can inform users of impending failures while there is still time to perform
proactive actions, such as copy data to another device.
Table 7-4 SMART (02h)
Byte
Length
Description
0
1
Critical Warning
1-2
2
Composite Temperature (PCB Sensor)
3
1
Available Spare
4
1
Available Spare Threshold
5
1
Percentage Used (Average Erase Count / P/E Cycle Count)
6-31
26
Reserved
32-47
16
Data Units Read
48-63
16
Data Units Written
64-79
16
Host Read Commands
80-95
16
Host Write Commands
96-111
16
Controller Busy Time
112-127
16
Power Cycles
128-143
16
Power On Hours
144-159
16
Unsafe Shutdowns
160-175
16
Media and Data Integrity Errors
176-191
16
Number of Error Information Log Entries
192-195
4
Warning Composite Temperature Time
196-199
4
Critical Composite Temperature Time
200-201
2
Temperature Sensor 1: Controller Temperature
202-203
2
Temperature Sensor 2: PCB Temperature
204-205
2
Temperature Sensor 3: NAND Flash Temperature
206-207
2
Temperature Sensor 4
208-209
2
Temperature Sensor 5
210-211
2
Temperature Sensor 6
212-213
2
Temperature Sensor 7
214-215
2
Temperature Sensor 8
216-511
296
Reserved
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Table 7-5 SMART (C0h)
Byte
Length
Description
0-255
256
256-257
2
SSD Protect Mode
258-261
4
Host Read UNC Count
262-265
4
PHY Error Count
266-269
4
CRC Error Count
270-273
4
Total Early Bad Block Count
274-277
4
Total Later Bad Block Count
278-281
4
Max Erase Count
282-285
4
Average Erase Count
286-289
4
Program Fail Count
290-293
4
Erase Fail Count
294-301
8
Flash Write Sector
302-305
4
Total Spare Block
306-309
4
Current Spare Block
310-313
4
Read Retry Count
314-511
210
Reserved
Reserved
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© 2021 Apacer Technology Inc.
8. Electrical Specifications
8.1 Operating Voltage
Table 8-1 lists the supply voltage for PV210-M280.
Table 8-1 Operating Range
Item
Range
3.3V ± 5%
Supply Voltage
8.2 Power Consumption
Table 8-2 lists the power consumption for PV210-M280.
Table 8-2 Power Consumption
Capacity
240 GB
480 GB
960 GB
1,920 GB
Active (mA)
1,475
1,715
1,830
1,850
Idle (mA)
240
250
250
255
Mode
Note:
*All values are typical and may vary depending on flash configurations or host system settings.
**Active power is an average power measurement performed using CrystalDiskMark with 128KB sequential read/write transfers.
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© 2021 Apacer Technology Inc.
9. Physical Characteristics
9.1 Double Side
Figure 9-1 Dimensions – Double Side
9.2 CoreGlacier
Figure 9-2 Dimensions – CoreGlacier
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© 2021 Apacer Technology Inc.
9.3 Net Weight
Table 9-1 Net Weight
Capacity
Net Weight (g ± 5%)
240GB
7.9
480GB
7.9
960GB
8.35
1,920GB
8.96
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© 2021 Apacer Technology Inc.
10. Product Ordering Information
10.1 Product Code Designations
1
2
3
B
9
2
4
5
6
7
8
9
10
11
12
13
14
15
16
X
X
5
X
X
U
.
0
0
1
0
X
Code
.
Code 1-3
(Product Line & form factor)
Code 5-6
(Model/Solution)
Code 7-8
(Product Capacity)
Code 9
(Flash Type & Product Temp)
Code 10
(Product Spec)
Code 12-14
(Version Number)
Code 15-16
(Firmware Version)
PCIe M.2 2280
93: PV210
A3: PV210 with TCG Opal
5J: 240GB
5K: 480GB
5L: 960GB
5M: 1920GB
G: 3D TLC Standard temperature
H: 3D TLC Wide temperature
U:Double side M key with Graphene
Random numbers generated by system
04: Thermal Sensor OP
05: Thermal Sensor OP + TCG Opal
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© 2021 Apacer Technology Inc.
10.2 Valid Combinations
10.2.1 Without TCG Opal
Capacity
Standard Temperature
Wide Temperature
240GB
B92.935JGU.00104
B92.935JHU.00104
480GB
B92.935KGU.00104
B92.935KHU.00104
960GB
B92.935LGU.00104
B92.935LHU.00104
1920GB
B92.935MGU.00104
B92.935MHU.00104
Capacity
Standard Temperature
Wide Temperature
240GB
B92.A35JGU.00105
B92.A35JHU.00105
480GB
B92.A35KGU.00105
B92.A35KHU.00105
960GB
B92.A35LGU.00105
B92.A35LHU.00105
1920GB
B92.A35MGU.00105
B92.A35MHU.00105
10.2.2 With TCG Opal
Note: Valid combinations are those products in mass production or will be in mass production.
Consult your Apacer sales representative to confirm availability of valid combinations and to
determine availability of new combinations.
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© 2021 Apacer Technology Inc.
Revision History
Revision
Description
Date
0.1
Preliminary release
6/15/2021
1.0
Official release
6/23/2021
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© 2021 Apacer Technology Inc.
Global Presence
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sales@apacer.nl
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India
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Tel: 86-21-6228-9939
Fax: 86-21-6228-9936
sales@apacer.com.cn
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Bangalore-560069, India
Tel: 91-80-4152-9061/62
Fax: 91-80-4170-0215
sales_india@apacer.com
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