BXEN-40E-11L-3A-00-0-0

Bridgelux SMD 2835 0.2W 3V ® Product Data Sheet DS55 | | | | | | BXEN-27x 30x 35x 40x 50x 57x 65x SMD 2835 Introduction The Bridgelux SMD 2835 low power LED is hot-color targeted which ensures that the LEDs fall within their specified color bin at the typical application conditions of 85°C. With its broad lumen coverage and wide range of CCT options, the SMD 2835 provides unparalleled design-in flexibility for indoor and outdoor lighting applications. The SMD 2835 is ideal as a drop in replacement for emitters with an industry standard 2.8mm x 3.5mm footprint. Features Benefits • Industry-standard 2835 footprint • Lower operating and manufacturing cost • 9 bin color control enables tight color control • Ease of design and rapid go-to-market • Hot-color targeting ensures that color is within the ANSI bin at the typical application conditions of 85°C • Uniform consistent white light • Enables 3- and 5-step MacAdam ellipse custom binning kits • RoHS compliant and lead free • Multiple CCT configurations for a wide range of lighting applications • Reliable and constant white point • Environmentally friendly, complies with standards • Design flexibility Contents Product Feature Map 2 Product Nomenclature 2 Product Test Conditions 2 Product Selection Guide 3 Performance at Commonly Used Drive Currents 4 Electrical Characteristics 5 Absolute Maximum Ratings 6 Product Bin Definitions 7 Performance Curves 10 Typical Radiation Pattern 13 Typical Color Spectrum 14 Mechanical Dimensions 15 Reliability 16 Reflowing Characteristics 17 Packaging 18 Design Resources 20 Precautions 20 Disclaimers 20 About Bridgelux 21 1 Product Feature Map Bridgelux SMD LED products come in industry standard package sizes and follow ANSI binning standards. These LEDs are optimized for cost and performance, helping to ensure highly competitive system lumen per dollar performance while addressing the stringent efficacy and reliability standards required for modern lighting applications. Cathode Mark Yellow phosphor Light Emitting Surface (LES) Product Nomenclature The part number designation for Bridgelux SMD 2835 is explained as follows: 1 2 3 4 5 6 7 8 9 10 11 12 1314 15 16 BXEN – 30 E – 1 1 L – 3 A – 00 – 0 – 0 Product Family Nominal CCT 27 = 2,700K 30 = 3,000K 35 = 3,500K 40 = 4,000K 50 = 5,000K 57 = 5,700K 65 = 6,500K Color Bin Options Forward Voltage Bins Flux Bins Product Version Minimum CRI E = 80 CRI Typical Forward Voltage Low Power Die count in series Die count in parallel Product Test Conditions Bridgelux SMD 2835 LEDs are tested and binned with a 10ms pulse of 60mA at Tj (junction temperature)=Tsp (solder point temperature) =25°C. Forward voltage and luminous flux are binned at a Tj=Tsp=25°C, while color is hot targeted at a Tsp of 85°C. 2 Product Selection Guide The following product configurations are available: Table 1: Selection Guide, Pulsed Measurement Data at 60mA (Tj=Tsp=25°C) Part Number1,6 Nominal CCT2 (K) CRI3, 5 Forward Voltage4, 5 (V) Nominal Drive Current (mA) Min Typical Max Typical Pulsed Flux (lm)4, 5 Typical Power (W) Typical Efficacy (lm/W) 129 BXEN-27E-11L-3A-00-0-0 2700 80 60 2.8 3.1 3.4 24 0.2 BXEN-30E-11L-3A-00-0-0 3000 80 60 2.8 3.1 3.4 25 0.2 134 BXEN-35E-11L-3A-00-0-0 3500 80 60 2.8 3.1 3.4 25 0.2 134 140 BXEN-40E-11L-3A-00-0-0 4000 80 60 2.8 3.1 3.4 26 0.2 BXEN-50E-11L-3A-00-0-0 5000 80 60 2.8 3.1 3.4 26 0.2 140 BXEN-57E-11L-3A-00-0-0 5700 80 60 2.8 3.1 3.4 26 0.2 140 BXEN-65E-11L-3A-00-0-0 6500 80 60 2.8 3.1 3.4 25 0.2 134 Typical DC Flux (lm)5 Typical Power (W) Typical Efficacy (lm/W) 118 Table 2: Selection Guide, Stabilized DC Performance (T­sp = 85°C)7,8 Part Number 1,6 Nominal CCT2 (K) CRI 3, 5 Forward Voltage5 (V) Nominal Drive Current (mA) Min Typical Max BXEN-27E-11L-3A-00-0-0 2700 80 60 2.7 3.0 3.3 21 0.2 BXEN-30E-11L-3A-00-0-0 3000 80 60 2.7 3.0 3.3 22 0.2 125 BXEN-35E-11L-3A-00-0-0 3500 80 60 2.7 3.0 3.3 22 0.2 125 BXEN-40E-11L-3A-00-0-0 4000 80 60 2.7 3.0 3.3 23 0.2 129 BXEN-50E-11L-3A-00-0-0 5000 80 60 2.7 3.0 3.3 23 0.2 129 BXEN-57E-11L-3A-00-0-0 5700 80 60 2.7 3.0 3.3 23 0.2 129 BXEN-65E-11L-3A-00-0-0 6500 80 60 2.7 3.0 3.3 22 0.2 124 Notes for Table 1 & 2: 1. The last 6 characters (including hyphens ‘-’) refer to flux bins, forward voltage bins, and color bin options, respectively. “00-0-00” denotes the full distribution of flux, forward voltage, and 7 SDCM color. Example: BXEN-30E-11L-3A-00-0-0 refers to the full distribution of flux, forward voltage, and color within a 3000K 7-step ANSI standard chromaticity region with a minimum of 80CRI, 1x1 die configuration, low power, 3.1V typical forward voltage. 2. Product CCT is hot targeted at Tsp = 85°C. Nominal CCT as defined by ANSI C78.377-2011. 3. Listed CRIs are minimum values and include test tolerance. 4. Products tested under pulsed condition (10ms pulse width) at nominal drive current where T­j=T­sp=25°C. 5. Bridgelux maintains a ±7.5% tolerance on luminous flux measurements, ±0.1V tolerance on forward voltage measurements, and ±2 tolerance on CRI measurements for the SMD 2835. 6. Refer to Table 6 and Table 7 for Bridgelux SMD 2835 Luminous Flux Binning and Forward Voltage Binning information. 7. Typical stabilized DC performance values are provided as reference only and are not a guarantee of performance. 8. Typical performance is estimated based on operation under DC (direct current) with LED emitter mounted onto a heat sink with thermal interface material and the solder point temperature maintained at 85°C. Based on Bridgelux test setup, values may vary depending on the thermal design of the luminaire and/or the exposed environment to which the product is subjected. 3 Performance at Commonly Used Drive Currents SMD 2835 LEDs are tested to the specifications shown using the nominal drive currents in Table 1. SMD 2835 may also be driven at other drive currents dependent on specific application design requirements. The performance at any drive current can be derived from the current vs. voltage characteristics shown in Figure 2 and the relative luminous flux vs. current characteristics shown in Figure 3. The performance at commonly used drive currents is summarized in Table 3. Table 3: Performance at Commonly Used Drive Currents Part Number BXEN-27E-11L-3A-00-0-0 BXEN-30E-11L-3A-00-0-0 BXEN-35E-11L-3A-00-0-0 BXEN-40E-11L-3A-00-0-0 BXEN-50E-11L-3A-00-0-0 BXEN-57E-11L-3A-00-0-0 BXEN-65E-11L-3A-00-0-0 CRI 80 80 80 81 82 83 84 Drive Current1 (mA) Typical Vf Tsp = 25°C (V) Typical Power Tsp = 25°C (W) Typical Pulsed Flux2 Tsp = 25°C (lm) Typical DC Flux3 Tsp = 85°C (lm) Typical Efficacy Tsp = 25°C (lm/W) 20 2.8 0.1 9 8 158 30 2.9 0.1 13 11 150 40 2.9 0.1 17 15 143 60 3.1 0.2 24 21 129 80 3.2 0.3 31 27 122 20 2.8 0.1 9 8 165 156 30 2.9 0.1 13 12 40 2.9 0.1 18 15 149 60 3.1 0.2 25 22 134 80 3.2 0.3 33 28 127 20 2.8 0.1 9 8 165 156 30 2.9 0.1 13 12 40 2.9 0.1 18 15 149 60 3.1 0.2 25 22 134 80 3.2 0.3 33 28 127 20 2.8 0.1 10 8 171 30 2.9 0.1 14 12 163 40 2.9 0.1 18 16 155 60 3.1 0.2 26 23 140 80 3.2 0.3 34 29 132 20 2.8 0.1 10 8 171 30 2.9 0.1 14 12 163 40 2.9 0.1 18 16 155 60 3.1 0.2 26 23 140 80 3.2 0.3 34 29 132 20 2.8 0.1 10 8 171 30 2.9 0.1 14 12 163 40 2.9 0.1 18 16 155 60 3.1 0.2 26 23 140 80 3.2 0.3 34 29 132 20 2.8 0.1 9 8 165 156 30 2.9 0.1 13 12 40 2.9 0.1 18 15 149 60 3.1 0.2 25 22 134 80 3.2 0.3 33 28 127 Notes for Table 3: 1. Alternate drive currents in Table 3 are provided for reference only and are not a guarantee of performance. 2. Bridgelux maintains a ± 7.5% tolerance on flux measurements. 3. Typical stabilized DC performance values are provided as reference only and are not a guarantee of performance. 4 Electrical Characteristics Table 4: Electrical Characteristics Forward Voltage (V) 2,3 Part Number 1 BXEN-xxE-11L-3A-00-0-0 Drive Current (mA) 60 Minimum Typical Maximum 2.8 3.1 3.4 Typical Temperature Coefficient of Forward Voltage ∆Vf/∆T (mV/ºC) Typical Thermal Resistance Junction to Solder Point4 R j-sp (ºC/W) -1.9 29 Notes for Table 4: 1. The last 6 characters (including hyphens ‘-’) refer to flux bins, forward voltage bins, and color bin options, respectively. “00-0-00” denotes the full distribution of flux, forward voltage, and 7 SDCM color. Example: BXEN-30E-11L-3A-00-0-0 refers to the full distribution of flux, forward voltage, and color within a 3000K 7-step ANSI standard chromaticity region with a minimum of 80CRI, 1x1 die configuration, low power, 3.1V typical forward voltage. 2. Bridgelux maintains a tolerance of ± 0.1V on forward voltage measurements. Voltage minimum and maximum values at the nominal drive current are guaranteed by 100% test. 3. Products tested under pulsed condition (10ms pulse width) at nominal drive current where Tsp = 25°C. 4. Thermal resistance value was calculated using total electrical input power; optical power was not subtracted from input power. 5 Absolute Maximum Ratings Table 5: Maximum Ratings Parameter Maximum Rating LED Junction Temperature (Tj) 125°C Storage Temperature -40°C to +105°C Operating Solder Point Temperature (TSp) -40°C to +105°C Soldering Temperature 260°C or lower for a maximum of 10 seconds Maximum Drive Current3 80mA Maximum Peak Pulsed Forward Current1 120mA Maximum Reverse Voltage2 -5V Moisture Sensitivity Rating MSL 3 Electrostatic Discharge 2kV HBM. JEDEC-JS-001-HBM and JEDEC-JS-001-2012 Notes for Table 5: 1. Bridgelux recommends a maximum duty cycle of 10% and pulse width of 10 ms when operating LED SMD at maximum peak pulsed current specified. Maximum peak pulsed current indicate values where LED SMD can be driven without catastrophic failures. 2. Light emitting diodes are not designed to be driven in reverse voltage and will not produce light under this condition. Maximum rating provided for reference only. 3. The maximum drive current for LM80 test results is based on the nominal drive current listed. 6 Product Bin Definitions Table 6 lists the standard photometric luminous flux bins for Bridgelux SMD 2835 LEDs. Although several bins are listed, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all CCTs. Table 6: Luminous Flux Bin Definitions at 60mA, Tsp=25°C Bin Code Minimum Maximum 1A 22 24 1B 24 26 1C 26 28 1D 28 30 1E 30 32 Unit Condition lm IF=60mA Unit Condition V IF=60mA Note for Table 6: 1. Bridgelux maintains a tolerance of ± 7.5% on luminous flux measurements. Table 7: Forward Voltage Bin Definition at 60mA, Tsp=25°C Bin Code Minimum Maximum A 2.8 2.9 B 2.9 3.0 C 3.0 3.1 D 3.1 3.2 E 3.2 3.3 F 3.3 3.4 Note for Table 7: 1. Bridgelux maintains a tolerance of ± 0.1V on forward voltage measurements. 7 Product Bin Definitions Table 8: 3- and 5-step MacAdam Ellipse Color Bin Definitions CCT 2700K 3000K 3500K 4000K 5000K 5700K 6500K Color Space Center Point Major Axis Minor Axis Ellipse Rotation Angle Color Bin 0.4101 0.00810 0.00420 53.70 1 0.4578 0.4101 0.01350 0.00700 53.70 1/A/B/C/D X Y 3 SDCM 0.4578 5 SDCM 3 SDCM 0.4338 0.4030 0.00834 0.00408 53.22 1 5 SDCM 0.4338 0.4030 0.01390 0.00680 53.22 1/A/B/C/D 3 SDCM 0.4103 0.3961 0.00927 0.00414 54.00 1 5 SDCM 0.4103 0.3961 0.01545 0.00690 54.00 1/A/B/C/D 3 SDCM 0.3818 0.3797 0.00939 0.00402 53.72 1 5 SDCM 0.3818 0.3797 0.01565 0.00670 53.72 1/A/B/C/D 3 SDCM 0.3447 0.3553 0.00822 0.00354 59.62 1 5 SDCM 0.3447 0.3553 0.01370 0.00590 59.62 1/A/B/C/D 3 SDCM 0.3287 0.3417 0.00746 0.00320 59.09 1 5 SDCM 0.3287 0.3417 0.01243 0.00533 59.09 1/A/B/C/D 3 SDCM 0.3123 0.3282 0.00669 0.00285 58.57 1 5 SDCM 0.3123 0.3282 0.01115 0.00475 58.57 1/A/B/C/D Notes for Table 8: 1. Color binning at Tsp=85°C 2. Bridgelux maintains a tolerance of ± 0.007 on x and y color coordinates in the CIE 1931 color space. 8 Product Bin Definitions Figure 1: C.I.E. 1931 Chromaticity Diagram (9 Color Bin Structure, hot-color targeted at Tsp=85°C) 9 Performance Curves Figure 2: Drive Current vs. Voltage (Tsp=25°C) 90 80 Forward Current (mA) 70 60 50 40 30 20 10 0 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 Forward Voltage (V) Figure 3: Typical Relative Luminous Flux vs. Drive Current (Tsp=25°C) 1.4 Relative Luminous Flux 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 10 20 30 40 50 60 70 80 90 Forward Current (mA) Note for Figure 3: 1. Bridgelux does not recommend driving high power LEDs at low currents. Doing so may produce unpredictable results. Pulse width modulation (PWM) is recommended for dimming effects. 10 Performance Curves Figure 4: Typical Relative DC Flux vs. Solder Point Temperature 1.00 Warm White Neutral White Cool White 25°C Pulsed Relative Luminous Flux 0.97 0.94 0.91 0.88 0.85 0.82 0 25 50 75 100 125 Solder Point Temperature (°C) Figure 5: Typical DC ccy Shift vs. Solder Point Temperature 0 25 50 75 100 125 0.000 ccy Shift -0.003 -0.006 -0.009 -0.012 -0.015 Warm White Neutral White Cool White 25°C Pulsed Solder Point Temperature (°C) Notes for Figures 4 & 5: 1. Characteristics shown for warm white based on 3000K and 80 CRI. 2. Characteristics shown for neutral white based on 4000K and 80 CRI. 3. Characteristics shown for cool white based on 6500K and 80 CRI. 4. For other color SKUs, the shift in color will vary. Please contact your Bridgelux Sales Representative for more information. 11 Performance Curves Figure 6: Typical DC ccx Shift vs. Solder Point Temperature 0 25 50 75 100 125 0.000 ccx Shift -0.002 -0.004 -0.006 -0.008 -0.010 Warm White Neutral White Cool White 25°C Pulsed Solder Point Temperature (°C) Notes for Figure 6: 1. Characteristics shown for warm white based on 3000K and 80 CRI. 2. Characteristics shown for neutral white based on 4000K and 80 CRI. 3. Characteristics shown for cool white based on 6500K and 80 CRI. 4. For other color SKUs, the shift in color will vary. Please contact your Bridgelux Sales Representative for more information. 12 Typical Radiation Pattern Figure 7: Typical Spatial Radiation Pattern at 60mA, Tsp=25°C 100% 90% Relative Intensity 80% 70% 60% 50% 40% 30% 20% 10% 0% -90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90 Angular Displacement (⁰) Notes for Figure 7: 1. Typical viewing angle is 120⁰. 2. The viewing angle is defined as the off axis angle from the centerline where luminous intensity (Iv) is ½ of the peak value. Figure 8: Typical Polar Radiation Pattern at 60mA, Tsp=25°C 13 Typical Color Spectrum Figure 9: Typical Color Spectrum 1.0000 2700K Relative Spectral Power Distribution 3000K 0.8000 4000K 6500K 0.6000 0.4000 0.2000 0.0000 400 450 500 550 600 650 700 750 800 Wavelength (nm) Notes for Figure 9: 1. Color spectra measured at nominal current for Tsp = 25°C 2. Color spectra shown for warm white is 2700K and 80 CRI. 3. Color spectra shown for warm white is 3000K and 80 CRI. 4. Color spectra shown for neutral white is 4000K and 80 CRI. 5 Color spectra shown for cool white is 6500K and 80 CRI. 14 Mechanical Dimensions Figure 10: Drawing for SMD 2835 Cathode Mark Notes for Figure 10: 1. Drawings are not to scale. 2. Drawing dimensions are in millimeters. 3. Unless otherwise specified, tolerances are ± 0.10mm. Recommended PCB Soldering Pad Pattern 15 Reliability Table 9: Reliability Test Items and Conditions No . Items R而非人eference Standard Test Conditions Drive Current Test Duration Units Failed/Tested 1 Moisture/Reflow Sensitivity J-STD-020E Tsld = 260°C, 10sec, Precondition: 60°C, 60%RH, 168hr - 3 reflows 0/22 2 Low Temperature Storage JESD22-A119 Ta=-40°C - 1000 hours 0/22 3 High Temperature Storage JESD22-A103D Ta= 100°C - 1000 hours 0/22 4 Low Temperature Operating Life JESD22-A108D Ta=-40°C 60mA 1000 hours 0/22 5 Temperature Humidity Operating Life JESD22-A101C Tsp=85°C℃, RH=85% 60mA 1000 hours 0/22 6 High Temperature Operating Life JESD22-A108D Tsp=105°C 80mA 1000 hours 0/22 7 Power switching IEC62717:2014 Tsp= 105°C 30 sec on, 30 sec off 80mA 30000 cycles 0/22 8 Thermal Shock JESD22-A106B Ta=-40°C ~100°C; Dwell : 15min; Transfer: 10sec - 200 cycles 0/22 9 Temperature Cycle JESD22-A104E Ta=-40°C ~100°C; Dwell at extreme temperature: 15min; Ramp rate < 105°C/min - 200 cycles 0/22 10 Electrostatic Discharge JS-001-2012 HBM, 2KV, 1.5kΩ, 100pF, Alternately positive or negative - - 0/22 Passing Criteria Item Symbol Test Condition Passing Criteria Forward Voltage Vf 60mA ΔΔVf