AF16GUD3A-WAAIX

ATP UHS-I microSD Memory Card Specification AF8GUD3-WAAIX AF16GUD3-WAAIX AF32GUD3-WAAIX Revision 1.6_IT ATP Electronics, Inc. Table of Contents Disclaimer ............................................................................................................................................ 1 1.0 Introduction ............................................................................................................................ 2 1.1 1.2 1.3 1.4 2.0 Main Features ................................................................................................................................... 2 Card Images ...................................................................................................................................... 4 Capacities ......................................................................................................................................... 4 Icon Specification .............................................................................................................................. 5 microSD Card Hardware System .......................................................................................... 5 2.1 2.2 3.0 Power Up .......................................................................................................................................... 6 Power Up Time................................................................................................................................. 7 Product Specifications ............................................................................................................ 8 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 3.10 3.11 3.12 3.13 3.14 3.15 4.0 Ultra High Speed Type I (UHS-I) Card ................................................................................................. 8 UHS-I Card Types............................................................................................................................... 8 Host and Card Combination .............................................................................................................. 9 Bus Speed Mode Selection Sequence .............................................................................................. 10 Comparison of SD Card ................................................................................................................... 11 Environment Specifications ............................................................................................................. 12 Reliability ........................................................................................................................................ 13 Data Retention ................................................................................................................................ 13 Performance ................................................................................................................................... 14 Extra Features ................................................................................................................................. 15 Host Device Compatibility: Optimize UHS Performance ................................................................... 16 Advanced Dynamic / Static Wear Leveling - Longer Life Expectancy ............................................. 17 Read Disturb Protector – AutoRefresh Technology – Ensure Data Integrity ..................................... 17 Physical Dimension (Units in mm) .................................................................................................. 18 Mechanical Form Factor (Units in mm) ........................................................................................... 18 Electrical Characteristics ..................................................................................................... 21 4.1 4.2 4.3 4.4 5.0 DC Characteristics .......................................................................................................................... 21 Summary of Bus Speed Mode and Maximum Current ..................................................................... 22 AC Characteristics .......................................................................................................................... 23 Bus Signal Line Load ...................................................................................................................... 26 Card Registers ...................................................................................................................... 27 5.1 5.2 5.3 5.4 5.5 5.6 5.7 5.8 6.0 OCR Register .................................................................................................................................. 27 CID Register ................................................................................................................................... 29 CSD Register .................................................................................................................................. 30 RCA Register .................................................................................................................................. 34 DSR Register (Optional) ................................................................................................................... 34 SCR Register .................................................................................................................................. 34 SSR Register ................................................................................................................................... 35 CSR Register .................................................................................................................................. 35 SD Card Functional Description .......................................................................................... 36 6.1 6.2 6.2.1 SD BUS Protocol ............................................................................................................................ 36 Command ....................................................................................................................................... 40 Command Types and Format ..................................................................................................................... 40 ATP Electronics, Inc. 6.2.2 6.2.3 6.3 6.4 6.4.1 6.4.2 6.4.3 6.4.4 6.4.5 6.4.6 6.5 6.5.1 6.5.2 6.6 6.6.1 6.6.2 6.6.3 6.6.4 6.6.5 6.6.6 6.6.7 6.6.8 6.6.9 6.7 6.7.1 6.7.2 6.7.3 6.8 6.8.1 6.8.2 6.8.3 6.8.4 Command Classes...................................................................................................................................... 40 Detailed Command Description ................................................................................................................. 43 Card State Transition Table ............................................................................................................. 51 Responses ....................................................................................................................................... 53 R1 (Normal Response Command) .............................................................................................................. 53 R1b ........................................................................................................................................................... 53 R2 (CID, CSD register) ................................................................................................................................ 53 R3 (OCR Register) ...................................................................................................................................... 54 R6 (Published RCA response) ..................................................................................................................... 54 R7 (Card interface condition) ..................................................................................................................... 54 SD Card Status................................................................................................................................ 56 56 Card Status ................................................................................................................................................ 56 SD Status ................................................................................................................................................... 60 Card Identification Mode and Data Transfer Mode .......................................................................... 64 Card Identification Mode ........................................................................................................................... 65 Card Initialization and Identification Process .............................................................................................. 67 Initialization Command (ACMD41) ............................................................................................................. 69 Bus Signal Voltage Switch Sequence .......................................................................................................... 70 Timing to Switch Signal Voltage ................................................................................................................. 71 Timing of Voltage Switch Error Detection ................................................................................................. 73 Voltage Switch Command ......................................................................................................................... 73 Tuning Command...................................................................................................................................... 74 Data Transfer Mode................................................................................................................................... 75 Write Protect Management ............................................................................................................ 77 Mechanical Write Protect Switch ............................................................................................................... 77 Card's Internal Write Protection (Optional) ................................................................................................ 77 Card Lock/Unlock Operation ...................................................................................................................... 77 Error Handling ................................................................................................................................ 81 Error Correction Code (ECC)....................................................................................................................... 81 Cyclic Redundancy Check (CRC) ................................................................................................................. 81 CRC and Illegal Command .......................................................................................................................... 82 Read, Write and Erase Time-out ................................................................................................................ 82 ATP Electronics, Inc. ATP UHS-I microSD Card Specification Version 1.6_IT Disclaimer ATP Electronics Inc. shall not be liable for any errors or omissions that may appear in this document, and disclaims responsibility for any consequences resulting from the use of the information set forth herein. ATP may make changes to specifications and product descriptions at any time, without notice. The information in this paper is furnished for informational use only so ATP assumes no responsibility or liability for any errors or inaccuracies that may appear in this document. All parts of the ATP documentation are protected by copyright law and all rights are reserved. This documentation may not, in whole or in part, be copied, photocopied, reproduced, translated, or reduced to any electronic medium or machine-readable form without prior consent, in writing, from ATP Electronics, Inc. The information set forth in this document is considered to be “Proprietary” and “Confidential” property owned by ATP. © Copyright ATP All rights reserved. ATP Confidential © ATP Electronics, Inc. Page 1 of 83 ATP UHS-I microSD Card Specification Version 1.6_IT 1.0 Introduction ATP UHS-I (Ultra High Speed 1) microSDHC card is compatible with SD Memory Card Specification Ver. 3.01, which supports up to 104MB/s Bus I/F Speed. The read speed of ATP UHS-I microSDHC memory card is up to 71MB/s; almost 3 times faster than conventional high speed microSDHC card (22.5MB/s read speed). ATP microSDHC UHS-I memory card is backward compatible to SD2.0 devices. However, the maximum transfer speed can be achieved along with UHS-I compliant devices. ATP UHS-I microSDHC memory card implements advanced wear leveling algorithm and bad block management to prolong the life time of SD card. Nonetheless, the increased read speed and Read Disturb Protector – AutoRefresh technology enhance the read performance and assure the data integrity at the same time. Considering high performance, reliability and compatibility, ATP UHS-I microSDHC memory card is highly recommended especially for navigation system, drive recorder, surveillance systems, DSLR and HD camcorder applications. 1.1 Main Features  Compliant with SD Specification version 3.01  Supports SD mode  High reliability, operating at -40oC to 85oC  Multi-Level Cell (MLC) / 2 bit-per-cell NAND Flash  Supports dual voltage 3.3V and 1.8V I/O  Bus Speed Mode (using 4 parallel data lines) - Default Speed mode: 3.3V signaling, Frequency up to 25 MHz, up to 12.5 MB/sec - High Speed mode: 3.3V signaling, Frequency up to 50 MHz, up to 25 MB/sec - SDR12 - SDR up to 25MHz 1.8V signaling - SDR25 - SDR up to 50MHz 1.8V signaling - SDR50: 1.8V signaling, Frequency up to 100 MHz, up to 50MB/sec - SDR104: 1.8V signaling, Frequency up to 208MHz, up to 104MB/sec - DDR50: 1.8V signaling, Frequency up to 50 MHz, sampled on both clock edges, up to 50MB/sec Note: Timing in 1.8V signaling is different from that of 3.3V signaling.  SIP (System In Package) process  Water proof, Dust proof and ESD resistant ATP Confidential © ATP Electronics, Inc. Page 2 of 83 ATP UHS-I microSD Card Specification Version 1.6_IT  Enhanced endurance by Advanced Static/Dynamic Wear-Leveling  Read Disturb Protector - AutoRefresh technology to ensure data integrity especially in frequent read operations  Enhanced F/W algorithm to minimize the risk of a sudden power-off  Support BCH ECC engine up to 72bits/1Kbyte  Supports CPRM  RoHS compliant  CE & FCC certification  Controlled BOM  Customized service: adjustable CID registers, firmware & setting and logo by projects ATP Confidential © ATP Electronics, Inc. Page 3 of 83 ATP UHS-I microSD Card Specification Version 1.6_IT 1.2 Card Images Front Back* W Note: Laser marking on the backside to distinguish the product as an industrial temperature solution Figure 1-2: Product Pictures 1.3 Capacities ATP P/N CAPACITY AF8GUD3-WAAIX 8GB microSDHC AF16GUD3-WAAIX 16GB microSDHC AF32GUD3-WAAIX 32GB microSDHC Table 1-3: Capacities ATP Confidential © ATP Electronics, Inc. Page 4 of 83 ATP UHS-I microSD Card Specification Version 1.6_IT 1.4 Icon Specification Figure 1-4: Icon Specification 2.0 microSD Card Hardware System Figure 2-0: microSD Card Function Block Diagram Pin # Name 1 2 DAT2 CD/DAT32 SD Interface Type1 Description Name Data Line [Bit 2] RSV I/O/PP 3 I/O/PP Card Detect / Data Line CS ATP Confidential © ATP Electronics, Inc. SPI Interface Type Description 1 I3 Chip Select (Active Low) Page 5 of 83 ATP UHS-I microSD Card Specification Version 1.6_IT 3 4 5 6 7 8 CMD VDD CLK VSS DAT0 DAT1 PP S I S I/O/PP I/O/PP [Bit 3] Command/ Response Supply Voltage Clock Supply Voltage Ground Data Line [Bit 0] Data Line [Bit 1] DI VDD SCLK VSS DO RSV I S I S O/PP Data In Supply Voltage Clock Supply Voltage ground Data Out Table 2-0: Pad Assignment Notes: 1) S: power supply; I: input; O: output using push-pull drivers; PP: I/O using push-pull drivers; 2) The extended DAT lines (DAT1-DAT3) are input on power up. They start to operate as DAT lines after SET_BUS_WIDTH command. The Host shall keep its own DAT1-DAT3 lines in input mode, as well, while they are not used. 3) At power up this line has a 50KOhm pull up enabled in the card. This resistor serves two functions Card detection and Mode Selection. For Mode Selection, the host can drive the line high or let it be pulled high to select SD mode. If the host wants to select SPI mode it should drive the line low. For Card detection, the host detects that the line is pulled high. This pull-up should be disconnected by the user, during regular data transfer, with SET_CLR_CARD_DETECT (ACMD42) command 4) DAT1 line may be used as Interrupt Output (from the Card) in SDIO mode during all the times that it is not in use for data transfer operations (refer to "SDIO Card Specification" for further details). 5) DAT2 line may be used as Read Wait signal in SDIO mode (refer to "SDIO Card Specification" for further details). 2.1 Power Up Figure 2-1 Power-Up Diagram ATP Confidential © ATP Electronics, Inc. Page 6 of 83 ATP UHS-I microSD Card Specification Version 1.6_IT ‘Power up time' is defined as voltage rising time from 0 volt to VDD min (refer to 6.6) and depends on application parameters such as the maximum number of SD Cards, the bus length and the characteristic of the power supply unit. 'Supply ramp up time' provides the time that the power is built up to the operating level (Host Supply Voltage) and the time to wait until the SD card can accept the first command, • The host shall supply power to the card so that the voltage is reached to Vdd_min within 250ms and start to supply at least 74 SD clocks to the SD card with keeping CMD line to high. In case of SPI mode, CS shall be held to high during 74 clock cycles. • After power up (including hot insertion, i.e. inserting a card when the bus is operating) the SD Card enters the idle state. In case of SD host, CMD0 is not necessary. In case of SPI host, CMD0 shall be the first command to send the card to SPI mode. • CMD8 is newly added in the Physical Layer Specification Version 2.00 to support multiple voltage ranges and used to check whether the card supports supplied voltage. The version 2.00 or later host shall issue CMD8 and verify voltage before card initialization. The host that does not support CMD8 shall supply high voltage range. • ACMD41 is a synchronization command used to negotiate the operation voltage range and to poll the cards until they are out of their power-up sequence. In case the host system connects multiple cards, the host shall check that all cards satisfy the supplied voltage. Otherwise, the host should select one of the cards and initialize. 2.2 Power Up Time Reset level is not described in Physical Layer Specification Version 2.00. Change of Figure 2-2 is applied. Host needs to keep power line level less than 0.5V and more than 1ms before power ramp up. Figure 2-2 Change of Figure for power up ATP Confidential © ATP Electronics, Inc. Page 7 of 83 ATP UHS-I microSD Card Specification Version 1.6_IT 3.0 Product Specifications 3.1 Ultra High Speed Type I (UHS-I) Card UHS-I provides up to 104MB/sec performance on 4-bit SD bus with the single end driver interface. Card form factor is the same and existing connector can be used. UHS-I Operation Modes • DS - Default Speed up to 25MHz 3.3V signaling • HS - High Speed up to 50MHz 3.3V signaling • SDR12 - SDR up to 25MHz 1.8V signaling • SDR25 - SDR up to 50MHz 1.8V signaling • SDR50 - SDR up to 100MHz 1.8V signaling • SDR104 - SDR up to 208MHz 1.8V signaling • DDR50 - DDR up to 50MHz 1.8V signaling Note: Timing in 1.8V signaling is different from that of 3.3V signaling. 3.2 UHS-I Card Types UHS-I supports two card Types: UHS50 and UHS104 UHS-I is not applied to SDSC card but can be applied to SDHC and SDXC card. Figure 3-2-1 UHS-I Card Type Modes of Operation versus Frequency Range ATP Confidential © ATP Electronics, Inc. Page 8 of 83 ATP UHS-I microSD Card Specification Version 1.6_IT Figure 3-2-2 UHS-I Card Type Modes of Operation versus Throughout 3.3 Host and Card Combination Table 3-3 shows usable UHS performance depends on the combination of host and card. UHS-I for removable card is presumed that one card is connected to a SD bus. Maximum performance of up to 104MB/s is possible only if host supports SDR104 mode and card is UHS104 Card (supports SDR104 mode). If card is a UHS50 Card or if host doesn't support SDR104 mode, performance is limited to 50MB/s (SDR104 mode cannot be used). Host may use DDR50 mode with UHS50 Card and UHS104 Card in microSD form factors. Host types: SDR-FD – SDR signaling, fixed-delay (can't use tuning) SDR-VD – SDR signaling, variable-delay (can use tuning) DDR – DDR signaling Table 3-3 host and card combination ATP Confidential © ATP Electronics, Inc. Page 9 of 83 ATP UHS-I microSD Card Specification Version 1.6_IT Host can choose one of UHS-I modes by CMD6 Function Group 1. Each UHS-I mode is specified by the maximum frequency, sampling edges (rising-only or both) and maximum current consumption for compatibility with existing cards. Host can choose one of UHS-I mode depending on capability of generating SDCLK frequency and capacity of power supply host supported. CMD19 can be executed in transfer state of 1.8V signaling mode while the card is unlocked. The other case, CMD19 is treated as illegal command. 3.4 Bus Speed Mode Selection Sequence Figure 3-4 Command sequence to use UHS-I page Figure 3-4 shows command sequence to use a UHS-I. After power cycle, card is in 3.3V signaling mode. The first CMD0 selects the bus mode; SD mode or SPI mode. 1.8V signaling mode can be entered only in SD mode. Once the card enters 1.8V signaling mode, the card cannot be switched to SPI mode or 3.3V signaling without power cycle. If the card receives CMD0, card returns to Idle state but still work with SDR12 timing. UHS-I is provided in SD mode but not in SPI mode. ATP Confidential © ATP Electronics, Inc. Page 10 of 83 ATP UHS-I microSD Card Specification Version 1.6_IT As higher bus speed requires low level signaling, UHS-I adopts 1.8V signaling level for SDR50, DDR50 and SDR104 modes. Still card is supplied with 3.3V by the host and 1.8V signaling level for SDCLK, CMD and DAT[3:0] lines is converted from 3.3V power line. To avoid voltage mismatch between host and card, signaling level is changed by voltage switch sequence at the initialization. The host and card communicate using ACMD41 whether host and card support 1.8V signaling mode. Support of 1.8V signaling both host and card means UHS-I can be used. CMD11 invokes the voltage switch sequence. The card enters UHS-I mode and card input and output timings are changed (SDR12 in default) when the voltage switch sequence is completed successfully. (Refer to Section 4.2.4 for more detail.) Only 4-bit bus mode is supported in UHS-I except CMD42. If the card is locked, host needs to unlock the card by CMD42 in 1-bit mode and then needs to issue ACMD6 to change 4-bit bus mode. Operating in 1-bit mode is not assured. Host can choose suitable output driver strength by CMD6 Function Group 3. 3.5 Comparison of SD Card Addressing Mode HCS/CCS bits of ACMD41 CMD8 (SEND_IF_COND) CMD16 (SET_BLOCKLEN) Lock/Unlock Function Write Protect Groups Total Bus Capacitance for each signal line CSD Version (CSD_STRUCTURE Value) Speed Class SD3.0 Standard (Backward compatible to 2.0 host) SD3.0 SDHC (Backward compatible to 2.0 host) Byte (1 byte unit) Support Support Support Mandatory Optional 40pF Block (512 byte unit) Support Support Support (Only CMD42) Mandatory Not Support 40pF 1.0 (0x0) 2.0 (0x1) Optional Mandatory (Class 2 / 4 / 6 / 10) Table 3-5 Comparison of SD3.0 standard and SD3.0 SDHC ATP Confidential © ATP Electronics, Inc. Page 11 of 83 ATP UHS-I microSD Card Specification Version 1.6_IT 3.6 Environment Specifications Type Temperature Humidity Random Vibration Test Bend Test Torque Test Salt Spray Test (MIL-STD-883G Method1009.8) UV Light Exposure Test (ISO 7816-1) Drop Test Measurement Operation o o -40 C to 85 C *Note : Based on ATP internal H/L Temperature test Non-Operation Operation Non-Operation -55oC to 90oC Non-Operation Non-Operation Non-Operation 10~2000Hz, 6Grms, 30mins per axis 10N to the center of the card 0.1N-m or +/-2.5° Non-Operation 35oC,Over 85% RH,3% Salt Concentration, 24 hours Non-Operation 254nm, 15Ws/cm2 Non-Operation 150cm/Free fall, total 6 drops 8%~ 95% relative humidity, non-condensing Table 3-6: Environment Specifications ATP Confidential © ATP Electronics, Inc. Page 12 of 83 ATP UHS-I microSD Card Specification Version 1.6_IT 3.7 Reliability Type Number of insertions Endurance TBW (Total Bytes Written) MTBF(@ 25oC) Measurement 10,000 minimum Advanced Dynamic / Static Wear Leveling algorithm 4.8 Terabytes Random Write 8GB 9.6 Terabytes Sequential Write 9.6 Terabytes Random Write 16GB 19.2 Terabytes Sequential Write 19.2 Terabytes Random Write 32GB 38.4 Terabytes Sequential Write >2,000,000 hours Table 3-7: Reliability Note 1: TBW (total bytes written) is an index of how many TB (Terabytes) can be used for written under product life time. The endurance for flash cards can be predicted based on the usage conditions applied to the device, the internal NAND flash cycles, the write amplification factor, and the wear leveling efficiency of the flash devices. Above TBW is for reference only. Please contact ATP for TBW in real applications. 1 TeraBytes = 1000 GigaBytes (Disk storage) Note 2: MTBF highly depends on testing method. All ATP products are tested with Bellcore Method II (Combines Method I predictions with laboratory data). 3.8 Data Retention Endurance Used Number of P/E Cycles Used (block level) Corresponding Data Retention at 55C use condition ≦10% P/E cycles ≦300 Cycles 5 years ＞10% P/E cycles ＞300 ～3000 Cycles 1 year Table 3-8: Data Retention Note 1: Data retention refers to the ability of a memory bit to retain its data state over a period of time after the data is written in NAND Flash regardless of whether the part is powered on or powered off. A data retention failure is when there is at least 1 bit of data that cannot be read or is read incorrectly. Note 2: NAND Flash suppliers refer to JEDEC JESD47 & JESD22 for Data Retention testing. Assuming