SFUI008GJ1AE1TO-I-5S-2AP-STD 数据手册
Product Data Sheet
Industrial
USB Flash Drive Module
U-58 Series
USB 3.1 SuperSpeed, pSLC
Commercial and Industrial
Temperature Grade
Date :
Re vi si o n:
Janu ar y 1 3, 20 2 0
1 .0 0
Contents
1.
PRODUCT SUMMARY ............................................................................................................ 3
2.
PRODUCT FEATURES ............................................................................................................ 4
3.
ORDERING INFORMATION ...................................................................................................... 5
4.
PRODUCT DESCRIPTION ......................................................................................................... 6
4.1 PERFORMANCE SPECIFICATIONS ...................................................................................................... 7
4.2 CURRENT CONSUMPTION ............................................................................................................ 7
4.3 ENVIRONMENTAL SPECIFICATIONS .................................................................................................. 8
4.4 REGULATORY COMPLIANCE ......................................................................................................... 9
4.5 MECHANICAL SPECIFICATIONS ...................................................................................................... 9
4.6 RELIABILITY AND ENDURANCE .................................................................................................... 10
4.7 DRIVE GEOMETRY SPECIFICATION .................................................................................................. 10
5.
ELECTRICAL INTERFACE ......................................................................................................... 11
6.
ELECTRICAL SPECIFICATION .................................................................................................... 12
7.
PACKAGE MECHANICAL ........................................................................................................ 13
8.
ATA PASS-THROUGH COMMANDS (IDENTIFY DEVICE AND S.M.A.R.T.) .................................................. 14
8.1 ATA PASS-THROUGH COMMANDS .................................................................................................. 14
8.2 IDENTIFY DEVICE .................................................................................................................. 14
8.3 S.M.A.R.T. COMMANDS .......................................................................................................... 15
9.
PART NUMBER DECODER ...................................................................................................... 18
10. MARKING SPECIFICATION ..................................................................................................... 20
10.1 TOP VIEW........................................................................................................................ 20
10.2 LABEL CONTENT .................................................................................................................. 20
11. REVISION HISTORY ............................................................................................................. 21
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U-58 Series – Industrial USB Flash Drive Module (eUSB)
8 GBytes up to 16 GBytes
1. Product Summary
1
2
Capacities: 8 GBytes, 16 GBytes
Form Factor:
o USB3.1 solid state flash drive for internal 9(10)-pin USB connector terminal (26.65mm x 36.8mm)
o 2.54mm or 2.00mm connector with keyed pin9
Compliance: USB 3.1 Gen 1 SuperSpeed specification compatible (backward compliance with USB 2.0/1.1)
Performance:
o Read Performance: Sequential Read up to 180 MBytes/s, Random Read IOPS up to 4,100
o Write Performance: Sequential Write up to 76 MBytes/s, Random Write IOPS up to 1,680
Operating Temperature Range 1:
o Commercial: 0 °C to 70 °C
o Industrial: -40 °C to 85 °C
Storage Temperature Range: -40 °C to 85 °C
Operating Voltage: 3.3V ±5% or 5V ± 10%
Data Retention: 10 Years @ Life Begin; 1 Year @ Life End
Endurance in TeraBytes Written (TBW) @ Max Capacity2:
o Enterprise Workload ≥ 67.2
Shock/Vibration: 1,500 g / 50 g
High-Performance 32-Bit Processor with Integrated, Parallel Flash Interface Engines:
o Triple-Level Cell (TLC) 3D NAND Flash in pSLC mode
o Hardware BCH Code ECC (up to 60bit correction per 1 KByte page)
High Reliability:
o Mean Time Between Failure (MTBF): > 3,000,000 hours
o Data Reliability: < 1 non-recoverable error per 1016 bits read
Adequate airflow is required to ensure the drive temperature, as reported in the S.M.A.R.T. data, does not exceed the specified
maximum operating temperature.
According to JEDEC (JESD47I), the time to write the full TBW is a minimum of 18 months. Higher average daily data volume reduces the
specified TBW. The values listed are estimates and are subject to change without notice.
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2. Product Features
Page based Flash management for increased endurance & random performance
Optimized FW algorithms especially for high read access and long data retention applications
o Proven power fail management for highest reliability
o Near Miss ECC technology
Minimize the risk of uncorrectable bit failure over the product life time. Each read command
analyzes the ECC margin level and refreshes data if necessary.
o Read Disturb Management
The read commands are monitored and the content is refreshed when critical levels have
occurred.
o Wear Leveling technology
Equal wear leveling of static and dynamic data. The wear leveling assures that dynamic data
as well as static data is balanced evenly across the memory. This guarantees the maximum
write endurance of the device.
o Data Care Management
The interruptible background process controls the user data for read disturb effects or high
temperature related retention degradation and refreshes data if necessary.
Detailed S.M.A.R.T. support and extended vendor information
LED for operation indication
In-field firmware update
Swissbit Life Time Monitoring (SBLTM) tool and SDK for SBLTM (on request)
Controlled BOM & PCN process
Customized options like registers, removable device, connector options, write protect switch,
grounded mounting hole, densities, uploads, label, etc.
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3. Ordering Information
Table 1: Standard Product List
Temperature
Capacity
Commercial
Industrial
Part Number
Part Number
8 GBytes
SFUI008GcxAE1TO-C-5S-2yP-STD
SFUI008GcxAE1TO-I-5S-2yP-STD
16 GBytes
SFUI016GcxAE1TO-C-6B-2yP-STD
SFUI016GcxAE1TO-I-6B-2yP-STD
c = connector, x = product generation, y = firmware revision
Table 2: Available Part Numbers
Industrial Temperature
Capacity
Part Number
Connector
8 GBytes
SFUI008GJ1AE1TO-I-5S-2AP-STD
2.54mm pitch
8 GBytes
SFUI008GK1AE1TO-I-5S-2AP-STD
2.00mm pitch
16 GBytes
SFUI016GJ1AE1TO-I-6B-2AP-STD
2.54mm pitch
16 GBytes
SFUI016GK1AE1TO-I-6B-2AP-STD
2.00mm pitch
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4. Product Description
The Swissbit U-58 USB 3.1 embedded USB flash drive provides a robust, high performance, and reliable storage
product with industry compatible interface and small form factor. The U-58 pSLC technology both enables
high 3D TLC NAND flash operation and excellent endurance. The use of page based Flash management and a
global wear leveling extends the endurance to unprecedented values for USB products.
The 10-pin connector makes easy integration into existing or newly designed system boards possible. The
U-58 is compatible with standard on-board USB connectors that use a single USB 2.0 or USB 3.1 channel. It
may not be used in mainboard USB 2.0 connectors that support two USB channels per socket. The embedded
USB module serves applications which utilize USB products as acceleration cache for HDDs or as a boot media,
for example networking and telecommunication systems.
For outdoor use or in poorly ventilated systems the U-58 is available in industrial temperature grade from
-40°C to +85°C. Each individual industrial temperature grade drive is tested at these corners to verify the
temperature resistance.
The U-58 firmware includes data care management features which refresh storage areas that are not or only
infrequently read. At high temperature storage these areas are prone to retention loss. The firmware monitors
the state of the NAND blocks and refreshes those that show a high level of degradation, thus preventing
uncorrectable errors. This is an important feature for USB flash drives that are used as read only boot media.
The U-58 consists of a high performance 32bit RISC USB controller, the 10pin connector, power circuitry and
different numbers of NAND dies.
The U-58 can flexibly operate at 3.3V ±5% or 5V ± 10%.
It supports USB 3.1 Gen 1 SuperSpeed and is fully backwards compatible to USB 2.0/1.1 High/Full Speed.
Figure 1: U-58 Functional Block Diagram
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4.1 Performance Specifications
The U-58 read/write sequential and random CDM performance benchmarks are detailed in the following Table
3 and Table 4.
Table 3: Read/Write Performance in SuperSpeed mode3
Capacity
Sequential Read
(MBPS)
Sequential Write
(MBPS)
Random Read 4K
(IOPS)
Random Write 4K
(IOPS)
8 GBytes
97.4
42.7
4,160
1,620
16 GBytes
180
76
4,100
1,680
Table 4: Read/Write Performance in High-Speed mode3
Capacity
Sequential Read
(MBPS)
Sequential Write
(MBPS)
Random Read 4K
(IOPS)
Random Write 4K
(IOPS)
8 GBytes
39.2
30.4
2,970
1,440
16 GBytes
39
30
2,970
1,500
4.2 Current Consumption
The drive-level current consumption as a function of operating mode is shown in the following Table 5.
Table 5: Current Consumption4
3
4
Capacity
Sequential
Read
Sequential
Write
Random Read
4K
Random Write
4K
Idle
8 GBytes
93
82
73
78
59
16 GBytes
146
120
92
98
41
Unit
mA
The values are measured using CrystalDiskMark 5.1.2 x64 (CDM) with Seq Q1T1 and 4KiB Q8T8. Performance depends on flash type and
number, file/cluster size, and burst speed.
All values are the typical recorded at 25 °C, with 5V supply voltage at fastest CrystalDiskMark 5.1.2 x64 (CDM) in SuperSpeed mode.
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4.3 Environmental Specifications
Recommended Operating Conditions
The recommended operating conditions for the U-58 USB flash drives are provided in the following Table 6.
Table 6: Recommended Operating Conditions5
Parameter
Value
Commercial Operating Temperature
0 °C to 70 °C
Industrial Operating Temperature
-40 °C to 85 °C
3.3 V ± 5% or 5.0 V ± 10%
Power Supply VCC Voltage
Recommended Storage Conditions
The recommended storage conditions are listed in the following Table 7.
Table 7: Recommended Storage Conditions
Parameter
Value
Commercial Storage Temperature
-40 °C to 85 °C6
Industrial Storage Temperature
-40 °C to 85 °C6
Shock, Vibration and Humidity
The maximum shock, vibration and humidity conditions are listed in the following Table 8.
Table 8: Shock, Vibration and Humidity
Parameter
Value
1,500 g (JESD22-B110, IEC 60068-2-27)
Non-Operating Shock
Non-Operating Vibration
50 g (IEC 60068-2-6, MIL-STD-883 M2007.3)
Humidity (Non-Condensing)
5
6
85% RH 85 °C, 1000 hrs (JESD22-A101)
Adequate airflow is required to ensure the drive temperature, as reported in the S.M.A.R.T. data, does not exceed the specified
maximum operating temperature.
The retention at high temperature is reduced. The acceleration factor at 85°C compared with 40°C is 170, i.e. the initial endurance at
10 years@40°C is reduced to 22 days@85°C.
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4.4 Regulatory Compliance
The U-58 devices comply with the standards listed in the following Table 9.
Table 9: Regulatory Compliance
Compliance
Country
Type
Standard(s)/Directive
CE
European Union
Compliance
2014/30/EU
EN 55032:2015
EN 61000-6-4:2007 +A1:2011
EN 55035:2017
EN 61000-6-2:2005/AC:2015
EN 61000-4-2:2009
FCC
United States
Compliance
47 CFR Part 15, class B
RoHS
European Union
Compliance
2011/65/EU, 2015/863
WEEE
European Union
Compliance
2012/19/EU
REACH
European Union
Compliance
1907/2006
UL
United States
Compliance
Conformity by subparts
4.5 Mechanical Specifications
Physical dimensions are detailed in the following Table 10. Figure 2 and Figure 3 on page 13 illustrate the
U-58 dimensions.
Table 10: Measured Physical Dimensions
Physical Dimensions
Unit
Length
36.8±0.15
Width
26.65±0.15
Thickness (Max)
9.7±0.25
Weight (Max Capacity)
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4.6 Reliability and Endurance
The Mean Time Between Failure (MTBF) is specified to exceed the value listed in the following Table 11. Data
reliability with effective error tolerance and data retention at the beginning and end of life is also provided.
Table 11: Reliability
Parameter
Value
MTBF (at 25 °C)
> 3,000,000 hours
Data Reliability
< 1 Non-Recoverable Error per 10 Bits Read
Data Retention
10 Years at Start (JESD47), 1 Year at EOL
16
Endurance represented as both TeraBytes Written (TBW) and full Drive Writes Per Day (DWPD) is provided in the
following Table 12.
Table 12: Endurance7
Drive
Capacity
Enterprise
TBW
DWPD8
8 GBytes
35.8
4.1
16 GBytes
67.2
3.8
Total LBA
User Addressable Bytes
Decimal
(Unformatted)
8 GBytes
15,663,104
8,019,509,248
16 GBytes
31,326,208
16,039,018,496
4.7 Drive Geometry Specification
Table 13: Drive Geometry
Raw Capacity
7
8
Enterprise workload follows the JEDEC JESD219 standard. Enterprise workload values are measured based on 168 hours of runtime.
1 TByte = 1012 bytes
DWPD values are based on a service life of 3 years
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5. Electrical Interface
USB connector 10pin (2mm or 2.54mm pitch)
Do not connect the drives to a standard USB2 host pin header with two USB 2.0 ports!
If pin 2 has 5V at the host side, it can destroy the USB3 SSRX+ input of the device.
USB 3.1 Gen1 SuperSpeed interface, USB2.0 high-speed and 1.1 full-speed compatible
Table 14: Electrical pinout from device and host view.
Never connect >1.8V to pin2 and pin4.
1
Signal
device view
V_Bus
Signal
host view
V_Bus
Description
host view
Operating voltage
2
SSRX+
SSTX+
Host transmit +
Pin
3
D-
D-
Data signal pair
4
SSRX-
SSTX-
Host transmit -
5
D+
D+
Data signal pair
6
GND
GND
Ground
7
GND
GND
Ground
8
SSTX+
SSRX+
Host receive +
9
-
-
Keyed at connector
10
SSTX-
SSRX-
Host receive -
2
4
6
1
3
5
8
7
10
See also chapter 7 Package Mechanical
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6. Electrical Specification
Table 15: Absolute Maximum Ratings
Parameter
Symbol
Min
Max
Power Supply Voltage
V_Bus
-0.5
6.0
Voltage at D+ and D-
V_Data
-0.5
5.0
Voltage at USB3 pins
V_Data
-0.5
1.8
0
70
-40
85
Commercial Operating Temperature
T_A
Industrial Operating Temperature
Unit
V
°C
Table 16: DC characteristics for SuperSpeed operation (T=25°C, V_Bus=5V)
Parameter
Symbol
Supply Voltage
V_Bus
Write current
I_WR
Read current
I_RD
Idle current
Suspend current
Density
Min
Typ
Max
Unit
all
3.1
V
3.3 or 5.0
5.50
8 GBytes
82
90
16 GBytes
120
132
8 GBytes
93
103
16 GBytes
146
161
I_IDL
all
599
65
I_CCS
all
1.9
2.5
mA
Table 17: DC characteristics for High-Speed operation (T=25°C, V_Bus=5V)
Parameter
Symbol
Supply Voltage
V_Bus
Write current
I_WR
Read current
I_RD
Idle current
Suspend current
9
Density
Min
Typ
Max
Unit
all
3.1
V
3.3 or 5.0
5.50
8 GBytes
49
54
16 GBytes
61
67
8 GBytes
54
60
16 GBytes
67
74
I_IDL
all
9
40
2.1
2.5
36
I_CCS
all
High Speed Idle Level
V_HSOI
all
-10
10
High Speed Data Signaling LOW
V_HSOL
all
-10
10
High Speed Data Signaling HIGH
V_HSOH
all
360
440
Chirp J Level (differential)
V_CHIRPJ
all
360
440
Chirp K Level (differential)
V_CHIRPK
all
-440
-360
mA
mV
Typically 5 minutes after power on the device performs a background data care management, that needs up to 119mA in SuperSpeed
and 112mA in High-Speed mode.
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7. Package Mechanical
Standard form factor of PCBs 36.8mm x 26.65mm
Hole for mechanical fixture (optional grounded)
3 additional holes
LED for operation indication (optional without LED)
2 connector types
o 2.54mm pitch, 7.5mm long
standard
o 2.00mm pitch, 3.68mm long low profile
Component heights
max. 1.4mm on connector side
max. 1.4mm on flash side
Figure 2: Mechanical Dimensions for U-58 8GB drive
All dimensions are in millimeters, tolerance: ±0.15
Figure 3: Mechanical Dimensions for U-58 16GB drive
All dimensions are in millimeters, tolerance: ±0.15
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8. ATA Pass-Through commands (Identify Device and S.M.A.R.T.)
8.1 ATA Pass-Through commands
Additional to the standard SCSI commands the device also supports the ATA Pass-Through commands.
Table 18: ATA PASS-TRHOUGH(x) commands
SCSI command
OpCode
ATA PASS-THROUGH(12)
A1h
ATA PASS-THROUGH(16)
85h
Description
Write and read ATA registers to send commands and read information
http://www.t10.org/ftp/t10/document.04/04-262r8.pdf
Table 19: ATA register addressing
Offset address
Input
Output
0
Type
Data
1
Identify device
e.g. SMART commands
Byte
xx
yyh*
Word
Feature
Error
2
Sector count
Byte
xx
01h
3
LBA_Low
Byte
xx
xx
4
LBA_Mid
Byte
xx
4Fh
5
LBA_High
Byte
xx
C2h
Byte
E0h
E0h
Byte
ECh
B0h
6
Drive/head
7
Command
Status
* see below
8.2 Identify Device
The Identify Device returns a identify sector compatible to ATA and SATA devices.
Here an example of the interpretation of this sector.
Table 20: Identify Device Information
Word(s)
Default
Value
0
0040h
…
…
10-19
aaaa*
Total
Bytes
…
…
Data Field Type Information
2
Standard Configuration Fixed (optional 848Ah for removable)
…
…
20
Serial number in ASCII (right-justified)
…
…
…
…
23-26
XXXX*
8
Firmware revision in ASCII (big-endian byte order in Word)
27-46
XXXX*
40
Model number in ASCII (right-justified)
…
…
…
…
60-61
XXXXh
4
Total number of sectors addressable in LBA mode
…
…
…
…
82
0101h
7701h*
4063h*
2
Command set: SMART feature set, service interrupt
…
…
…
…
85
000Xh
0701h*
4063h*
2
Command set enabled: SMART feature set enabled/disabled
…
…
…
…
255
XXA5h
2
Integrity Word
…
…
…
…
* Values depend on device configuration.
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8.3 S.M.A.R.T. commands
The intent of the SMART command feature set is to protect user data and minimize the likelihood of
unscheduled system downtime that may be caused by predictable degradation and/or fault of the device. By
monitoring and storing critical performance and calibration parameters, SMART feature set devices attempt to
predict the likelihood of a near-term degradation or fault condition. Providing the host system the knowledge
of a negative reliability condition allows the host system to warn the user of the impending risk of a data loss
and advise the user of the appropriate action.
All S.M.A.R.T. commands have the command code B0h. The different commands are selected by the Feature
register.
Table 21: S.M.A.R.T. Features Supported
Feature
Sect
Count
LBA
low
LBA
mid
LBA
high
DRV
head
Command
S.M.A.R.T. Read Data
D0h
01h
xx
4Fh
C2h
E0h
B0h
S.M.A.R.T. Read Attribute Thresholds
D1h
01h
xx
4Fh
C2h
E0h
B0h
S.M.A.R.T. Enable Operations
D8h
xx
xx
4Fh
C2h
E0h
B0h
S.M.A.R.T. Disable Operations
D9h
xx
xx
4Fh
C2h
E0h
B0h
S.M.A.R.T. Return Status
DAh
xx
xx
4Fh
C2h
E0h
B0h
Operation
All commands are aborted, if the LBA signature is invalid.
S.M.A.R.T. Read Data (D0h)
When the drive receives the S.M.A.R.T. Read Data subcommand, it returns one sector (512 bytes) of data. See
the following table for the data structure of this sector.
Table 22: S.M.A.R.T. Data Structure
Byte(s)
Value
Description
0-1
0010h
S.M.A.R.T. structure version
2-361
XXh
Attribute entries 1 to 30 (see Table 23)
362
00h
Off-line data collection status (no off-line data collection started)
363
00h
Self-test execution status byte (self-test completed)
364-365
0000h
366
00h
Vendor specific
367
00h
Off-line data collection capability (no off-line data collection)
368-369
0003h
370
00h
No Error logging capability
371
00h
Vendor specific
372
00h
Short self-test routine recommended polling time, in minutes
373
00h
Extended self-test routine recommended polling time, in minutes
374-385
00h
Reserved
386-387
0004h
SMART Version
388-510
XXh
Vendor specific
511
XXh
Data structure checksum
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S.M.A.R.T. Attribute Entry Structure
Each attribute entry (Bytes 2-361) consists of 12 bytes. See the following table for the data structure of each
entry.
Table 23: Attribute Entry
Offset Byte(s)
Value
Description
0
XXh
1-2
XXXXh
3
XXh
Current value as a percentage 64h = 100%
4
XXh
Worst value as a percentage 64h = 100%
5-10
XXXXh
11
00h
Attribute ID (see Table 24)
Flags (little-endian)
Bit0: Advisory (0) or Prefailure (1)
Bit1: Not used (0) or updated during normal operation (1)
Raw value (little-endian)
Reserved
S.M.A.R.T. Attributes
The drives support the S.M.A.R.T. attributes listed in the following table.
The Threshold values can be read out with the S.M.A.R.T. Read Attribute Thresholds command (D1h)
The first attributes (196, 213, 229) are “Pre-Fail” type, while all other are Advisory (Old Age).
Table 24: S.M.A.R.T. Attributes
ID
dec
ID
hex
Value
Worst
Description
RAW values
Offset 5-10
196
C4h
X%
X%
25
Spare Block
Count
Number of total
available NAND spare
blocks
Initial (offset 5-7) and current
(offset 8-10) number of spare
blocks
213
D5h
X%
X%
25
Spare Block
Count worst
channel
Spare block count for
the NAND with the
lowest number of
remaining spare blocks
Initial (offset 5-7) and current
(offset 8-10) number of spare
blocks of the channel with the
lowest current number of spare
blocks
229
E5h
X%
X%
2
Total Erase
Count
Estimated number of
Estimated number of total NAND
total NAND block erases block erases
203
CBh
100
100
0
Total ECC Errors All recorded ECC errors
Total number of ECC errors
(correctable and uncorrectable)
(offset 5-8)
204
CCh
100
100
0
Correctable ECC Total recorded ECC
Errors
errors that were
corrected during the
life of the drive
Total number of correctable ECC
errors (offset 5-8)
199
C7h
100
100
0
UDMA CRC
Errors
Dummy attribute,
included for legacy
reasons
This value is fixed at 0.
232
E8h
100
100
0
Total Number
of Reads
Total number of NAND
READ commands
Total number of NAND READ
commands
12
0Ch
100
100
0
Power-On
Count
Count of power-on
events
Number of power cycles (offset
5-8)
241
F1h
100
100
0
Total LBAs
Written
Total amount of data
written to the drive
Total number of LBAs written to
the disk, divided by 65536
242
F2h
100
100
0
Total LBAs
Read
Total amount of data
read from the drive
Total number of LBAs read from
the disk, divided by 65536
214
D6h
100
100
0
Management
Block status
Total number of times
the management block
has been updated
Management block write count
(offset 5-8)
215
D7h
X%
X%
0
Trim Status
Amount of device
content that is
currently in the
trimmed state
This value is fixed at 0.
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ID
dec
ID
hex
Value
Worst
194
C2h
X°C
Max °C
ThresAttribute
hold
0
Temperature
Status
Description
RAW values
Offset 5-10
Device temperature in
Celsius (°C)
Current (offset 5) /Min (offset 6) /
Max temperature (offset 7)
* These threshold values are changeable using the Write Attribute Thresholds command.
S.M.A.R.T. Read Attribute Thresholds (D1h)
When the drive receives the S.M.A.R.T. Read Attribute Thresholds subcommand, it returns one sector (512 bytes)
of data similar as S.M.A.R.T. Read data sector, but with the threshold value in offset 1 of each attribute (see
Table 24).
S.M.A.R.T. Enable Operations (D8h)
This command enables access to the S.M.A.R.T. capabilities of the drive. The state of SMART (enabled or
disabled) is preserved across power cycles.
S.M.A.R.T. Disable Operations (D9h)
This command disables access to the S.M.A.R.T. capabilities of the drive. The state of SMART (enabled or
disabled) is preserved across power cycles.
S.M.A.R.T. Return Status (DAh)
Table 25: S.M.A.R.T. Return Status
Feature
Sect
Count
LBA
low
LBA
mid
LBA
high
DRV
head
Command
DAh
xx
xx
4Fh
C2h
E0h
B0h
S.M.A.R.T. Return Status OK
xx
xx
xx
4Fh
C2h
xx
xx
S.M.A.R.T. Return Status Pre-FAIL*
xx
xx
xx
F4h
2Ch
xx
xx
Operation
Command S.M.A.R.T. Return Status
Response
* If a threshold exceeded condition exists for either the Spare Block Count Worst Channel attribute or the Erase Count attribute, the
device will set the Cylinder Low register to F4h and the Cylinder High register to 2Ch. In this case the drive should be replaced soon.
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9. Part Number Decoder
S
F
UI
016G
J
1
A
E
1
TO
1
2
3
4
5
6
7
8
9
10
Manuf.
Memory Type.
Product Type
Density
Platform
Product Generation
Memory Organization
-
I
11
-
6
B
12
13
-
2AP
14
-
STD
15
Option
Configuration
Manuf. Code: Flash Mode
Manuf. Code: Flash Package
Temp. Option
Flash Vendor Code
Number of Flash Chips
Technology
9.1 Manufacturer
Swissbit code
S
Flash
F
U-xxx USB Flash Drive Module (Internal)
UI
9.2 Memory Type
9.3 Product Type
9.4 Density
8 GBytes
008G
16 GBytes
016G
32 GBytes
032G
9.5 Platform
U-xxx – 2.54mm plug
J
U-xxx – 2.00mm plug
K
First generation
1
x8
A
U-5xx platform UFD
E
1 Flash
1
2 Flash
2
Toshiba
TO
9.6 Product Generation
9.7 Memory Organization
9.8 Technology
9.9 Number of Flash Chips
9.10 Flash Code
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9.11 Temperature Option
Commercial Temperature Range: 0 °C to 70 °C
C
Industrial Temperature Range: -40 °C to 85 °C
I
3D TLC MONO (single die package)
5
3D TLC DDP (dual die package)
6
3D TLC QDP (quad die package)
7
3D TLC ODP (octal die package)
8
9.12 Die Classification
9.13 Pin Mode
BGA
TSOP
Single nCE and Single R/nB
A
S
Dual nCE and Dual R/nB
B
T
Quad nCE and Quad R/nB
C
U
Octal nCE and Octal R/nB
V
*
*Not Available
9.14 Configuration XYZ
X = Configuration
Configuration
X
Removable Drive
1
Fixed Drive
2
Y = Firmware Revision
FW Revision
Y
Revision 1
A
Z= Optional setting
Optional Setting
Z
Default (SLC or MLC)
1
pSLC (pseudo SLC)
P
Swissbit / Standard
STD
Customized version
XXX
9.15 Option
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10. Marking Specification
10.1 Top View
Figure 4: U-58 top view (example)
10.2 Label content
Figure 5: U-58 label details
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11. Revision History
Table 26: Document Revision History
Date
Revision
Description
Revision Details
16-Aug-2019
0.90
Preliminary release
-
09-Sep-2019
0.91
Correction in Table 12
Doc. req. no. 3175
13-Jan-2020
1.00
Initial release
Doc. req. no. 3378
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© 2020 SWISSBIT AG All rights reserved.
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