MGV05032R2M-10

Laird Technologies ,Co., Ltd. SPECIFICATION FOR APPROVAL Customer ： All Manufacturer ： Laird Technologies Co.,Ltd. Product ： Molding Power Inductor Laird P/N ： MGV0503 Series Customer P/N ： N/A Issued Date ： 2018.2.8 Rev ： A Customer Response Approved By: Signature: Date: Laird Signature Approved By Checked By Chiang Siemens Mi Prepared By Denny Chen Laird (Foshan) Magnetics Co., Ltd. Fu’an Industrial Zone, Leliu Town, Shunde, Foshan City, Guangdong, China 528322 Tel: +86 (757) 25638860 Fax: +86 (757) 25638862 ISO 9001 ISO14001 Email: china@lairdtech.com Website: www.lairdtech.com OHSAS18001 Laird Technologies, Co., Ltd Molding Power Inductor www.lairdtech.com MGV0503 Series Rev: A Rev Items Before After Owner Date A ─ ─ ─ Denny 2018.2.8 Laird Technologies, Co., Ltd Molding Power Inductor www.lairdtech.com MGV0503 Series Rev: A SPECIFICATION FOR APPROVAL 1.MECHANICAL & DIMENSIONS 100 A (UNIT: mm) E B C A 5.50±0.50 B 5.10±0.30 C 3.00±0.40 D 1.50±0.30 E 1.10±0.30 L 6.50 ref G 2.50 ref H 1.80 ref D REMARK L G H 2.PART NUMBER NOMENCLATOR: MGV 0503 A B 100 C A: Product Series. B: Series number, part size C: Inductance code M - 1X D E D: Inductance Tolerance. (M=±20% ,N=±30%) E: "X"=0:Standard catalog part number "X"=1-9:Controlled customized part or different performance than std catalog part. And "5-9" is for automotive grade. 3.EQUIVALENT CIRCUIT: Page : 1/9 Laird Technologies, Co., Ltd Molding Power Inductor www.lairdtech.com MGV0503 Series Rev: A SPECIFICATION FOR APPROVAL PART NUMBER INDUCTANCE (uH) MGV0503R10N-10 0.10±30% 23 27 2.5 3.0 MGV0503R22M-10 0.22±20% 15.5 21 3.7 4.4 MGV0503R33M-10 0.33±20% 14 18 4.3 5.0 MGV0503R47M-10 0.47±20% 12 16 6.4 7.4 MGV0503R56M-10 0.56±20% 10 15 8 10 MGV0503R68M-10 0.68±20% 8.5 14 10 12 MGV0503R82M-10 0.82±20% 8.0 13 11.5 13 MGV05031R0M-10 1.00±20% 7.0 11 13 14 MGV05031R2M-10 1.20±20% 6.5 11 14 16 MGV05031R5M-10 1.50±20% 6.0 10 16 25 MGV05032R2M-10 MGV05033R3M-10 MGV05034R7M-10 MGV05036R8M-10 MGV0503100M-10 MGV0503150M-10 MGV0503220M-10 MGV0503330M-10 2.20±20% 3.30±20% 4.70±20% 6.80±20% 10.0±20% 15.0±20% 22.0±20% 33.0±20% 5.5 5.0 4.6 4.0 2.8 2.1 1.9 1.6 9 8 6 4.3 3.5 2.6 1.7 1.6 25 32 50 68 110 165 220 380 35 38 53 76 128 190 250 440 Irms(A) Typ. Isat(A) Typ. DCR(mΩ) Typ DCR(mΩ) Max REMARK GENERAL SPECIFICATION: 1, Test conditions(L): 100KHz, 1Vrms 2, Operating temperature: -55℃ to +125℃(Including self-heating) 3, Storage temperature: -10℃ to +40℃ 4, Humidity range: 60% RH Max. 5, Heat Rated Current (Irms) will cause the coil temperature rise approximately ∆t of 40°C 6, Saturation Current (Isat) will cause L0 to drop approximately 30%. 7, Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions. 8, Storage condition (component in its packaging) Page 2/9 Laird Technologies, Co., Ltd Molding Power Inductor www.lairdtech.com MGV0503 Series Rev: A SPECIFICATION FOR APPROVAL Characteristics Curve MGV0503R10N-10 MGV0503R22M-10 0.12 0.25 100 120 70 0.08 60 0.06 50 40 0.04 30 20 0.02 100 0.2 80 0.15 60 0.1 40 0.05 20 10 0 0 20 30 0 40 0 0 10 IDC(A) MGV0503R33M-10 MGV0503R47M-10 0.6 100 0.5 0.3 80 0.25 0.2 60 0.15 40 0.1 20 0.05 0 Inductance (uH) 120 Temperature Rise (℃) Inductance (uH) 0.35 20 90 80 70 0.4 60 50 0.3 40 0.2 30 20 0.1 10 0 0 10 0 0 30 5 0.6 100 0.5 80 0.4 60 0.3 40 0.2 20 0.1 0 0 IDC(A) 20 15 20 0.8 140 0.7 120 0.6 Inductance (uH) 120 Temperature Rise (℃) Inductance (uH) 0.7 10 15 MGV0503R68M-10 MGV0503R56M-10 5 10 IDC(A) IDC(A) 0 30 IDC(A) 0.4 0 20 Temperature Rise (℃) 10 100 0.5 80 0.4 60 0.3 40 0.2 Temperature Rise (℃) 0 Temperature Rise (℃) 80 Inductance (uH) Inductance (uH) 0.1 Temperature Rise (℃) 90 20 0.1 0 0 0 5 10 15 20 IDC(A) Page 3/9 Laird Technologies, Co., Ltd Molding Power Inductor www.lairdtech.com MGV0503 Series Rev: A SPECIFICATION FOR APPROVAL Characteristics Curve 120 1.2 100 0.6 0.5 80 0.4 60 0.3 40 0.2 0 10 15 80 0.8 60 0.6 40 0.4 20 0 0 20 5 MGV05031R2M-10 60 0.6 40 0.4 0 10 1 80 0.8 60 0.6 40 20 0.2 0 0 5 100 1.2 0.4 20 0.2 120 1.4 Inductance (uH) 80 0.8 Temperature Rise (℃) Inductance (uH) 100 1 0 0 15 5 140 4 120 3.5 100 1.5 80 60 1 40 0.5 20 0 0 5 10 IDC(A) 15 15 MGV05033R3M-10 140 120 3 Inductance (uH) Inductance (uH) 2 Temperature Rise (℃) MGV05032R2M-10 0 10 IDC(A) IDC(A) 2.5 140 1.6 120 1.2 MGV05031R5M-10 1.8 140 1.4 0 15 IDC(A) IDC(A) 1.6 10 Temperature Rise (℃) 5 1 0 0 0 100 0.2 20 0.1 120 100 2.5 80 2 60 1.5 40 1 Temperature Rise (℃) Inductance (uH) 0.7 MGV05031R0M-10 Temperature Rise (℃) 1.4 Inductance (uH) 0.8 140 Temperature Rise (℃) MGV0503R82M-10 0.9 20 0.5 0 0 0 5 10 15 IDC(A) Page 4/9 Laird Technologies, Co., Ltd Molding Power Inductor www.lairdtech.com MGV0503 Series Rev: A SPECIFICATION FOR APPROVAL Characteristics Curve 90 7 80 70 4 60 3 50 40 2 30 20 1 0 4 6 50 6 40 5 4 30 3 20 2 10 1 0 0 8 10 0 0 1 2 IDC(A) 30 4 20 2 0 2 3 60 12 Inductance (uH) 40 6 Temperature Rise (℃) Inductance (uH) 50 8 50 10 40 8 30 6 20 4 10 2 0 0 10 0 0 4 1 2 MGV0503220M-10 35 15 30 25 10 20 15 5 10 5 0 0 0.5 1 1.5 IDC(A) 2 2.5 80 70 Inductance (uH) 40 90 30 Temperature Rise (℃) Inductance (uH) 20 MGV0503330M-10 35 50 45 0 3 IDC(A) IDC(A) 25 70 14 60 1 5 MGV0503150M-10 16 70 10 0 4 IDC(A) MGV0503100M-10 12 3 Temperature Rise (℃) 2 60 25 60 20 50 15 40 30 10 20 5 Temperature Rise (℃) 0 MGV05036R8M-10 Temperature Rise (℃) 8 Inductance (uH) Inductance (uH) 5 100 Temperature Rise (℃) MGV05034R7M-10 6 10 0 0 0 0.5 1 1.5 2 2.5 IDC(A) Page 5/9 Laird Technologies, Co., Ltd Molding Power Inductor www.lairdtech.com MGV0503 Series Rev: A Recommended Soldering Conditions ■ For Lead-Free Application Figure 1 . Re-flow Soldering Within 4 sec Reflow times: 3 times max Figure 2 . Hand Soldering P R E - H E A T IN G S O L D E R IN G NATURAL C O O L IN G 0 TEM PERATURE C 280 230 150 O v e r 1 m in . G r a d u a l C o o lin g W ith in 3 s e c . Hand solder times: 1 time max page 6/9 Laird Technologies, Co., Ltd Molding Power Inductor www.lairdtech.com MGV0503 Series Rev: A Reliability and Testing Conditions / Pin Type Power Inductors SMD series(Consumer) Item Reference Additional Requirements Operating temperature -55℃~ +125℃(Including self-temperature rise) range Storage temperature and humidity range High Temperature Exposure (Storage) -10℃ to +40℃ , 60% RH Max MIL-STD-202 Method 108 85±2℃, 168+24hours JESD22 Method JA-104 -40℃→+85, transforming interval:20s, 100cycles Operational Life MIL-PRF-2 85±℃, 168+24hours Apply maximum rated voltage and current according part drawing External Visual MIL-STD-883 Method 2009 Inspect device construction, marking and workmanship. Electrical Test not required. JESD22 Method JB-100 Verify physical dimensions to the applicable device detail specification. Note: User(s) and Suppliers spec. Electrical Test not required MIL-STD-202 Method 204 10~55Hz,1.5mm, 2 hours in each 3mutually Temperature Cycling Physical Dimension Vibration Resistance to Soldering MIL-STD-202 Method 210 Heat 1. Max. 260±5℃,10±1s, 2 times 2.Solder Composition: Sn/3Ag/0.5Cu Solderability J-STD-002 245±5℃, 5±1sec, Solder: Sn/3.0Ag/0.5Cu Electrical Characterization Print Spec Parametrically test per lot and sample size requirements, summary to show Min, Max, Mean and Standard deviation at room as well as Min and Max Operating temperatures AEC-Q200-005 Board Flex Terminal Strength(SMD) AEC-Q200-006 2mm,30±1s 10N, 5S, X,Y direct Page 7/9 Laird Technologies, Co., Ltd Molding Power Inductor www.lairdtech.com MGV0503 Series Rev: A PACKAGING Reel Dimension Type A(mm) B(mm) C(mm) D(mm) 13'x12 12.4+2/-0 100 ± 2 13+0.5/-0.2 330 B D C A Tape Dimension W E 12.0±0.3 1.75±0.1 F 5.50±0.1 P A0 B0 8.00±0.1 5.50±0.1 6.20±0.1 P2 P0 K0 t D0 2.0±0.1 4.0±0.1 3.3±0.1 0.35±0.05 1.5Ref. Packaging Quantity P/N Chip/Reel MGV0503 Series 2000pcs Size Peeling Off Force The force peeling off cove tape is 10 to 100 grams in the arrow direction under the following conditions Room Temp (℃) Room Humidity Room atrn (hPa) Teaming Speed 5~35 45~85 860~1060 300 ※Storage Conditions 1. Temperature and humidity conditions: -10-+40℃ and 60% RH. 2. Recommended products should be used within 12 months from the time of manufacturing. 3. The packaging material should be kept where no chlorine or sulfur exists in the air. 4. Allowable stacking condition of Packaging box：max height 1.5m or 5 boxes stacking Page 8/9 Laird Technologies, Co., Ltd Molding Power Inductor www.lairdtech.com MGV0503 Series Rev: A SPECIFICATION FOR APPROVAL MATERIAL IDENTIFICATION ITEM DESCRIPTION 1 Powder 2 Copper Wire 3 4 Spec SGS No. SUPPLIERS Iron Powder SCL03H001687001 Laird AIB SCL01G06040701E PACIFIC Coating Paint RHS01G006468001 BERLIN Clip Clip CAN1406178103 HUIGAO Page 9/9