AF960GSTJA-8BEIP

M.2 NVMe Targeted Product Portfolio, Engineered Specifically for Your Mission Critical Applications Key Features • MCU-based Power Loss Protection Design * • Self-Encrypting Drive (SED) with AES 256-bit Encryption, TCG OPAL 2.0* • Thermal Management Solutions** • End-to-End Data protection • TRIM function support * May vary by product and project support ** Customization available on a project basis. M.2 solid state modules based on the NVMe™protocol leverage the blazing-fast PCI Express® (PCIe®) interface to deliver dramatic improvements in speed and performance to fulfill the increasing demand for responsiveness in enterprise storage systems and to support the growing data-hungry needs of today’s enterprise. Delivering 32 Gb/s bandwidth on a PCIe 3.1 x4 slot (8 Gb/s per lane), ATP NVMe SSDs outperform Serial ATA 6 Gb/s SSDs with 4-6X faster access, over 3X lower latency, and higher Input/Output per Second (IOPS). ATP NVMe SSDs with industrial operating temperature rating deliver stable performance even in extreme temperatures ranging from -40°C to 85°C, while Dynamic Thermal Throttling automatically adjusts the speed to maintain cooler operation under intense and heavy workloads. Adopting NVMe 1.3 specifications and integrating 3D NAND TLC technology, ATP’s M.2 2280 NVMe modules offer up to 1.92TB of storage capacity and deliver boosted performance with sequential read up to 3,420 MB/s, sequential write up to 3,050 MB/s, and random read/write IOPS up to 225,200/179,200. Designed to move past the limitations of mechanical drives, NVMe was specifically built from the ground up for faster, more efficient access to storage devices with non-volatile memory such as current NAND flash solutions and future non-volatile memory technologies. These SSDs can deliver fast, reliable and durable performance for any demanding application. PRODUCT FLYER M.2 NVMe 1 Specifications M.2 NVMe Premium Product Line Superior N700Pi N750Pi N700Si Interface N700Sc N650Si N650Sc PCIe G3 x4 Flash Type 3D TLC (pSLC mode) Form Factor Operating Temperature (Tcase)1 3D TLC (pSLC mode) 3D TLC M.2 2230-S4-M M.2 2280-D2-M M.2 2280-D2-M -40°C to 85°C Power Loss Protection Options -40°C to 85°C Hardware + Firmware Based Optional SED Features 0°C to 70°C -40°C to 85°C Firmware Based 0°C to 70°C Hardware + Firmware Based or Firmware Based AES 256-bit Encryption, TCG Opal 2.0 Capacity 40 GB to 320 GB 40 GB to 640 GB 40 GB / 80 GB / 160 GB 120 GB to 960 GB Performance Sequential Read (MB/s) up to 3,150 Sequential Write (MB/s) up to 2,670 2,820 2,000 3,420 1,600 3,050 Random Reads IOPS up to 147,789 (4K, QD32) 135,600 (4K, QD32) 222,700 (4K, QD32) Random Writes IOPS up to 114,227 (4K, QD32) 112,000 (4K, QD32) 176,600 (4K, QD32) Endurance and Reliability 16,000 TB Endurance (TBW)2 up to 4,280 TB 4,640 TB >1,500,000 hours >2,000,000 hours 21,300 TB Reliability MTBF @ 25°C >2,000,000 hours Dimensions: L x W x H (mm) 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA) 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink) Others Certifications 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA) 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink) 30.0 x 22.0 x 2.5 CE, FCC, BSMI, UKCA, RoHS, REACH Warranty 5 years 2 years M.2 NVMe Value Superior Product Line N600Si N600Vc N600Sc Interface N600Vc N600Vi N600Vc PCIe G3 x4 Flash Type 3D TLC Form Factor M.2 2280-D2-M Operating Temperature (Tcase)1 Power Loss Protection Options -40°C to 85°C 3D TLC M.2 2280 S2-M 0°C to 70°C 3D TLC (TLC Mode) M.2 2242 D5-M 0°C to 70°C -40°C to 85°C - AES 256-bit Encryption, TCG Opal 2.0 Capacity 0°C to 70°C Firmware Based Hardware + Firmware Based or Firmware Based Optional SED Features M.2 2230-S4-M 120 GB to 1,920 GB 120 GB to 960 GB 120GB / 240GB / 480GB Performance Sequential Read (MB/s) up to 3,420 2,600 2,000 Sequential Write (MB/s) up to 3,050 1,870 1,570 Random Reads IOPS up to 225,200 (4K, QD32) 184,300 (4K, QD32) 135,600 (4K, QD32) Random Writes IOPS up to 179,200 (4K, QD32) 145,900 (4K, QD32) 112,000 (4K, QD32) Endurance and Reliability Endurance (TBW)2 up to 5,585 TB 1,536 TB Reliability MTBF @ 25°C >2,000,000 hours >2,000,000 hours Dimensions: L x W x H (mm) 80.0 x 22.0 x 3.5 (M.2 2280 Bare PCBA) 80.0 x 24.4 x 12.5 (M.2 2280 with 8 mm heatsink) 768 TB >1,500,000 hours Others Certifications 42.0 x 22.0 x 3.6 80.0 x 22.0 x 2.2 30.0 x 22.0 x 2.5 CE, FCC, BSMI, UKCA, RoHS, REACH Warranty 2 years 1 Case Temperature, the composite temperature as indicated by SMART temperature attributes. 2 Under highest Sequential write value. May vary by density, configuration and applications. Technologies & Add-On Services S S.M.A.R.T. Hardware-based Power Loss Protection AutoRefresh Advanced Wear Leveling Dynamic Data Refresh End-to End Data Protection Secure Erase Premium ▲ Superior ▲ Value - TCG Opal 2.0 - Industrial Temperature Anti-Sulfur Resistors Conformal Coating ▲ ▲ ▲ ▲ ▲ - ▲ ▲ ▲: Customization option available on a project basis. PRODUCT FLYER M.2 NVMe 2 Hot Items Ordering Information Product Line Capacity1 Operating Temperature2 Power Loss Protection3 SED4 P/N N650Si 120GB -40°C to 85°C Hardware + Firmware Based - AF120GSTJA-8BCIP N650Si 240GB -40°C to 85°C Hardware + Firmware Based - AF240GSTJA-8BCIP N650Si 480GB -40°C to 85°C Hardware + Firmware Based - AF480GSTJA-8BCIP N650Si 960GB -40°C to 85°C Hardware + Firmware Based - AF960GSTJA-8BCIP N650Sc 120GB 0°C to 70°C Hardware + Firmware Based - AF120GSTJA-8BCXP N650Sc 240GB 0°C to 70°C Hardware + Firmware Based - AF240GSTJA-8BCXP N650Sc 480GB 0°C to 70°C Hardware + Firmware Based - AF480GSTJA-8BCXP N650Sc 960GB 0°C to 70°C Hardware + Firmware Based - AF960GSTJA-8BCXP N600Sc 120GB 0°C to 70°C Hardware + Firmware Based - AF120GSTJA-8BAXP N600Sc 240GB 0°C to 70°C Hardware + Firmware Based - AF240GSTJA-8BAXP N600Sc 480GB 0°C to 70°C Hardware + Firmware Based - AF480GSTJA-8BAXP N600Sc 960GB 0°C to 70°C Hardware + Firmware Based - AF960GSTJA-8BAXP N600Sc 1920GB 0°C to 70°C Hardware + Firmware Based - AF1T92STJA-8BAXP N600Sc 120GB 0°C to 70°C Firmware Based - AF120GSTJA-8BAXX N600Sc 240GB 0°C to 70°C Firmware Based - AF240GSTJA-8BAXX N600Sc 480GB 0°C to 70°C Firmware Based - AF480GSTJA-8BAXX N600Sc 960GB 0°C to 70°C Firmware Based - AF960GSTJA-8BAXX N600Sc 1920GB 0°C to 70°C Firmware Based - AF1T92STJA-8BAXX N600Vc (M.2 NVMe 2280) 120GB 0°C to 70°C Firmware Based - AF120GSTJA-DBCXX N600Vc (M.2 NVMe 2280) 240GB 0°C to 70°C Firmware Based - AF240GSTJA-DBCXX N600Vc (M.2 NVMe 2280) 480GB 0°C to 70°C Firmware Based - AF480GSTJA-DBCXX N600Vc (M.2 NVMe 2242) 120GB 0°C to 70°C Firmware Based - AF120GSTJC-DBBXX N600Vc (M.2 NVMe 2242) 240GB 0°C to 70°C Firmware Based - AF240GSTJC-DBBXX N600Vc (M.2 NVMe 2242) 480GB 0°C to 70°C Firmware Based - AF480GSTJC-DBBXX N600Vc (M.2 NVMe 2242) 960GB 0°C to 70°C Firmware Based - AF960GSTJC-DBBXX 1 Amount of actual usable storage that can be utilized. 2 Refers to Case Temperature range during device operation, as indicated by SMART temperature attributes. 3 Hardware + Firmware-based power loss protection design with Level 4 (data-in-flight) protection; Firmware-based power loss protection design with Level 1 (data-at-rest) protection. 4 Allows data written to and read from the SSD to be constantly and automatically encrypted and decrypted. Conforms to TCG Opal 2.0 and uses AES 256-bit HW encryption. Product spec and its related information are subject to change without advance notice. Please refer to www.atpinc.com for latest information v2 202207 © Copyright 2022 ATP Electronics, Inc. All rights reserved. The Global Leader in Specialized Storage and Memory Solutions We build With you ATP TAIWAN (HQ) ATP USA ATP EUROPE ATP JAPAN ATP CHINA TEL: +886-2-2659-6368 sales-apac@atpinc.com TEL: +1-408-732-5000 sales@atpinc.com TEL: +49-89-374-9999-0 sales-europe@atpinc.com TEL: +81-3-6260-0797 sales-japan@atpinc.com TEL: +86-21-5080-2220 sales@cn.atpinc.com