RoHS Compliant
PCI Express Flash Drive
PV910-M242 Product Specifications
November 22, 2022
Version 1.3
Apacer Technology Inc.
1F, No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City, Taiwan, R.O.C
Tel: +886-2-2267-8000
www.apacer.com
Fax: +886-2-2267-2261
Specifications Overview:
–
Compliant with NVMe 1.3
–
Compatible with PCIe Gen3 x2 interface
Temperature Range
–
Operating:
Standard: 0°C to 70°C
Wide: -40°C to 85°C
Capacity
–
PCIe Interface
–
60, 120, 240, 480 GB
Performance1
Storage: -40°C to 100°C
Supply Voltage
–
3.3 V ± 5%
–
Interface burst read/write: 2 GB/sec
–
Sequential read: up to 1,630 MB/sec
–
Sequential write: up to 1,280 MB/sec
–
Active mode (Max.): 645 mA
–
Random read (4K): up to 136,000 IOPS
–
Idle mode: 145 mA
–
Random write (4K): up to 131,000 IOPS
Power Consumption1
Connector Type
–
Flash Management
75-pin M.2 module pinout
Power Management
–
Low-Density Parity-Check (LDPC) Code
–
Global Wear Leveling
–
Supports APST
–
Flash bad-block management
–
Supports ASPM L1.2
–
Flash Translation Layer: Page Mapping
–
DataDefenderTM
–
S.M.A.R.T.
–
TRIM
–
Hyper Cache Technology
–
AES 256-bit hardware encryption
–
Over-provisioning
–
Signed Firmware
–
SMART Read Refresh
–
NVMe Secure Erase
TM
NAND Flash Type: 3D TLC (BiCS3)
MTBF: >3,000,000 hours
Endurance (in drive writes per day: DWPD)
60 GB: 2.04 DWPD
–
120 GB: 2.02 DWPD
–
240 GB: 1.99 DWPD
–
480 GB: 1.96 DWPD
NVMe Features2
–
–
Supports HMB (Host Memory Buffer)
Security
Reliability
–
Thermal Sensor
–
Thermal Throttling
–
End-to-End Data Protection
Form Factor
–
M.2 2242-D5-B-M Key
–
Dimensions: 22.00 x 42.00 x 3.88 (max.),
unit: mm
–
Net weight: 3.53g ± 5%
LED Indicators for Drive Behavior
RoHS Compliant
Notes:
1. Varies from capacities. The values for performances and power consumptions presented are typical and may vary
depending on flash configurations or platform settings.
2. Windows 10 (version 1703) onwards supports the HMB (Host Memory Buffer) function.
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© 2022 Apacer Technology Inc.
Table of Contents
1. General Description ..........................................................................4
2. Functional Block ...............................................................................4
3. Pin Assignments ................................................................................5
4. Product Specifications ......................................................................8
4.1 Capacity ......................................................................................................................................... 8
4.2 Performance .................................................................................................................................. 8
4.3 Environmental Specifications ........................................................................................................ 9
4.4 Mean Time Between Failures (MTBF) .......................................................................................... 9
4.5 Certification and Compliance......................................................................................................... 9
4.6 Endurance ..................................................................................................................................... 9
4.7 LED Indicator Behavior ................................................................................................................ 10
5. Flash Management ..........................................................................11
5.1 Error Correction/Detection ........................................................................................................... 11
5.2 Bad Block Management .............................................................................................................. 11
5.3 Global Wear Leveling .................................................................................................................. 11
5.4 Flash Translation Layer – Page Mapping.................................................................................... 11
5.5 DataDefenderTM ........................................................................................................................... 11
5.6 TRIM ............................................................................................................................................ 12
5.7 Hyper Cache Technology ............................................................................................................ 12
5.8 Over-provisioning ........................................................................................................................ 12
5.9 SMART Read RefreshTM ............................................................................................................. 12
5.10 NVMe Secure Erase .................................................................................................................. 12
6. NVMe Support Features ..................................................................13
6.1 Host Memory Buffer..................................................................................................................... 13
7. Security and Reliability Features ...................................................14
7.1 Advanced Encryption Standard ................................................................................................... 14
7.2 Signed Firmware ......................................................................................................................... 14
7.3 Thermal Sensor ........................................................................................................................... 14
7.4 Thermal Throttling ....................................................................................................................... 14
7.5 End-to-End Data Protection......................................................................................................... 14
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8. Software Interface ..........................................................................15
8.1 Command Set .............................................................................................................................. 15
8.2 S.M.A.R.T. ................................................................................................................................... 16
9. Electrical Specifications.................................................................18
9.1 Operating Voltage ........................................................................................................................ 18
9.2 Power Consumption .................................................................................................................... 18
10. Mechanical Specifications ...........................................................19
10.1 Dimensions ................................................................................................................................ 19
10.2 Net Weight ................................................................................................................................. 19
11. Product Ordering Information .......................................................20
11.1 Product Code Designations ....................................................................................................... 20
11.2 Valid Combinations .................................................................................................................... 21
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© 2022 Apacer Technology Inc.
1. General Description
Apacer PV910-M242, utilizing 3D NAND for higher capacity up to 480GB and providing more power
efficiency than 2D NAND, is the next generation Solid State Drive (SSD) with compact and highspeed storage to support larger, faster hosts deployed in a wide range of applications that require
outstanding performance.
Designed with PCIe-based connector pinouts, PV910-M242 provides full compliance with the latest
PCIe Gen3 x2 and NVM Express interface specifications which allows the SSD to not only operate in
power management modes and greatly save on power consumption, but also deliver exceptionally
low latency and high performance, up to 1,630 MB/s read and 1,280 MB/s write. This new standard is
designed for a variety of applications ranging from industrial, imaging, computing to enterprise
markets.
PV910-M242 is built with a powerful PCIe controller that supports on-the-module ECC as well as
efficient wear leveling scheme, and implemented with LDPC (Low Density Parity Check) ECC engine
to extend SSD endurance and increase data reliability. Furthermore, PV910-M242 is equipped with a
built-in thermal sensor to monitor the temperature of the SSD via S.M.A.R.T commands and
configured with thermal throttling to dynamically adjust frequency scaling to enhance data reliability
and provide sustained performance while overheating. For highly-intensive applications, End-to-End
Data Protection ensures that data integrity can be assured at multiple points in the path to enable
reliable delivery of data transfers.
Security-wise, Advanced Encryption Standard (AES) ensures data security and provides users with
peace of mind knowing their data is safeguarded at all times, while Signed Firmware allows the drive
to install valid and authentic firmware by including a digital signature. PV910-M242 also adopts the
latest page mapping file translation layer and comes with various implementations including power
saving modes, flash block management, S.M.A.R.T., TRIM, Hyper Cache technology, overprovisioning, DataDefenderTM and SMART Read RefreshTM.
With exceptional performance, trustable reliability and enhanced data protection, PV910-M242 is
definitely the ideal storage or cache solution for a variety of applications ranging from industrial,
imaging, computing to enterprise markets.
2. Functional Block
Figure 2-1 Functional Block Diagram
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© 2022 Apacer Technology Inc.
3. Pin Assignments
This connector does not support hot plug capability. There are a total of 75 pins. 12 pin locations are
used for mechanical key locations; this allows such a module to plug into both Key B and Key M
connectors.
Figure 3-1 Pin Connectors
Table 3-1 Pin Assignments
Pin
Type
Description
1
GND
Ground
2
3.3V
3.3V source
3
GND
Ground
4
3.3V
3.3V source
5
N/C
No connect
6
N/C
No connect
7
N/C
No connect
8
N/C
No connect
9
GND
Ground
10
LED1#(O)
Status indicators via LED devices
11
N/C
No connect
12
Module Key
Module Key
13
Module Key
Module Key
14
Module Key
Module Key
15
Module Key
Module Key
16
Module Key
Module Key
17
Module Key
Module Key
18
Module Key
Module Key
19
Module Key
Module Key
20
N/C
No connect
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© 2022 Apacer Technology Inc.
Table 3-1 Pin Assignments
Pin
Type
Description
21
GND
Ground
22
N/C
No connect
23
N/C
No connect
24
N/C
No connect
25
N/C
No connect
26
N/C
No connect
27
GND
Ground
28
N/C
No connect
29
PETn1
PCIe TX Differential signal defined by the PCI Express M.2 spec
30
N/C
Reserved for Apacer use only1
31
PETp1
PCIe TX Differential signal defined by the PCI Express M.2 spec
32
N/C
No connect
33
GND
Ground
34
N/C
No connect
35
PERn1
PCIe RX Differential signal defined by the PCI Express M.2 spec
36
N/C
No connect
37
PERp1
PCIe RX Differential signal defined by the PCI Express M.2 spec
38
N/C
No connect
39
GND
Ground
40
SMB_CLK
No connect
41
PETn0
PCIe TX Differential signal defined by the PCI Express M.2 spec
42
SMB_DATA
No connect
43
PETp0
PCIe TX Differential signal defined by the PCI Express M.2 spec
44
ALERT#
No connect
45
GND
Ground
46
N/C
No connect
47
PERn0
PCIe RX Differential signal defined by the PCI Express M.2 spec
48
N/C
No connect
49
PERp0
50
PERST#(I)(0/3.3V)
51
GND
52
CLKREQ#(I/O)(0/3.3V)
53
REFCLKn
54
PEWAKE#(I/O)(0/3.3V)
55
REFCLKp
56
Reserved for MFG DATA
PCIe RX Differential signal defined by the PCI Express M.2 spec
PE-Reset is a functional reset to the card as specification. defined by
the PCIe Mini CEM
Ground
Clock Request is a reference clock request signal as defined by the
PCIe Mini CEM specification; Also used by L1 PM Substates.
PCIe Reference Clock signals (100 MHz) spec. defined by the PCI
Express M.2
Open Drain with pull up on platform; Active Low. PCIe PME Wake.
PCIe Reference Clock signals (100 MHz) spec. defined by the PCI
Express M.2
Reserved for Apacer use only1
57
GND
Ground
58
Reserved for MFG CLOCK
Reserved for Apacer use only1
59
Module Key
Module Key
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© 2022 Apacer Technology Inc.
Table 3-1 Pin Assignments
Pin
Type
Description
60
Module Key
Module Key
61
Module Key
Module Key
62
Module Key
Module Key
63
Module Key
Module Key
64
Module Key
Module Key
65
Module Key
Module Key
66
Module Key
Module Key
67
N/C
Reserved for Apacer use only1
68
N/C
No connect
69
PEDET (NC-PCIe)
Host I/F Indication; No connect for PCIe.
70
3.3V
3.3V source
71
GND
Ground
72
3.3V
3.3V source
73
GND
Ground
74
3.3V
3.3V source
75
GND
Ground
Note:
1.
Reserved by Apacer, please do not connect to a host.
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© 2022 Apacer Technology Inc.
4. Product Specifications
4.1 Capacity
Capacity specifications of PV910-M242 are available as shown in Table 4-1. It lists the specific
capacity and the default numbers of heads, sectors and cylinders for each product line.
Table 4-1 Capacity Specifications
Capacity
Total bytes
Total LBA
60 GB
60,022,480,896
117,231,408
120 GB
120,034,123,776
234,441,648
240 GB
240,057,409,536
468,862,128
480 GB
480,103,981,056
937,703,088
Notes:
Display of total bytes varies from operating systems.
1 GB = 1,000,000,000 bytes; 1 sector = 512 bytes.
LBA count addressed in the table above indicates total user storage capacity and will remain the same throughout the
lifespan of the device. However, the total usable capacity of the SSD is most likely to be less than the total physical
capacity because a small portion of the capacity is reserved for device maintenance usages.
4.2 Performance
Performance of PV910-M242 is listed below in Table 4-2.
Table 4-2 Performance Specifications
Capacity
60 GB
120 GB
240 GB
480 GB
Sequential Read (MB/s)
750
1,440
1,630
1,525
Sequential Write (MB/s)
250
495
950
1,280
Random Read IOPS (4K)
41,000
79,000
123,000
136,000
Random Write IOPS (4K)
49,000
99,000
130,000
131,000
Performance
Notes:
Measured with OS version: Win10 (64bit), version 1803 with HMB (Host Memory Buffer), performance may differ from
various flash configurations or host system settings.
Sequential read/write is based on CrystalDiskMark 8.0.4 with file size 1,000MB.
Random read/write is measured using IOMeter with Queue Depth 128.
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© 2022 Apacer Technology Inc.
4.3 Environmental Specifications
Environmental specifications of PV910-M242 are shown in Table 4-3.
Table 4-3 Environmental Specifications
Item
Specifications
Operating temp.
0°C to 70°C (Standard); -40°C to 85°C (Wide)
Non-operating temp.
-40°C to 100°C
Operating vibration
7.69 GRMS, 20~2000 Hz/random (compliant with MIL-STD-810G)
Non-operating vibration
4.02 GRMS, 15~2000 Hz/random (compliant with MIL-STD-810G)
Operating shock
50(G), 11(ms), half-sine wave
Non-operating shock
1,500(G), 0.5(ms), half-sine wave
Note: This Environmental Specification table indicates the conditions for testing the device. Real world usages may affect the
results.
4.4 Mean Time Between Failures (MTBF)
Mean Time Between Failures (MTBF) is predicted based on reliability data for the individual
components in PV910-M242. The prediction result for PV910-M242 is more than 1,000,000 hours.
Note: The MTBF is predicated and calculated based on “Telcordia Technologies Special Report, SR-332, Issue
2” method.
4.5 Certification and Compliance
PV910-M242 complies with the following standards:
FCC
CE
RoHS
MIL-STD-810G
4.6 Endurance
The endurance of a storage device is predicted by Drive Writes Per Day based on several factors
related to usage, such as the amount of data written into the drive, block management conditions, and
daily workload for the drive. Thus, key factors, such as Write Amplifications and the number of P/E
cycles, can influence the lifespan of the drive.
Table 4-4 Endurance Specifications
Capacity
Drive Writes Per Day
60 GB
2.04
120 GB
2.02
240 GB
1.99
480 GB
1.96
Notes:
This estimation complies with JEDEC JESD-219, enterprise endurance workload of random data with payload size
distribution.
Flash vendor guaranteed 3D NAND TLC P/E cycle: 3K
WAF may vary from capacity, flash configurations and writing behavior on each platform.
1 Terabyte = 1,024GB
DWPD (Drive Writes Per Day) is calculated based on the number of times that user overwrites the entire capacity of an
SSD per day of its lifetime during the warranty period. (3D NAND TLC warranty: 3 years)
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4.7 LED Indicator Behavior
The behavior of the PV910-M242 LED indicators is described in Table 4-5.
Table 4-5 LED Behavior
Location
LED
Description
LED A
DAS
LED blinks when the drive is being accessed
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© 2022 Apacer Technology Inc.
5. Flash Management
5.1 Error Correction/Detection
PV910-M242 implements a hardware ECC scheme, based on the Low Density Parity Check (LDPC).
LDPC is a class of linear block error correcting code which has apparent coding gain over BCH code
because LDPC code includes both hard decoding and soft decoding algorithms. With the error rate
decreasing, LDPC can extend SSD endurance and increase data reliability while reading raw data
inside a flash chip.
5.2 Bad Block Management
Bad blocks are blocks that include one or more invalid bits, and their reliability is not guaranteed.
Blocks that are identified and marked as bad by the manufacturer are referred to as “Initial Bad
Blocks”. Bad blocks that are developed during the lifespan of the flash are named “Later Bad Blocks”.
Apacer implements an efficient bad block management algorithm to detect the factory-produced bad
blocks and manages any bad blocks that appear with use. This practice further prevents data being
stored into bad blocks and improves the data reliability.
5.3 Global Wear Leveling
Flash memory devices differ from Hard Disk Drives (HDDs) in terms of how blocks are utilized. For
HDDs, when a change is made to stored data, like erase or update, the controller mechanism on
HDDs will perform overwrites on blocks. Unlike HDDs, flash blocks cannot be overwritten and each
P/E cycle wears down the lifespan of blocks gradually. Repeatedly program/erase cycles performed
on the same memory cells will eventually cause some blocks to age faster than others. This would
bring flash storages to their end of service term sooner. Global wear leveling is an important
mechanism that levels out the wearing of all blocks so that the wearing-down of all blocks can be
almost evenly distributed. This will increase the lifespan of SSDs.
5.4 Flash Translation Layer – Page Mapping
Page mapping is an advanced flash management technology whose essence lies in the ability to
gather data, distribute the data into flash pages automatically, and then schedule the data to be
evenly written. Page-level mapping uses one page as the unit of mapping. The most important
characteristic is that each logical page can be mapped to any physical page on the flash memory
device. This mapping algorithm allows different sizes of data to be written to a block as if the data is
written to a data pool and it does not need to take extra operations to process a write command. Thus,
page mapping is adopted to increase random access speed and improve SSD lifespan, reduce block
erase frequency, and achieve optimized performance and lifespan.
5.5 DataDefenderTM
Apacer’s DataDefender is an advanced technology of power failure management which combines
both firmware and hardware mechanisms to ensure data integrity. When power disruption occurs, the
low voltage detector will be triggered. When this happens, the SSD’s protection mechanism is
activated and cuts off data transmission from the host. Once the power supply is resumed, the
firmware protection mechanism will ensure the integrity of the firmware as well as the data already
written into the NAND flash media.
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5.6 TRIM
TRIM is a feature which helps improve the read/write performance and speed of solid-state drives
(SSD). Unlike hard disk drives (HDD), SSDs are not able to overwrite existing data, so the available
space gradually becomes smaller with each use. With the TRIM command, the operating system can
inform the SSD which blocks of data are no longer in use and can be removed permanently. Thus, the
SSD will perform the erase action, which prevents unused data from occupying blocks all the time.
5.7 Hyper Cache Technology
Apacer proprietary Hyper Cache technology uses a portion of the available capacity as SLC (1bit-percell) NAND flash memory, called Hyper cache mode. When data is written to SSD, the firmware will
direct the data to Hyper Cache mode, providing excellent performance to handle various scenarios in
industrial use.
5.8 Over-provisioning
Over-provisioning (OP) is a certain portion of the SSD capacity exclusively for increasing Garbage
Collection (GC) efficiency, especially when the SSD is filled to full capacity or performs a heavy
mixed-random workload. OP has the advantages of providing extended life expectancy, reliable data
integrity, and high sustained write performance.
5.9 SMART Read RefreshTM
Apacer’s SMART Read Refresh plays a proactive role in avoiding read disturb errors from occurring to
ensure health status of all blocks of NAND flash. Developed for read-intensive applications in
particular, SMART Read Refresh is employed to make sure that during read operations, when the
read operation threshold is reached, the data is refreshed by re-writing it to a different block for
subsequent use.
5.10 NVMe Secure Erase
NVMe Secure Erase is an NVMe drive sanitize command currently embedded in most of the storage
drives. Defined in NVMe specifications, NVMe Secure Erase is part of Format NVM command that
allows storage drives to erase all user data areas. The erase process usually runs on the firmware
level as most of the NVMe-based storage media currently in the market are built-in with this command.
NVMe Secure Erase can securely wipe out the user data in the drive and protects it from malicious
attack.
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6. NVMe Support Features
6.1 Host Memory Buffer
Host Memory Buffer (HMB) allows HOST to allocate system memory for SSD’s exclusive use in order
to provide better performance and endurance, especially for DRAMless solutions.
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7. Security and Reliability Features
7.1 Advanced Encryption Standard
Advanced Encryption Standard (AES) is a specification for the encryption of electronic data. AES has
been adopted by the U.S. government since 2001 to protect classified information and is now widely
implemented in embedded computing applications. The AES algorithm used in software and hardware
is symmetric so that encrypting/decrypting requires the same encryption key. Without the key, the
encrypted data is inaccessible to ensure information security.
Notably in flash memory applications, AES 256-bit hardware encryption is the mainstream to protect
sensitive or confidential data. The hardware encryption provides better performance, reliability, and
security than software encryption. It uses a dedicated processor, which is built inside the controller, to
process the encryption and decryption. This enormously shortens the processing time and makes it
efficient.
7.2 Signed Firmware
Apacer’s Signed Firmware technology is a secure way to update firmware. By including a digital
signature, a firmware update will be authenticated by the Apacer SSD before a firmware update is
performed. This extra layer of protection keeps drives secure.
7.3 Thermal Sensor
Apacer Thermal Sensor is a digital temperature sensor with serial interface. By using designated pins
for transmission, storage device owners are able to read temperature data.
7.4 Thermal Throttling
Thermal throttling can monitor the temperature of the SSD equipped with a built-in thermal sensor.
This method can ensure the temperature of the device stays within temperature limits by drive
throttling, i.e. reducing the speed of the drive when the device temperature reaches the threshold level,
so as to prevent overheating, guarantee data reliability, and prolong product lifespan. When the
temperature exceeds the maximum threshold level, thermal throttling will be triggered to reduce
performance step by step to prevent hardware components from being damaged. Performance is only
permitted to drop to the extent necessary for recovering a stable temperature to cool down the
device’s temperature. Once the temperature decreases to the minimum threshold value, transfer
speeds will rise back to its optimum performance level.
7.5 End-to-End Data Protection
End-to-End Data Protection is a feature implemented in Apacer SSD products that extends error
control to cover the entire path from the host computer to the drive and back, and that ensures data
integrity at multiple points in the path to enable reliable delivery of data transfers. Unlike ECC which
does not exhibit the ability to determine the occurrence of errors throughout the process of data
transmission, End-to-End Data Protection allows SSD controller to identify an error created anywhere
in the path and report the error to the host computer before it is written to the drive. This errorchecking and error-reporting mechanism therefore guarantees the trustworthiness and reliability of the
SSD.
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8. Software Interface
8.1 Command Set
Table 8-1 summarizes the commands supported by PV910-M242.
Table 8-1 Admin Commands
Opcode
Command Description
00h
Delete I/O Submission Queue
01h
Create I/O Submission Queue
02h
Get Log Page
04h
Delete I/O Completion Queue
05h
Create I/O Completion Queue
06h
Identify
08h
Abort
09h
Set Features
0Ah
Get Features
0Ch
Asynchronous Event Request
10h
Firmware Activate
11h
Firmware Image Download
14h
Device Self-test
Table 8-2 Admin Commands – NVM Command Set Specific
Opcode
80h
Command Description
Format NVM
Table 8-3 NVM Commands
Opcode
Command Description
00h
Flush
01h
Write
02h
Read
09h
Dataset Management
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© 2022 Apacer Technology Inc.
8.2 S.M.A.R.T.
SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is an open standard
that allows a hard disk drive to automatically detect its health and report potential failures. When a
failure is recorded by SMART, users can choose to replace the drive to prevent unexpected outage or
data loss. Moreover, SMART can inform users of impending failures while there is still time to perform
proactive actions, such as copy data to another device.
Table 8-4 SMART (02h)
Byte
Length
Description
0
1
Critical Warning
1-2
2
Composite Temperature (PCB Sensor)
3
1
Available Spare
4
1
Available Spare Threshold
5
1
Percentage Used (Average Erase Count / P/E Cycle Count)
6-31
26
Reserved
32-47
16
Data Units Read
48-63
16
Data Units Written
64-79
16
Host Read Commands
80-95
16
Host Write Commands
96-111
16
Controller Busy Time
112-127
16
Power Cycles
128-143
16
Power On Hours
144-159
16
Unsafe Shutdowns
160-175
16
Media and Data Integrity Errors
176-191
16
Number of Error Information Log Entries
192-195
4
Warning Composite Temperature Time
196-199
4
Critical Composite Temperature Time
200-201
2
Temperature Sensor 1: Controller Temperature
202-203
2
Temperature Sensor 2: PCB Temperature
204-205
2
Temperature Sensor 3: NAND Flash Temperature
206-207
2
Temperature Sensor 4
208-209
2
Temperature Sensor 5
210-211
2
Temperature Sensor 6
212-213
2
Temperature Sensor 7
214-215
2
Temperature Sensor 8
216-511
296
Reserved
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Table 8-5 SMART (C0h)
Byte
Length
Description
0-255
256
256-257
2
SSD Protect Mode
258-261
4
Host Read UNC Count
262-265
4
PHY Error Count
266-269
4
CRC Error Count
270-273
4
Total Early Bad Block Count
274-277
4
Total Later Bad Block Count
278-281
4
Max Erase Count
282-285
4
Average Erase Count
286-289
4
Program Fail Count
290-293
4
Erase Fail Count
294-301
8
Flash Write Sector
302-305
4
Total Spare Block
306-309
4
Current Spare Block
310-313
4
Read Retry Count
314-511
210
Reserved
Reserved
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© 2022 Apacer Technology Inc.
9. Electrical Specifications
9.1 Operating Voltage
Table 9-1 lists the supply voltage for PV910-M242.
Table 9-1 Operating Range
Item
Range
Supply Voltage
3.3V ± 5%
9.2 Power Consumption
Table 9-2 lists the power consumption for PV910-M242.
Table 9-2 Power Consumption (Unit: mA)
Capacity
60 GB
120 GB
240 GB
480 GB
Active (Max.)
350
545
605
645
Idle
140
145
140
145
Mode
Notes:
All values are typical and may vary depending on flash configurations or host system settings.
Power consumption is measured using CrystalDiskMark 8.0.4.
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© 2022 Apacer Technology Inc.
10. Mechanical Specifications
10.1 Dimensions
Unit: mm
Figure 10-1 Dimensions
10.2 Net Weight
Table 10-1 Net Weight
Capacity
Net Weight (g ± 5%)
60GB
3.01
120GB
3.39
240GB
3.39
480GB
3.53
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© 2022 Apacer Technology Inc.
11. Product Ordering Information
11.1 Product Code Designations
Apacer’s PV910-M242 is available in different configurations and densities. See the chart below for a
comprehensive list of options for the PV910-M242 series devices.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
B
7
2
.
9
1
5
X
X
B
.
0
0
2
0
7
Code
Code 1-3
(Product Line & Form Factor)
Code 5-6
(Model/Solution)
Code 7-8
(Product Capacity)
Code 9
(Flash Type & Product Temp)
Code 10
(Product Spec)
Code 12-14
(Version Number)
Code 15-16
(Firmware Version)
PCIe M.2 2242
PV910-M242
5G: 60GB
5H: 120GB
5J: 240GB
5K: 480GB
G: 3D TLC Standard Temperature
H: 3D TLC Wide Temperature
Double side B+M key
Random numbers generated by system
Thermal Sensor OP
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© 2022 Apacer Technology Inc.
11.2 Valid Combinations
The following table lists the available models of the PV910-M242 series which are in mass production
or will be in mass production. Consult your Apacer sales representative to confirm availability of valid
combinations and to determine availability of new combinations.
Capacity
Standard Temperature
Wide Temperature
60GB
B72.915GGB.00207
B72.915GHB.00207
120GB
B72.915HGB.00207
B72.915HHB.00207
240GB
B72.915JGB.00207
B72.915JHB.00207
480GB
B72.915KGB.00207
B72.915KHB.00207
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© 2022 Apacer Technology Inc.
Revision History
Revision
Description
Date
1.0
Initial release
4/26/2022
- Updated Performance and Power Consumption on Specifications
Overview page
- Updated the description for pins 30, 56, 58 and 67 at Table 3-1
1.1
- Updated Table 4-2 and CDM version at the notes
7/5/2022
- Updated endurance rating and warranty period at Endurance on
Specifications Overview page and 4.6 Endurance
- Updated Table 9-2
1.2
Updated pin type and description of pins 12-19, 46, 48 and 68 at
Table 3-1
8/17/2022
1.3
Modified pin type and description of pins 5, 7, 11, 23 and 25 at Table
3-1
11/22/2022
22
© 2022 Apacer Technology Inc.
Global Presence
Taiwan (Headquarters)
U.S.A.
Apacer Technology Inc.
1F., No.32, Zhongcheng Rd., Tucheng Dist.,
New Taipei City 236, Taiwan R.O.C.
Tel: 886-2-2267-8000
Fax: 886-2-2267-2261
amtsales@apacer.com
Apacer Memory America, Inc.
46732 Lakeview Blvd., Fremont, CA 94538
Tel: 1-408-518-8699
Fax: 1-510-249-9551
sa@apacerus.com
Japan
Europe
Apacer Technology Corp.
6F, Daiyontamachi Bldg., 2-17-12, Shibaura, Minato-Ku,
Tokyo, 108-0023, Japan
Tel: 81-3-5419-2668
Fax: 81-3-5419-0018
jpservices@apacer.com
Apacer Technology B.V.
Science Park Eindhoven 5051 5692 EB Son,
The Netherlands
Tel: 31-40-267-0000
Fax: 31-40-290-0686
sales@apacer.nl
China
India
Apacer Electronic (Shanghai) Co., Ltd
Room D, 22/FL, No.2, Lane 600, JieyunPlaza,
Tianshan RD, Shanghai, 200051, China
Tel: 86-21-6228-9939
Fax: 86-21-6228-9936
sales@apacer.com.cn
Apacer Technologies Pvt Ltd,
1874, South End C Cross, 9th Block Jayanagar,
Bangalore-560069, India
Tel: 91-80-4152-9061/62
Fax: 91-80-4170-0215
sales_india@apacer.com
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© 2022 Apacer Technology Inc.
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