TMD3782
Color Light-to-Digital Converter with
Proximity Sensing
General Description
The TMD3782x device will perform color temperature
measurement, ambient light sensing (ALS) and proximity
detection with background light rejection. The device detects
light intensity under a variety of lighting conditions and through a
variety of attenuation materials, including dark glass. The
proximity detection feature allows a large dynamic range of
operation for accurate distance detection, such as in a cell phone
when the user positions the phone close to their ear. IR LED sink
current is factory trimmed to provide consistent proximity
response without requiring customer calibrations. An internal
state machine provides the ability to put the device into a low
power state between proximity and RGBC measurements
providing very low average power consumption.
The color sensing feature is useful in applications such as
backlight control, solid state lighting, reflected LED color
sampler, or fluorescent light color temperature detection. The
integrated IR blocking filter makes this device an excellent
ambient light sensor, color temperature monitor, and general
purpose color sensor.
Ordering Information and Content Guide appear at end of
datasheet.
Key Benefits & Features
The benefits and features of TMD3782, Color Light-to-Digital
Converter with Proximity Sensing are listed below:
Figure 1:
Added Value of Using TMD3782
Benefit
Feature
• Single Device Integrated Optical
Solution
• RGB, Ambient Light Sensor (ALS) and Proximity Support
• Power Management Features
• I²C Fast Mode Interface Compatible
• Integral IR LED
• Small 8 lead optical module
• Color Temperature and Ambient Light
Sensing
• UV / IR blocking filters
• Programmable Gain & Integration Time
• 1,000,000:1 Dynamic Range
• Equal Response to 360º Incident Light
• Circular Segmented RGBC Photodiode
• Ideal for Operation Behind Dark Glass
• Very High Sensitivity
ams Datasheet
[v3-02] 2015-Sep-11
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TMD3782 − General Description
Benefit
• Proximity Detection with Integrated IR
LED
Feature
• Background Ambient Light Rejection
• Factory Trimmed, Consistent Response
• Programmable Current Sink for IR LED Drive
Applications
The TMD3782 applications include:
• Ambient Light Sensing
• Color Temperature Sensing
• Cell Phone Touch Screen Disable
• Mechanical Switch Replacement
• Industrial Process Control
• Medical Diagnostics
Block Diagram
The functional blocks of this device are shown below:
Figure 2:
TMD3782 Block Diagram
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TMD3782 − Detailed Description
Detailed Description
The TMD3782 is a digital color light sensor device containing
four analog-to-digital converters (ADCs) that integrate currents
from photodiodes. Multiple photodiode segments for red, green,
blue, and clear are geometrically arranged to reduce the reading
variance as a function of the incident light angle. Integration of
all color sensing channels occurs simultaneously. Upon
completion of the conversion cycle, the result is transferred to the
corresponding data registers. The transfers are double-buffered to
ensure that the integrity of the data is maintained.
Communication with the device is accomplished through a fast
(up to 400 kHz), two-wire I²C serial bus for easy connection to
a microcontroller or embedded controller.
The TMD3782 provides a separate pin for level-style interrupts. When
interrupts are enabled and a pre-set value is exceeded, the
interrupt pin is asserted and remains asserted until cleared by
the controlling firmware. The interrupt feature simplifies and
improves system efficiency by eliminating the need to poll a
sensor for a light intensity or proximity value. An interrupt is
generated when the value of a clear channel or proximity conversion
equals or exceeds either an upper or lower threshold. In
addition, a programmable interrupt persistence feature allows
the user to determine how many consecutive s a m p l e s m u s t
e q u a l o r exceed the threshold to trigger an interrupt.
Interrupt thresholds and persistence settings are configured
independently for both the clear channel and proximity sensors.
Proximity detection is done using a dedicated proximity
photodiode centrally located beneath an internal lens, an internal
LED, and a driver circuit. The driver circuit requires no external
components and is trimmed to provide a calibrated proximity
response. Customer calibrations are usually not required. The
number of proximity LED pulses can be programmed from 1 to 255
pulses, providing a 2000:1 contiguous dynamic range.
Background ambient light is subtracted from the proximity
reading to improve accuracy in all lighting conditions.
ams Datasheet
[v3-02] 2015-Sep-11
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TMD3782 − Detailed Description
A state machine controls the functionality. Enabling bits
independently determine whether the Proximity, Wait or RGBC
/ ALS functions are performed. Average power consumption is
managed via control of variable endurance low power wait
cycles. Once initiated the state machine will run continuously
until disabled.
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TMD3782 − Pin Assignment
The TMD3782 pin assignments are described below.
Pin Assignment
Figure 3:
Pin Diagram
Package Module - 8 (Top View) Package
drawing is not to scale.
Figure 4:
Pin Description
Pin Number
Pin Name
Typ
1
VDD
PWR
2
SCL
I
3
GND
GND
Power supply ground. All voltages are referenced to GND.
4
LEDA
PWR
LED anode.
5
LEDK
-
LED cathode. Connect to LDR pin when using internal driver circuit.
6
LDR
-
Proximity IR LED controlled current sink driver.
7
INT
O
Interrupt — open drain (active low)
8
SDA
I/O
I²C serial data I/O terminal - serial data I/O for I²C.
ams Datasheet
[v3-02] 2015-Sep-11
Description
Supply voltage
I²C serial clock input terminal - clock signal for I²C serial data.
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TMD3782 − Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under Electrical
Characteristics is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
Figure 5:
Absolute Maximum Ratings
Parameter
Min
Max
Units
3.8
V
3.8
V
Max LEDA Voltage (2)
4.8
V
Max LDR Voltage (3)
4.4
V
Supply Voltage, VDD
Digital I/O Voltage (except LDR)
-0.5
Output Terminal Current (except LDR)
-1
20
mA
Storage Temperature Range, Tstg
-40
85
ºC
ESD Tolerance, JEDEC Specification
±2000
V
Comments
All voltages are with respect to GND
JESD22-A11 Class 1C
Note(s) and/or Footnote(s):
1. All voltages are with respect to GND.
2. Maximum 4.8V DC over 7 years lifetime
Maximum 5.0V spikes with up to 250s cumulative duration over 7 years lifetime
Maximum 5.5V spikes with up to 10s (=1000*10ms) cumulative duration over 7 years lifetime
3. Maximum voltage with LDR = off
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[v3-02] 2015-Sep-11
TMD3782 − Electrical Characteristics
All limits are guaranteed. The parameters with min and max
values are guaranteed with production tests or SQC (Statistical
Quality Control) methods.
Electrical Characteristics
Figure 6:
Recommended Operating Conditions
Symbol
VDD
TA
Parameter
Min
Typ
Max
Units
Supply voltage
2.7
3
3.3
V
Operating free-air temperature (1)
-30
85
ºC
Note(s) and/or Footnote(s):
1. While the device is operational across the temperature range, functionality will vary with temperature. Specifications are stated
only at 25°C unless otherwise noted.
Figure 7:
Operating Characteristics, V DD=3V, TA=25ºC (unless otherwise noted)
Symbol
IDD
Parameter
Supply current
Conditions
Typ
Max
Units
Active - LDR pulses off
235
330
μA
Wait state
65
Sleep state — no I²C
activity
2.5
10
0
0
0.4
0.6
V
Leakage current, SDA, SCL,
INT pins
-5
5
μA
Leakage current, LDR pin
-10
10
μA
VOL
INT, SDA output low voltage
ILEAK
ILEAK
3 mA sink current
6 mA sink current
Min
VIH
SCL, SDA input high voltage
TMD37821
TMD37823
VIL
SCL, SDA input low voltage
TMD37821
TMD37823
ams Datasheet
[v3-02] 2015-Sep-11
0.7 VDD
1.25
V
0.3 VDD
0.54
V
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TMD3782 − Electrical Characteristics
Figure 8:
Optical Characteristics (Clear Channel), V DD = 3V, TA = 25ºC, AGAIN = 16x, ATIME = 0xF6
Clear Channel
Parameter
Re
Irradiance responsivity
Test Conditions
Unit
Min
Typ
Max
λD = 465 nm (1)
9.4
11.8
14.2
λD = 525 nm (2)
12.5
15.6
18.7
λD = 615 nm (3)
14.6
18.2
21.8
count/
(μW/cm2)
Figure 9:
Optical Characteristics (RGBC), V DD = 3V, TA = 25ºC
Clear Channel
Parameter
Color ADC count value
ratio:
Color/Clear
Test
Conditions
Red
Channel
Green
Channel
Blue
Channel
Min
Max
Min
Max
Min
Max
λD = 465 nm (1)
0%
15%
10%
42%
70%
90%
λD = 525 nm (2)
4%
25%
60%
85%
10%
45%
λD = 615 nm (3)
80%
110%
0%
14%
5%
24%
Note(s) and/or Footnote(s):
1. The 465 nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics: dominant wavelength
λ D = 465 nm, spectral halfwidth Δλ½ = 22 nm.
2. The 525 nm input irradiance is supplied by an InGaN light-emitting diode with the following characteristics: dominant wavelength
λ D = 525 nm, spectral halfwidth Δλ½ = 35 nm.
3. The 615 nm input irradiance is supplied by a AlInGaP light-emitting diode with the following characteristics: dominant wavelength
λ D = 615 nm, spectral halfwidth Δλ½ = 15 nm.
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[v3-02] 2015-Sep-11
TMD3782 − Electrical Characteristics
Figure 10:
RGBC Characteristics, VDD = 3 V, TA = 25ºC, AGAIN = 16x, AEN = 1 (unless otherwise noted)
Parameter
Dark ADC count value
ADC integration time step
size
Conditions
Channel
Min
Typ
Max
Units
0
1
3
counts
1
counts(1)
2.53
ms
Ee = 0, AGAIN = 60x,
ATIME=0xD6 (100ms)
ATIME = 0xFF
0
2.25
2.38
ADC number of integration
steps
1
256
steps
ADC counts per step
0
1023
counts
0
65535
counts
4.2
17
63
×
ADC count value
ATIME = 0xC0 (152.3 ms)
Gain scaling, relative to 1×
gain setting (2)
AGAIN = 4x
AGAIN = 16x
AGAIN = 60x
3.8
15
58
4.0
16
60
Note(s) and/or Footnote(s):
1. Based on typical 3-sigma distribution. Not 100% tested.
2. Clear channel response to a red LED light source with a dominant wavelength (λ D) of 615 nm and a spectral halfwidth (Δλ½) of 20 nm.
Figure 11:
Proximity Characteristics, VDD = 3 V, TA = 25ºC, PEN = 1 (unless otherwise noted)
Parameter
IDD Supply current
Conditions
Min
LDR pulse on
ADC conversion time step size
Typ
Max
3
2.25
LED pulse period
2.38
Units
mA
2.53
ms
14
us
LED pulse width
LED on time
6.3
us
Nominal LED drive current
(measured at LDR=0.6V) (1)
PDRIVE = 0 (100%)
PDRIVE = 1 (50%)
PDRIVE = 2 (25%)
PDRIVE = 3 (12.5%)
100
50
25
12.5
mA
Proximity offset, no target (2), (3)
Pulses: 8
PDRIVE = 0 (100%)
100
165
230
counts
Proximity response,
100-mm target (3)
73 mm × 83 mm, 90% reflective Kodak
Gray Card, 8 pulses,
PDRIVE = 0 (100%)(3)
415
510
605
counts
Note(s) and/or Footnote(s):
1. Value is factory adjusted to meet the Prox count specification. Considerable variation (relative to the typical value) is possible after
adjustment.
2. Proximity offset is the sum of optical and electrical offsets, and will change from one design implementation (or test system) to
another. 100% tested.
3. Application design must use correct electrical schematic to ensure proper offset results. Refer to application guide and guidance
for proper circuit.
ams Datasheet
[v3-02] 2015-Sep-11
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TMD3782 − Electrical Characteristics
Figure 12:
IR LED Characteristics, VDD = 3 V, TA = 25ºC
Symbol
Parameter
Conditions
Min
Typ
Max
Units
1.4
1.5
V
VF
Forward Voltage
IF = 20 mA
VR
Reverse Voltage
IR = 10 μA
5
V
PO
Radiant Power
IF = 20 mA
4.5
mW
λp
Peak Wavelength
IF = 20 mA
850
nm
Δλ
Spectral Radiation
Bandwidth
IF = 20 mA
40
nm
Optical Rise, r
Fall Time
IF = 100 mA, TW = 125 ns,
duty cycle = 25%
20
40
ns
Min
Typ
Max
Units
2.25
2.38
2.53
ms
TR, TF
Figure 13:
Wait Characteristics, VDD = 3 V, TA = 25ºC, WEN = 1 (unless otherwise noted)
Parameter
Wait step size
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Conditions
WTIME = 0xFF
Channel
ams Datasheet
[v3-02] 2015-Sep-11
TMD3782 − Timing Characteristics
The timing characteristics of TMD3782 are given below.
Timing Characteristics
Figure 14:
AC Electrical Characteristics, VDD = 3 V, TA = 25ºC (unless otherwise noted)
Parameter(1)
Description
Min
Typ
Max
Units
400
kHz
f(SCL)
Clock frequency (I²C only)
t(BUF)
Bus free time between start and stop
condition
1.3
μs
Hold time after (repeated) start
condition. After this period, the first
clock is generated.
0.6
μs
t(SUSTA)
Repeated start condition setup time
0.6
μs
t(SUSTO)
Stop condition setup time
0.6
μs
t(HDDAT)
Data hold time
0
μs
t(SUDAT)
Data setup time
100
ns
t(LOW)
SCL clock low period
1.3
μs
t(HIGH)
SCL clock high period
0.6
μs
t(HDSTA)
0
tF
Clock/data fall time
300
ns
tR
Clock/data rise time
300
ns
Ci
Input pin capacitance
10
pF
Note(s) and/or Footnote(s):
1. Specified by design and characterization; not production tested.
Timing Diagrams
Figure 15:
Parameter Measurement Information
ams Datasheet
[v3-02] 2015-Sep-11
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TMD3782 − Typical Operating Characteristics
Typical Operating
Characteristics
Figure 16:
Spectral Responsivity
Figure 17:
Normalized IDD vs. VDD and Temperature
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TMD3782 − Typical Operating Characteristics
Figure 18:
Typical LDR Current vs. Voltage
Figure 19:
RGBC Responsivity vs. Angular Displacement
Green LED
Both Axes
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[v3-02] 2015-Sep-11
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TMD3782 − Typical Operating Characteristics
Figure 20:
Proximity Responsivity vs. Angular Displacement
Proximity Normalized Angular Response
110%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
-30
-20
-10
0
10
20
30
Response angle relative to perpendicular
Figure 21:
Responsivity Temperature Coefficient
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TMD3782 − I²C Protocol
Interface and control are accomplished through an I²C serial
compatible interface (standard or fast mode) to a set of registers
that provide access to device control functions and output data.
The devices support the 7-bit I²C addressing protocol.
I²C Protocol
The I²C standard provides for three types of bus transaction:
read, write, and a combined protocol (Figure 22). During a write
operation, the first byte written is a command byte followed by
data. In a combined protocol, the first byte written is the
command byte followed by reading a series of bytes. If a read
command is issued, the register address from the previous
command will be used for data access. Likewise, if the MSB of
the command is not set, the device will write a series of bytes
at the address stored in the last valid command with a register
address. The command byte contains either control information
or a 5-bit register address. The control commands can also be
used to clear interrupts.
The I²C bus protocol was developed by Philips (now NXP). For
a complete description of the I²C protocol, please review the
NXP I²C design specification at
http://www.I²C-bus.org/references/.
Figure 22:
I²C Write, Read and Combined Protocols
A
N
P
R
S
ams Datasheet
[v3-02] 2015-Sep-11
Acknowledge (0)
Not Acknowledged (1)
Stop Condition
Read (1)
Start Condition
Sr
W
Repeated Start Condition
Write (0)
Continuation of Protocol
Master - to - Slave
Slave - to - Master
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TMD3782 − Register Description
The TMD3782 is controlled and monitored by data registers and
a command register accessed through the serial interface. These
registers provide for a variety of control functions and can be read
to determine results of the ADC conversions. The register set is
summarized in Figure 23.
Register Description
Figure 23:
Register Map
Address
Register Name
R/W
-
COMMAND
W
0x00
ENABLE
0x01
Reset
Value
Register Function
Specified register address
0x00
R/W
Enables states and interrupts
0x00
ATIME
R/W
RGBC time
0xFF
0x03
WTIME
R/W
Wait time
0xFF
0x04
AILTL
R/W
Clear interrupt low threshold low byte
0x00
0x05
AILTH
R/W
Clear interrupt low threshold high byte
0x00
0x06
AIHTL
R/W
Clear interrupt high threshold low byte
0x00
0x07
AIHTH
R/W
Clear interrupt high threshold high byte
0x00
0x08
PILTL
R/W
Proximity interrupt low threshold low byte
0x00
0x09
PILTH
R/W
Proximity interrupt low threshold high byte
0x00
0x0A
PIHTL
R/W
Proximity interrupt high threshold low byte
0x00
0x0B
PIHTH
R/W
Proximity interrupt high threshold high byte
0x00
0x0C
PERS
R/W
Interrupt persistence filters
0x00
0x0D
CONFIG
R/W
Configuration
0x00
0x0E
PPULSE
R/W
Proximity pulse count
0x00
0x0F
CONTROL
R/W
Gain control register
0x00
0x11
REVISION
R
Die revision number
Rev.
0x12
ID
R
Device ID
0x13
STATUS
R
Device status
0x00
0x14
CDATA
R
Clear ADC low data register
0x00
0x15
CDATAH
R
Clear ADC high data register
0x00
0x16
RDATA
R
Red ADC low data register
0x00
0x17
RDATAH
R
Red ADC high data register
0x00
0x18
GDATA
R
Green ADC low data register
0x00
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ID
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TMD3782 − Register Description
Reset
Value
Address
Register Name
R/W
Register Function
0x19
GDATAH
R
Green ADC high data register
0x00
0x1A
BDATA
R
Blue ADC low data register
0x00
0x1B
BDATAH
R
Blue ADC high data register
0x00
0x1C
PDATA
R
Proximity ADC low data register
0x00
0x1D
PDATAH
R
Proximity ADC high data register
0x00
The mechanics of accessing a specific register depends on the
specific protocol used. In general, the COMMAND register is
written first to specify the specific control/status register for
following read/write operations.
Command Register
The Command Register specifies the address of the target
register for future write and read operations, and is used to clear
interrupt sources.
Figure 24:
Command Register
7
6
COMMAND
5
4
3
2
TYPE
Fields
Bits
COMMAND
7
1
0
ADD
Description
Select Command Register. Must write as 1 when addressing COMMAND register.
Selects type of transaction to follow in subsequent data transfers:
FIELD VALUE
TYPE
6:5
TRANSACTION TYPE
00
Repeated byte protocol transaction
01
Auto-increment protocol transaction
10
Reserved — Do not use
11
Special function — See description below
Byte protocol will repeatedly read the same register with each data access. Block
protocol will provide auto-increment function to read successive bytes.
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[v3-02] 2015-Sep-11
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TMD3782 − Register Description
Fields
Bits
Description
Address field/special function field. Depending on the transaction type, see above,
this field either specifies a special function command or selects the specific
control−status−register for following write and read transactions. The field values
listed below apply only to special function commands:
FIELD VALUE
ADD
4:0
SPECIAL FUNCTION
00000
Normal —no action
00101
Proximity interrupt clear
00110
Clear channel interrupt clear
00111
Proximity and Clear interrupt clear
other
Reserved — Do not write
Clear channel/Proximity Interrupt Clear. Clears any pending Clear/Proximity
interrupt. This special function is self clearing.
System Timing
The system state machine shown in Figure 25 provides an
overview of the states and state transitions that provide system
control of the device. This section highlights the programmable
features, which affect the state machine cycle time, and
provides details to determine system level timing.
When the proximity detection feature is enabled (PEN), the
state machine transitions through the Prox Accum, Prox Wait,
and Prox ADC states. The Prox Wait time is a fixed 2.4 ms,
whereas the Prox Accum time is determined by the number of
proximity LED pulses (PPULSE) and the Prox ADC time is
determined by the integration time (PTIME). The formulas to
determine the Prox Accum and Prox ADC times are given in the
associated boxes in Figure 25. If an interrupt is generated as a
result of the proximity cycle, it will be asserted at the end of the
Prox ADC state.
When the power management feature is enabled (WEN), the
state machine will transition in turn to the Wait state. The wait
time is determined by WLONG, which extends normal operation
by 12× when asserted, and WTIME. The formula to determine
the wait time is given in the box associated with the Wait state
in Figure 25.
When the RGBC feature is enabled (AEN), the state machine will
transition through the RGBC Init and RGBC ADC states. The
RGBC Init state takes 2.4 ms, while the RGBC ADC time is
dependent on the integration time (ATIME). The formula to
determine RGBC ADC time is given in the associated box in
Figure 25. If an interrupt is generated as a result of the RGBC
cycle, it will be asserted at the end of the RGBC ADC.
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TMD3782 − Register Description
Figure 25:
Enhanced State Machine Diagram
Note(s) and/or Footnote(s):
1. There is a 2.4 ms warm-up delay if PON is enabled. If PON is not enabled, the device will return to the Sleep state as shown.
2. PON, PEN, WEN and AEN are fields in the Enable register (0x00).
3. PON=1, PEN-1, WEN-1, AEN=0 is unsupported and will lead to erroneous proximity readings.
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[v3-02] 2015-Sep-11
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TMD3782 − Register Description
Enable Register (0 x 00)
The Enable Register is used primarily to power the device on
and off, and enable functions and interrupts.
Figure 26:
Enable Register
7
6
Reserved
5
4
3
2
1
0
PIEN
AIEN
WEN
PEN
AEN
PON
Field
Bits
Reserved
7:6
PIEN
5
Proximity Interrupt Enable. When asserted permits proximity interrupts to be
generated, subject to the persist filter.
AIEN
4
Ambient Light Sensing (ALS) Interrupt Enable. When asserted permits ALS
interrupts to be generated, subject to the persist filter.
WEN (1), (2)
3
Wait Enable. This bit activates the wait feature. Writing a 1 activates the wait
timer. Writing a 0 disables the wait timer.
PEN (1), (2)
2
Proximity enable. This bit activates the proximity function. Writing a 1
enables proximity. Writing a 0 disables proximity.
AEN (1), (2)
1
ADC enable. This bit activates the four-channel (RGBC) ADC. Writing a 1
enables the ADC. Writing a 0 disables the ADC.
0
Power ON. This bit activates the internal oscillator to permit the timers and
ADC channels to operate. Writing a 1 activates the oscillator. Writing a 0
disables the oscillator. During reads and writes over the I²C interface, this bit
is temporarily overridden and the oscillator is enabled, independent of the
state of PON.
PON
Description (Reset value = 0x00)
Reserved. Write as 0.
Note(s) and/or Footnote(s):
1. The PON bit must also be set=1 for these functions to operate.
2. WEN=1, PEN=1, AEN=0 is unsupported and will lead to erroneous proximity readings.
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TMD3782 − Register Description
RGBC Integration Time Register (0x01)
The RGBC Timing Register controls the internal integration time
of the RGBC channel ADCs. Upon power up, the RGBC time
register is set to 0xFF.
The maximum (or saturation) count value can be calculated
based upon the integration time cycles as follows:
min [CYCLES * 1024, 65535]
Figure 27:
RGBC Integration Time Register
Field
Bits
ATIME
Description (Reset value = 0xFF)
REGISTER VALUE
CYCLES
TIME
Max Count
0xFF
1
2.38 ms
1024
0xF6
10
24 ms
10240
0xD6
42
100 ms
43008
0xC0
64
152 ms
65535
0x00
256
609 ms
65535
7:0
Wait Time Register (0x03)
Wait time is set in 2.38 ms increments unless the WLONG bit is
asserted in which case the wait times are 12× longer. WTIME is
programmed as a 2’s complement number.
Figure 28:
Wait Time Register
Field
WTIME
Bits
7:0
Description (Reset value = 0xFF)
REGISTER
VALUE
WAIT TIME
TIME
(WLONG=0)
TIME
(WLONG=1)
0xFF
1
2.38 ms
0.03 s
0xAB
85
202 ms
2.43 s
0x00
256
609 ms
7.31 s
Note(s) and/or Footnote(s):
1. The wait time register should be configured before AEN and/or PEN is asserted.
ams Datasheet
[v3-02] 2015-Sep-11
Page 21
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TMD3782 − Register Description
Clear Channel Interrupt Threshold Registers
(0x04 - 0x0b)
The Clear Channel Interrupt Threshold Registers provide 16 bit
values to be used as the high and low thresholds for comparison
to the 16 bit CDATA values. If AIEN (r0x00:b4) is enabled and
CDATA is not between AILT and AIHT for the number of
consecutive samples specified in APERS (r0x0C) an interrupt is
asserted on the interrupt pin.
Figure 29:
Clear Channel Interrupt Threshold Registers
Registers
Address
Bits
Description (Reset value = 0x00)
AILTL
0x04
7:0
ALS low threshold lower byte
AILTH
0x05
7:0
ALS low threshold upper byte
AIHTL
0x06
7:0
ALS high threshold lower byte
AIHTH
0x07
7:0
ALS high threshold upper byte
Proximity Interrupt Threshold Registers
(0x04 - 0x0b)
The Proximity Interrupt Threshold Registers provide 16 bit
values to be used as the high and low thresholds for comparison
to the 16 bit PDATA values. If PIEN (r0x00:b5) is enabled and
PDATA is not between PILT and PIHT for the number of
consecutive samples specified in PPERS (r0x0C) an interrupt is
asserted on the interrupt pin.
Figure 30:
Proximity Interrupt Threshold Registers
Registers
Address
Bits
PILTL
0x08
7:0
Proximity low threshold lower byte
PILTH
0x09
7:0
Proximity low threshold upper byte
PIHTL
0x0a
7:0
Proximity high threshold lower byte
PIHTH
0x0b
7:0
Proximity high threshold upper byte
Page 22
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Description (Reset value = 0x00)
ams Datasheet
[v3-02] 2015-Sep-11
TMD3782 − Register Description
Interrupt Persistence Register (0x0C)
The Interrupt Register controls the interrupt capabilities of the
device.
Figure 31:
Interrupt Persistence Register
7
6
5
4
3
PPERS
Field
2
1
0
APERS
Bits
Description (Reset value = 0x00)
Proximity interrupt persistence. Controls rate of proximity interrupts to the host processor.
FIELD VALUES
PPERS
7:4
0000
Every proximity cycle generates an interrupt
0001
Any value outside of threshold range
0010
2 consecutive values out of range
….
1111
ams Datasheet
[v3-02] 2015-Sep-11
PERSISTENCE
….
15 consecutive values out of range
Page 23
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TMD3782 − Register Description
Field
Bits
Description (Reset value = 0x00)
Clear channel interrupt persistence. Controls rate of Clear channel interrupts to the host
processor.
FIELD VALUE
APERS
3:0
PERSISTENCE
0000
Every RGBC cycle generates an interrupt
0001
Any value outside of threshold range
0010
2 consecutive values out of range
0011
3 consecutive values out of range
0100
5 consecutive values out of range
0101
10 consecutive values out of range
0110
15 consecutive values out of range
0111
20 consecutive values out of range
1000
25 consecutive values out of range
1001
30 consecutive values out of range
1010
35 consecutive values out of range
1011
40 consecutive values out of range
1100
45 consecutive values out of range
1101
50 consecutive values out of range
1110
55 consecutive values out of range
1111
60 consecutive values out of range
Configuration Register (0x0D)
The Configuration Register sets the wait long time.
Figure 32:
Configuration Register
7
6
5
4
3
Reserved
2
1
0
WLONG
Reserved
Field
Bits
Reserved
7:2
WLONG
1
Wait Long. When asserted, the wait cycles are increased by a factor 12× from
that programmed in the WTIME register.
Reserved
0
Reserved. Write as 0.
Page 24
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Description (Reset value = 0x00)
Reserved. Write as 0.
ams Datasheet
[v3-02] 2015-Sep-11
TMD3782 − Register Description
Proximity Pulse Count Register (0x0E)
The Proximity Pulse Count Register sets the number of
proximity pulses that will be transmitted.
Figure 33:
Proximity Pulse Count Register
Field
Bits
PPULSE
7:0
Description (Reset value = 0x00)
Proximity Pulse Count. Specifies the number of proximity pulses to be
generated.
Control Register (0x0F)
The Control Register provides RGBC gain settings and a control
for managing the proximity reading in the event the analog
circuitry becomes saturated. Bit 5 must be set =1 for proper
device operation.
Figure 34:
Control Register
7
6
PDRIVE
Field
5
4
Reserved
PSAT
Bits
3
2
1
0
Reserved
AGAIN
Description (Reset value = 0x00)
00 = 100%
01 = 50%
10 = 25%
11 = 12.5%
PDRIVE
7:6
Reserved
5
Reserved. Must be written = 1
PSAT
4
0 = PDATA output regardless of ambient light level
1 = PDATA output equal to dark current value if saturated
Reserved
3:2
Reserved. Write as 00
RGBC Gain Control.
AGAIN
ams Datasheet
[v3-02] 2015-Sep-11
FIELD VALUE
RGBC GAIN VALUE
00
1X Gain
01
4X Gain
10
16X Gain
11
60X Gain
1:0
Page 25
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TMD3782 − Register Description
Revision Register (0x11)
The ID register provides the die revision. This register is a
read-only register.
Figure 35:
Revision Register
Field
Bits
Description (Reset value = REV)
RESERVED
7:3
Reserved
REV
2:0
Die revision
ID Register (0x12)
The ID Register provides the value for the part number. This
register is a read-only register.
Figure 36:
ID Register
Field
Bits
ID
7:0
Description (Reset value = ID)
0x60 = TMD37821
0x69 = TMD37823
Part number identification.
Status Register (0x13)
The Status Register provides the internal status of the device.
This register is read only.
Figure 37:
Status Register
7
6
Reserved
5
4
PINT
AINT
3
2
Reserved
1
0
PVALID
AVALID
Field
Bits
Reserved
7:6
PINT
5
Proximity Interrupt.
AINT
4
Ambient Light Sensor (ALS) Interrupt.
Reserved
3:2
PVALID
1
Indicates that a proximity cycle has completed since PEN was asserted.
AVALID
0
Indicates that the RGBC cycle has completed since AEN was asserted.
Page 26
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Description (Reset value = 0x00)
Reserved.
Reserved.
ams Datasheet
[v3-02] 2015-Sep-11
TMD3782 − Register Description
RGBC Data Registers (0x14 - 0x1b)
Clear, red, green, and blue data is stored as 16-bit values. To
ensure the data is read correctly, a two-byte read I²C transaction
should be used with a read word protocol bit set in the
command register. With this operation, when the lower byte
register is read, the upper eight bits are stored into a shadow
register, which is read by a subsequent read to the upper byte.
The upper register will read the correct value even if additional
ADC integration cycles end between the reading of the lower
and upper registers.
Figure 38:
RGBC Data Registers
Register
Address
Bits
Description (Reset value = 0x00)
CDATAL
0x14
7:0
Clear data low byte
CDATAH
0x15
7:0
Clear data high byte
RDATAL
0x16
7:0
Red data low byte
RDATAH
0x17
7:0
Red data high byte
GDATAL
0x18
7:0
Green data low byte
GDATAH
0x19
7:0
Green data high byte
BDATAL
0x1a
7:0
Blue data low byte
BDATAH
0x1b
7:0
Blue data high byte
Proximity Data Registers (0x1c - 0x1d)
Proximity data is stored as a 16-bit value. To ensure the data is
read correctly, a two-byte read I²C transaction should be used
with a read word protocol bit set in the command register. With
this operation, when the lower byte register is read, the upper
eight bits are stored into a shadow register, which is read by a
subsequent read to the upper byte. The upper register will read
the correct value even if additional ADC integration cycles end
between the reading of the lower and upper registers.
Figure 39:
Proximity Data Registers
Register
Address
Bits
PDATAL
0x1c
7:0
Proximity data low byte
PDATAH
0x1d
7:0
Proximity data high byte
ams Datasheet
[v3-02] 2015-Sep-11
Description (Reset value = 0x00)
Page 27
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TMD3782 − Application Information
Application Information
In a proximity sensing system, the IR LED can be pulsed by the
TMD3782 with more than 100 mA of rapidly switching current,
therefore, a few design considerations must be kept in mind to
get the best performance. The key goal is to reduce the power
supply noise coupled back into the device during the LED
pulses. If V bat does not exceed the maximum specified LDR pin
voltage (including when the battery is being recharged), LEDA
can be directly tied to V bat for best proximity performance.
In many systems, there is a quiet analog supply and a noisy
digital supply. By connecting the quiet supply to the V DD pin
and the noisy supply to the LED, the key goal can be meet. Place
a 1-μF low-ESR decoupling capacitor as close as possible to the
V DD pin and another at the LED anode, and a 10 - 22μF bulk
capacitor at the output of the LED voltage regulator to supply
the 100-mA current surge.
If operating from a single supply, use a 22-Ω resistor in series
with the V DD supply line and a 1-μF low ESR capacitor to filter
any power supply noise. The previous capacitor placement
considerations apply.
Figure 40:
Typical Application Hardware Circuit
V BUS in the above figure refers to the I²C bus voltage which is
either V DD or 1.8 V. Be sure to apply the specified I²C bus voltage
shown in the Available Options table for the specific device
being used.
The I²C signals and the Interrupt are open-drain outputs and
require pull−up resistors. The pull-up resistor (RP) value is a
function of the I²C bus speed, the I²C bus voltage, and the
capacitive load. The ams EVM running at 400 kbps, uses 1.5-kΩ
resistors. A 10-kΩ pull-up resistor (RPI) can be used for the
interrupt line.
Page 28
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ams Datasheet
[v3-02] 2015-Sep-11
TMD3782 − PCB Pad Layout
PCB Pad Layout
Suggested PCB pad layout guidelines for the surface mount
module are shown. Flash Gold is recommended surface finish
for the landing pads.
Figure 41:
Suggested PCB Layout
Note(s) and/or Footnote(s):
1. All linear dimensions are in millimeters.
2. This drawing is subject to change without notice.
ams Datasheet
[v3-02] 2015-Sep-11
Page 29
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TMD3782 − Package Drawings & Markings
Package Drawings & Markings
Figure 42:
Package Diagrams
RoHS
Green
Note(s) and/or Footnote(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ± 0.05 mm unless otherwise noted.
2. Contacts are copper with NiPdAu plating.
3. This package contains no lead (Pb).
4. This drawing is subject to change without notice.
Page 30
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ams Datasheet
[v3-02] 2015-Sep-11
TMD3782 − Mechanical Data
Mechanical Data
The mechanical data of TMD3782 is explained below.
Figure 43:
Carrier Tape and Reel Information
Note(s) and/or Footnote(s):
1. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481−B 2001.
4. Each reel is 330 millimeters in diameter and contains 2500 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481−B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
ams Datasheet
[v3-02] 2015-Sep-11
Page 31
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TMD3782 − Soldering and Storage Information
Soldering and Storage
Information
Soldering Information
The package has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 44:
Solder Reflow Profile
Parameter
Reference
Average temperature gradient in preheating
Device
2.5 ºC/s
tsoak
2 to 3 minutes
Time above 217 ºC (T1)
t1
Max 60 s
Time above 230 ºC (T2)
t2
Max 50 s
Time above Tpeak - 10 ºC (T3)
t3
Max 10 s
Peak temperature in reflow
Tpeak
260 ºC
Soak time
Temperature gradient in cooling
Max -5 ºC/s
Figure 45:
Solder Reflow Profile Graph
(s)
Page 32
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ams Datasheet
[v3-02] 2015-Sep-11
TMD3782 − Soldering and Storage Information
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is baked prior to being
dry packed for shipping.
Devices are dry packed in a sealed aluminized envelope called
a moisture-barrier bag with silica gel to protect them from
ambient moisture during shipping, handling, and storage
before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture
barrier bag is 12 months from the date code on the bag when
stored under the following conditions:
Shelf Life: 12 months
Ambient Temperature: < 40°C
Relative Humidity: < 90%
Rebaking of the devices will be required if the devices exceed
the 12 month shelf life or the Humidity Indicator Card shows
that the devices were exposed to conditions beyond the
allowable moisture region.
Floor Life
The module has been assigned a moisture sensitivity level of
MSL 3. As a result, the floor life of devices removed from the
moisture barrier bag is 168 hours from the time the bag was
opened, provided that the devices are stored under the
following conditions:
Floor Life: 168 hours
Ambient Temperature: < 30°C
Relative Humidity: < 60%
If the floor life or the temperature/humidity conditions have
been exceeded, the devices must be rebaked prior to solder
reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded,
rebake at 50°C for 12 hours.
ams Datasheet
[v3-02] 2015-Sep-11
Page 33
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TMD3782 − Ordering & Contact Information
Ordering & Contact Information
Figure 46:
Ordering Information
Ordering Code
Address
Interface
Delivery Form
TMD37821
0x39
I²C Vbus = VDD Interface
Module-8
TMD37823
0x39
I²C bus = 1.8V Interface
Module-8
TMD37825 (1)
0x29
I²C Vbus = VDD Interface
Module-8
TMD37827 (1)
0x29
I²C bus = 1.8V Interface
Module-8
Note(s) and/or Footnote(s):
1. Contact ams for availability.
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
ams_sales@ams.com
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbaderstrasse 30
8141 Unterpremstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
Page 34
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ams Datasheet
[v3-02] 2015-Sep-11
TMD3782 − RoHS Compliant & ams Green Statement
RoHS Compliant & ams Green
Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
ams Datasheet
[v3-02] 2015-Sep-11
Page 35
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TMD3782 − Copyrights & Disclaimer
Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141
Unterpremstaetten, Austria-Europe. Trademarks Registered. All
rights reserved. The material herein may not be reproduced,
adapted, merged, translated, stored, or used without the prior
written consent of the copyright owner.
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
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ams Datasheet
[v3-02] 2015-Sep-11
TMD3782 − Document Status
Document Status
Document Status
Product Preview
Preliminary Datasheet
Datasheet
Datasheet (discontinued)
ams Datasheet
[v3-02] 2015-Sep-11
Product Status
Definition
Pre-Development
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Pre-Production
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Discontinued
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Page 37
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TMD3782 − Revision Information
Revision Information
Changes from 3-01 (2014-Oct-21) to current revision 3-02 (2015-Sep-11)
Page
Updated Figure 11
9
Note(s) and/or Footnote(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
Page 38
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ams Datasheet
[v3-02] 2015-Sep-11
TMD3782 − Content Guide
Content Guide
1
1
2
2
General Description
Key Benefits & Features
Applications
Block Diagram
3
5
6
7
Detailed Description
Pin Assignment
Absolute Maximum Ratings
Electrical Characteristics
11
11
Timing Characteristics
Timing Diagrams
12
15
Typical Operating Characteristics
I²C Protocol
16
17
18
20
21
21
22
23
24
25
25
26
26
26
27
27
Register Description
Command Register
System Timing
Enable Register (0 x 00)
RGBC Integration Time Register (0x01)
Wait Time Register (0x03)
Clear Channel Interrupt Threshold Registers
(0x04 - 0x0b)
Proximity Interrupt Threshold Registers
(0x04 - 0x0b)
Interrupt Persistence Register (0x0C)
Configuration Register (0x0D)
Proximity Pulse Count Register (0x0E)
Control Register (0x0F)
Revision Register (0x11)
ID Register (0x12)
Status Register (0x13)
RGBC Data Registers (0x14 - 0x1b)
Proximity Data Registers (0x1c - 0x1d)
28
29
30
31
Application Information
PCB Pad Layout
Package Drawings & Markings
Mechanical Data
32
32
33
33
33
33
33
Soldering and Storage Information
Soldering Information
Storage Information
Moisture Sensitivity
Shelf Life
Floor Life
Rebaking Instructions
34
35
36
37
38
Ordering & Contact Information
RoHS Compliant & ams Green Statement
Copyrights & Disclaimer
Document Status
Revision Information
22
ams Datasheet
[v3-02] 2015-Sep-11
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