MS5525DSO
(Digital Small Outline)
SPECIFICATIONS
Integrated Digital Pressure Sensor
(24-bit ∆Σ ADC)
Fast Conversion Down to 1 ms
Low Power, 1 µA (standby < 0.15 µA)
Supply Voltage: 1.8 to 3.6V
Pressure Range: 1 to 30 PSI
I2C and SPI Interface
The MS5525DSO is a new generation of Digital Small Outline
pressure sensors from MEAS with SPI and I 2C bus interface
designed for high volume OEM users. The sensor module
includes a pressure sensor and an ultra low power 24-bit ∆Σ
ADC with internal factory calibrated coefficients. It provides a
24-bit digital pressure and temperature value and different
operation modes that allow the user to optimize for conversion
speed and current consumption. The MS5525DSO can be
interfaced to virtually any microcontroller. The communication
protocol is simple, without the need of programming internal
registers in the device.
This new sensor module generation is based on leading
MEMS technology and latest benefits from TE proven
experience and know-how in high volume manufacturing of
pressure modules, which have been widely used for over a
decade.
The rugged engineered thermoplastic transducer is available
in single and dual port configurations, and can measure
absolute, gauge, compound, and differential pressure from 1
to 30psi.
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 1
MS5525DSO
(Digital Small Outline)
FEATURES
Small Outline IC Package
Barbed Pressure Ports
Low Power, High Resolution ADC
Digital Pressure and Temperature Outputs
APPLICATIONS
Factory Automation
Altitude and Airspeed Measurements
Medical Instruments
Leak Detection
STANDARD RANGES (PSI)
FS Pressure
1
2
5
15
30
Absolute
DB, DH,FT
DB, DH,FT
Gauge
DB, SB, ST, DH,FT
DB, SB, ST, DH,FT
DB, SB, ST, DH,FT
DB, SB, ST, DH,FT
DB, SB, ST, DH,FT
Differential
DB, SB,ST, DH
DB, SB,ST, DH
DB, SB,ST ,DH
DB, DH
DB, DH
See Package Configurations: DB= Dual Barb, DH= Dual Hole, SB=Single Barb, ST=Single Tube, FT=Front Side Tube
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 2
MS5525DSO
(Digital Small Outline)
ABSOLUTE MAXIMUM RATING
Parameter
Supply Voltage
Storage Temperature
Overpressure
Burst Pressure
ESD
Solder Temperature
Conditions
TA = 25°C
TA = 25 °C, both Ports
TA = 25 °C, Port 1
HBM
Min
-0.3
-40
Max
3.6
125
60
-4
+4
250°C, 5 sec max.
Unit
V
°C
psi
psi
kV
Symbol/Notes
VDD
See Table 1
EN 61000-4-2
Table 1- BURST PRESSURE BY RANGE AND PORT DESIGNATION.
Range
001
002
005
015
030
Port 1
10
20
50
120
120
Port 2
10
20
15
60
120
Unit
psi
psi
psi
psi
psi
ENVIRONMENTAL SPECIFICATIONS
Parameter
Mechanical Shock
Mechanical Vibration
Thermal Shock
Life
MTTF
Conditions
Mil Spec 202F, Method 213B, Condition C, 3 Drops
Mil Spec 202F, Method 214A, Condition 1E, 1Hr Each Axis
100 Cycles over Storage Temperature, 30 minute dwell
1 Million FS Cycles
>10Yrs, 70 ºC, 1 Million Pressure Cycles, 120%FS Pressure
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 3
MS5525DSO
(Digital Small Outline)
PERFORMANCE SPECIFICATIONS
Supply Voltage1 3.0 Vdc
Reference Temperature: 25°C (unless otherwise specified)
PARAMETERS
MIN
Operating Voltage
1.8
TYP
MAX
ADC
24
Pressure Accuracy
See Table 2 Below
Total Error Band (TEB)
UNITS
NOTES
3.6
-2.5
2.5
bits
%FS
2,5
%FS
3
Temperature Accuracy (Reference Temperature)
±1.5
ºC
4,5
Temperature Accuracy
±2.5
ºC
4,5
See OSR Table Below
mA
Supply Current
Compensated Temperature
Operating Temperature
0
85
-40
+125
Conversion Time
Weight
Media
ºC
ºC
See OSR Table Below
mS
3
grams
Non-Corrosive Dry Gases Compatible with Silicon, Glass, LCP, RTV,
Gold, Thermo-Epoxy, Silicone Gel, Aluminum and Epoxy. See
“Wetted Material by Port Designation” chart.
Notes
1. Proper operation requires an external capacitor placed as shown in Application Circuit. Output is not ratiometric to supply voltage.
2. The maximum deviation from a best fit straight line(BFSL) fitted to the output measured over the pressure range at 25°C. Includes all
errors due to pressure non linearity, hysteresis, and non repeatability.
3. The maximum deviation from ideal output with respect to input pressure and temperature over the compensated temperature range.
Total error band (TEB) includes all accuracy errors, thermal errors over the compensated temperature range, span and offset calibration
tolerances. TEB values are valid only at the calibrated supply voltage.
4. The deviation from a best fit straight line (BFSL) from 25°C. to 85°C.
5. Six coefficients must be read by microcontroller software and are used in a mathematical calculation for converting D1 and D2 into
compensated pressure and temperature values.
Table 2- TYPICAL ACCURACY SPECIFICATION BY PRESSURE RANGE
Range
001
002
005
015
030
Port 1
±0.25
±0.25
±0.50
±0.25
±0.25
SENSOR SOLUTIONS ///MS5525DSO
Port 2
±1.0
±0.5
±1.0
±0.25
±0.25
Unit
%FSS
%FSS
%FSS
%FSS
%FSS
09/2016
Page 4
MS5525DSO
(Digital Small Outline)
OVERSAMPLNG RATIO (OSR) PERFORMANCE CHARACTERISTICS
SUPPLY CURRENT CHARACTERISTICS
Parameter
Symbol
Supply current
(1 sample per sec.)
IDD
Peak supply current
Standby supply current
Conditions
OSR
Min.
Typ.
12.5
6.3
3.2
1.7
0.9
1.4
0.02
Max
Min.
7.40
3.72
1.88
0.95
0.48
Typ.
8.22
4.13
2.08
1.06
0.54
Max
9.04
4.54
2.28
1.17
0.60
Unit
Min.
Typ.
Max
20
400
100% VDD
20% VDD
Unit
MHz
kHz
V
V
4096
2048
1024
512
256
during conversion
at 25°C
Unit
µA
0.14
mA
µA
ANALOG DIGITAL CONVERTER (ADC)
Parameter
Symbol
Conversion time
Conditions
OSR
tc
4096
2048
1024
512
256
ms
INPUT/OUTPUT SPECIFICATIONS
2
DIGITAL INPUTS (CSB, I C, DIN, SCLK)
Parameter
Serial data clock
Serial data clock
Input high voltage
Input low voltage
Symbol
SCLK
SCL
VIH
VIL
Ileak25°C
Ileak85°C
CIN
Input leakage current
Input capacitance
Conditions
SPI protocol
I2C protocol
Pins CSB
80% VDD
0% VDD
at 25°C
0.15
µA
6
pF
2
PRESSURE OUTPUTS (I C, DOUT)
Parameter
Output high voltage
Output low voltage
Load capacitance
SENSOR SOLUTIONS ///MS5525DSO
Symbol
VOH
VOL
CLOAD
Conditions
Isource = 0.6 mA
Isink = 0.6 mA
Min.
80% VDD
0% VDD
09/2016
Typ.
Max
100% VDD
20% VDD
16
Unit
V
V
pF
Page 5
MS5525DSO
(Digital Small Outline)
FUNCTIONAL DESCRIPTION
BLOCK DIAGRAM
Figure 1: Block diagram of MS5525DSO
GENERAL
The MS5525DSO consists of a piezo-resistive sensor and a sensor interface IC. The main function of the
MS5525DSO is to convert the uncompensated analog output voltage from the piezo-resistive pressure
sensor to a 24-bit digital value, as well as providing a 24-bit digital value for the temperature of the sensor.
FACTORY CALIBRATION
Every module is individually factory calibrated at two temperatures and three pressures. As a result, six
coefficients necessary to compensate for process variations and temperature variations are calculated and
stored in the 128-bit PROM of each module. These bits, partitioned into six coefficients, C1 through C6, must
be read by the microcontroller software and used in the program converting D1 and D2 into compensated
pressure and temperature values.
The coefficients C0 and C7 are for factory calibration and CRC.
SERIAL INTERFACE
The MS5525DSO has built in two types of serial interfaces: SPI and I2C. Pulling the Protocol Select pin PS to
low selects the SPI protocol, pulling PS to high activates the I2C bus protocol.
Pin PS
Mode
Pins used
High
Low
IC
SPI
SDA, SCL CSB
SDI, SDO, SCLK, CSB
2
SPI MODE
The external microcontroller clocks in the data through the input SCLK (Serial CLocK) and SDI (Serial Data
In). In the SPI mode module can accept both mode 0 and mode 3 for the clock polarity and phase. The
sensor responds on the output SDO (Serial Data Out). The pin CSB (Chip Select) is used to
enable/disable the interface, so that other devices can talk on the same SPI bus. The CSB pin can be
pulled high after the command is sent or after the end of the command execution (for example end of
conversion). The best noise performance from the module is obtained when the SPI bus is idle and without
communication to other devices during the ADC conversion.
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 6
MS5525DSO
(Digital Small Outline)
I2C MODE & ADDRESSING
The external microcontroller clocks in the data through the input SCL (Serial CLock) and SDA (Serial DAta).
The sensor responds on the same pin SDA which is bidirectional for the I2C bus interface. So this interface
type uses only 2 signal lines and does not require a chip select, which can be favorable to reduce board
space. In I2C -Mode the complement of the pin CSB (Chip Select) represents the LSB of the I2C address. It
is possible to use two sensors with two different addresses on the I2C bus. The pin CSB must be connected
to VDD or GND do not leave these pins unconnected.
Pin CSB
Address (7 bits)
High
Low
0x76
0x77
COMMANDS
The MS5525DSO has only five basic commands:
1. Reset
2. Read PROM (128 bit of calibration words)
3. D1 conversion
4. D2 conversion
5. Read ADC result (24 bit pressure / temperature)
Size of each command is 1 byte (8 bits) as described in the table below. After ADC read commands the device will
return 24 bit result and after the PROM read 16bit result. The address of the PROM is embedded inside of the
PROM read command using the Ad2, Ad1 and Ad0 bits.
Bit number
Bit name
Command byte
0
1
2
PRM COV
-
3
Typ
4
5
6
7
Ad2/ Ad1/ Ad0/ Stop
Os2 Os1 Os0
Command
Reset
Convert D1 (OSR=256)
Convert D1 (OSR=512)
Convert D1 (OSR=1024)
Convert D1 (OSR=2048)
Convert D1 (OSR=4096)
Convert D2 (OSR=256)
Convert D2 (OSR=512)
Convert D2 (OSR=1024)
Convert D2 (OSR=2048)
Convert D2 (OSR=4096)
ADC Read
PROM Read
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
1
1
1
1
1
0
0
1
0
0
0
0
1
0
0
0
0
1
0
Ad2
0
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
hex value
1
0
0
1
1
0
0
0
1
1
0
0
Ad1
1
0
1
0
1
0
0
1
0
1
0
0
Ad0
0
0
0
0
0
0
0
0
0
0
0
0
0
0x1E
0x40
0x42
0x44
0x46
0x48
0x50
0x52
0x54
0x56
0x58
0x00
0xA0 to
0xAE
Figure 4: Command
structure
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 7
MS5525DSO
(Digital Small Outline)
Start
5525DSO-pp005GS Example
Tmin=-40°C , Tmax=125°C
Variable
C1
Coefficient Description
Pressure Sensitivity, SENST1
Recommended
Variable Type
Size [1]
Value
[Bit]
Min
Max
Example/
Typical
unsigned int 16
16
0
65535
36402
0
65535
39473
C2
Pressure Offset, OFFT1
unsigned int 16
16
C3
Temperature Coefficient, Pressure Sensitivity, TCS
unsigned int 16
16
0
65535
40393
C4
Temperature Coefficient, Pressure Offset, TCO
unsigned int 16
16
0
65535
29523
unsigned int 16
16
0
65535
29854
unsigned int 16
16
0
65535
21917
C5
C6
Reference Temperature, TREF
Temperature Coefficient Temperature, TEMPSENS
Read Calibration Data from PROM
Read Digital Pressure and Temperature Data
D1
Digital Pressure Value
unsigned int 32
24
0
16777216
5240585
D2
Digital Temperature Value
unsigned int 32
24
0
16777216
3869265
Calculate Temperature
dT
Difference between actual and reference temperature
dT = D2 - TRE F = D2 - C5 * 2Q5
signed int 32
25
-16776960
16777216
47953
TEMP
Measured temperature
TEMP=20°C+dT*TEMPSENS=2000+dT*C6/2Q6
signed int 32
41
-4000
12500
=25.01°C
2501
Calculate Temperature Compensated Pressure
OFF
Offset at actual temperature
OFF=OFFT1+TCO * dT=C2*2Q2+(C4*dT)/2Q4
signed int 64
41
5218046194
SENS
Sensitivity at actual temperature
SENS=SENST1+TCS*dT=C1*2Q1+(C3*dT)/2Q3
signed int 64
41
2415906558
P
Temperature Compensated Pressure
P=D1*SENS-OFF=(D1*SENS/221-OFF)/215
signed int 32
61
24996
=2.4996psi
Display Pressure and Temperature Value
Figure 1: Flow chart for pressure and temperature reading and software compensation.
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 8
MS5525DSO
(Digital Small Outline)
Qx Coefficients Matrix by Pressure Range
Part Number
Pmin
Pmax
Q1
Q2
Q3
Q4
Q5
7
Q6
21
TRES
PRES
(°C)
(PSI)
0.01
0.0001
5525DSO-pp001GS
0
1
14
16
7
5
5525DSO-pp001DS
-1
1
15
17
7
5
7
21
0.01
0.0001
5525DSO-pp002GS
0
2
14
15
8
6
7
22
0.01
0.0001
5525DSO-pp002DS
-2
2
16
18
6
4
7
22
0.01
0.0001
5525DSO-pp005GS
0
5
16
17
6
5
7
21
0.01
0.0001
5525DSO-pp005DS
-5
5
17
19
5
3
7
22
0.01
0.0001
5525DSO-pp0015AS
0
15
16
17
6
5
7
22
0.01
0.0001
5525DSO-pp0015GS
0
15
16
17
6
5
7
22
0.01
0.0001
5525DSO-pp0015DS
-15
15
17
19
5
3
7
22
0.01
0.0001
5525DSO-pp0030AS
0
30
17
18
5
4
7
22
0.01
0.0001
5525DSO-pp0030GS
0
30
17
18
5
4
7
22
0.01
0.0001
5525DSO-pp0030DS
-30
30
18
20
4
1
7
22
0.01
0.0001
11
10
9
MEMORY MAPPING
Memory Mapping
Address
15
14
13
12
8
7
6
0
Reserved for Manufacturer
1
Coefficient 1 (C1)
2
Coefficient 2 (C2)
3
Coefficient 3 (C3)
4
Coefficient 4 (C4)
5
Coefficient 5 (C5)
6
Coefficient 6 (C6)
5
7
4
3
2
1
0
CRC
Figure 2: Memory PROM Mapping
Notes
[1]
Maximal size of intermediate result during evaluation of variable.
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 9
MS5525DSO
(Digital Small Outline)
SPI INTERFACE
RESET SEQUENCE
The Reset sequence shall be sent once after power-on to make sure that the calibration PROM gets loaded
into the internal register. It can be also used to reset the device ROM from an unknown condition
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 10
MS5525DSO
(Digital Small Outline)
CONVERSION SEQUENCE
The conversion command is used to initiate uncompensated pressure (D1) or uncompensated temperature (D2)
conversion. The chip select can be disabled during this time to communicate with other devices.
After the conversion, using ADC read command the result is clocked out with the MSB first. If the conversion is
not executed before the ADC read command, or the ADC read command is repeated, it will give 0 as the output
result. If the ADC read command is sent during conversion the result will be 0, the conversion will not stop and
the final result will be wrong. Conversion sequence sent during the already started conversion process will yield
incorrect result as well.
PROM READ SEQUENCE
The read command for PROM shall be executed once after reset by the user to read the content of the
calibration PROM and to calculate the calibration coefficients. There are in total 8 addresses resulting in a total
memory of 128 bit. Address 0 contains factory data and the setup, addresses 1-6 calibration coefficients and
address 7 contains the serial code and CRC. The command sequence is 8 bits long with a 16 bit result which is
clocked with the MSB first.
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 11
MS5525DSO
(Digital Small Outline)
I2C INTERFACE
COMMANDS
Each I2C communication message starts with the start condition and it is ended with the stop condition. The
MS5525DSO address is 111011Cx, where C is the complementary value of the pin CSB. Since the IC does
not have a microcontroller inside, the commands for I2C and SPI are quite similar.
RESET SEQUENCE
The reset can be sent at any time. In the event that there is not a successful power on reset this may be caused
by the SDA being blocked by the module in the acknowledge state. The only way to get the MS5525DSO to
function is to send several SCLKs followed by a reset sequence or to repeat power on reset.
1 1 1 0 1 1 CSB 0 0 1 0 1 0 0 1 1 0 0
Device Address
command
S
Device Address
W A
cmd byte
A P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
Figure 10: I2C Reset Command
PROM READ SEQUENCE
The PROM Read command consists of two parts. First command sets up the system into PROM read mode.
The second part gets the data from the system.
1 1 1 0 1 1 CSB 0 0 1 0 1 0 0 1 1 0 0
Device Address
command
S
Device Address
W A
cmd byte
A P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
Figure 11: I2C Command to read memory address= 011 (Coefficient 3)
1 1 1 0 1 1 CSB 1 0 1 1 0 0 X X X X 0 X X X X X X X X 0
Device Address
data
data
S
Device Address
R A
Memory bit 15 - 8
A
Memory bit 7 - 0
N P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
Figure 12: I2C response from MS5525DSO
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 12
MS5525DSO
(Digital Small Outline)
CONVERSION SEQUENCE
A conversion can be started by sending the command to MS5525DSO. When command is sent to the system it
stays busy until conversion is done. When conversion is finished the data can be accessed by sending a Read
command, when an acknowledge appears from the MS5525DSO, 24 SCLK cycles may be sent to receive all
result bits. Every 8-bit the system waits for an acknowledge signal.
1 1 1 0 1 1 CSB 0 0 0 1 0 0 1 0 0 0 0
Device Address
command
S
Device Address
W A
cmd byte
A P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
Figure 13: I2C Command to initiate a pressure conversion (OSR=4096, typ=D1)
1 1 1 0 1 1 CSB 0 0 0 0 0 0 0 0 0 0 0
Device Address
command
S
Device Address
W A
cmd byte
A P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
Figure 14: I2C ADC read sequence
1 1 1 0 1 1 CSB 1 0 X X X X X X X X 0 X X X X X X X X 0 X X X X X X X X 0
Device Address
data
data
data
S
Device Address
R A
Data 23-16
A
Data 8 - 15
A
Data 7 - 0
N P
From Master
From Slave
S = Start Condition
P = Stop Condition
W = Write
R = Read
A = Acknowledge
N = Not Acknowledge
Figure 15: I2C response from MS5525DSO
CYCLIC REDUNDANCY CHECK (CRC)
MS5525DSO contains a PROM memory with 128-Bit. A 4-bit CRC has been implemented to check the data
validity in memory. The application note AN520 describes in detail CRC-4 code used.
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 13
MS5525DSO
(Digital Small Outline)
PINOUT, MARKING, AND PRESSURE TYPE CONFIGURATION
Pressure Type
Pmin
0psiA
Pmax
+Prange
-Prange
+Prange
0psiG
+Prange
Absolute
Differential/
Bidirectional
Gauge
Pin Name
Pin
SGND
SOUTSDO
1,3
2,4
5
6
SDA/SDI
Description
Output is proportional to the difference between 0psiA (Pmin) and pressure
applied to Port 1.
Output is proportional to the difference between Port 1 and Port 2. Output
swings positive when Port 2> Port 1. Output is 50% of total counts when
Port 1=Port 2.
Output is proportional to the difference between 0psiG (Pmin) and Port 1.
Output swings positive when Port 2> Port 1.
Function
I2C
Sensor Ground
Sensor Outputs, Negative
Serial Data Output
2
I C Data Input and Output
SPI Serial Data Input
2
SCL/SCLK
7
I C Clock
CSB
GND
PS
8
2
9
10
SPI
SPI Clock
Defines I C Address
Ground
Chip Select (Active Low)
Protocol Select
PS = (VDD)
PS = (GND)
2
I C Protocol Selected
SPI Protocol Selected
2
CSB= (VDD) I C Address =1110110X (0xEC, 0xED)
2
CSB= (GND) I C Address=1110111X (0xEE, 0xEF)
Supply+
11,13
Positive Supply Voltage
SOUT+
12,14
Sensor Outputs, Positive
WETTED MATERIAL BY PORT DESIGNATION
Port
LCP
Style
All
Port 1
Port 2
X
X
Material
Thermo-Epoxy
Epoxy
Resin
X
X
X
X
RTV
Glass
Silicon
X
X
X
Silicone
Gel
X
"X" Indicates Wetted Materials
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 14
MS5525DSO
(Digital Small Outline)
RECOMMEND PCB LAYOUT
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 15
MS5525DSO
(Digital Small Outline)
APPLICATION CIRCUIT
The MS5525DSO is a circuit that can be used in conjunction with a microcontroller. It is designed for lowvoltage systems with a supply voltage of 3 V.
Figure 17: Typical application circuit with SPI / I2C protocol communication
Note
1. Place 100nF capacitor between Supply and GND to within 2 cm of sensor.
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 16
MS5525DSO
(Digital Small Outline)
DIMENSIONS
MS5525DSO-DBxxxyS
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 17
MS5525DSO
(Digital Small Outline)
MS5525DSO-STxxxyS
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 18
MS5525DSO
(Digital Small Outline)
MS5525DSO-SBxxxyS
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 19
MS5525DSO
(Digital Small Outline)
MS5525DSO-DHxxxyS
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 20
MS5525DSO
(Digital Small Outline)
MS5525DSO-FTxxxyS
SENSOR SOLUTIONS ///MS5525DSO
09/2016
Page 21
MS5525DSO
(Digital Small Outline)
ORDERING INFORMATION
5525DSO
-
DB
005
G
S
Pressure
Type
Pin Style
Model
-
Package Style
Pressure
Range
MS5525DSO
-
DB = Dual Barb
SB = Single Barb
ST = Single Tube
DH = Dual Hole
FT = Front Tube
001
002
005
015
030
A = Absolute
D = Differential
G = Gauge
S = Gull Wing
NORTH AMERICA
EUROPE
ASIA
Measurement Specialties, Inc.,
a TE Connectivity company
45738 Northport Loop West
Fremont, CA 94538
Tel: +1 800 767 1888
Fax: +1 510 498 1578
customercare.frmt@te.com
MEAS Switzerland Sarl,
a TE Connectivity company
Ch. Chapons-des-Prés 11
CH-2022 Bevaix
Tel: +41 32 847 9550
Fax: +41 32 847 9569
customercare.bevx@te.com
Measurement Specialties (China) Ltd.,
a TE Connectivity company
No. 26 Langshan Road
Shenzhen High-Tech Park (North) Nanshan District,
Shenzhen, 518057
China
Tel: +86 755 3330 5088
Fax: +86 755 3330 5099
customercare.shzn@te.com
TE.com/sensorsolutions
Measurement Specialties, Inc., a TE Connectivity company.
Measurement Specialties, TE Connectivity, TE Connectivity (logo) and EVERY CONNECTION COUNTS are trademarks. All other logos, products and/or company names referred to herein
might be trademarks of their respective owners.
The information given herein, including drawings, illustrations and schematics which are intended for illustration purposes only, is believed to be reliable. However, TE Connectivity makes
no warranties as to its accuracy or completeness and disclaims any liability in connection with its use. TE Connectivity‘s obligations shall only be as set forth in TE Connectivity‘s Standard
Terms and Conditions of Sale for this product and in no case will TE Connectivity be liable for any incidental, indirect or consequential damages arising out of the sale, resale, use or misuse
of the product. Users of TE Connectivity products should make their own evaluation to determine the suitability of each such product for the specific application.
© 2015
TE Connectivity Ltd. family of companies
SENSOR SOLUTIONS ///MS5525DSO
All Rights Reserved.
09/2016
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