SPECIFICATION
Product Type : EPD
Model Number : GDEW042Z15
Description
: Screen Size: 4.2"
Color: Black, White and Red
Display Resolution: 400*300
Prepared
Checked
Approved
Issue Date
:
:
:
:
Li Lanxi
Wen Xin
Jian Yongcheng
2017.10.13
DALIAN GOOD DISPLAY CO., LTD.
No.17 Gonghua Street, Shahekou District, Dalian 116021 China
Tel: +86-411-84619565 Fax: +86-411-84619585-810
Email: info@good-display.com
Website: www.good-display.com
GDEW042Z15
Revision History
Rev.
Issued Date
Revised Contents
1.0
May.05.2015
Preliminary
1.1
Jul.23.2015
1. In part 9-1): Add the panel’s storage and transportation conditions.
2. In part 9-1): Add the panel’s operation conditions.
3. In part note 9-2: Modify each update interval time should be minimum at 150
seconds to 180 seconds.
4. In part 12: Delete block diagram.
1.2
Aug.21.2015
1. In part 8: Modify typical operating sequence.
1.3
Sep.23.2015
1. Modify GDEW042Z10 to GDEW042Z15.
1.4
Oct.30.2015
1. In part 6: Delete command 70h.
2.0
Mar.01.2017
1. In part 7-5): Modify Reference Circuit.
2.1
Aug.04.2017
1. In part 7-5): Modify Reference Circuit.
2.2
2.3
Oct.13.2017
Apr.27.2018
1. In part 7-5): Modify Reference Circuit.
1. In part 7-1) Absolute maximum rating.
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GDEW042Z15
TECHNICAL SPECIFICATION
CONTENTS
NO.
ITEM
PAGE
-
Cover
1
-
Revision History
2
-
Contents
3
1
Application
4
2
Features
4
3
Mechanical Specifications
4
4
Mechanical Drawing of EPD module
5
5
Input/Output Terminals
6
6
Command Table
8
7
Electrical Characteristics
27
8
Typical Operating Sequence
35
9
Optical Characteristics
39
10
Handling, Safety and Environment Requirements
41
11
Reliability test
42
12
Point and line standard
44
13
Packing
45
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3/45
GDEW042Z15
1. Over View
The display is a TFT active matrix electrophoretic display, with interface and a reference system design. The 4.2” active area
contains 400×300 pixels, and has 1-bit white/black and 1-bit red full display capabilities. An integrated circuit contains gate
buffer, source buffer, interface, timing control logic, oscillator, DC-DC, SRAM, LUT, VCOM, and border are supplied with
each panel.
2. Features
High contrast
High reflectance
Ultra wide viewing angle
Ultra low power consumption
Pure reflective mode
Bi-stable
Commercial temperature range
Landscape, portrait mode
Antiglare hard-coated front-surface
Low current deep sleep mode
On chip display RAM
Waveform stored in On-chip OTP
Serial peripheral interface available
On-chip oscillator
On-chip booster and regulator control for generating VCOM, Gate and source driving voltage
I2C Signal Master Interface to read external temperature sensor
Available in COG package IC thickness 300um
3. Mechanical Specifications
Parameter
Specifications
Unit
Screen Size
4.2
Inch
Display Resolution
400(H)×300(V)
Pixel
Active Area
84.8(H)×63.6 (V)
mm
Pixel Pitch
0.212×0.212
mm
Pixel Configuration
Square
Outline Dimension
91.0(H)×77.0(V) ×1.18(D)
mm
Weight
13.76±0.5
g
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Remark
Dpi: 120
4/45
A
B
91±0.2 EPD
89.2±0.2 PS
86.8±0.2 FPL
84.8±0.1 AA
0.9
1.2
1
1.5max
1
1.2
0.9
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PS
1.18±0.1
(ec area)
1.33 max
file number
NUMBERS Change the
INK
DATE
NAME
DESIGN AUDITING TECHNICS
SIGN
IC
1.35 max
Generation
of No.
RTV
(rtv area)
NO.
GLASS
EC
(without protective film)
FPL
mm
1/1
QUALITY
PAGE
UNIT
MATERIAL
ALL UP
WEIGHT
SUBSTANCE
S
DRAWINGS
AMOUNT
SCALE
GDEW042Z15
FIGURE NUMBER
NAME
DALIAN GOOD DISPLAY CO., LTD.
QUANTITY
GDEW042Z15
4. Mechanical Drawing of EPD module
72.3±0.2
69±0.2 FPL
67.1
63.6±0.1 AA
67.1
69±0.2 FPL
71.4±0.2 PS
77±0.2 EPD
5/45
GDEW042Z15
5. Input/Output Terminals
5-1) Pin out List
Pin #
Type
1
Single
Description
Remark
NC
No connection and do not connect with other NC pins
Keep Open
2
O
GDR
N-Channel MOSFET Gate Drive Control
3
O
RESE
Current Sense Input for the Control Loop
4
C
VGL
Negative Gate driving voltage
5
C
VGH
Positive Gate driving voltage
6
O
TSCL
I2C Interface to digital temperature sensor Clock pin
7
I/O
TSDA
I2C Interface to digital temperature sensor Date pin
8
I
BS1
Bus selection pin
Note 5-5
9
O
BUSY
Busy state output pin
Note 5-4
10
I
RES #
Reset
Note 5-3
11
I
D/C #
Data /Command control pin
Note 5-2
12
I
CS #
Chip Select input pin
Note 5-1
13
I/O
D0
serial clock pin (SPI)
14
I/O
D1
serial data pin (SPI)
15
I
VDDIO
Power for interface logic pins
16
I
VCI
Power Supply pin for the chip
VSS
Ground
17
18
C
VDD
Core logic power pin
19
C
VPP
Power Supply for OTP Programming
20
C
VSH
Positive Source driving voltage
21
C
PREVGH
Power Supply pin for VGH and VSH
22
C
VSL
Negative Source driving voltage
23
C
PREVGL
Power Supply pin for VCOM, VGL and VSL
24
C
VCOM
VCOM driving voltage
Note 5-1: This pin (CS#) is the chip select input connecting to the MCU. The chip is enabled for MCU communication only when
CS# is pulled Low.
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GDEW042Z15
Note 5-2: This pin (D/C#) is Data/Command control pin connecting to the MCU. When the pin is pulled HIGH, the data will be
interpreted as data. When the pin is pulled Low, the data will be interpreted as command.
Note 5-3: This pin (RES#) is reset signal input.
The Reset is active Low.
Note 5-4: This pin (BUSY) is Busy state output pin. When Busy is low, the operation of chip should not be interrupted and any
commands should not be issued to the module. The driver IC will put Busy pin low when the driver IC is working such
as:
- Outputting display waveform; or
- Programming with OTP
- Communicating with digital temperature sensor
Note 5-5: This pin (BS1) is for 3-line SPI or 4-line SPI selection. When it is “Low”, 4-line SPI is selected. When it is “High”, 3-line
SPI (9 bits SPI) is selected. Please refer to below Table.
Table: Bus interface selection
BS1
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MPU Interface
L
4-lines serial peripheral interface (SPI)
H
3-lines serial peripheral interface (SPI) – 9 bits SPI
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GDEW042Z15
6. Command Table
W/R: 0: Write cycle
#
1
2
3
4
1: Read cycle
Command
6
7
8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
0
0
0
1
#
#
#
#
#
#
#
#
0
0
0
0
0
0
0
0
0
1
0
1
-
-
-
-
-
-
#
#
VDS_EN,VDG_EN
03h
0
1
-
-
-
-
-
#
#
#
VCOM_HV,VGHL_LV[1:0]
00h
0
1
-
-
#
#
#
#
#
#
VDH[5:0]
26h
0
1
-
-
#
#
#
#
#
#
VDL[5:0]
26h
0
1
-
-
#
#
#
#
#
#
VDHR[5:0]
03h
Power OFF(POF)
0
0
0
0
0
0
0
0
1
0
02h
Power
0
0
0
0
0
0
0
0
1
1
03h
0
1
-
-
#
#
-
-
-
-
0
0
0
0
0
0
0
1
0
0
04h
0
0
0
0
0
0
0
1
0
1
05h
0
0
0
0
0
0
0
1
1
0
06h
0
1
#
#
#
#
#
#
#
#
BT_PHA[7:0]
17h
0
1
#
#
#
#
#
#
#
#
BT_PHB[7:0]
17h
0
1
-
-
#
#
#
#
#
#
BT_PHC[5:0]
17h
0
0
0
0
0
0
0
1
1
1
0
1
1
0
1
0
0
1
0
1
Check code
A5h
0
0
0
0
0
1
0
0
0
0
B/W Pixel Data (400×300)
10h
0
1
#
#
#
#
#
#
#
#
KPXL[1:8]
00h
0
1
..
..
..
..
..
..
..
..
..
…
0
1
#
#
#
#
#
#
#
#
KPXL[n-1:n]
00h
0
0
0
0
0
1
0
0
0
1
11h
1
1
#
-
-
-
-
-
-
-
00h
0
0
0
0
0
1
0
0
1
0
12h
Display Start
0
0
0
0
0
1
0
0
1
1
Red Pixel Data (400 x 300)
13h
Transmission
0
1
#
#
#
#
#
#
#
#
RPXL[1:8]
00h
2(DTM2, Red Data)
0
1
..
..
..
..
..
..
..
..
..
..
(x-byte command)
0
1
#
#
#
#
#
#
#
#
RPXL[n-1: n]
00h
0
0
0
0
1
0
0
0
0
0
Panel Setting (PSR)
Setting
Power
(PWR)
OFF
Sequence
Power ON(PON)
Power
ON
Measure(PMES)
Booster
Soft
Start(BTST)
Deep Sleep
Start
Transmission
1(DTM1,
white/black
11
12
Registers
Default
00h
RES[1:0],REG,KW/R,UD,
SHL,SHD_N,RST_N
0Fh
01h
T_VDS_OF
00h
07h
Data)
(x-byte command)
10
#: Valid Data
C/D
Display
9
D7~D0: -: Don’t care
W/R
Setting(PFS)
5
C/D: 0: Command 1: Data
Data Stop
Display
Refresh(DRF)
VCOM LUT(LUTC)
13
(45-byte command,
structure
of
bytes
20h
2~7 repeated)
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8/45
GDEW042Z15
#
Command
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
Registers
Default
0
0
0
0
1
0
0
0
0
1
21h
0
0
0
0
1
0
0
0
1
0
22h
0
0
0
0
1
0
0
0
1
1
23h
0
0
0
0
1
0
0
1
0
0
24h
0
0
0
0
1
1
0
0
0
0
30h
0
1
-
-
#
#
#
#
#
#
0
0
0
1
0
0
0
0
0
0
1
1
#
#
#
#
#
#
#
#
LM[10:3]/TSR[7:0]
00h
1
1
#
#
#
-
-
-
-
-
LM[2:0]/-
00h
0
0
0
1
0
0
0
0
0
1
0
1
#
-
-
-
#
#
#
#
0
0
0
1
0
0
0
0
1
0
0
1
#
#
#
#
#
#
#
#
WATTR[7:0]
00h
0
1
#
#
#
#
#
#
#
#
WMSB[7:0]
00h
0
1
#
#
#
#
#
#
#
#
WLSB[7:0]
00h
0
0
0
1
0
0
0
0
1
1
1
1
#
#
#
#
#
#
#
#
RMSB[7:0]
00h
1
1
#
#
#
#
#
#
#
#
RLSB[7:0]
00h
0
0
0
1
0
1
0
0
0
0
0
1
#
#
#
#
#
#
#
#
W2W LUT (LUTWW)
14
(43-byte command,
structure
of
bytes
2~7
repeated 7 times)
B2W
LUT
(LUTBW
/
LUTR)
15
(43-byte command,
structure
of
bytes
2~7
repeated 7 times)
W2B
LUT
(LUTWB
/
LUTW)
16
(43-byte command,
structure
of
bytes
2~7
repeated 7 times)
B2B
LUT
(LUTBB
/
LUTB)
17
(43-byte command,
sturcture
of
bytes
2~7
repeated 7 times)
18
19
PLL control(PLL)
Temperature
Calibration (TSC)
Temperature
20
Sensor
Sensor
Selection
(TSE)
21
22
23
Temperature
Sensor
Write(TSW)
Temperature Sensor Read
(TSR)
Vcom and data interval
setting(CDI)
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M[2:0],N[2:0]
3Ch
40h
41h
TSE,TO[3:0]
00h
42h
43h
50h
VBD[1:0],DDX[1:0],
CDI[3:0]
D7h
9/45
GDEW042Z15
#
24
Command
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
Lower
0
0
0
1
0
1
0
0
0
1
1
1
-
-
-
-
-
-
-
#
TCON setting
0
0
0
1
1
0
0
0
0
0
(TCON)
0
1
#
#
#
#
#
#
#
#
0
0
0
1
1
0
0
0
0
1
-
-
-
-
-
-
-
#
Power
Detection
(LPD)
25
26
27
28
29
Resolution
setting (TRES)
GSST Setting
(GSST)
Get
Status
31
#
#
#
#
#
0
0
0
0
1
-
-
-
-
-
-
-
#
0
1
#
#
#
#
#
#
#
#
0
0
0
1
1
0
0
1
0
1
0
1
-
-
-
-
-
-
-
#
0
1
#
#
#
#
#
0
0
0
0
1
-
-
-
-
-
-
-
#
0
1
#
#
#
#
#
#
#
#
0
0
0
1
1
1
0
0
0
1
1
-
#
#
#
#
#
#
#
Auto
0
0
1
0
0
0
0
0
0
0
0
1
-
-
#
#
#
#
#
#
0
0
1
0
0
0
0
0
0
1
Value(VV)
1
1
-
-
#
#
#
#
#
#
VCM_DC
0
0
1
0
0
0
0
0
1
0
0
1
-
-
#
#
#
#
#
#
0
0
1
0
0
1
0
0
0
0
0
1
-
-
-
-
-
-
-
#
0
1
#
#
#
#
#
0
0
0
0
1
-
-
-
-
-
-
-
#
Partial
0
1
#
#
#
#
#
1
1
1
Window (PTL)
0
1
-
-
-
-
-
-
-
#
0
1
#
#
#
#
#
#
#
#
0
1
-
-
-
-
-
-
-
#
0
1
#
#
#
#
#
#
#
#
0
1
-
-
-
-
-
-
-
#
Measurement
Read
Vcom
Setting
Default
51h
LPD
01h
60h
S2G[3:0],G2S[3:0]
22h
61h
00h
HRES[8:3]
00h
00h
VRES[8:0]
00h
65h
00h
HST[8:3]
00h
00h
VST[8:0]
00h
71h
2
1
(VDCS)
32
1
(FLG)
Vcom
30
0
Registers
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PTL_FLAG,I C_BUSY,DATA
_FLAG,PON,POF,BUSY
02h
80h
AMVT[1:0],XON,AMVS,
AMV,AMVE
10h
81h
VV[5:0]
00h
82h
VDCS[5:0]
00h
90h
HRST[8:3]
HRED[8:3]
VRST[8:0]
VRED[8:0]
PT_SCAN
00h
00h
00h
07h
00h
00h
00h
00h
01h
10/45
GDEW042Z15
#
33
34
35
Command
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
1
0
0
1
0
0
0
1
91h
0
0
1
0
0
1
0
0
1
0
92h
Program
0
0
1
0
1
0
0
0
0
0
A0h
Mode (PGM)
0
1
1
0
1
0
0
1
0
1
0
0
1
0
1
0
0
0
0
1
A1h
0
0
1
0
1
0
0
0
1
0
A2h
1
1
-
-
-
-
-
-
-
-
Read Dummy
N/A
1
1
#
#
#
#
#
#
#
#
Data of Address = 000h
N/A
1
1
..
..
..
..
..
..
..
..
..
N/A
1
1
#
#
#
#
#
#
#
#
Data of address = n
N/A
Power Saving
0
0
1
1
1
0
0
0
1
1
(PWS)
0
1
#
#
#
#
#
#
#
#
In
Partial
(PTIN)
Partial
Out
(PTOUT)
Registers
Check code = A5h
Default
A5h
Active
36
Progrmming
(APG)
37
38
Read
OTP
(ROTP)
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E3h
VCOM_W[3:0],SD_W[3:0]
00h
11/45
GDEW042Z15
(1) Panel Setting (PSR) (Register: R00H)
Action
Setting the panel
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
0
0
0
1
RES1
RES0
REG_EN
BWR
UD
SHL
SHD_N
RST_N
RES[1:0]: Display Resolution setting (source x gate)
00b: 400x300 (Default)
Active source channels: S0 ~ S399. Active gate channels: G0 ~ G299.
01b: 320x300
Active source channels: S0 ~ S319. Active gate channels: G0 ~ G299.
10b: 320x240
Active source channels: S0 ~ S319. Active gate channels: G0 ~ G239.
11b: 200x300
Active source channels: S0 ~ S199. Active gate channels: G0 ~ G299.
REG_EN: LUT selection
0: LUT from OTP. (Default)
1: LUT from register.
BWR:
Black / White / Red
0: Pixel with B/W/Red. (Default)
1: Pixel with B/W.
UD:
Gate Scan Direction
First line to last line: Gn-1 → Gn-2 → Gn-3 → … → G0
0: Scan down.
1: Scan up. (default) First line to last line: G0 → G1 → G2 → … → Gn-1
SHL:
Source Shift direction
First data to last data: Sn-1 → Sn-2 → Sn-3 → … → S0
0: Shift left
1: Shift right. (default) First data to last data: S0 → S1 → S2 → … → Sn-1
SHD_N:
Booster Switch
0: Booster OFF, register data are kept, and SEG/BG/VCOM are kept 0V or floating.
1: Booster ON
(Default)
When SHD_N become LOW, charge pump will be turned OFF, register and SRAM data will keep until VDD OFF, and
SD output and VCOM will remain previous condition. SHD_N may have two conditions: 0v or floating.
RST_N:
Soft Reset
1: No effect
(Default).
Booster OFF, Register data are set to their default values, and SEG/BG/VCOM: 0V
When RST_N become LOW, the driver will be reset, all registers will be reset to their default value. All driver
functions will be disabled. SD output and VCOM will base on previous condition. It may have two conditions: 0v or
floating.
(2) Power Setting (PWR) (R01H)
Action
Selecting
Internal/External
Power
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
0
1
0
1
-
-
-
-
-
-
VDS_EN
VDG_EN
0
1
-
-
-
-
-
VCOM_HV
0
1
-
-
VDH[5:0]
0
1
-
-
VDL[5:0]
0
1
-
-
VDHR[5:0]
VGHL_LV[1:0]
VDS_EN: Source power selection
0: External source power from VDH/VDL pins
1: Internal DC/DC function for generating VDH/VDL
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GDEW042Z15
VDG_EN: Gate power selection
0: External gate power from VGH/VGL pins
1: Internal DC/DC function for generating VGH/VGL
VCOM_HV: VCOM Voltage Level
0: VCOMH=VDH+VCOMDC, VCOML=VDL+VCOMDC
1: VCOML=VGH, VCOML=VGL
VGHL_LV[1:0]: VGH / VGL Voltage Level selection.
VGHL_LV
VGHL voltage level
00(Default)
VGH=16V,VGL= -16V
01
VGH=15V,VGL= -15V
10
VGH=14V,VGL= -14V
11
VGH=13V,VGL= -13V
VDH[5:0]: Internal VDH power selection for B/W pixel.(Default value: 100110b)
VDL[5:0]:
VDH
VDH_V
VDH
VDH_V
000000
2.4V
…
…
000001
2.6V
100110
10.0V
000010
2.8V
100111
10.2V
000011
3.0V
101000
10.4V
000100
3.2V
101001
10.6V
000101
3.4V
101010
10.8V
000110
3.6V
101011
11.0V
000111
3.8V
(others)
11.0V
Internal VDL power selection for B/W pixel. (Default value: 100110b)
VDL
VDL_V
VDL
VDL_V
000000
-2.4V
…
…
000001
-2.6V
100110
-10.0V
000010
-2.8V
100111
-10.2V
000011
-3.0V
101000
-10.4V
000100
-3.2V
101001
-10.6V
000101
-3.4V
101010
-10.8V
000110
-3.6V
101011
-11.0V
000111
-3.8V
(others)
-11.0V
VDHR[5:0]: Internal VDHR power selection for Red pixel. (Default value: 000011b)
VDHR
VDHR _V
VDHR
VDHR _V
000000
2.4V
…
…
000001
2.6V
100110
10.0V
000010
2.8V
100111
10.2V
000011
3.0V
101000
10.4V
000100
3.2V
101001
10.6V
000101
3.4V
101010
10.8V
000110
3.6V
101011
11.0V
000111
3.8V
(others)
11.0V
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GDEW042Z15
(3) Power OFF (PWR) (R02H)
Action
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
Turning OFF the power
0
0
0
0
0
0
0
0
1
0
After the Power Off command, the driver will power off following the Power Off Sequence. This command will turn off charge
pump, T-con, source driver, gate driver, VCOM, and temperature sensor, but register data will be kept until VDD becomes OFF.
Source Driver output and Vcom will remain as previous condition, which may have 2 condition: 0V or floating.
(4) Power off sequence setting (PFS) (R03H)
Action
Setting Power OFF sequence
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
0
1
1
0
1
-
-
T_VDS_OFF[1:0]
-
-
-
-
T_VDS_OFF[1:0]: Power OFF Sequence of VDH and VDL.
00b: 1frame (Default)
01b: 2 frames
10b: 3frames
11b:4 frame
(5) Power ON (PON) (R04H)
Action
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
Turning ON the Power
0
0
0
0
0
0
0
1
0
0
After the Power ON command, the driver will be powered ON following the Power ON Sequence. Refer to the Power ON
Sequence section. In the sequence, temperature sensor will be activated for one time sensing before enabling booster.
(6) Power ON Measure (PMES) (R05H)
Action
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
1
0
1
This command enables the internal band gap, which will be cleared by the next POF.
(7) Booster Soft Start (BTST) (R06H)
Action
Starting
W/
C/
R
D
0
0
0
1
0
1
0
1
data
transmissio
n
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
1
1
0
BT_PHA
BT_PHA
BT_PHA
BT_PHA
BT_PHA
BT_PHA
BT_PHA
BT_PHA
7
6
5
4
3
2
1
0
BT_PHB
BT_PHB
BT_PHB
BT_PHB
BT_PHB
BT_PHB
BT_PHB
BT_PHB
7
6
5
4
3
2
1
0
-
-
BT_PHC
BT_PHC
BT_PHC
BT_PHC
BT_PHC
BT_PHC
5
4
3
2
1
0
BTPHA[7:6]: Soft start period of phase A
00b: 10mS
01b: 20mS
10b: 30mS
11b: 40mS
BTPHA[5:3]: Driving strength of phase A
000b: strength 1
001b: strength 2
010b: strength 3
011b: strength 4
100b: strength 5
101b: strength 6
110b: strength 7
111b: strength 8 (strongest)
BTPHA[2:0]: Minimum OFF time setting of GDR in phase B
000b: 0.27uS
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001b: 0.34uS
010b: 0.40uS
011b: 0.54uS
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GDEW042Z15
100b: 0.80uS
101b: 1.54uS
110b: 3.34uS
111b: 6.58uS
BTPHB[7:6]: Soft start period of phase B.
01b: 20mS
00b: 10mS
10b: 30mS
11b: 40mS
BTPHB[5:3]: Driving strength of phase B
000b: strength 1
001b: strength 2
010b: strength 3
011b: strength 4
100b: strength 5
101b: strength 6
110b: strength 7
111b: strength 8 (strongest)
BTPHB[2:0]: Minimum OFF time setting of GDR in phase B
000b: 0.27uS
001b: 0.34uS
010b: 0.40uS
011b: 0.54uS
100b: 0.80uS
101b: 1.54uS
110b: 3.34uS
111b: 6.58uS
BTPHC[5:3]: Driving strength of phase C
000b: strength 1
001b: strength 2
010b: strength 3
011b: strength 4
100b: strength 5
101b: strength 6
110b: strength 7
111b: strength 8 (strongest)
BTPHC[2:0]: Minimum OFF time setting of GDR in phase C
000b: 0.27uS
001b: 0.34uS
010b: 0.40uS
011b: 0.54uS
100b: 0.80uS
101b: 1.54uS
110b: 3.34uS
111b: 6.58uS
(8) Deep Sleep (DSLP) (R07H)
Action
Deep Sleep
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
0
0
1
1
1
0
1
1
0
1
0
0
1
0
1
After this command is transmitted, the chip would enter the deep-sleep mode to save power.
The deep sleep mode would return to standby by hardware reset.
The only one parameter is a check code, the command would be executed if check code = 0xA5.
(9) Data Start Transmission 1 (DTM1) (R10H)
Action
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
1
0
0
0
0
Starting data
0
1
Pixel1
Pixel2
Pixel3
Pixel4
Pixel5
Pixel6
Pixel7
Pixel8
transmission
0
1
..
..
..
..
..
..
..
..
0
1
Pixel(n-7)
Pixel(n-6)
Pixel(n-5)
Pixel(n-4)
Pixel(n-3)
Pixel(n-2)
Pixel(n-1)
Pixel(n)
This command starts transmitting data and write them into SRAM. To complete data transmission, command DSP (Data
transmission Stop) must be issued. Then the chip will start to send data/VCOM for panel.
In B/W mode, this command writes “OLD” data to SRAM.
In B/W/Red mode, this command writes “B/W” data to SRAM.
In Program mode, this command writes “OTP” data to SRAM for programming.
(10) Data Stop (DSP) (R11H)
Action
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
Stopping data
0
0
0
0
0
1
0
0
0
1
transmission
1
1
Data_flag
-
-
-
-
-
-
-
To stop data transmission, this command must be issued to check the data_flag.
Data_flag:
Data flag of receiving user data.
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GDEW042Z15
0: Driver didn’t receive all the data.
1: Driver has already received all the one-frame data (DTM1 and DTM2).
After “Data Start” (R10h) or “Data Stop” (R11h) commands and when data_flag=1, the refreshing of panel starts and BUSY signal
will become “0”.
(11) Display Refresh (DRF) (R12H)
Action
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
Refreshing the display
0
0
0
0
0
1
0
0
1
0
While user sent this command, driver will refresh display (data/VCOM) according to SRAM data and LUT.
After Display Refresh command, BUSY signal will become “0” and the refreshing of panel starts.
(12) Data Start Transmission 2 (DTM2) (R13H)
Action
Starting data transmission
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
0
1
0
0
1
1
0
1
Pixel1
Pixel2
Pixel3
Pixel4
Pixel5
Pixel6
Pixel7
Pixel8
0
1
..
..
..
..
..
..
..
..
0
1
Pixel(
Pixel(
Pixel(
Pixel(
Pixel(
Pixel(
Pixel(n-
Pixel(n)
n-7)
n-6)
n-5)
n-4)
n-3)
n-2)
1)
This command starts transmitting data and write them into SRAM. To complete data transmission, command DSP (Data
transmission Stop) must be issued. Then the chip will start to send data/VCOM for panel.
In B/W mode, this command writes “NEW” data to SRAM.
In B/W/Red mode, this command writes “RED” data to SRAM.
(13) VCOM LUT (LUTC) (R20H)
This command builds Look-up Table for VCOM
(14) W2W LUT (LUTWW)
(R21H)
This command builds Look-up Table for White-to-White.
(15) B2W LUT (LUTBW/LUTR)
(R22H)
This command builds Look-up Table for Black-to-White.
(16) W2B LUT (LUTWB/LUTW)
(R23H)
This command builds Look-up Table for White - to- Black.
(17) B2B LUT (LUTBB / LUTB) (R24H)
This command builds Look-up Table for Black - to- Black.
(18) PLL Control (PLL)
Action
Controlling PLL
(R30H)
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
0
1
1
0
0
0
0
0
1
-
-
M[2:0]
N[2:0]
The command controls the PLL clock frequency. The PLL structure must support the following frame rates:
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GDEW042Z15
M
1
2
N
Frame Rate
1
M
N
Frame Rate
29 Hz
1
2
14 Hz
3
10 Hz
4
7 Hz
N
Frame Rate
N
Frame Rate
86 Hz
1
150 Hz
1
200 Hz
2
43 Hz
2
72 Hz
2
100 Hz
3
29 Hz
3
48 Hz
3
67 Hz
4
21 Hz
4
36 Hz
4
50 Hz (Default)
5
6 Hz
5
17 Hz
5
29 Hz
5
40 Hz
6
5 Hz
6
14 Hz
6
24 Hz
6
33Hz
7
4 Hz
7
12Hz
7
20 Hz
7
29 Hz
1
57 Hz
1
114 Hz
1
171 Hz
2
29 Hz
2
57 Hz
2
86 Hz
3
19 Hz
3
38 Hz
3
57 Hz
4
14 Hz
4
29Hz
4
43 Hz
5
11 Hz
5
23 Hz
5
34 Hz
6
10 Hz
6
19 Hz
6
29 Hz
7
8 Hz
7
16 Hz
7
24 Hz
3
4
(19) Temperature Sensor Calibration (TSC)
Action
Sensing
Temperature
M
5
6
M
7
(R40H)
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
1
0
0
0
0
0
0
1
1
D10/TS7
D9/TS6
D8/TS5
D7/TS4
D6/TS3
D5/TS2
D4/TS1
D3/TS0
1
1
D2
D1
D0
-
-
-
-
-
This command reads the temperature sensed by the temperature sensor.
TS[7:0]:
When TSE (R41h) is set to 0, this command reads internal temperature sensor value.
D[10:0]:
When TSE (R41h) is set to 1, this command reads external LM75 temperature sensor value.
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GDEW042Z15
TS[7:0]/D[10:3]
Temperature (℃)
TS[7:0]/D[10:3]
Temperature (℃)
TS[7:0]/D[10:3]
Temperature (℃)
1110_0111
-25
0000_0000
0
0001_1001
25
1110_1000
-24
0000_0001
1
0001_1010
26
1110_1001
-23
0000_0010
2
0001_1011
27
1110_1010
-22
0000_0011
3
0001_1100
28
1110_1011
-21
0000_0100
4
0001_1101
29
1110_1100
-20
0000_0101
5
0001_1110
30
1110_1101
-19
0000_0110
6
0001_1111
31
1110_1110
-18
0000_0111
7
0010_0000
32
1110_1111
-17
0000_1000
8
0010_0001
33
1111_0000
-16
0000_1001
9
0010_0010
34
1111_0001
-15
0000_1010
10
0010_0011
35
1111_0010
-14
0000_1011
11
0010_0100
36
1111_0011
-13
0000_1100
12
0010_0101
37
1111_0100
-12
0000_1101
13
0010_0110
38
1111_0101
-11
0000_1110
14
0010_0111
39
1111_0110
-10
0000_1111
15
0010_1000
40
1111_0111
-9
0001_0000
16
0010_1001
41
1111_1000
-8
0001_0001
17
0010_1010
42
1111_1001
-7
0001_0010
18
0010_1011
43
1111_1010
-6
0001_0011
19
0010_1100
44
1111_1011
-5
0001_0100
20
0010_1101
45
1111_1100
-4
0001_0101
21
0010_1110
46
1111_1101
-3
0001_0110
22
0010_1111
47
1111_1110
-2
0001_0111
23
0011_0000
48
1111_1111
-1
0001_1000
24
0011_0001
49
(20) Temperature Sensor Enable (TSE)
(R41H)
Action
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
Enable Temperature
0
0
0
1
0
0
0
0
0
1
Sensor/Offset
0
1
TSE
-
-
-
TO[3:0]
This command selects Internal or External temperature sensor.
TSE:
Internal temperature sensor switch
0: Enable (Default)
TO[3:0]:
1: Disable; using external sensor.
Temperature offset.
TO[3:0]
Calculation
TO[3:0]
Calculation
0000 b
0
1000
-8
0001
1
1001
-7
0010
2
1010
-6
…
…
…
…
0110
6
1110
-2
0111
7
1111
-1
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GDEW042Z15
(21) Temperature Sensor Write (TSW)
Action
(R42H)
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
1
0
0
0
0
1
0
Write External Temperature
0
1
WATTR[7:0]
Sensor
0
1
WMSB[7:0]
0
1
WLSB[7:0]
This command reads the temperature sensed by the temperature sensor.
WATTR: D[7:6]: I2C Write Byte Number
00b : 1 byte (head byte only)
01b : 2 bytes (head byte + pointer)
10b : 3 bytes (head byte + pointer + 1st parameter)
11b : 4 bytes (head byte + pointer + 1st parameter + 2nd parameter)
D[5:3]: User-defined address bits (A2, A1, A0)
D[2:0]: Pointer setting
WMSB[7:0]: MSByte of write-data to external temperature sensor.
WLSB[7:0]: LSByte of write-data to external temperature sensor.
(22) Temperature Sensor Read (TSR)
Action
Read External Temperature
Sensor
(R43H)
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
1
0
0
0
0
1
1
1
1
RMSB[7:0]
1
1
RLSB[7:0]
This command reads the temperature sensed by the temperature sensor.
RMSB[7:0]: MSByte read data from external temperature sensor
RLSB[7:0]: LSByte read data from external temperature sensor
(23) VCOM And Data Interval Setting (CDI)
(R50H)
Action
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
Set Interval Between Vcom and
0
0
0
1
0
1
0
0
0
0
Data
0
1
VBD[1:0]
DDX[1:0]
CDI[3:0]
This command indicates the interval of Vcom and data output. When setting the vertical back porch, the total blanking will be kept
(20 Hsync).
VBD[1:0]:
Border data selection
B/W/Red mode (BWR=0)
DDX[0]
0
VBD[1:0]
LUT
00
Floating
01
LUTR
10
LUTW
11
LUTB
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DDX[0]
1(Default)
VBD[1:0]
LUT
00
LUTB
01
LUTW
10
LUTR
11
Floating
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GDEW042Z15
B/W mode (BWR=1)
DDX[0]
0
VBD[1:0]
LUT
DDX[0]
00
Floating
01
LUTBW (1→0)
10
LUTWB (0→1)
11
Floating
1(Default)
VBD[1:0]
LUT
00
Floating
01
LUTWB (1→0)
10
LUTBW (0→1)
11
Floating
DDX[1:0]: Data polality.
DDX[1] for RED data, DDX[0] for BW data in the B/W/Red mode.
DDX[0] for B/W mode.
B/W/Red mode (BWR=0)
DDX[1:0]
00
01(Default)
Data{Red, B/W}
LUT
00
LUTW
01
LUTB
10
LUTR
11
DDX[1:0]
Data{Red, B/W}
LUT
00
LUTR
01
LUTR
10
LUTW
LUTR
11
LUTB
00
LUTB
00
LUTR
01
LUTW
01
LUTR
10
LUTR
10
LUTB
11
LUTR
11
LUTW
Data{New, Old}
LUT
00
LUTWW (0→0)
01
LUTBW (1→0)
10
LUTWB (0→1)
11
LUTBB (1→1)
00
LUTBB (0→0)
01
LUTWB (0→1)
10
LUTBW (1→0)
11
LUTWW (1→1)
10
11
B/W mode (BWR=1)
DDX[0]
00
01(Default)
CDI[3:0]:
DDX[0]
10
11
Data{New, Old}
LUT
0
LUTBW(1→0)
1
LUTWB(0→1)
0
LUTWB(1→0)
1
LUTBW(0→1)
Vcom and data interval
CDI[3:0]
Vcom and Data Interval
CDI[3:0]
Vcom and Data Interval
0000 b
17 hsync
0110
11
0001
16
0111
10 (Default)
0010
15
…
…
0011
14
1101
4
0100
13
1110
3
0101
12
1111
2
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GDEW042Z15
(24) Low Power Detection (LPD)
Action
Detect Low Power
(R51H)
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
1
0
1
0
0
0
1
1
1
-
-
-
-
-
-
-
LPD
This command indicates the input power condition. Host can read this flag to learn the battery condition.
LPD: Interval Low Power Detection Flag
0: Low power input (VDD < 2.5V)
(25) TCON Setting (TCON)
1: Normal status (default)
(R60H)
Action
Set Gate/Source Non-overlap Period
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
1
1
0
0
0
0
0
0
1
S2G[3:0]
G2S[3:0]
This command defines non-overlap period of Gate and Source.
S2G[3:0] or G2S[3:0]: Source to Gate / Gate to Source Non-overlap period
S2G[3:0] or G2S[3:0]
Period
S2G[3:0] or G2S[3:0]
Period
0000b
4
…
…
0001
8
1011
48
0010
12(Default)
1100
52
0011
16
1101
56
0100
20
1110
60
0101
24
1111
64
Period = 660 nS.
(26) Resolution Setting (TRES)
Action
Set Display Resolution
(R61H)
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
1
1
0
0
0
0
1
0
1
0
1
0
1
0
1
HRES[8]
HRES[7:3]
-
-
-
-
-
0
0
0
-
-
VRES[8]
VRES[7:0]
This command defines alternative resolution and this setting is of higher priority than the RES[1:0] in R00H (PSR).
HRES[8:3]: Horizontal Display Resolution
VRES[8:0]: Vertical Display Resolution
Active channel calculation:
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GD : First active gate = G0 (Fixed);
LAST active gate = VRES[8:0] - 1
SD : First active source =S0 (Fixed);
LAST active source = HRES[8:3]*8 – 1
(27) GSST Setting(GSST)
Action
Gate/Source
Start setting
(R65H)
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
1
1
0
0
1
0
1
0
1
-
-
-
-
-
-
-
HST8
0
1
0
0
0
0
1
-
-
VST[8]
0
1
HST[7:3]
-
-
-
-
VST[7:0]
This command defines the First Active Gate and First Active Source of active channels.
HST[8:3]: First active source. (Default: S0)
VST[8:0]: First active gate. (Default: G0)
(28) Get Status (FLG)
Action
Read Flags
(R71H)
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
1
1
1
0
0
0
1
2
2
data_ flag
PON
POF
BUSY
1
1
-
PTL_flag
I C_ERR
I C_ BUSY
This command reads the IC status.
PTL_FLAG
2
Partial display status (high: partial mode)
I C_ERR:
I2C master error status
I2C_BUSY:
I2C master busy status (low active)
data_flag:
Driver has already received all the one frame data
PON:
Power ON status
POF:
Power OFF status
BUSY:
Driver busy status (low active)
(29) Auto Measure Vcom (AMV)
Action
Automatically measure Vcom
(R80H)
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
1
0
0
0
0
0
0
0
0
1
-
-
AMVT[1:0]
XON
AMVS
AMV
AMVE
This command reads the IC status.
AMVT[1:0]:
XON:
Auto Measure Vcom Time
00b: 3s
01b: 5s (Default)
10b: 8s
11b: 10s
All Gate ON of AMV
0: Gate normally scan during Auto Measure VCOM period. (default)
1: All Gate ON during Auto Measure VCOM period.
AMVS: Source output of AMV
0: Source output 0V during Auto Measure VCOM period. (default)
1: Source output VDHR during Auto Measure VCOM period.
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AMV:
Analog signal
0: Get Vcom value with the VV command (R81h) (default)
1: Get Vcom value in analog signal. (External analog to digital converter)
AMVE: Auto Measure Vcom Enable (/Disable)
0: No effect
1: Trigger auto Vcom sensing.
(30) Vcom Value (VV)
(R81H)
Action
Automatically measure Vcom
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
1
0
0
0
0
0
0
1
1
1
-
-
VV[5:0]
This command gets the Vcom value.
VV[5:0]:
Vcom Value Output
VV[5:0]
Vcom value
00 0000b
-0.10 V
00 0001b
-0.15 V
00 0010b
-0.20 V
:
:
11 1010b
-3.00 V
(31) VCM_DC Setting (VDCS)
Action
Set VCM_DC
(R82H)
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
1
0
0
0
0
0
1
0
0
1
-
-
VDCS[5:0]
This command sets VCOM_DC value
VDCS[5:0]: VCOM_DC Setting
VDCS[5:0]
Vcom value
00 0000b
-0.10 V (default)
00 0001b
-0.15 V
00 0010b
-0.20 V
:
:
11 1010b
-3.00 V
(32) Partial Window(PTL)
(R90H)
Action
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
1
0
0
1
0
0
0
0
0
1
-
-
-
-
-
-
-
HRST[8]
0
1
0
0
0
Set Partial Window 0
1
-
-
HRED[8]
0
1
1
1
1
0
1
-
-
VRST[8]
0
1
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HRST[7:3]
-
-
-
-
-
HRED[7:3]
-
-
-
-
VRST[7:0]
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0
1
0
1
0
1
-
-
-
-
-
-
-
VRED[8]
-
-
PT_SCAN
VRED[7:0]
-
-
-
-
-
This command sets partial window.
HRST[8:3]: Horizontal start channel bank. (value 00h~31h)
HRED[7:3]: Horizontal end channel bank. (value 00h~31h). HRED must be greater than HRST.
VRST[8:0]: Vertical start line. (value 000h~12Bh)
VRED[8:0]: Vertical end line. (value 000h~12Bh). VRED must be greater than VRST.
PT_SCAN:
0: Gates scan only inside of the partial window.
1: Gates scan both inside and outside of the partial window. (default)
(33) Partial In (PTIN)
(R91H)
Action
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
Partial In
0
0
1
0
0
1
0
0
0
1
This command makes the display enter partial mode.
(34) Partial Out (PTOUT)
(R92H)
Action
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
Partial In
0
0
1
0
0
1
0
0
1
0
This command makes the display exit partial mode and enter normal mode.
(35) Program Mode (PGM)
Action
W/R
(RA0H)
C/D
D7
D6
D5
D4
D3
D2
D1
D0
Enter
Program 0
0
1
0
1
0
0
0
0
0
Mode
0
1
1
0
1
0
0
1
0
1
After this command is issued, the chip would enter the program mode.
The mode would return to standby by hardware reset.
The only one parameter is a check code, the command would be excuted if check code = 0xA5.
(36) Active Program (APG)
(RA1H)
Action
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
Active Program OTP
0
0
1
0
1
0
0
0
0
1
After this command is transmitted, the programming state machine would be activated.
The BUSY flag would fall to 0 until the programming is completed.
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(37) Read OTP Data (ROTP)
(RA2H)
Action
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
0
0
1
0
1
0
0
0
1
0
1
1
Dummy
1
1
The data of address 0x000 in the OTP
Read OTP data for check 1
1
The data of address 0x001 in the OTP
1
1
..
1
1
The data of address (n-1) in the OTP
1
1
The data of address (n) in the OTP
The command is used for reading the content of OTP for checking the data of programming.
The value of (n) is depending on the amount of programmed data, the max address = 0xFFF.
The sequence of programming OTP
(38) Power Saving (PWS)
(RE3H)
Action
W/R
C/D
D7
D6
D5
D4
D3
D2
D1
D0
Power Saving for
0
0
1
1
1
0
0
0
1
1
Vcom &Source
0
1
VCOM_W[3:0]
SD_W[3:0]
This command is set for saving power during fresh period. If the output voltage of VCOM / Source is from negative to positive or
from positive to negative, the power saving mechanism will be activated. The active period width is defined by the following two
parameters.
VCOM_W[3:0]: VCOM power saving width (unit = line period)
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SD_W[3:0]: Source power saving width (unit = 660nS)
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7. Electrical Characteristics
7-1) Absolute maximum rating
Parameter
Symbol
Rating
Unit
Logic Supply Voltage
VCI
-0.3 to +6.0
V
Logic Input Voltage
VIN
-0.3 to VCI +2.4
V
Operating Temp. range
TOPR
0 to +50
℃
Storage Temp. range
TSTG
-25 to +70
℃
Humidity range
-
%RH
40~70
*Note: Avoid direct sunlight.
7-2) Panel DC Characteristics
The following specifications apply for: VSS = 0V, VCI = 3.3V, TA = 25℃
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Single ground
VSS
-
-
0
-
V
Logic Supply Voltage
VCI
-
2.3
3.3
3.6
V
High level input voltage
VIH
Digital input pins
0.7VCI
-
VCI
V
Low level input voltage
VIL
Digital input pins
0
-
0.3VCI
V
High level output voltage
VOH
Digital input pins , IOH= 400uA
VCI-0.4
-
-
V
Low level output voltage
VOL
Digital input pins , IOL= -400uA
0
-
0.4
V
Image update current
IUPDATE
-
-
8
10
mA
Standby panel current
Istandby
-
-
-
5
uA
Power panel(update)
PUPDATE
-
-
26.4
40
mW
Standby power panel
PSTBY
-
-
-
0.0165
mW
Operating temperature
-
-
0
-
40
℃
Storage temperature
-
-
-25
-
60
℃
Image update Time at 25 ℃
-
-
-
12
15
Sec
-
2
5
uA
-
35
50
uA
DC/DC off
Deep sleep mode current
IVCI
No clock
No input load
Ram data not retain
DC/DC off
Sleep mode current
IVCI
No clock
No input load
Ram data retain
- The Typical power consumption is measured with following pattern transition: from horizontal 2 gray scale pattern to vertical 2
gray scale pattern.(Note 7-1)
- The standby power is the consumed power when the panel controller is in standby mode.
- The listed electrical/optical characteristics are only guaranteed under the controller & waveform provided by Good Display
- Vcom is recommended to be set in the range of assigned value ± 0.1V.
Note 7-1
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The Typical power consumption
7-3) Panel AC Characteristics
7-3-1) Oscillator frequency
The following specifications apply for : VSS = 0V, VCI = 3.3V, TA = 25℃
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Internal Oscillator frequency
Fosc
VCI=2.3 to 3.6V
-
1.625
-
MHz
7-3-2) MCU Interface
7-3-2-1) MCU Interface Selection
In this module, there are 4-wire SPI and 3-wire SPI that can communicate with MCU. The MCU interface mode can be set by
hardware selection on BS1 pins. When it is “Low”, 4-wire SPI is selected. When it is “High”, 3-wire SPI (9 bits SPI) is selected.
Pin Name
Data/Command Interface
Control Signal
Bus interface
D1
D0
CS#
D/C#
RES#
SPI4
SDIN
SCLK
CS#
D/C#
RES#
SPI3
SDIN
SCLK
CS#
L
RES#
Table 7-1: MCU interface assignment under different bus interface mode
Note 7-2: L is connected to VSS
Note 7-3: H is connected to VCI
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7-3-2-2) MCU Serial Interface (4-wire SPI)
The 4-wire SPI consists of serial clock SCLK, serial data SDIN, D/C#, CS#. In SPI mode, D0 acts as SCLK, D1 acts as SDIN.
Function
CS#
D/C#
SCLK
Write Command
L
L
↑
Write data
L
H
↑
Table 7-2: Control pins of 4-wire Serial Peripheral interface
Note 7-4: ↑stands for rising edge of signal
SDIN is shifted into an 8-bit shift register in the order of D7, D6, ... D0. The data byte in the shift register is written to the Graphic
Display Data RAM (RAM) or command register in the same clock. Under serial mode, only write operations are allowed.
Figure 7-1: Write procedure in 4-wire Serial Peripheral Interface mode
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7-3-2-3) MCU Serial Interface (3-wire SPI)
The 3-wire serial interface consists of serial clock SCLK, serial data SDIN and CS#.
In 3-wire SPI mode, D0 acts as SCLK, D1 acts as SDIN, The pin D/C# can be connected to an external ground.
The operation is similar to 4-wire serial interface while D/C# pin is not used. There are altogether 9-bits will be shifted into the shift
register on every ninth clock in sequence: D/C# bit, D7 to D0 bit. The D/C# bit (first bit of the sequential data) will determine the
following data byte in shift register is written to the Display Data RAM (D/C# bit = 1) or the command register (D/C# bit =
0).Under serial mode, only write operations are allowed.
Function
CS#
D/C#
SCLK
Write Command
L
Tie LOW
↑
Write data
L
Tie LOW
↑
Table 7-3: Control pins of 3-wire Serial Peripheral Interface
Note 7-5: ↑stands for rising edge of signal
: Write procedure in 3-wire Serial Peripheral Interface mode
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7-3-3) Timing Characteristics of Series Interface
Symbol
Signal
Parameter
Min
Typ
Max
Unit
Chip Select Setup Time
60
-
-
ns
Chip Select Hold Time
65
-
-
ns
Chip Select Setup Time
20
-
-
ns
tchw
Chip Select Setup Time
40
-
-
ns
tscycw
Serial clock cycle (write)
100
-
-
ns
tshw
SCL “H” pulse width (write)
35
-
-
ns
SCL“L” pulse width (write)
35
-
-
ns
Serial clock cycle (Read)
150
-
-
ns
tshr
SCL “H” pulse width (Read)
60
-
-
ns
tslr
SCL “L” pulse width (Read)
60
-
-
ns
Data setup time
30
-
-
ns
Data hold time
30
-
-
ns
Access time
-
-
10
ns
Output disable time
15
-
-
ns
tcss
tcsh
tscc
tslw
tscycr
CS#
SCLK
tsds
tsdh
tacc
SDIN
(DIN)
(DOUT)
toh
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7-4) Power Consumption
Parameter
Symbol
Conditions
TYP
Max
Unit
Remark
Panel power consumption during update
-
25℃
26.4
40
mW
-
Power consumption in standby mode
-
25℃
-
0.0165
mW
-
7-5) Reference Circuit
Figure . 7-5 (1)
Figure . 7-5 (2)
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Figure . 7-5 (3)
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Figure . 7-5 (4)
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8. Typical Operating Sequence
8-1) Normal Operation Flow
1. BWR mode & LUT form Register
System Power
Reset the EPD driver IC
Booster soft start
Power setting
Power on
Panel setting
PLL control
Resolution setting
Load image data
Display refresh
Border floating
Turn off
Enter into deep
sleep mode
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2. BWR mode & LUT form OTP
System Power
Reset the EPD driver IC
Booster soft start
Power on
Panel setting
Resolution setting
Load image data
Display refresh
Border floating
Turn off
Enter into deep
sleep mode
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8-2) Reference Program Code
1. BWR mode & LUT from register
System power
LUT
Reset the EPD driver IC
Data start transmission 1
SPI (0x10)
Booster soft start
SPI (0x06,0x17,0x17,0x17)
Transport B/W data
Power setting
Data start transmission 2
SPI (0x01,0x03,0x00,0x2b,0x2b,0x09)
SPI (0x13)
Power on
Transport red data
SPI (0x04)
Display refresh
Check BUSY pin
BUSY=Low
SPI (0x12)
BUSY=High
Panel setting
SPI (0x00,0xaf)
Check BUSY pin
BUSY=Low
BUSY=High
Vcom and data interval setting
PLL control
SPI (0x50,value)Note1
SPI (0x30,0x3a)
Power off
Resolution setting
SPI (0x02)
SPI (0x61,0x01,0x90,0x01,0x2c)
Deep sleep
VCM_DC setting
SPI (0x07,0xa5)
SPI (0x82,0x12)
Vcom and data interval setting
SPI (0x50,0x87)
Note1: Set border to floating.
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GDEW042Z15
2. BWR mode & LUT from OTP
System power
Data start transmission 2
SPI (0x13)
Reset the EPD driver IC
Transport red data
Booster soft start
SPI (0x06,0x17,0x17,0x17)
Display refresh
SPI (0x12)
Power on
SPI (0x04)
Check BUSY pin
Check BUSY pin
BUSY=Low
BUSY=Low
BUSY=High
Vcom and data interval setting
BUSY=High
SPI (0x50,value)Note1
Panel setting
SPI (0x00,0x0f)
Power off
SPI (0x02)
Resolution setting
SPI (0x61,0x01,0x90,0x01,0x2c)
Deep sleep
SPI (0x07,0xa5)
Vcom and data interval setting
SPI (0x50,0x87)
Data start transmission 1
SPI (0x10)
Transport B/W data
Note1: Set border to floating.
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9. Optical characteristics
9-1) Specifications
Measurements are made with that the illumination is under an angle of 45 degrees, the detection is perpendicular unless otherwise
specified.
T=25℃
SYMBOL
PARAMETER
CONDITIONS
MIN
TYPE
MAX
UNIT
R
Reflectance
White
30
35
-
%
-
-
DS+(WS-DS)×n(m-1)
-
L*
-
-
-
-
Gn
2Grey Level
CR
Contrast Ratio
indoor
Panel’s life
8
0℃~40℃
1000000 times or 5 years
Storage and
Image Update
Note
Note
9-1
Note
9-2
Update the white screen
transportation
Panel
Suggest update once every
Update Time
Operation
24 hours or at least 10 days
to update again.
WS: White state, DS: Dark state
Gray state from Dark to White : DS、WS
m: 2
Note 9-1: Luminance meter: Eye – One Pro Spectrophotometer
Note 9-2: Panel life will not guaranteed when work in temperature below 0 degree or above 40 degree. Each update interval time
should be minimum at 180 seconds.
9-2) Definition of contrast ratio
The contrast ratio (CR) is the ratio between the reflectance in a full white area (R1) and the reflectance in a dark area (Rd)() :
R1: white reflectance
Rd: dark reflectance
CR = R1/Rd
Display
θ
Ring light
Detector
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9-3) Reflection Ratio
The reflection ratio is expressed as:
R = Reflectance Factor white board x (L center / L white board)
L center is the luminance measured at center in a white area (R=G =B=1). L white board is the luminance of a standard white board. Both
are measured with equivalent illumination source. The viewing angle shall be no more than 2 degrees.
Viewing
direction
9 o'clock
direction 180°
α
12 o'clock
direction 90°
3 o'clock
direction 0°
θ
6 o'clock
direction 270°
9-4) Bi-stability
The Bi-stability standard as follows:
Bi-stability
Result
AVG
24 hours
Luminance drift
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MAX
White state
△L*
-
3
Black state
△L*
-
3
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10. Handling, Safety and Environmental Requirements
Warning
The display glass may break when it is dropped or bumped on a hard surface. Handle with care.
Should the display break, do not touch the electrophoretic material. In case of contact with electrophoretic material, wash with
water and soap.
Caution
The display module should not be exposed to harmful gases, such as acid and alkali gases, which corrode electronic components.
Disassembling the display module can cause permanent damage and invalidate the warranty agreements.
Observe general precautions that are common to handling delicate electronic components. The glass can break and front surfaces
can easily be damaged. Moreover the display is sensitive to static electricity and other rough environmental conditions.
Data sheet status
Product specification
The data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134).
Stress above one or more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics
sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and dose not form part of the specification.
Product environmental certification
RoHS
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11. Reliability test
TEST
CONDITION
METHOD
REMARK
When the experimental cycle finished, the EPD samples will
be
1
taken
out
from
the
high
High-Tempera
T =40℃,RH=35% for
temperature environmental chamber and set aside for a few
ture Operation
240 hrs
minutes. As EPDs return to room temperature, testers will
observe the appearance, and test electrical and optical
performance based on standard# IEC 60 068-2-2Bp.
When the experimental cycle finished, the EPD samples will
be
2
Low-Tempera
ture Operation
T = 0℃ for 240 hrs
taken
out
from
the
low
temperature environmental chamber and set aside for a few
minutes. As EPDs return room temperature, testers will
observe the appearance, and test electrical and optical
performance based on standard# IEC 60 068-2-2Ab.
When the experimental cycle finished, the EPD samples will
T = +60℃,
3
be
taken
out
from
the
high
High-Tempera
RH=35%
temperature environmental chamber and set aside for a few
ture Storage
for 240 hrs
minutes. As EPDs return to room temperature, testers will
Test in white pattern
observe the appearance, and test electrical and optical
performance based on standard# IEC 60 068-2-2Bp.
When the experimental cycle finished, the EPD samples will
4
Low-Tempera
ture Storage
T = -25℃
for 240 hrs
Test in white pattern
be
taken
out
from
the
low
temperature environmental chamber and set aside for a few
minutes. As EPDs return to room temperature, testers will
observe the appearance, and test electrical and optical
performance based on standard# IEC 60 068-2-2Ab
High
5
When the experimental cycle finished, the EPD samples will
must meet electrical
performance
standards.
When experiment
finished, the EPD
must meet electrical
performance
standards.
When experiment
finished, the EPD
must meet electrical
performance
standards.
When experiment
finished, the EPD
must meet electrical
performance
standards.
When experiment
T=+40℃,
be taken out from the environmental chamber and set aside
finished, the EPD
High-
RH=80%
for a few minutes. As EPDs return to room temperature,
must meet electrical
Humidity
for 240 hrs
testers will observe the appearance, and test electrical and
performance
optical performance based on standard# IEC 60 068-2-3CA.
standards.
When the experimental cycle finished, the EPD samples will
When experiment
be taken out from the environmental chamber and set aside
finished, the EPD
for a few minutes. As EPDs return to room temperature,
must meet electrical
testers will observe the appearance, and test electrical and
performance
optical performance based on standard# IEC 60 068-2-3CA.
standards.
High
Temperature,
HighHumidity
Storage
T=+50℃,
RH=80%
for 240 hrs
Test in white pattern
Samples are put in the Temp & Humid. Environmental
When experiment
→[Temperature rise
Chamber. Temperature cycle starts with -25℃, storage
finished, the EPD
30mins]
period 30 minutes. After 30 minutes, it needs 30min to
must meet electrical
[+60℃,RH=35%
let temperature rise to 60℃. After 30min, temperature
performance
30mins]
will be adjusted to 60℃,RH=35% and storage period is
standards.
[-25℃ 30mins]
7
finished, the EPD
Temperature,
Operation
6
When experiment
Temperature
Cycle
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1.
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GDEW042Z15
→[Temperature drop
30 minutes. After 30 minutes, it needs 30min to let
30mins], 1cycle=2hrs,
temperature rise to -25℃.
50 cycles
Test in white pattern
One temperature cycle
(2hrs) is complete.
2.
Temperature cycle repeats 50 times.
3.
When 50 cycles finished, the samples will be taken out
from experiment chamber and set aside a few minutes.
As EPDs return to room temperature, tests will observe
the appearance, and test electrical and optical
performance based on standard# IEC 60 068-2-14NB.
8
9
2
UV exposure
765 W/m for 168
Resistance
hrs,40℃
Electrostatic
Machine Model:
discharge
+/-250V, 0Ω, 200PF
Standard# IEC 60 068-2-5 Sa
Standard# IEC61000-4-2
1.04G,Frequency :
10
Package
Vibration
10~500Hz
Direction : X, Y, Z
Full packed for shipment
Duration:1hours in each
direction
Drop from height of
122 cm on
11
Package Drop
Impact
Concrete surface
Drop sequence:1 corner,
Full packed for shipment
3edges,
6face
One drop for each.
Actual EMC level to be measured on customer application.
Note: (1) The protective film must be removed before temperature test.
(2) There’s temperature vs display quality limitation in our display module, we guarantee 1 pixel display quality from 5℃ ~
30℃, and 2 pixel display quality for 0℃~ 5℃ & 30℃ ~ 40℃.
(3) In order to make sure the display module can provide the best display quality, the update should be made after putting the
display module in stable temperature environment for 15 mins.
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GDEW042Z15
12. Point and line standard
Shipment Inseption Standard
Part-A:Active area
Part-B:Border area
Equipment:Electrical test fixture, Point gauge
Outline dimension:
91.0(H)×77.0(V) ×1.18(D)
Unit:mm
Temperature
Environment
23±2℃
Name
Spot
Humidity
Illuminance
55±
1200~
5%RH
1500Lux
Time
300 mm
35 Sec
Causes
Spot size
Part-A
B/W spot in glass or
D ≤ 0.25mm
Ignore
protection sheet,
0.25mm < D ≤ 0.4mm
0.4mm < D
foreign mat. Pin hole
Scratch or line defect
Distance
4
Length
Width
Part-A
Scratch on FPL or
L ≤2.0mm
W≤0.2 mm
Ignore
Particle is Protection
2.0 mm < L≤ 5.0mm
0.2 mm 1/4L
Scratch or line defect: W ≤1/4L
Definition for L/W and D (major axis)
FPC bonding area pad doesn’t allowed visual inspection.
Note: AQL = 0.4
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GDEW042Z15
13. Packing
empty tray
2
6
1
3
3
vacuum
bag
2nd layer
1st layer
4
4
2
2
2
4
3
00
mm
1
tape
12(PCS)×12(Layer)=144PCS
1150mm
7550mm
total 12 layer
78
Protector
9000mm
Pallet
PP belt
144(PCS)×16(BOX)=2304PCS
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