microSD™, microSDHC™ and
microSDXC™Cards
OEM Product Manual
Revision 3.7
Document No. 80-36-03335
September 2015
SanDisk Corporation
Corporate Headquarters • 951 SanDisk Drive • Milpitas, CA 95035
Phone (408) 801-1000 • Fax (408) 801-8657
www.sandisk.com
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SanDisk microSD™, microSDHC™ and microSDXC™ cards
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Products, samples and prototypes are subject to update and change for technological and manufacturing
purposes.
SanDisk Corporation general policy does not recommend the use of its products in life support applications
wherein a failure or malfunction of the product may directly threaten life or injury. Without limitation to the
foregoing, SanDisk shall not be liable for any loss, injury or damage caused by use of its products in any of
the following applications:
•
Special applications such as military related equipment, nuclear reactor control, and aerospace
•
Control devices for automotive vehicles, train, ship and traffic equipment
•
Safety system for disaster prevention and crime prevention
•
Medical-related equipment including medical measurement device
Accordingly, in any use of SanDisk products in life support systems or other applications where failure
could cause damage, injury or loss of life, the products should only be incorporated in systems designed
with appropriate redundancy, fault tolerant or back-up features. Per SanDisk Terms and Conditions of
Sale, the user of SanDisk products in life support or other such applications assumes all risk of such use
and agrees to indemnify, defend and hold harmless SanDisk Corporation and its affiliates against all
damages.
Security safeguards, by their nature, are capable of circumvention. SanDisk cannot, and does not,
guarantee that data will not be accessed by unauthorized persons, and SanDisk disclaims any warranties
to that effect to the fullest extent permitted by law.
This document and related material is for information use only and is subject to change without prior notice.
SanDisk Corporation assumes no responsibility for any errors that may appear in this document or related
material, nor for any damages or claims resulting from the furnishing, performance or use of this document
or related material. SanDisk Corporation explicitly disclaims any express and implied warranties and
indemnities of any kind that may or could be associated with this document and related material, and any
user of this document or related material agrees to such disclaimer as a precondition to receipt and usage
hereof. EACH USER OF THIS DOCUMENT EXPRESSLY WAIVES ALL GUARANTIES AND
WARRANTIES OF ANY KIND ASSOCIATED WITH THIS DOCUMENT AND/OR RELATED MATERIALS,
WHETHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION, ANY IMPLIED WARRANTY
OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR INFRINGEMENT,
TOGETHER WITH ANY LIABILITY OF SANDISK CORPORATION AND ITS AFFILIATES UNDER ANY
CONTRACT, NEGLIGENCE, STRICT LIABILITY OR OTHER LEGAL OR EQUITABLE THEORY FOR
LOSS OF USE, REVENUE, OR PROFIT OR OTHER INCIDENTAL, PUNITIVE, INDIRECT, SPECIAL OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION PHYSICAL INJURY OR DEATH,
PROPERTY DAMAGE, LOST DATA, OR COSTS OF PROCUREMENT OF SUBSTITUTE GOODS,
TECHNOLOGY OR SERVICES.
No part of this document may be reproduced, transmitted, transcribed, stored in a retrievable manner or
translated into any language or computer language, in any form or by any means, electronic, mechanical,
magnetic, optical, chemical, manual or otherwise, without the prior written consent of an officer of SanDisk
Corporation.
All parts of the SanDisk documentation are protected by copyright law and all rights are reserved.
SanDisk and the SanDisk logo are trademarks of SanDisk Corporation, registered in the United States and
other countries. SD, microSD, microSDHC and microSDXC marks and logos are trademarks of SD-3C,
LLC. All other brand names mentioned herein are for identification purposes only and may be the
trademarks of their respective holder(s).
© 2015 SanDisk Corporation. All rights reserved.
Document No. 80-36-03335 Rev 3.7
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Revision History
Date
Revision
Description
July 2008
1.0
First Revision
June 2010
2.0
Added 32 GB
Replaced SD 2.0 with SD 3.0
ACMD41 to ready after power up updated
Updated marking, section 5
Updated Tables 7, 9, and 11 to remove < 1G references
Updated Figure 1 – SD card block diagram
March 2011
2.1
Added speed class to Ordering Information Table
April 2011
2.2
Added 64GB and updated SDA 3.0 to SD3.UHS-I 50
October 2011
2.3
Added SDSDQAC SKUs to Ordering Information.
Updated Figure 7 to add High Performance figure.
November 2011
2.4
Added Ordering Information.
Reference to SDA corrections. Added SDSDQAD SKUs to
Ordering Information
Marking info updated with alternate laser marking guide and
Premier microSD product marking info
January 2012
2.5
July 2012
2.6
July 2013
3.0
November 2013
3.1
February 2014
3.2
May 2014
3.3
June 2014
3.4
Remove figures 4 and 5. Update Table 2. Update Section 5.
July 2014
3.5
Updated section 1.1 and 1.2, from 64GB to 128GB
October 2014
3.6
Updated CID Register
September 2015
3.7
Added 200GB part number
Removed High Performance line (SDSDQAC)
Added SDSDQAE SKUs
Removed SDSDQ SKUs
Removed random IOPs performance from ordering information
Updated Table 2: Card Power and Section 6: Ordering
information
Added 128GB microSD – SDSDQAD-128G
Updated Table 10
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Table of Contents
1
Introduction......................................................................................... 1
1.1 General Description ....................................................................... 1
1.2 Features....................................................................................... 2
1.3 Scope .......................................................................................... 2
1.4 SD Card Standard ......................................................................... 2
1.5 Functional Description .................................................................... 3
1.5.1 Technology Independence .................................................... 3
1.5.2 Defect and Error Management ............................................... 3
1.5.3 Content Protection ............................................................... 3
1.5.4 Wear Leveling ..................................................................... 3
1.5.5 Automatic Sleep Mode.......................................................... 3
1.5.6 Hot Insertion ...................................................................... 4
1.6 microSD Card Products in SD Bus Mode ............................................ 4
1.7 SPI Mode ..................................................................................... 6
2
Product Specifications ........................................................................... 7
2.1 microSD Card Product Family .......................................................... 7
2.1.1 Typical Card Power Requirements .......................................... 7
2.1.2 System Performance ............................................................ 8
2.1.3 Reliability and Durability ....................................................... 9
2.1.4 Physical Specifications ......................................................... 9
3
Interface Description........................................................................... 10
3.1 Pins and Registers ....................................................................... 10
3.2 Bus Topology .............................................................................. 11
3.2.1 SD Bus ............................................................................ 11
3.2.2 SPI Bus ............................................................................ 11
3.3 Hot Insertion and Power Protection ................................................ 11
3.4 Electrical Interface ....................................................................... 11
3.4.1 Power Up ......................................................................... 11
3.4.2 Bus Operating Conditions ................................................... 12
3.4.3 Bus Timing ....................................................................... 12
3.5 microSD Card Product Family Registers .......................................... 12
3.5.1 Operation Conditions Register ............................................. 12
3.5.2 Card Identification Register................................................. 12
3.5.3 Card Specific Data Register ................................................. 13
3.5.4 Card Status Register .......................................................... 16
3.5.5 SD Status Register ............................................................ 16
3.5.6 Relative Card Address Register ............................................ 16
3.5.7 SD Card Configuration Register ........................................... 16
3.5.8 microSD Card Product Family Registers in SPI Mode ............... 16
3.5.9 Data Interchange Format and Card Sizes .............................. 16
4
microSD Card Protocol Description ........................................................ 17
4.1 General Description ..................................................................... 17
4.2 SD Bus Protocol .......................................................................... 17
4.3 Functional Description .................................................................. 17
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4.3.1 Card Identification Mode..................................................... 17
4.3.2 Data Transfer Mode ........................................................... 17
4.3.3 Clock Control .................................................................... 18
4.3.4 Cyclic Redundancy Codes ................................................... 18
4.3.5 Error Conditions ................................................................ 18
4.3.6 Commands ....................................................................... 18
4.3.7 Card State Transition ......................................................... 18
4.3.8 Timing Diagrams and Values ............................................... 18
4.3.9 Speed Class Specification ................................................... 18
4.3.10 Erase Timeout Calculation .................................................. 18
5
Marking............................................................................................. 19
6
Ordering Information .......................................................................... 20
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INTRODUCTION
1.1 General Description
SanDisk’s microSD™, microSDHC™ (High Capacity) and microSDXC™ (Extended
Capacity) cards are flash based removable non-volatile memory devices specifically
designed to meet the security, capacity, performance and environmental requirements
inherent in next generation mobile phones and consumer electronic devices.
The microSD card includes a content protection system that complies with the
security of the Secure Digital Music Initiative (SDMI) standard and has a higher
memory capacity. In the microSD card, card content is protected from unauthorized
use by mutual authentication and a cipher algorithm. Unsecured access to the user's
own content is also available.
microSD cards are based on an 8-pin interface designed to operate in a maximum
operating frequency of 208 MHz. The interface for microSD card products allows for
easy integration into any design, regardless of which type of microprocessor is used.
In addition to the interface, microSD card products offer an alternate communicationprotocol based on the SPI standard.
SanDisk’s microSD card Product Family provides up to 200 gigabytes (GB)1 of
memory using flash memory chips, which were designed especially for use in mass
storage applications. In addition to the mass storage-specific flash memory chip, cards
in the microSD card product family includes an on-board intelligent controller which
manages interface protocols; security algorithms for content protection; data storage
and retrieval, as well as Error Correction Code (ECC) algorithms; defect handling;
power management; wear leveling, and clock control.
SD Bus/SPI Bus
Interface
SanDisk
Single Chip
Controller
Data In/Out
Control
NAND
SanDisk microSD Card
Figure 1: SanDisk’s microSD Card Block Diagram
1
1
Gigabyte
(GB)
=
1
billion
bytes.
Some
capacity
is
not
available
for
data
storage.
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1.2 Features
General features of cards in the SanDisk microSD Memory Card Product Family
include:
•
•
•
•
•
•
•
•
•
•
•
•
•
Up to 200 GB2 of data storage
SD - protocol compatible
Supports SPI Mode
Targeted for portable and stationary applications for secured (content protected)
and unsecured data storage
Voltage range of 2.7 to 3.6V
Variable clock rate 0-25 MHz (standard), 0-50 MHz (high performance), 0-208
MHz (Ultra High Speed)
Up to 104 MB/sec* data transfer rate (using four parallel data lines)
Memory field error correction
Content protection mechanism that complies with highest security of SDMI
standard
Password protection
Built-in write protection features (permanent and temporary)
Supports card detection (insertion and removal)
Application-specific commands
1.3 Scope
This document describes key features and specifications of the microSD cards as well
as the information required to interface these products to a host system. Chapter 2
describes the physical and mechanical properties of cards in the microSD card product
family, Chapter 3 contains the pins and register overview, and
Chapter 4 gives a general overview of the SD protocol. Information about SPI
Protocol can be referenced in Section 7 of the SDA Physical Layer Specification,
Version 3.01.
1.4 SD Card Standard
SanDisk’s microSD memory cards are fully compatible with the SDA Physical Layer
Specification, Version 3.01. This specification is available from the SD Card
Association (SDA).
SD Card Association
2400 Camino Ramon, Suite 375
San Ramon, CA 94583 USA
Telephone: +1 (925) 275-6615
Fax: +1 (925) 886-4870
E-mail: office@sdcard.org
Web site: www.sdcard.org
2
1
Gigabyte
(GB)
=
1
billion
bytes.
Some
capacity
is
not
available
for
data
storage.
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agreements.
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1.5 Functional Description
The family of SanDisk microSD cards contains a high-level, intelligent subsystem as
shown in Figure 1. This intelligent (microprocessor) subsystem provides many
capabilities not found in other types of memory cards. These capabilities include:
•
Host independence from details of erasing and programming flash memory
•
Sophisticated system for managing defects (analogous to systems found in
magnetic disk drives)
•
Sophisticated system for error recovery including a powerful ECC
•
Power management for low power operation
1.5.1
Technology Independence
The 512-byte sector size of a card in the microSD card product family is the same as
that in an IDE magnetic disk drive. To write or read a sector (or multiple sectors), the
host software simply issues a read or write command to the card. The command
contains the address and number of sectors to write or read. The host software then
waits for the command to complete.
The host software does not get involved in the details of how the flash memory is
erased, programmed or read. This is extremely important because flash devices are
expected to get increasingly complex in the future. Because cards in the SanDisk
microSD Card Product Family use an intelligent on-board controller, host system
software will not need to be updated as new flash memory evolves. In other words,
systems that support the microSD Card Product Family today will be able to access
future SanDisk cards built with new flash technology without having to update or
change host software.
1.5.2
Defect and Error Management
The SanDisk microSD Card Product Family contains a sophisticated defect and error
management system. This system is analogous to the systems found in magnetic disk
drives and in many cases offers enhancements. If necessary, SanDisk microSD Card
Product Family will rewrite data from a defective sector to a good sector. This is
completely transparent to the host and does not consume any user data space. In the
extremely rare case that a read error does occur, SanDisk microSD Memory Card
Product Family has innovative algorithms to recover the data. These defect and error
management systems, coupled with the solid state construction, give SanDisk
microSD Card Product Family enormous reliability.
1.5.3
Content Protection
A detailed description of the content protection mechanism and related security SD
commands can be found in the SD Security Specification from the SDA. All SD
security-related commands in the SanDisk microSD Card Product Family operate in
the data transfer mode.
1.5.4
Wear Leveling
Wear leveling is an intrinsic part of the erase pooling functionality of cards in the
SanDisk microSD Card Product Family using NAND memory.
1.5.5
Automatic Sleep Mode
A unique feature of cards in the SanDisk microSD Card Product Family is automatic
entrance and exit from sleep mode. Upon completion of an operation, cards enter
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sleep mode to conserve power if no further commands are received in less than 5
milliseconds (ms). The host does not have to take any action for this to occur.
However, in order to achieve the lowest sleep current, the host needs to shut down its
clock to the card. In most systems, cards are in sleep mode except when accessed by
the host, thus conserving power.
When the host is ready to access a card in sleep mode, any command issued to it will
cause it to exit sleep, and respond.
1.5.6
Hot Insertion
Support for hot insertion will be required on the host but will be supported through
the connector. Connector manufacturers will provide connectors that have power pins
long enough to be powered before contact is made with the other pins.
1.6 microSD Card Products in SD Bus Mode
The following sections provide valuable information on cards in the SanDisk
microSD Card Product Family in SD Bus mode.
Cards in the SanDisk microSD Card Product Family are fully compliant with the SDA
Physical Layer Specification, Version 3.01. Card Specific Data (CSD) Register
structures are compliant with CSD Structure 1.0 and 2.0.
This section covers Negotiating Operating Conditions, Card Acquisition and
Identification, Card Status, Memory Array Partitioning, Read/Write Operations, Data
Transfer Rate, Data Protection in Flash Cards, Write Protection, Copy Bit, and CSD
Register.
Additional practical card detection methods can be found in application notes
pertaining to the SDA Physical Layer Specification, Version 3.01.
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SanDisk microSD Card
Figure 2: Memory Array Partitioning
Figure 3: Data Transfer Formats
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Table 1 contains descriptions for each transfer mode.
Table 1: Mode Descriptions
Mode
Single Block
Description
In this mode the host reads or writes one data block in a pre-specified length.
The data block transmission is protected with 16-bit CRC that is generated by
the sending unit and checked by the receiving unit.
The block length for read operations is limited by the device sector size (512
bytes) but can be as small as a single byte. Misalignment is not allowed. Every
data block must be contained in a single physical sector.
The block length for write operations must be identical to the sector size and
the start address aligned to a sector boundary.
Multiple Block
This mode is similar to the single block mode, except for the host can read/
write multiple data blocks (all have the same length) that are stored or retrieved
from contiguous memory addresses starting at the address specified in the
command. The operation is terminated with a stop transmission command.
Misalignment and block length restrictions apply to multiple blocks and are
identical to the single block read/write operations.
1.7 SPI Mode
The SPI Mode is a secondary communication protocol for cards in the SanDisk
microSD Card Product Family. This mode is a subset of the SD Protocol, designed to
communicate with an SPI channel, commonly found in Motorola and other vendors'
microcontrollers. Detailed information about SPI Mode can be found in Section 7 or
the SDA Physical Layer Specification, Version 3.01.
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PRODUCT SPECIFICATIONS
2.1 microSD Card Product Family
This section provides product specifications for the microSD Card Product Family.
For more details about the environmental, reliability and durability specifications,
refer the SDA Physical Layer Specification, Version 3.01 and microSD card
addendum v3.0.
2.1.1
Typical Card Power Requirements
The values stated in Table 2 represent the SanDisk microSD Card power
requirements.
Table 2: microSD Card Power Requirements
Mode
Maximum Value
Typical Value at 25C
Standard Mode (25 MHz)
500 uA
600 uA (128/200GB)
Sleep
Read
100 mA
Write
100 mA
Standard Mode – for SDXC card XPC bit on (25 MHz)
Host selected XPC bit in
ACMD41
500 uA
600 uA (128/200GB)
Sleep
Read
150 mA
Write
150 mA
High Performance Mode (50 MHz)
500 uA
600 uA (128/200GB)
Sleep
Read
200 mA
Write
200 mA
UHS-I SDR50 Mode – (100 MHz)
500 uA
600 uA (128/200GB)
Sleep
Read
400 mA
Write
400 mA
UHS-I DDR50 Mode – (50 MHz)
500 uA
600 uA (128/200GB)
Sleep
Read
400 mA
Write
400 mA
UHS-I SDR104 Mode – (208 MHz)
500 uA
600 uA (128/200GB)
Sleep
Read
800 mA
Write
800 mA
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Note: Current consumption is measured by averaging over one (1) second. Refer to
Section 6.6.3 of the SDA Physical Layer Specification, Version 3.01 for more
information
2.1.2
System Performance
This section provides the system performance specifications for the SanDisk microSD
Card Product Family. All performance values in Table 3 were measured under the
following conditions:
•
Voltage range 2.7 to 3.6V
•
Operating temperature -25°C to 85°C
•
Independent of card clock frequency
Table 3: System Performance
Timing
Maximum Value
Block Read Access Time
100 ms
Block Write Access Time
250 ms for SDHC,
500 ms for SDXC
ACMD41 to ready after power-up
1s
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Reliability and Durability
For microSD environmental, reliability and durability specifications, refer to SDA
Physical Layer Specification, Version 3.01 and microSD Card Addendum v3.0.
2.1.4
Physical Specifications
For detail dimensions and tolerances refer to SDA microSD Card Addendum,
Mechanical Specification for microSD Memory Card.
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INTERFACE DESCRIPTION
3.1 Pins and Registers
The microSD Card Product Family has exposed contacts on one side. The host uses a
dedicated connector to connect to microSD cards.
In Table 4, pin assignments for the microSD Card are described for SD Bus Mode and
SPI Bus Mode
Note: Pin assignments are provided by the SDA Physical Layer Specification,
Version 3.01 and associated addendums (microSD). For more details, refer to Section
3.7 of the SDA Physical Layer Specification, Version 3.01
Table 4: SD Bus Mode Pin Assignment
Pin No.
SD Mode
Name
1
DAT2
Type
2,5
1
I/O/PP
2
2
CD/DAT3
3
CMD
PP
4
VDD
5
Data Line [bit 2]
Name
RSV
Type
3
1
Description
Reserved
Card Detect/Data Line [bit 3]
CS
I
Command/Response
DataIn
I
Data In
S
Supply Voltage
VDD
S
Supply Voltage
CLK
I
Clock
SCLK
I
Clock
6
VSS
S
Supply voltage ground
VSS
S
Supply voltage ground
7
DAT0
Data Line [bit 1]
DataOUT
O/PP
Data Out
Data Line [bit 2]
4
-
Reserved
8
DAT1
I/O/PP
3
Description
SPI mode
I/O/PP
2,4
I/O/PP
RSV
Chip select (active low)
Notes: 1. Type Key: S=power supply; I=input; O=output using push-pull drivers; PP=I/O using
push-pull drivers.
2.
The extended DAT lines (DAT1-DAT3) are input on power up. They start to
operate as DAT lines after the SET_BUS_WIDTH command. It is the responsibility
of the host designer to connect external pull-up resistors to all data lines even if
only DAT0 is to be used. If not, there may be unexpected high current consumption
due to the floating inputs of DAT1 & DAT2 (if they are not used).
3.
At power up this line has a 50 kilohm pull-up enabled in the card. This resistor
serves two functions: Card Detection and Mode Selection. For Mode Selection, the
host can drive the line high or let it be pulled high to select SD mode. If the host
wants to select SPI mode, it should drive the line low. For Card Detection, the host
detects that the line is pulled high. The user should disconnect this pull-up with
SET_CLR_CARD_DETECT (ACMD42) command during regular data transfer.
4.
DAT1 line may be used as Interrupt Output (from the Card) in SDIO mode during
all the times that it is not in use for data transfer operations.
5.
DAT2 line may be used as Read Wait signal in SDIO mode.
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Each card has a set of information registers. Register descriptions and SDA references
are provided in Section 5.0 of the SDA Physical Layer Specification, Version 3.01.
Table 5: microSD Card Product Family Register Overview
Register
Abbreviation
Width (in bits)
CID
128
Card identification number
RCA
16
Relative card address
CSD
128
Card specific data
SCR
64
SD configuration register
OCR
32
Operation condition register
SSR
512
SD status register
CSR
32
Card status register
Register Name
3.2 Bus Topology
The family of microSD products supports two communication protocols: SD and SPI.
For more details, refer to Section 3.5 of the SDA Physical Layer Specification,
Version 3.01. Section 6 of the specification contains a bus circuitry diagram for
reference.
3.2.1
SD Bus
For more details, refer to Section 3.5.1 of the SDA Physical Layer Specification,
Version 3.01.
3.2.2
SPI Bus
For more details, refer to Section 3.5.2 of the SDA Physical Layer Specification,
Version 3.01.
3.3 Hot Insertion and Power Protection
Refer to Section 6.1 and Section 6.2 of the SDA Physical Layer Specification,
Version 3.01.
3.4 Electrical Interface
The power scheme of microSD products is handled locally in each card and in the bus
master. Refer to Section 6.4 of the SDA Physical Layer Specification, Version 3.01.
3.4.1
Power Up
Power must be applied to the VDD pin before any I/O pin is set to logic HIGH. In
other words, CMD, CLK, and DAT0-3 must be at zero (0) volts when power is
applied to the VDD pin. For more information, refer to Section 6.4.1 of the SDA
Physical Layer Specification, Version 3.01.
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Card VDD
Figure 4: Recommended Power Control Scheme
The recommended power control scheme for microSD cards is illustrated in Figure 4.
Most card connectors have a card detect switch that signals the SD host when the card
is inserted. After the host is aware of the card insertion, it turns on the FET switch to
apply power to card's VDD pin.
Once the card is inserted and all card pins are making contact, there should be a delay
before the FET switch is turned on.
Note: Because there are clamping diodes on the CMD, CLK, and DAT0-3 pins, it is
crucial to ensure that CLK, CMD, and DAT0-3 are at zero (0) volts during the delay
and before the FET switch is turned on. If any I/O pin, (CMD, CLK, or DAT0-3) goes
above zero volts during the delay and before power reaches the card VDD pin, it will
forward bias the clamping diodes and can cause the card to go into an unknown state.
It is the host's responsibility to make sure power gets to VDD before CMD, CLK, or
DAT0-3 go above zero volts.
3.4.2
Bus Operating Conditions
SPI Mode bus operating conditions are identical to SD Card Bus Mode operating
conditions. For details, see Section 6.6 of the SDA Physical Layer Specification,
Version 3.01.
3.4.3
Bus Timing
See SDA Physical Layer Specification, Version 3.01.
3.5 microSD Card Product Family Registers
There is a set of eight registers within the card interface. However, the DSR Register
is optional and is not used in the SanDisk microSD Card Product Family. For specific
information about all registers, refer to Section 5 of the SDA Physical Layer
Specification, Version 3.01.
3.5.1
Operation Conditions Register
The Operation Conditions Register (OCR) stores a card's VDD voltage profile. Refer
to Section 5.1 of the SDA Physical Layer Specification, Version 3.01 for more
information.
3.5.2
Card Identification Register
The Card Identification (CID) Register is 16 bytes long and contains the unique card
identification number. It is programmed during card manufacturing and cannot be
changed by card hosts. See Table 8.
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Table 6: CID Register Definitions
Name
Type
Width
CID Value
Comments
Manufacturer ID
(MID)
Binary
8
0x03
Manufacturer IDs are
controlled and assigned
by the SD-3C, LLC
OEM/Application ID
(OID)
ASCII
16
SD ASCII Code 0x53, 0x44
Identifies the card OEM
and/or the card
contents. The
OID is controlled and
assigned by the SD-3C,
LLC
Product Name
(PNM)
ASCII
Product Revision
PRV)
40
BCD
8
SKU prefix
Value1
Value2
SDSDQAB
SUXXG
SSXXG
SDSDQAD
SUXXG
SLXXG
SDSDQAE
SUXXG
SEXXG
Product Revision xx
Five-character ASCII
string.
Product Name could be
either Value1 or Value2.
XXG =
04G,08G,16G,32G,64G,
or 128, 200 referring to
capacity (note: 128 and
200 are 128GB and
200GB card,
respectively)
See Section 5.2 in the
SDA Physical Layer
Specification,
Version 3.01.
Serial Number
(PSN)
Binary
32
Product serial number
32-bit unsigned integer
Reserved
-
4
-
-
Manufacturer Date
Code (MDT)
BCD
12
Manufacture date (for example,
April 2001=0x014)
Manufacturing date–
yym (offset from 2000)
CRC7 Checksum
(CRC)
Binary
7
CRC7
Calculated
Not used, always 1
-
1
-
-
3.5.3
Card Specific Data Register
The Card Specific Data (CSD) Register configuration information is required to
access card data. The CSD defines the data format, error correction type, maximum
data access time, etc. The field structures of the CSD Register vary depending on the
physical specifications and card capacity. The CSD_STRUCTURE field in the CSD
Register indicates which structure version is used. Table 9 shows the version number
as it relates to the CSD structure. Refer to Section 5.3.1 of the SDA Physical Layer
Specification, Version 3.01 for more information.
Table 7: CSD Register Structure
CSD_Structure
CSD Structure Version
0
CSD Version 1.0
Valid for SD Card Physical
Specification / Card Capacity
Version 1.01 to 1.10
Version 2.00/Standard Capacity
1
CSD Version 2.0
Version 2.00/High Capacity and
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Extended Capacity
2-3
Reserved
-
Table 8 provides an overview of the CSD Register. More field-specific information
can be found in Section 5.3.2 of the SDA Physical Layer Specification, Version 3.01.
Table 8: CSD Register (CSD Version 1.0)
Field
Typical CSD Value
Description
CSD_STRUCTURE
1.0
CSD Structure
-
-
Reserved
TAAC
1.5 msec
Data read access-time-1
NSAC
0
Data read access-time-2 in CLK cycles
(NSAC*100)
TRANS_SPEED
Standard Mode 25 MHz
High Performance Mode 50MHz
Maximum data transfer rate
Ultra High Speed Mode-I
104MHz
CCC
All (inc. WP, lock/unlock)
Card command classes
READ_BL_LEN
2G = 0xA
Up to 1G – 0x9
Maximum read data block length
READ_BL_PARTIAL
Yes
Partial blocks for read allowed
WRITE_BLK_MISALIGN
No
Write block misalignment
READ_BLK_MISALIGN
No
Read block misalignment
DSR_IMP
No
DSR implemented
-
-
Reserved
C_SIZE
1 GB
2 GB
Secured
0xF22
0xF24
Device size
VDD_R_CURR_MIN
100 mA
Maximum read current @VDD min
VDD_R_CURR_MAX
80 mA
Maximum read current @VDD max
VDD_W_CURR_MIN
100 mA
Maximum write current @VDD min
VDD_W_CURR_MAX
80 mA
Maximum write current @VDD max
C_SIZE_MULT
2G=2048
1G-1024
Device size multiplier
ERASE_BLK_EN
Yes
Erase single block enable
SECTOR_SIZZE
31 blocks
Erase sector size
WP_GRP_SIZE
127 sectors
Write protect group size
WP_GRP_ENABLE
Yes
Write protect group enable
Reserved
-
Reserved for MMC compatibility
R2W_FACTOR
X16
Write speed factor
WRITE_BL_LEN
0x9
Maximum write data block length
WRITE_BL_PARTIAL
No
Partial blocks for write allowed
-
-
Reserved
FILE_FORMAT_GRP
0
File format group
COPY
Has been copied
Copy flag (OTP)
PERM_WRITE_PROTECT
Not protected
Permanent write protection
TMP_WRITE_PROTECT
Not protected
Temporary write protection
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Field
OEM Product Manual
3.7
Typical CSD Value
Description
FILE_FORMAT
HD w/partition
File format
Reserved
-
Reserved
CRC
CRC7
CRC
-
-
Not used, always "1"
Refer to Section 5.3.3, Table 5-16 of the SDA Physical Layer Specification, Version
3.01 for more detailed information.
Table 9: CSD Register (CSD Version 2.0)
Field
Typical CSD Value
Description
CSD_STRUCTURE
2.0
CSD Structure
-
-
Reserved
TAAC
1.5 msec
Data read access-time
NSAC
0
Data read access-time-2 in CLK cycles
(NSAC*100)
TRANS_SPEED
Standard Mode 25 MHz
High Performance Mode 50MHz
Maximum data transfer rate
Ultra High Speed Mode 104MHz
CCC
All (inc. WP, lock/unlock)
Card command classes
READ_BL_LEN
9
Maximum read data block length
READ_BL_PARTIAL
Yes
Partial blocks for read allowed
WRITE_BLK_MISALIGN
No
Write block misalignment
READ_BLK_MISALIGN
No
Read block misalignment
DSR_IMP
No
DSR implemented
-
0
Reserved
C_SIZE
See SDA Physical Layer
Specification
Device size
-
0
Reserved
ERASE_BLK_EN
1
Erase single block enable
SECTOR_SIZE
64 blocks
Erase sector size
WP_GRP_SIZE
000000b
Write protect group size
WP_GRP_ENABLE
No
Write protect group enable
Reserved
-
Reserved for MMC compatibility
R2W_FACTOR
X4
Write speed factor
WRITE_BL_LEN
Maximum write data block length
WRITE_BL_PARTIAL
No
Partial blocks for write allowed
-
-
Reserved
FILE_FORMAT_GRP
0
File format group
COPY
Has been copied
Copy flag (OTP)
PERM_WRITE_PROTECT
Not protected
Permanent write protection
TMP_WRITE_PROTECT
Not protected
Temporary write protection
FILE_FORMAT
HD w/partition
File format
Reserved
-
Reserved
CRC
CRC7
CRC
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SanDisk microSD™, microSDHC™ and microSDXC™ cards
Field
-
Typical CSD Value
-
3.5.4
OEM Product Manual
3.7
Description
Not used, always "1"
Card Status Register
The Card Status Register (CSR) transmits the card's status information (which may be
stored in a local status register) to the host. The CSR is defined in Section 4.10.1 in
the SDA Physical Layer Specification, Version 3.01.
3.5.5
SD Status Register
The SD Status Register (SSR) contains status bits that are related to the microSD Card
proprietary features and may be used for future applications. The SD Status structure
is described in Section 4.10.2 in the SDA Physical Layer Specification, Version 3.01.
3.5.6
Relative Card Address Register
The 16-bit Relative Card Address (RCA) Register carries the card address published
by the card during the card identification. Refer to Section 5.4 in the SDA Physical
Layer Specification, Version 3.01 for more information.
3.5.7
SD Card Configuration Register
The SD Card Configuration Register (SCR) is in addition to the CSD Register. The
SCR provides information about special features in the SanDisk SD Card products.
For more information, refer to Section 5.6 in the SDA Physical Layer Specification,
Version 3.01.
3.5.8
microSD Card Product Family Registers in SPI
Mode
All card registers are accessible in SPI Mode. Their format is identical to the format in
the SD Bus Mode; however a few fields are irrelevant in SPI Mode. In SPI Mode, the
Card Status Register also has a different, shorter format. Refer to Section 7.4 in the
SDA Physical Layer Specification, Version 3.01 for more details.
3.5.9
Data Interchange Format and Card Sizes
In general, a file system provides structure for data in SanDisk microSD Card
products. The SD Card File System Specification, published by the SDA, describes
the file format system that is implemented in the microSD Card products. In general,
each card is divided into two separate DOS-formatted partitions as follows:
•
User Area–used for secured and non-secured data storage and can be accessed by
the user with regular read/write commands.
•
Security Protected Area–used by content protection applications to save security
related data and can be accessed by the host using the secured read/write
command after doing authentication as defined in the SD Security Specification.
The security protected area size is defined by SanDisk as approximately one
percent of the total size of the card.
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Table 10: Minimum User Area DOS Image Parameters
Capacity
1
Total LBAs
2
No. of Partition
Total Partition
System Area
Sectors
Sectors
2
User Data
Sectors
2
User Data
Bytes
2
2
200GB
384503808
32768
384471040
384438272
196832395264
128GB
249736192
32768
249703424
249670656
127831375872
64GB
124735488
32768
124702720
124669952
63831015424
32GB
62333952
8192
62325760
62309376
31902400512
16GB
31116288
8192
31108096
31099904
15923150848
8GB
15523840
8192
15515648
15507456
7939817472
4GB
7744512
8192
7736320
7728128
3956801536
1
1 (GB) = 1 billion bytes. Some capacity not available for data storage.
Total LBAs, Number of Partition System Area Sectors, Total Partition Sectors, User Data Sectors and User Data
Bytes are minimum values. Actual values may vary depending on flash technology used.
2
4
MICROSD CARD PROTOCOL DESCRIPTION
4.1 General Description
SD Protocol information for cards in the SanDisk microSD Card Product Family is
contained in this chapter; information includes SD bus protocol, card identification,
and a functional description.
4.2 SD Bus Protocol
Communication over the SD bus is based on command and data-bit streams initiated
by a start bit and terminated by a stop bit. See Section 3.6.1 of the SDA Physical
Layer Specification, Version 3.01 for details.
4.3 Functional Description
In the SanDisk microSD Card Product Family, the host controls all communication
between itself and the cards. This section provides a general overview of the card
identification and data transfer modes; commands; card dependencies; various card
operation modes and restrictions for controlling the clock signal. For SD Card
commands, together with corresponding responses, state transitions, error conditions,
and timings refer to Section 4 of the SDA Physical Layer Specification, Version 3.01.
4.3.1
Card Identification Mode
In Card Identification Mode, the host resets all cards, validates operation voltage
range, identifies and requests cards to publish a relative card address. For more
information see Section 4.2 in the SDA Physical Layer Specification, Version 3.01.
4.3.2
Data Transfer Mode
Functionality of the Data Transfer Mode can be found in Section 4.3 of the SDA
Physical Layer Specification, Version 3.01. This section includes information about
data read and write, erase, write-protect management, card lock/unlock operations,
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application-specific commands, switch function command, high-speed mode,
command system, and the Send Interface Condition command (CMD8). CMD8 is part
of identification mode and command functional differences in microSD cards.
4.3.3
Clock Control
The host can use the bus clock signal in SanDisk microSD cards to switch them to
energy saving mode or to control data flow on the bus. See Section 4.4 of the SDA
Physical Layer Specification, Version 3.01.
Cyclic Redundancy Codes
The Cyclic Redundancy Check (CRC) protects against transmission errors that may
occur on the bus in SanDisk microSD Card Product Family cards. Detailed
information and examples for CRC7 and CRC16 are provided in Section 4.5 of the
SDA Physical Layer Specification, Version 3.01.
4.3.4
Error Conditions
See Section 4.6 of the SDA Physical Layer Specification, Version 3.01.
4.3.5
Commands
See Section 4.7 of the SDA Physical Layer Specification, Version 3.01 for detailed
information about card commands in the SanDisk microSD Card Product Family.
4.3.6
Card State Transition
In microSD cards, the state transition is dependent on the received command. The
transition is defined in Section 4.8 of the SDA Physical Layer Specification, Version
3.01 along with responses sent on the command line.
4.3.7
Timing Diagrams and Values
See Section 4.12 of the SDA Physical Layer Specification, Version 3.01.
4.3.8
Speed Class Specification
SDA speed class specification classifies card minimum write performance by speed
class number and offers the method to test performance. For more information, refer
to Section 4.13 of the SDA Physical Layer Specification, Version 3.01.
4.3.9
Erase Timeout Calculation
See Section 4.14 of the SDA Physical Layer Specification, Version 3.01.
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5
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3.7
MARKING
Performance microSD Cards
Premier microSD Cards
Superior microSD Cards
Figure 5: Marking Specs for
microSD, microSDHC, microSDXC Cards
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3.7
ORDERING INFORMATION
To order SanDisk products directly from SanDisk, please contact your local sales
office.
Part Number
Capacity2
SDSDQAB-004G
4 GB
SDSDQAB-008G
8 GB
SDSDQAB-016G
16 GB
SDSDQAB-032G
32 GB
SDSDQAB-064G
64 GB
SDSDQAD-008G
8 GB
SDSDQAD-016G
16 GB
Interface
Sequential Write: 5 MB/s
UHS-I 50
32 GB
SDSDQAD-064G
64 GB
SDSDQAD-128G
128 GB
Sequential Read: 20 MB/s
SC4
UHS-I 50
SDSDQAD-032G
Speed Class1
Sequential Write: 10 MB/s
Sequential Read: 40 MB/s
U1/SC10
Sequential Write: 10 MB/s
SDSDQAD-200G
200GB
UHS-I 104
Sequential Read: 80 MB/s
U1/SC10
SDSDQAE-032G
32 GB
SDSDQAE-064G
64 GB
Sequential Write: 50 MB/s
UHS-I 104
Sequential Read: 80 MB/s
U3/SC10
1.
Based
on
SanDisk
internal
testing;
performance
may
be
lower
depending
upon
host
device.
1
megabyte
(MB)
=
1
million
bytes.
2.
1
gigabyte
(GB)
=
1
billion
bytes.
Some
capacity
not
available
for
data
storage.
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