www.osram-os.com
GF CSSRML . 24
DATASHEET
GF CSSRML.24
Datasheet
Published by ams-OSRAM AG
Tobelbader Strasse 30, 8141 Premstaetten, Austria
Phone +43 3136 500-0
ams-osram.com
© All
reserved
| Version
1.0 | 2022-04-27
1 rights
GF CSSRML . 24
DATASHEET
OSLON® Optimal
GF CSSRML.24
A brand new family of LEDs with our ams OSRAM’s latest
chip technology, delivering significant performance upgrades.
Offered in four colors for ease of design and flexibility for all
your horticulture spectrum needs. With Hyper Red (660 nm),
Deep Blue (450 nm), Far Red (730 nm) and Horti White options
to select from both narrow spectrum and full spectrum solutions
can be designed to meet all crop needs for both greenhouses
and vertical farms.
The OSLON® Optimal strikes a perfect balance of performance
and cost along with proven robustness,
high reliability and long lifetime.
Applications
- Architecture
Features
- Horticulture Lighting
- Package: SMT ceramic package with silicone lens
- Typ. Radiation: 120° (Lambertian emitter)
- ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
- Radiant Flux: typ. 440 mW
- Radiant Efficiency: typ. 64.5%
- Photon Flux: typ. 2.69 umol/s
- Photon Flux Efficacy: typ. 3.94 umol/J
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GF CSSRML . 24
DATASHEET
Ordering Information
Type
Total radiant flux 1)
IF = 350 mA
ΦE
GF CSSRML.24-TNUL-1-1
380 ... 565 mW
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Ordering Code
Q65113A4445
GF CSSRML . 24
DATASHEET
Maximum Ratings
Parameter
Symbol
Operating Temperature
Top
min.
max.
-40 °C
125 °C
Storage Temperature
Tstg
min.
max.
-40 °C
125 °C
Junction Temperature
Tj
max.
135 °C
Forward current
IF
min.
max.
30 mA
1000 mA
Surge Current
t ≤ 10 µs; D = 0.005 ; TJ = 25 °C
IFS
max.
2000 mA
Reverse voltage 2)
VR
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
VESD
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Values
Not designed for
reverse operation
8 kV
GF CSSRML . 24
DATASHEET
Characteristics
IF = 350 mA; TJ = 25 °C
Parameter
Symbol
Peak Wavelength
λpeak
typ.
730 nm
Centroid Wavelength 3)
IF = 350 mA
λcentroid
min.
typ.
max.
710 nm
727 nm
740 nm
Spectral Bandwidth at 50% Irel,max
∆λ
typ.
30 nm
Viewing angle at 50% IV
2φ
typ.
120 °
Forward Voltage 4)
IF = 350 mA
VF
min.
typ.
max.
1.80 V
1.95 V
2.20 V
Reverse current 2)
IR
Electrical thermal resistance junction/solderpoint
with efficiency ηe = 64.5 %
RthJS elec.
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Values
Not designed
for reverse
operation
typ.
2.0 K / W
GF CSSRML . 24
DATASHEET
Brightness Groups
Group Total radiant
flux 1)
IF = 350 mA
min.
ΦE
Total radiant PPF *
flux 1)
IF = 350 mA
max.
min.
ΦE
Φp
PPF *
PPF/W *
PF **
PF **
PF/W **
max.
Φp
typ.
min.
Φp,b
max.
Φp,b
typ.
TN
380 mW
415 mW
0.098
µmol/s
0.107
µmol/s
0.15
µmol/J
2.32
µmol/s
2.54
µmol/s
3.56
µmol/J
TO
415 mW
450 mW
0.107
µmol/s
0.116
µmol/s
0.16
µmol/J
2.54
µmol/s
2.75
µmol/s
3.88
µmol/J
UJ
450 mW
485 mW
0.116
µmol/s
0.125
µmol/s
0.18
µmol/J
2.75
µmol/s
2.97
µmol/s
4.19
µmol/J
UK
485 mW
525 mW
0.125
µmol/s
0.135
µmol/s
0.19
µmol/J
2.97
µmol/s
3.21
µmol/s
4.53
µmol/J
UL
525 mW
565 mW
0.135
µmol/s
0.145
µmol/s
0.21
µmol/J
3.21
µmol/s
3.46
µmol/s
4.89
µmol/J
Note: [*] Photosynthetic Photon Flux includes wavelengths between 400 and 700 nm
Note: [**] Photon Flux includes wavelengths between 280 and 800 nm
Note: PPF and PF values are for reference only
Forward Voltage Groups
Group
E1
E2
F1
F2
Forward Voltage 4)
IF = 350 mA
min.
VF
Forward Voltage 4)
IF = 350 mA
max.
VF
1.80 V
1.90 V
1.90 V
2.00 V
2.00 V
2.10 V
2.10 V
2.20 V
Centroid Wavelength
Group
710 nm
1
Centroid Wavelength 3)
IF = 350 mA
min.
λcentroid
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Centroid Wavelength 3)
IF = 350 mA
max.
λcentroid
740 nm
GF CSSRML . 24
DATASHEET
Group Name on Label
Example: TN-1-E1
Brightness
Wavelength
TN
1
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Forward Voltage
E1
GF CSSRML . 24
DATASHEET
Relative Spectral Emission
5)
Irel = f (λ); IF = 350 mA; TJ = 25 °C
Irel
GF CSSRML.24
1,0
: Vλ
: far red
0,8
0,6
0,4
0,2
0,0
350
400
Radiation Characteristics
450
500
550
600
650
700
750
800
λ / nm
5)
Irel = f (ϕ); TJ = 25 °C
GF CSSRML.24
ϕ/°
-40°
-50°
-20°
-10°
0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
1,0
-30°
0,8
0,6
-60°
-70°
0,4
-80°
0,2
-90°
0,0
-100°
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Irel
GF CSSRML . 24
DATASHEET
Forward current
Relative Radiant Power
5)
IF = f(VF); TJ = 25 °C
IF / mA
5), 6)
ΦE/ΦE(350 mA) = f(IF); TJ = 25 °C
GF CSSRML.24
Φe
GF CSSRML.24
1000
Φe(350mA)
800
2,5
2,0
600
1,5
1,0
400
0,5
200
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10
00
80
0
2,4 2,6
VF / V
60
0
2,2
40
0
2,0
20
0
1,8
30
0,0
30
1,51,6
IF / mA
GF CSSRML . 24
DATASHEET
Forward Voltage
Relative Radiant Power
5)
ΔVF = VF - VF(25 °C) = f(Tj); IF = 350 mA
∆VF / V
0,3
GF CSSRML.24
ΦE/ΦE(25 °C) = f(Tj); IF = 350 mA
Φe
1,2
GF CSSRML.24
Φe (25°C)
0,2
1,0
0,1
0,8
0,0
0,6
-0,1
0,4
-0,2
0,2
-0,3
-40 -20 0 20 40 60 80 100 120
Tj / °C
0,0
-40 -20 0 20 40 60 80 100 120
Tj / °C
Centroid Wavelength
5)
Δλcentr = λcentr - λcentr(25 °C) = f(Tj); IF = 350 mA
∆λ centr / nm
5)
20
10
GF CSSRML.24
0
-10
-20
-40 -20 0 20 40 60 80 100 120
Tj / °C
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GF CSSRML . 24
DATASHEET
Max. Permissible Forward Current
IF = f(T)
IF / mA
GF CSSRML.24
1100
1000
900
800
700
600
500
400
300
200
100
0
Don't use below 30 mA
0
20
40
60
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80
100
120
Ts / °C
GF CSSRML . 24
DATASHEET
Dimensional Drawing
7)
Further Information:
Approximate Weight:
27.7 mg
Package marking:
Anode
ESD advice:
The device is protected by ESD device which is connected in parallel to the
Chip.
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GF CSSRML . 24
DATASHEET
Recommended Solder Pad
7)
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Further information can be found in our Application Note: “Handling and Processing Details for Ceramic LEDs”.
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GF CSSRML . 24
DATASHEET
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
Tp 245 ˚C
240 ˚C
tP
217 ˚C
200
tL
150
tS
100
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
Profile Feature
Symbol
Pb-Free (SnAgCu) Assembly
Minimum
Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
tS
Time tS
TSmin to TSmax
Ramp-up rate to peak*)
TSmax to TP
Liquidus temperature
60
2
3
100
120
2
3
Unit
K/s
s
K/s
TL
217
Time above liquidus temperature
tL
80
100
s
Peak temperature
TP
245
260
°C
Time within 5 °C of the specified peak
temperature TP - 5 K
tP
20
30
3
6
Ramp-down rate*
TP to 100 °C
10
Time
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
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°C
480
s
K/s
s
GF CSSRML . 24
DATASHEET
Taping
7)
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GF CSSRML . 24
DATASHEET
Tape and Reel
8)
Reel Dimensions
A
330 mm
W
Nmin
12 + 0.3 / - 0.1 mm
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W1
60 mm
W2 max
12.4 + 2 mm
18.4 mm
Pieces per PU
3000
GF CSSRML . 24
DATASHEET
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
Moisture-sensitive label or print
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Humidity indicator
Barcode label
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
Do not eat.
Comparator
check dot
WET
If wet,
examine units, if necessary
bake units
15%
If wet,
examine units, if necessary
bake units
10%
5%
If wet,
parts still adequately dry.
change desiccant
Humidity Indicator
MIL-I-8835
Desiccant
AM
OSR
OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
17 | Version 1.0 | 2022-04-27
GF CSSRML . 24
DATASHEET
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
This device is designed for specific/recommended applications only. Please consult OSRAM Opto
Semiconductors Sales Staff in advance for detailed information on other non-recommended applications
(e.g. automotive).
Change management for this component is aligned with the requirements of the lighting market.
For further application related information please visit www.osram-os.com/appnotes
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GF CSSRML . 24
DATASHEET
Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on our website.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.
Product and functional safety devices/applications or medical devices/applications
Our components are not developed, constructed or tested for the application as safety relevant component
or for the application in medical devices.
Our products are not qualified at module and system level for such application.
In case buyer – or customer supplied by buyer – considers using our components in product safety devices/
applications or medical devices/applications, buyer and/or customer has to inform our local sales partner
immediately and we and buyer and /or customer will analyze and coordinate the customer-specific request
between us and buyer and/or customer.
19 | Version 1.0 | 2022-04-27
GF CSSRML . 24
DATASHEET
Glossary
1)
Brightness: Brightness values are measured during a current pulse of typically 10 ms, with a tolerance
of +/- 7%.
2)
Reverse Operation: Not designed for reverse operation. Continuous reverse operation can cause migration and damage of the device.
3)
Wavelength: The wavelength is measured at a current pulse of typically 10 ms, with a tolerance of ±
0.5 nm.
4)
Forward Voltage: The Forward voltage is measured during a current pulse duration of typically 1 ms
with a tolerance of ± 0.05V .
5)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
6)
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single devices within one packing unit.
7)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
8)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
20 | Version 1.0 | 2022-04-27
GF CSSRML . 24
DATASHEET
Revision History
Version
Date
Change
1.0
2022-04-27
Initial Version
21 | Version 1.0 | 2022-04-27
GF CSSRML . 24
DATASHEET
Published by ams-OSRAM AG
Tobelbader Strasse 30, 8141 Premstaetten, Austria
Phone +43 3136 500-0
ams-osram.com
© All rights reserved
22 | Version 1.0 | 2022-04-27