AF64GUD4A-EBAIM

ATP UHS-I microSDHC/microSDXC Memory Card Specification High Endurance S750 Series Datasheet Version 2.1 P/N AF8GUD4A-EBAXM/ AF8GUD4A-EBAIM AF16GUD4A-EBAXM/ AF16GUD4A-EBAIM AF32GUD4A-EBAXM/ AF32GUD4A-EBAIM AF64GUD4A-EBAXM/ AF64GUD4A-EBAIM ATP SLC mode UHS-I (A1/U3) microSDHC/microSDXC Card Specification Version 2.1 CONTENT CONTENT ............................................................................................................................... 1 Disclaimer ............................................................................................................................. 3 Revision History ..................................................................................................................... 4 1.0 Product Specification ...................................................................................................... 5 1.1 Product Image ................................................................................................................... 6 1.2 Capacity ............................................................................................................................ 6 1.3 Environment Specifications ............................................................................................... 7 1.4 Reliability .......................................................................................................................... 7 1.5 1.6 1.7 1.8 1.9 1.10 1.11 1.12 1.13 Electrical Characteristics – DC Characteristics .................................................................. 8 Electrical Characteristics – Summary of Bus Speed Mode and Maximum Current .......... 9 Electrical Characteristics – AC Characteristics ................................................................ 10 Electrical Characteristics – Bus Signal Line Load ............................................................ 13 IOPS ................................................................................................................................. 14 Sequential Maximum Read/Write Performance ............................................................. 14 Write/Erase Endurance ................................................................................................... 14 Extra Features ................................................................................................................. 15 Certificates ...................................................................................................................... 15 2.0 Product Features .......................................................................................................... 16 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 Ultra-High-Speed Type I (UHS-I) Card ............................................................................. 16 UHS-I Card Types ............................................................................................................. 16 Host and Card Combination ............................................................................................ 17 Bus Speed Mode Selection Sequence .............................................................................. 18 Host Device Compatibility ............................................................................................... 20 High Endurance ............................................................................................................... 21 Low Latency .................................................................................................................... 21 Data Integrity - Read Retry and Auto Read Calibration (ARC) ........................................ 21 Data Integrity - Read Disturb Protector .......................................................................... 22 2.10 Data Integrity - Power Failure Protection ....................................................................... 22 2.11 Analysis Method - SD Life Monitor tool .......................................................................... 23 2.12 Advanced Card Analysis for SiP (System-In-Package) Memory Cards ............................ 25 3.0 Product Overview ......................................................................................................... 26 3.1 Block Diagram ................................................................................................................. 26 3.2 Power Up......................................................................................................................... 27 1 ATP Confidential © ATP Electronics, Inc. ATP SLC mode UHS-I (A1/U3) microSDHC/microSDXC Card Specification Version 2.1 3.3 Power Up Time ................................................................................................................ 28 4.0 Mechanical Dimension ................................................................................................. 29 4.1 Physical Dimension (Units in mm)................................................................................... 29 4.2 Mechanical Form Factor (Units in mm) .......................................................................... 29 5.0 Card Registers .............................................................................................................. 30 5.1 5.2 5.3 5.4 5.5 OCR Register ................................................................................................................... 30 CID Register ..................................................................................................................... 32 CSD Register .................................................................................................................... 33 RCA Register .................................................................................................................... 36 DSR Register (Optional)................................................................................................... 37 5.6 SCR Register .................................................................................................................... 37 5.7 SSR Register..................................................................................................................... 37 5.8 CSR Register .................................................................................................................... 37 6.0 SD Card Functional Description ..................................................................................... 38 6.1 SD BUS Protocol .............................................................................................................. 38 6.2 Command ........................................................................................................................ 42 6.3 Card State Transition Table ............................................................................................. 56 6.4 Responses ....................................................................................................................... 59 6.5 SD Card Status ................................................................................................................ 62 6.6 6.7 6.8 Card Identification Mode and Data Transfer Mode ....................................................... 75 Write Protect Management ............................................................................................ 91 Error Handling .............................................................................................................. 106 2 ATP Confidential © ATP Electronics, Inc. ATP SLC mode UHS-I (A1/U3) microSDHC/microSDXC Card Specification Version 2.1 Disclaimer ATP Electronics Taiwan Inc. and its affiliates(“ATP”) shall not be liable for any errors or omissions that may appear in this document, and ATP disclaims any responsibility for any consequences resulting from the usage of the information set forth herein. Moreover, ATP is not warranted and liable for using any ATP product in developing, or for incorporation into, any products or services used in applications or environments requiring failsafe performance, including but not limited to the usage in the operation of aircraft navigation or air traffic control, life support machines, surgically implanted devices, or other applications, devices or systems in which the failure of the ATP product could lead directly to death, personal injury, or severe physical or environmental damage. The information set forth in this document is considered to be “Proprietary” and “Confidential” and owned by ATP. All information in this document is protected by copyright law and all rights are reserved. This document may not, in whole or in part, be copied, photocopied, reproduced, translated, or reduced to any electronic medium or machine-readable form without the prior written consent of ATP. The products with controlled Bill of Materials(“BOMs”) shall follow ATP’s Product Change Notice(“PCN”) and End of Life(“EOL”) policy. ATP may make changes to the specifications and the product descriptions per ATP’s PCN and EOL policy (ATP Doc: ATP PCN and EOL Policy – NAND Flash-Based Products Revision). All information provided in this document is preliminary and the stated information, the terms and conditions will be subject to change at any time without notice. By reviewing or using the information contained in this document, the receiving party or the reader of this document understands and acknowledges that ATP will not be liable for any provided information, nor for any changes, errors or omissions, or the usage of the provided information. 3 ATP Confidential © ATP Electronics, Inc. ATP SLC mode UHS-I (A1/U3) microSDHC/microSDXC Card Specification Version 2.1 Revision History Date Apr. 16th, 2019 Version 1.0 Jul. 25th, 2019 1.1 Jun. 14th, 2021 1.2 Jul. 04th, 2022 1.3 Jul. 05th, 2022 2.1 Changes compared to previous issue - Official release of 1st Version with completely specification. - Update Performance Information. - Update Voltage Information. - Add alternative Solution - Add UKCA certification into backside marking - Update TBW - New solution release with LDPC controller High Endurance S750 series - Update main features (page 5) and Chapter 2 product features 4 ATP Confidential © ATP Electronics, Inc. ATP SLC mode UHS-I (A1/U3) microSDHC/microSDXC Card Specification Version 2.1 1.0 Product Specification Main Features: ⚫ Compliant with SD Specification version 6.10 ⚫ LDPC Controller ⚫ SiP (System-In-Package) process ⚫ Water proof, Dust proof and ESD Resistant ⚫ High Endurance – Advanced Static/Dynamic Wear-Leveling ⚫ High Endurance – 5K P/E cycles per block, low WAF ⚫ Low Latency ⚫ Data Integrity – Read retry & Auto-Read-Calibration (ARC) ⚫ Data Integrity – Read Disturb Protector ⚫ Data Integrity – Power failure protection ⚫ Analysis method – SD Life monitor tool ⚫ Analysis method – For SiP memory cards ⚫ Non-CPRM support by default ⚫ RoHS compliant ⚫ CE & FCC & UKCA certification ⚫ Controlled BOM ⚫ Customized service: adjustable CID registers, firmware & setting and logo by projects 5 ATP Confidential © ATP Electronics, Inc. ATP SLC mode UHS-I (A1/U3) microSDHC/microSDXC Card Specification Version 2.1 1.1 Product Image Figure 1-1: ATP Product Image (For Reference) *1 *1 W-marking represented W-Temp Series solution 1.2 Capacity Table 1-2: Capacity Settings ATP Part Number AF8GUD4A-EBAXM/ AF8GUD4A-EBAIM Capacity 8GB SDHC AF16GUD4A-EBAXM/ AF16GUD4A-EBAIM 16GB SDHC AF32GUD4A-EBAXM/ AF32GUD4A-EBAIM 32GB SDHC AF64GUD4A-EBAXM/ AF64GUD4A-EBAIM 64GB SDXC 6 ATP Confidential © ATP Electronics, Inc. ATP SLC mode UHS-I (A1/U3) microSDHC/microSDXC Card Specification Version 2.1 1.3 Environment Specifications Table 1-3-1: Environment Specification Type Temperature Standard Operating Non-Operating Humidity -25°C to 85°C -40°C to 85°C (W-Temp Solution) -55°C to 90°C Operating Non-Operating 8% ~ 95% relative humidity , non-condensing Random Vibration Test Non-Operating 10 ~ 2000Hz, 6Grms, 30min per axis Bend Test Non-Operating 10N to the center of the card, total 5 cycles Torque Test Non-Operating 0.15N-m or +/-2.5° Salt Spray Test (MIL-STD-883G Method1009.8) Non-Operating 35°C,Over 85% RH,3% Salt Concentration Solar Radiation Test Non-Operating 40°C ,Irradiation 1000W/m2 UV Light Exposure Test (ISO 7816-1) Non-Operating 254nm, 15Ws/cm2 Drop Test Non-Operating 150cm/Free fall, total 6 drops 1.4 Reliability Type Number of insertions TBW (Sequential Write) MTBF(@25°C) Table1-4: Reliability Meaurement Up to 20,000 times 8GB 436 Terabytes 16GB 872 Terabytes 32GB 1745 Terabytes 64GB 3490 Terabytes >3,000,000 hours Note 1: TBW (total bytes written) is an index of how many TB (Terabytes) can be used for written under product life time. The endurance for flash cards can be predicted based on the usage conditions applied to the device, the internal NAND flash cycles, the write amplification factor, and the wear leveling efficiency of the flash devices. Above TBW is for reference only. Please contact ATP for TBW in real applications. 1 TeraBytes = 1000 GigaBytes (Disk storage) Note 2: MTBF highly depends on testing method. All ATP products are tested with Bellcore Method II (Combines Method I predictions with laboratory data). 7 ATP Confidential © ATP Electronics, Inc. ATP SLC mode UHS-I (A1/U3) microSDHC/microSDXC Card Specification Version 2.1 1.5 Electrical Characteristics – DC Characteristics Power Consumption Capacity Table 1-5-1: Product Power Consumption Operating Current Operating Current (Typ.) (Max.) 8GB 16GB 32GB 64GB 105mA 113mA 114mA 118mA Operating Mode 198mA 238mA 278mA 366mA SDR104 SDR104 SDR104 SDR104 Note 1: Max. Allowed Power is defined as max. operating current 400mA at the max. voltage 3.6V. UHS-I card is up to 1.44W. Note 2: Operation current might subject to host devices, applications, product configurations and operation modes. Bus Operating Conditions for 3.3V Signaling Parameter Supply voltage Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Table 1-5-2: DC Characteristics Under 3.3V Signaling Symbol Min. Max. Unit VDD VOH VOL VIH VIL 2.7 0.75x VDD 0.625x VDD Vss-0.3 3.6 0.125 x VDD VDD + 0.3 0.25 x VDD V V V V V 250 ms -0.3 VDD+0.3 V -10 10 uA -10 10 uA Power Up Time Peak voltage on all lines All Inputs Input Leakage Current All Outputs Output Leakage Current Remark IOH=-2mA VDD min IOL=-2mA VDD min From 0V to VDD min The current consumption is measured by averaging over 1 second. ⚫ Before first command: Maximum 15 mA ⚫ During initialization: Maximum 100 mA ⚫ Operation in Default Speed Mode: Maximum 100 mA for SDSC and SDXC 100 mA (XPC=0) or 150 mA (XPC=1) for SDXC ⚫ Operation in High Speed Mode: Maximum 200 mA ⚫ Operation in UHS-I Mode: Maximum 400 mA (UHS50,DDR50) or 800 mA (UHS104) 8 ATP Confidential © ATP Electronics, Inc. ATP SLC mode UHS-I (A1/U3) microSDHC/microSDXC Card Specification Version 2.1 ⚫ Operation with other functions: Maximum 500 mA Some functions can be added by CMD6 and SDIO (ex. McEX, ASSD and Combo Card). Host needs to select functions so that the total current of selected functions shall be up to 500mA. In case of UHS-I card, host should not select UHS-I mode and the other functions at the same time. Bus Operating Conditions For 1.8V Signaling Table 1-5-3 DC Characteristics Under 1.8V Signaling Parameter Symbol Min Max Unit Remark Supply voltage VDD 2.7 3.6 V Regulator Voltage VDDIO 1.7 1.95 V Generated by VDD Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage VOH VOL VIH VIL 1.4 1.27 Vss-0.3 0.45 2.0 0.58 V V V V IOH=-2mA IOL=-2mA 1.6 Electrical Characteristics – Summary of Bus Speed Mode and Maximum Current The maximum frequency and the maximum current are determined by CMD6. Table 1-6-1 Bus Speed Modes *1: The card supports a UHS-I mode shall support all lower UHS-I modes. *2: Host may control power by the Power Limit function in CMD6. *3: SDSC stands for SD Standard Capacity Memory Card and *4: SDHC stands for SD High Capacity Memory Card. *5: SDXC stands for SD Extended Capacity Memory Card. *6: The actual maximum current may vary from the limit described in this table. It is limited by the Mechanical Addenda in the sections that define the thermal profile of the device and the connector profile. *7: Host may select either maximum power by XPC in ACMD41. 9 ATP Confidential © ATP Electronics, Inc. ATP SLC mode UHS-I (A1/U3) microSDHC/microSDXC Card Specification Version 2.1 1.7 Electrical Characteristics – AC Characteristics High Speed Mode Bus Timing (3.3V Signaling) Table 1-7-1: Bus Timing - Parameter Values (High Speed Mode) Parameter Symbol Min Max Unit Clock CLK (All values are referred to min (VIH) and max (VIL) fPP Clock frequency Data Transfer 0 50 Mode tWL Clock low time 7 tWH Clock high time 7 tTLH Clock rise time 3 tTHL Clock fall time 3 Remark MHz Ccard