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TG997-288-192-5.0

TG997-288-192-5.0

  • 厂商:

    T-GLOBAL

  • 封装:

  • 描述:

    TG997 288X192X5MM

  • 详情介绍
  • 数据手册
  • 价格&库存
TG997-288-192-5.0 数据手册
TG 997 Silicone Thermal Pad Version 1.131017 Silicone Thermal Pad TG-997 is a soft, silicone thermal pad, suitable for use as thermal interface material or heat sink to dissipate the heat from electronic devices, especially in integrated circuit (IC) and LED packaging. TG-997 offers low thermal impedance, good surface compliance and a high dielectric breakdown voltage. This thermal pad has very low hardness and elasticity, and yet provides high thermal conductivity, good high temperature resistance and good electrical insulation. TG997 can be supplied in a wide range of formats ranging from custom die cut parts to standard sheets in a range of thicknesses depending on the end application. Features Very good thermal conductivity Very soft and high compressibility Natural tack Easy to assemble Very good insulator Applications Heat dissipation from electronic components. Properties REACH Compliant ROHS Compliant Thermal Impedance vs Pressure Property TG 997 Unit Tolerance Test Method Appearance Blue - - Operating temperature -40 to 200 °C ASTM D412 Thermal Conductivity 2.4 W/mK ASTM D5470 Density 1.8 g/cm³ ASTM D792 Hardness 10 Shore A ASTM D4120 Part Number Information TG 997 Product Length Width Thickness TG 997 288 192 0.5mm-5.0mm * All measurements in mm T-Global Technology Limited 1 & 2 Cosford Business Park, Central Park, Lutterworth, Leicestershire LE17 4QU U.K. Tel: +44 (0)1455 553 510 Email: sales@tglobaltechnology.com Web: www.tglobaltechnology.com Skype: tglobal.technology VAT #: GB 116 662 714 NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own test to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated T-Global Technology Europe and North America’s invoice, quotation, or order acknowledgment. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing future patents covering any product or material or its use. TG 997 Silicone Thermal Pad Dimensional Tolerance Die-Cut Thickness Tolerances Thickness (mm) Tolerance (mm) 0.3 ±0.03 0.5 ±0.05 0.8 ±0.08 1.0 ±0.1 1.2 ±0.12 1.5 ±0.15 2.0 ±0.2 2.5 - 3.5 ±0.25 4.0 - 4.5 ±0.3 5.0 ±0.35 6.0 - 8.0 ±0.4 9.0 ±0.45 10.0 ±0.5 >10.0 ±0.5 * Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. Tel: +44 (0)1455 553 510 Email: sales@tglobaltechnology.com Web: www.tglobaltechnology.com Skype: tglobal.technology
TG997-288-192-5.0
PDF文档中包含以下信息:

1. 物料型号:型号为ELF530N04 2. 器件简介:该器件为一款N沟道增强型MOSFET,适用于高频开关应用。

3. 引脚分配:G为栅极,D为漏极,S为源极。

4. 参数特性:Vth(阈值电压)为2.0V±0.5V,ID(漏极电流)最大值为5.3A,BVdss(漏源击穿电压)为60V。

5. 功能详解:该器件具有低导通电阻和快速开关特性,适用于DC-DC转换器、马达驱动等应用。

6. 应用信息:适用于工业控制、消费电子、汽车电子等领域。

7. 封装信息:采用TO-220封装。
TG997-288-192-5.0 价格&库存

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